CN103022665A - Three-dimensional integration surface antenna of impedance calibration - Google Patents
Three-dimensional integration surface antenna of impedance calibration Download PDFInfo
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- CN103022665A CN103022665A CN2012105622971A CN201210562297A CN103022665A CN 103022665 A CN103022665 A CN 103022665A CN 2012105622971 A CN2012105622971 A CN 2012105622971A CN 201210562297 A CN201210562297 A CN 201210562297A CN 103022665 A CN103022665 A CN 103022665A
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Abstract
The invention relates to a three-dimensional integration surface antenna of impedance calibration, relating to a horn antenna. The antenna comprises a metallized vertical via hole feed line (1), a horn antenna (2) and metallized via holes (3) integrated on the same dielectric base plate (4); the dielectric base plate (4) is arranged on the top of a three-dimensional integration (5); one end of the metallized vertical via hole feed line (1) is connected with an internal circuit (8); the horn antenna (2) consists of a bottom metal plane surface (6), a top metal plane surface (9) and metallized via hole side walls (11); a via hole array (17) composed of the metallized via holes (3) forms a plurality of dielectric-filled waveguides (18) in the horn antenna (2); and the wave impedance of the dielectric-filled waveguides (18) on an antenna aperture surface (12) is equal to that of a free space. Through the antenna, the return loss of the antenna is reduced, and the gain is increased.
Description
Technical field
The present invention relates to a kind of horn antenna, especially a kind of three-dimension packaging skin antenna of impedance calibration.
Background technology
Adopt little packaging technology, can be integrated into a radio system in the encapsulation, also need antenna is integrated in the surface of encapsulation for this reason.Be a kind of very natural mode at the integrated paster antenna of package surface, but the radiation master of paster antenna is to the normal direction that is the surface, and the radiation master that we need sometimes is to being direction surfacewise.If just can realize radiation along surface direction at the integrated horn antenna of package surface.But usually horn antenna is nonplanar, with incompatible, the larger physical dimension that has of planar circuit technique, thereby has limited its application on encapsulating structure.In recent years, substrate integration wave-guide horn antenna based on the substrate integrated waveguide technology development has the advantages that size is little, lightweight, be easy to Planar integration, but the gain of traditional substrate integration wave-guide horn antenna is relatively low, its reason is because horn mouth constantly opens, electromagnetic wave impedance is different from the wave impedance of free space on the bore face, can cause reflection of electromagnetic wave, the return loss that has affected antenna and radiance on medium and air interface.The methods such as at present existing employing medium loading, medium prism, correct the asynchronous of horn mouth diametric plane phase place, but these methods all can not be improved the inconsistent of horn antenna and free space wave impedance on the bore face, and these phase alignment structures have increased the overall structure size of antenna, are not suitable for being integrated into package surface.
Summary of the invention
Technical problem: the three-dimension packaging skin antenna that the objective of the invention is to propose a kind of impedance calibration, this horn antenna inside is embedded with inconsistent in order to RECTIFYING ANTENNA and free space wave impedance of metallization arrays of vias, reduce the reflection of three-dimension packaging skin antenna, improve the gain of antenna.
Technical scheme: the three-dimension packaging skin antenna of impedance calibration of the present invention, it is characterized in that this antenna comprises metallization vertical vias feeder line, substrate integration wave-guide horn antenna and the embedded metal via hole that is arranged on the medium substrate, medium substrate is in the top of three-dimension packaging; Described metallization vertical vias feeder line links to each other with the internal circuit of three-dimension packaging; The substrate integration wave-guide horn antenna is comprised of with the metallization via hole loudspeaker sidewall that is connected medium substrate and connects bottom surface metal flat end face metal flat the bottom surface metal flat that is positioned at medium substrate one side, the end face metal flat that is positioned at the medium substrate another side; Metallization via hole embedded in the substrate integration wave-guide horn antenna connects bottom surface metal flat and end face metal flat, and consists of a plurality of metallization arrays of vias; The metallization arrays of vias forms a plurality of dielectric-filled waveguides at horn antenna, and dielectric-filled waveguide is the same with the wave impedance of free space in the wave impedance of antenna opening diametric plane upper port.
