CN103035738A - Silicon plastic packaging patch diode - Google Patents
Silicon plastic packaging patch diode Download PDFInfo
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- CN103035738A CN103035738A CN 201110299578 CN201110299578A CN103035738A CN 103035738 A CN103035738 A CN 103035738A CN 201110299578 CN201110299578 CN 201110299578 CN 201110299578 A CN201110299578 A CN 201110299578A CN 103035738 A CN103035738 A CN 103035738A
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Abstract
The invention relates to a semiconductor element, in particular to a silicon plastic packaging patch diode which comprises a diode body and a packaging casing, wherein the diode body comprises a ceramic substrate arranged in the packaging casing, a back electrode, a surface electrode, a chip, an upper layer electrode and end electrodes, wherein the back electrode and the surface electrode are respectively printed on the back surface and the front surface of the ceramic substrate, the chip is bonded on the surface electrode, the upper layer electrode is arranged at the position above the protruding point at the top end of the chip, insulating protective glue is covered on the upper layer electrode, the end electrodes which are fractured into strip shape and arranged outside the packaging casing are arranged on two sides of the ceramic substrate, and the tail ends of the end electrodes are fractured to be granular. The silicon plastic package patch diode has the advantages of being small in size, light in weight, high in assembling density, free of leads, stable in electrical performance, high in reliability, favorable for being high in frequency and speed and capable of being matched with an automatic pasting device.
Description
Technical field
The present invention relates to a kind of semiconductor device, especially a kind of silicon plastic packaging patch diode.
Background technology
At present in the industry, the diode product is mainly take the tubulose packing forms as main, but this profile has many shortcomings: in pickup, mount, in the process such as welding, the phenomenon such as material casting occurs easily, break, production efficiency is low, is not easy to high volume applications; Exist thermal coefficient of expansion not mate phenomenon, cause easily thermal mismatching and injury, reliability decrease; The bend resistance insufficient strength of product; The scarce capacity that the resisting temperature of the product of glass packaging is impacted causes breaking of product easily.Along with electronic product to lighter element, little, thin demand, the silicon plastic packaging patch diode is as a kind of new component of cost performance brilliance, it bring far-reaching influence will for its application.
Summary of the invention
The technical problem to be solved in the present invention is: based on the problems referred to above, the invention provides a kind of profile than plastic packaging Guan Gengxiao, manufacture process is easier, the silicon plastic packaging patch diode of performance high-quality.
The technical solution adopted for the present invention to solve the technical problems is: a kind of silicon plastic packaging patch diode is provided; comprise diode body and package casing; described diode body comprises the ceramic substrate that is positioned at package casing; backplate; facial electrode; chip; upper electrode and termination electrode; the back side of described ceramic substrate and front are printed with respectively backplate and facial electrode; be adhesive with chip on the facial electrode; salient point top position, chip top is upper electrode; be coated with insulation protection glue on the upper electrode; the ceramic substrate both sides be provided with jackknifing into strips be positioned at the outer termination electrode of package casing, termination electrode has the end that fractures and granulate.
The end surface of described termination electrode is the soldering-tin layer metal.
The raw material of described package casing is the flame retardant epoxy material.
The invention has the beneficial effects as follows: volume of the present invention is little, lightweight, and packaging density is high, without lead-in wire, and electric performance stablity, reliability is high, is conducive to high frequency, high speed, and can be sticked for being complementary with automatic mounting.
Description of drawings
The present invention is further described below in conjunction with accompanying drawing embodiment.
Fig. 1 is structural representation of the present invention.
Fig. 2 is the internal structure schematic diagram of Fig. 1.
Among the figure: 1. diode body, 2. package casing, 3. ceramic substrate, 4. backplate, 5. facial electrode, 6. chip, 7. upper electrode, 8. termination electrode, 9. insulation protection glue.
Embodiment
The invention will be further described in conjunction with specific embodiments now, and following examples are intended to illustrate the present invention rather than limitation of the invention further.
Silicon plastic packaging patch diode shown in Fig. 1～2; comprise diode body 1 and package casing 2; diode body 1 comprises the ceramic substrate 3 that is positioned at package casing 2; backplate 4; facial electrode 5; chip 6; upper electrode 7 and termination electrode 8; the back side of ceramic substrate 3 and front are printed with respectively backplate 4 and facial electrode 5; be adhesive with chip 6 on the facial electrode 5; salient point top position, chip 6 top is upper electrode 7; be coated with insulation protection glue 9 on the upper electrode 7; ceramic substrate 3 both sides be provided with jackknifing into strips be positioned at the outer termination electrode 8 of package casing 2, termination electrode 8 has the end that fractures and granulate.
The end surface of termination electrode 8 is the soldering-tin layer metal.
The raw material of package casing 2 is the flame retardant epoxy material.
Take above-mentioned foundation desirable embodiment of the present invention as enlightenment, by above-mentioned description, the relevant staff can in the scope that does not depart from this invention technological thought, carry out various change and modification fully.The technical scope of this invention is not limited to the content on the specification, must determine its technical scope according to the claim scope.
Claims (3)
1. silicon plastic packaging patch diode; comprise diode body (1) and package casing (2); it is characterized in that: described diode body (1) comprises the ceramic substrate (3) that is positioned at package casing (2); backplate (4); facial electrode (5); chip (6); upper electrode (7) and termination electrode (8); the back side of described ceramic substrate (3) and front are printed with respectively backplate (4) and facial electrode (5); be adhesive with chip (6) on the facial electrode (5); salient point top position, chip (6) top is upper electrode (7); be coated with insulation protection glue (9) on the upper electrode (7); ceramic substrate (3) both sides be provided with jackknifing into strips be positioned at the outer termination electrode (8) of package casing (2), termination electrode (8) has the end that fractures and granulate.
2. silicon plastic packaging patch diode according to claim 1, it is characterized in that: the end surface of described termination electrode (8) is the soldering-tin layer metal.
3. silicon plastic packaging patch diode according to claim 1, it is characterized in that: the raw material of described package casing (2) is the flame retardant epoxy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110299578 CN103035738A (en) | 2011-09-30 | 2011-09-30 | Silicon plastic packaging patch diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110299578 CN103035738A (en) | 2011-09-30 | 2011-09-30 | Silicon plastic packaging patch diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103035738A true CN103035738A (en) | 2013-04-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110299578 Pending CN103035738A (en) | 2011-09-30 | 2011-09-30 | Silicon plastic packaging patch diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103035738A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112839437A (en) * | 2020-12-31 | 2021-05-25 | 广州金升阳科技有限公司 | Double-sided plastic package power supply product |
-
2011
- 2011-09-30 CN CN 201110299578 patent/CN103035738A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112839437A (en) * | 2020-12-31 | 2021-05-25 | 广州金升阳科技有限公司 | Double-sided plastic package power supply product |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130410 |