CN103011054B - 机电换能器的制造方法 - Google Patents

机电换能器的制造方法 Download PDF

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Publication number
CN103011054B
CN103011054B CN201210344319.7A CN201210344319A CN103011054B CN 103011054 B CN103011054 B CN 103011054B CN 201210344319 A CN201210344319 A CN 201210344319A CN 103011054 B CN103011054 B CN 103011054B
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CN
China
Prior art keywords
substrate
silicon substrate
partition wall
insulating layer
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210344319.7A
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English (en)
Chinese (zh)
Other versions
CN103011054A (zh
Inventor
加藤绫子
虎岛和敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN103011054A publication Critical patent/CN103011054A/zh
Application granted granted Critical
Publication of CN103011054B publication Critical patent/CN103011054B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0075—For improving wear resistance
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0221—Variable capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0369—Static structures characterized by their profile
    • B81B2203/0392—Static structures characterized by their profile profiles not provided for in B81B2203/0376 - B81B2203/0384
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Medical Informatics (AREA)
  • Computer Hardware Design (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Pressure Sensors (AREA)
CN201210344319.7A 2011-09-20 2012-09-17 机电换能器的制造方法 Expired - Fee Related CN103011054B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-204970 2011-09-20
JP2011204970A JP5896665B2 (ja) 2011-09-20 2011-09-20 電気機械変換装置の製造方法

Publications (2)

Publication Number Publication Date
CN103011054A CN103011054A (zh) 2013-04-03
CN103011054B true CN103011054B (zh) 2015-10-14

Family

ID=47022442

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210344319.7A Expired - Fee Related CN103011054B (zh) 2011-09-20 2012-09-17 机电换能器的制造方法

Country Status (5)

Country Link
US (1) US8518733B2 (https=)
EP (1) EP2572804A3 (https=)
JP (1) JP5896665B2 (https=)
KR (1) KR101473709B1 (https=)
CN (1) CN103011054B (https=)

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* Cited by examiner, † Cited by third party
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JP5511260B2 (ja) * 2009-08-19 2014-06-04 キヤノン株式会社 容量型電気機械変換装置、及びその感度調整方法
JP5479390B2 (ja) * 2011-03-07 2014-04-23 信越半導体株式会社 シリコンウェーハの製造方法
JP6381195B2 (ja) 2013-10-22 2018-08-29 キヤノン株式会社 静電容量型トランスデューサ及びその作製方法
CN107567427B (zh) * 2015-01-16 2019-09-20 法国巴黎大区工商业委员会 用于从机械振动产生电能的微型动能采集器
CN105036058B (zh) * 2015-05-27 2016-10-05 华南理工大学 集成化电容式微加工超声换能器及其制备方法
JP6606034B2 (ja) * 2016-08-24 2019-11-13 株式会社日立製作所 容量検出型超音波トランスデューサおよびそれを備えた超音波撮像装置
KR20220098075A (ko) 2021-01-02 2022-07-11 김동호 참여용 골인보드
CN114380271B (zh) * 2021-09-02 2025-07-01 苏州清听声学科技有限公司 一种定向发声屏绝缘凸点压印制作方法

Citations (3)

* Cited by examiner, † Cited by third party
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US7037746B1 (en) * 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
CN101238754A (zh) * 2005-10-18 2008-08-06 株式会社日立制作所 超声波换能器、超声波探头以及超声波摄像装置
CN102158794A (zh) * 2010-01-26 2011-08-17 佳能株式会社 电容型机电变换器

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JPH0462875A (ja) * 1990-06-25 1992-02-27 Seiko Instr Inc 半導体装置
AU5215099A (en) * 1998-07-07 2000-01-24 Goodyear Tire And Rubber Company, The Method of fabricating silicon capacitive sensor
US6958255B2 (en) 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
JP4347885B2 (ja) 2004-06-03 2009-10-21 オリンパス株式会社 静電容量型超音波振動子の製造方法、当該製造方法によって製造された静電容量型超音波振動子を備えた超音波内視鏡装置、静電容量型超音波プローブおよび静電容量型超音波振動子
TWI268183B (en) * 2005-10-28 2006-12-11 Ind Tech Res Inst Capacitive ultrasonic transducer and method of fabricating the same
US7745248B2 (en) * 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
KR100977826B1 (ko) 2007-11-27 2010-08-27 한국전자통신연구원 멤스 마이크로폰 및 그 제조 방법
JP2010004199A (ja) * 2008-06-19 2010-01-07 Hitachi Ltd 超音波トランスデューサおよびその製造方法
JP5350092B2 (ja) * 2008-06-24 2013-11-27 キヤノン株式会社 機械電気変換素子及び機械電気変換装置の製造方法
JP5594986B2 (ja) 2008-06-24 2014-09-24 キヤノン株式会社 機械電気変換素子及び機械電気変換装置の製造方法
US20100173437A1 (en) * 2008-10-21 2010-07-08 Wygant Ira O Method of fabricating CMUTs that generate low-frequency and high-intensity ultrasound
KR101150186B1 (ko) 2009-12-04 2012-05-25 주식회사 비에스이 멤스 마이크로폰 및 그 제조방법
WO2011094393A1 (en) * 2010-01-29 2011-08-04 Research Triangle Institute Methods for forming piezoelectric ultrasonic transducers, and associated apparatuses
JP5677016B2 (ja) * 2010-10-15 2015-02-25 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5921079B2 (ja) * 2011-04-06 2016-05-24 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5812660B2 (ja) 2011-04-19 2015-11-17 キヤノン株式会社 電気機械変換装置及びその製造方法
JP5751026B2 (ja) * 2011-05-31 2015-07-22 セイコーエプソン株式会社 超音波トランスデューサー、生体センサー、及び超音波トランスデューサーの製造方法
KR101761819B1 (ko) * 2011-08-24 2017-07-26 삼성전자주식회사 초음파 변환기 및 그 제조 방법
JP2013051459A (ja) * 2011-08-30 2013-03-14 Canon Inc 電気機械変換装置及びその製造方法
JP5834657B2 (ja) * 2011-09-12 2015-12-24 セイコーエプソン株式会社 超音波プローブおよび超音波画像診断装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7037746B1 (en) * 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
CN101238754A (zh) * 2005-10-18 2008-08-06 株式会社日立制作所 超声波换能器、超声波探头以及超声波摄像装置
CN102158794A (zh) * 2010-01-26 2011-08-17 佳能株式会社 电容型机电变换器

Also Published As

Publication number Publication date
EP2572804A2 (en) 2013-03-27
KR101473709B1 (ko) 2014-12-17
CN103011054A (zh) 2013-04-03
US8518733B2 (en) 2013-08-27
EP2572804A3 (en) 2017-12-27
US20130071964A1 (en) 2013-03-21
JP2013070112A (ja) 2013-04-18
KR20130031206A (ko) 2013-03-28
JP5896665B2 (ja) 2016-03-30

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Granted publication date: 20151014

Termination date: 20210917