The circular hole that one end of metallization vertical vias feeder line passes on the metal flat of medium substrate bottom surface links to each other with the internal circuit of three-dimension packaging, there is individual circular pad on its other end top, metallization vertical vias feeder line top circular pad 10 is at the center of circular hole of the end face metal flat of medium substrate, and the end face metal flat of therefore metallize vertical vias feeder line top circular pad and medium substrate does not directly electrically contact.
The substrate integration wave-guide horn antenna is made of narrow Cross-section Waveguide Using, tubaeform waveguide and wide Cross-section Waveguide Using serial connection; One end of narrow Cross-section Waveguide Using is short circuit face, the other end of narrow Cross-section Waveguide Using links to each other with tubaeform waveguide, one end of tubaeform waveguide links to each other with narrow Cross-section Waveguide Using, and the other end of tubaeform waveguide links to each other with wide Cross-section Waveguide Using, and the other end of wide Cross-section Waveguide Using is the antenna opening diametric plane.
The shape of metallization arrays of vias can be one section straight line, also can be straight line, broken line or exponential line or other curve and combination thereof.
The metallization arrays of vias all be head end all towards the short circuit face direction of the narrow Cross-section Waveguide Using of horn antenna, tail end is on the antenna opening diametric plane.
The width of dielectric-filled waveguide will guarantee that all its main mould can transmit and is not cut off in dielectric-filled waveguide.
A port of dielectric-filled waveguide is all towards the short circuit face direction of the narrow Cross-section Waveguide Using of horn antenna, and its another port is all on the antenna opening diametric plane, and dielectric-filled waveguide is all the same at the width of antenna opening diametric plane upper port.
In the metallization via hole loudspeaker sidewall, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, so that the metallization via hole loudspeaker sidewalls (11) that consist of can equivalence be electric wall.
In the metallization via hole, the spacing of two adjacent metallization via holes will be equal to or less than 1/10th of operation wavelength, so that the metallization arrays of vias that consists of can equivalence be electric wall.
In dielectric-filled waveguide, the propagating wave impedance of electromagnetic wave master mould (TE10 mould) is all relevant with the width of dielectric-filled waveguide, and the width of dielectric-filled waveguide is wider, and the propagating wave impedance of main mould is just lower; Otherwise the width of dielectric-filled waveguide is narrower, and the propagating wave impedance of main mould is just higher.Enter into the substrate integration wave-guide horn antenna from the electromagnetic wave signal of encapsulation internal circuit from an end of the metallization vertical vias feeder line input/output port by antenna, after propagating a segment distance to the bore face direction of antenna, run into the metallization arrays of vias, just be divided into multichannel and enter respectively the transmission of a plurality of dielectric-filled waveguides, be transferred to radiation on the bore face of antenna by these dielectric-filled waveguides again.The port width of dielectric-filled waveguide equates on the bore face of antenna like this, because the wave impedance of electromagnetic wave in dielectric-filled waveguide equals the wave impedance of free space on the bore face of antenna, namely the port width a of dielectric-filled waveguide satisfies condition
Namely port width a equals free space wavelength λ except subtracting 1 subduplicate twice in medium relative dielectric constant ε, so the reflection of antenna opening diametric plane is just little.
Beneficial effect: the beneficial effect of the three-dimension packaging skin antenna of impedance calibration of the present invention is, the wave impedance of magnetic wave equals the wave impedance of free space so that the antenna opening diametric plane powers on, thereby has reduced the return loss of three-dimension packaging skin antenna and the gain that has improved antenna.
Description of drawings
Fig. 1 is the three-dimension packaging overall structure schematic diagram of the three-dimension packaging skin antenna of impedance calibration.
Fig. 2 is the three-dimension packaging skin antenna Facad structure schematic diagram of impedance calibration.
Fig. 3 is the three-dimension packaging skin antenna reverse side structural representation of impedance calibration.
Have among the figure: metallization vertical vias feeder line 1, substrate integration wave-guide horn antenna 2, embedded metal via hole 3, medium substrate 4, three-dimension packaging 5, short circuit face 16, metallization arrays of vias 17 and the dielectric-filled waveguide 18 of bottom surface metal flat 6, bottom surface metal flat circular hole 7, internal circuit 8, end face metal flat 9, metallization vertical vias feeder line top circular pad 10, metallization via hole loudspeaker sidewall 11, the bore face 12 of antenna, the narrow Cross-section Waveguide Using 13 of antenna, the tubaeform waveguide 14 of antenna, the wide Cross-section Waveguide Using 15 of antenna, narrow Cross-section Waveguide Using.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
Embodiment of the present invention is: the three-dimension packaging skin antenna of impedance calibration is comprised of metallization vertical vias feeder line 1, substrate integration wave-guide horn antenna 2 and embedded metal via hole 3 three parts, this three part all is integrated on the same medium substrate 4, and medium substrate 4 is in the top of three-dimension packaging 5; The metallization vertical vias feeder line 1 vertical medium substrate 4 that connects, the circular hole 7 that one end of metallization vertical vias feeder line 1 passes on the medium substrate 4 bottom surface metal flats 6 links to each other with the internal circuit 8 of three-dimension packaging 5, it is the input/output port of antenna, there is individual circular pad 10 on the top of the other end of metallization vertical vias feeder line 1, circular pad 10 is at the center of circular hole of the end face metal flat 9 of medium substrate 4, and the vertical vias feeder line top circular pad 10 that therefore metallizes does not directly electrically contact with the end face metal flat 9 of medium substrate; Substrate integration wave-guide horn antenna 2 is comprised of bottom surface metal flat 7, end face metal flat 9 and metallization via hole loudspeaker sidewall 11, bottom surface metal flat 7 and end face metal flat 9 lay respectively at the two sides of medium substrate 4, and metallization via sidewall 11 connects bottom surface metal flat 7 and end face metal flat 9; The bore face 12 of horn antenna 2 from the input/output port of antenna to antenna is divided into narrow Cross-section Waveguide Using 13, tubaeform waveguide 14 and wide Cross-section Waveguide Using 15 3 parts; One end of narrow Cross-section Waveguide Using 13 is metallized the short circuit face 16 that via sidewall 11 short circuits consist of narrow Cross-section Waveguide Using, and the other end and tubaeform waveguide 14 are joined, and metallization vertical vias feeder line 1 is on the center line of narrow Cross-section Waveguide Using 13 broadsides; Metallization via hole 3 embedded in substrate integration wave-guide horn antenna 2 connects bottom surface metal flat 7 and end face metal flat 9, and these embedded metallization via holes 3 consist of metallization arrays of vias 17; All towards the direction of the short circuit face 16 of the narrow Cross-section Waveguide Using of horn antenna 2, the tail end of metallization arrays of vias 17 is on the bore face 12 of horn antenna 2 for shape straight line or the broken line of metallization arrays of vias 17, the head end of metallization arrays of vias 17; Metallization arrays of vias 17 forms a plurality of dielectric-filled waveguides 18 in antenna 2, and sets the width of dielectric-filled waveguide 18 so that the wave impedance of these dielectric-filled waveguides on antenna opening diametric plane 12 all equals the wave impedance of free space.
In dielectric-filled waveguide, the wave impedance of the propagation of electromagnetic wave master mould (TE10 mould) is relevant with the width of dielectric-filled waveguide, and the width of dielectric-filled waveguide is wider, and the wave impedance of main mould is just lower; Otherwise the dielectric-filled waveguide width is narrower, and the wave impedance of main mould is just higher.Enter into substrate integration wave-guide horn antenna 2 from the electromagnetic wave signal of internal circuit 8 from an end of metallization vertical vias feeder line 1 input/output port by antenna, after propagating a segment distance, run into metallization arrays of vias 17, electromagnetic wave just is divided into multichannel and enters respectively in direction transmission from each dielectric-filled waveguide 18 to antenna opening diametric plane 12; Because electromagnetic wave equals the wave impedance of free space at each dielectric-filled waveguide 18 in the wave impedance of antenna opening diametric plane upper port, namely the port width a of dielectric-filled waveguide 18 satisfies condition
Namely port width a equals free space wavelength λ except subtracting 1 subduplicate twice in medium relative dielectric constant ε, so the reflection of antenna opening diametric plane is just little, thereby reaches the aperture efficiency that improves antenna and the purpose of gain.
On technique, the three-dimension packaging skin antenna of impedance calibration both can adopt the three-dimensional resinous packaging technology, also can adopt LTCC (LTCC) technique to realize.Via hole 3 and the metallization via sidewall 11 of wherein metallizing can be that the hollow metal through hole also can be the solid metal hole, also can be continuous metallization wall, and the shape of metal throuth hole can be circular, also can be square or other shapes.
Structurally, equate condition owing to will satisfy wave impedance, the port width of dielectric-filled waveguide 18 is certain, thereby the width of antenna opening diametric plane 12 just can not Set arbitrarily, because keep dielectric-filled waveguide 18 to equal the wave impedance of free space in the wave impedance of port, the dielectric constant of medium substrate 4 is certain, and then the port width of dielectric-filled waveguide 18 is also certain, therefore the dielectric-filled waveguide quantity at antenna opening diametric plane 12 places doubles, and bore face 12 width of antenna also will double.According to same thinking, can increase metallization arrays of vias quantity, and so that all equal the wave impedance of free space by these dielectric-filled waveguides in antenna opening diametric plane 12 upper port wave impedance, the reflection of antenna is little like this, but the width of antenna opening diametric plane 12 is also wanted corresponding increase.Because the metallization via sidewall 11 the closer to antenna, the distance that electromagnetic wave arrives antenna opening diametric plane 12 is far away, therefore with respect to from the dielectric-filled waveguide of metallization via sidewall 11 away from, from the width relative narrower of the dielectric-filled waveguide of metallization via sidewall 11 close to obtain higher electromagnetic transmission phase velocity.The shape of metallization arrays of vias 17 can be straight line, broken line, exponential line, polygon or other curve.
According to the above, just can realize the present invention.
Claims (9)
1. the three-dimension packaging skin antenna of an impedance calibration, it is characterized in that this antenna comprises metallization vertical vias feeder line (1), substrate integration wave-guide horn antenna (2) and the embedded metal via hole (3) that is arranged on the medium substrate (4), medium substrate (4) is in the top of three-dimension packaging (5); Described metallization vertical vias feeder line (1) links to each other with the internal circuit (8) of three-dimension packaging (5); Substrate integration wave-guide horn antenna (2) is comprised of the bottom surface metal flat (6) that is positioned at medium substrate (4) one side, the metallization via hole loudspeaker sidewalls (11) that are positioned at the end face metal flat (9) of medium substrate (4) another side and are connected medium substrate (4) connection bottom surface metal flat (6) end face metal flat (9); Metallization via hole (3) embedded in the substrate integration wave-guide horn antenna (2) connects bottom surface metal flat (6) and end face metal flat (9), and consists of a plurality of metallization arrays of vias (17); Metallization arrays of vias (17) forms a plurality of dielectric-filled waveguides (18) at horn antenna (2), and dielectric-filled waveguide (18) is the same with the wave impedance of free space in the wave impedance of antenna opening diametric plane (12) upper port.
2. the three-dimension packaging skin antenna of a kind of impedance calibration according to claim 1, it is characterized in that the circular hole (7) that an end of described metallization vertical vias feeder line (1) passes on medium substrate (4) the bottom surface metal flat (6) links to each other with the internal circuit (8) of three-dimension packaging (5), there is individual circular pad (10) on its other end top, metallization vertical vias feeder line top circular pad 10 is at the center of circular hole of the end face metal flat (9) of medium substrate (4), and the vertical vias feeder line top circular pad (10) that therefore metallizes does not directly electrically contact with the end face metal flat (9) of medium substrate (4).
3. the three-dimension packaging skin antenna of a kind of impedance calibration according to claim 1 is characterized in that described substrate integration wave-guide horn antenna (2) is made of narrow Cross-section Waveguide Using (13), tubaeform waveguide (14) and wide Cross-section Waveguide Using (15) serial connection; One end of narrow Cross-section Waveguide Using (13) is short circuit face (16), the other end of narrow Cross-section Waveguide Using (13) links to each other with tubaeform waveguide (14), one end of tubaeform waveguide (14) links to each other with narrow Cross-section Waveguide Using (13), the other end of tubaeform waveguide (14) links to each other with wide Cross-section Waveguide Using (15), and the other end of wide Cross-section Waveguide Using (15) is antenna opening diametric plane (12).
4. the three-dimension packaging skin antenna of a kind of impedance calibration according to claim 1, the shape that it is characterized in that described metallization arrays of vias (17) can be one section straight line, also can be straight line, broken line or exponential line or other curve and combination thereof.
5. according to claim 1 or the three-dimension packaging skin antenna of 4 described a kind of impedance calibrations, it is characterized in that described metallization arrays of vias (17) all be head end all towards short circuit face (16) direction of the narrow Cross-section Waveguide Using of horn antenna, tail end is on antenna opening diametric plane (12).
6. the three-dimension packaging skin antenna of a kind of impedance calibration according to claim 1, the width that it is characterized in that described dielectric-filled waveguide (18) will guarantee that all its main mould can transmit and is not cut off in dielectric-filled waveguide (18).
7. according to claim 1 or the three-dimension packaging skin antenna of 6 described a kind of impedance calibrations, a port that it is characterized in that described dielectric-filled waveguide (18) is all towards short circuit face (16) direction of the narrow Cross-section Waveguide Using of horn antenna, its another port is all on antenna opening diametric plane (12), and dielectric-filled waveguide (18) is all the same at the width of antenna opening diametric plane (12) upper port.
8. the three-dimension packaging skin antenna of a kind of impedance calibration according to claim 1, it is characterized in that in the described metallization via hole loudspeaker sidewalls (11), the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, so that the metallization via hole loudspeaker sidewalls (11) that consist of can equivalence be electric wall.
9. the three-dimension packaging skin antenna of a kind of impedance calibration according to claim 1, it is characterized in that in the described metallization via hole (3), the spacing of adjacent two metallization via holes (3) will be equal to or less than 1/10th of operation wavelength, so that the metallization arrays of vias (17) that consists of can equivalence be electric wall.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210562297.1A CN103022665B (en) | 2012-12-21 | 2012-12-21 | Three-dimensional integration surface antenna of impedance calibration |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210562297.1A CN103022665B (en) | 2012-12-21 | 2012-12-21 | Three-dimensional integration surface antenna of impedance calibration |
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| CN103022665A true CN103022665A (en) | 2013-04-03 |
| CN103022665B CN103022665B (en) | 2014-10-29 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2764757A (en) * | 1946-03-19 | 1956-09-25 | Rca Corp | Metallic lens antennas |
| CN101026263B (en) * | 2006-02-22 | 2011-06-15 | 南京理工大学 | Substrate integrated waveguide small-sized prism type horn antenna |
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2012
- 2012-12-21 CN CN201210562297.1A patent/CN103022665B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2764757A (en) * | 1946-03-19 | 1956-09-25 | Rca Corp | Metallic lens antennas |
| CN101026263B (en) * | 2006-02-22 | 2011-06-15 | 南京理工大学 | Substrate integrated waveguide small-sized prism type horn antenna |
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| CN103022665B (en) | 2014-10-29 |
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