CN102983061A - Wet process etching device and method using stirring rod to disturb carrier edge - Google Patents
Wet process etching device and method using stirring rod to disturb carrier edge Download PDFInfo
- Publication number
- CN102983061A CN102983061A CN2012103192076A CN201210319207A CN102983061A CN 102983061 A CN102983061 A CN 102983061A CN 2012103192076 A CN2012103192076 A CN 2012103192076A CN 201210319207 A CN201210319207 A CN 201210319207A CN 102983061 A CN102983061 A CN 102983061A
- Authority
- CN
- China
- Prior art keywords
- splash bar
- wet process
- carrier
- disturbance
- carrier edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000003756 stirring Methods 0.000 title claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 10
- 239000007795 chemical reaction product Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000376 reactant Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Abstract
A wet process etching device for disturbing the edge of a carrier by a stirring rod comprises a wet process etching tank, wherein etching liquid and the carrier are arranged in the wet process etching tank, the carrier is provided with a plurality of grooves, and workpieces are placed in the grooves. The etching device is characterized by further comprising two stirring rod groups, wherein the two stirring rod groups are respectively arranged on two sides of the carrier, each stirring rod group is provided with at least one stirring rod, and the stirring rods are driven by a driving mechanism and are used for stirring the etching solution. Therefore, the stirring rod is used for reciprocating stirring to generate micro vibration, the etching uniformity is improved, and the yield is improved.
Description
Technical field
The present invention relates to a kind of wet process engraving method and device, relate in particular to a kind of wet process engraving method and device with splash bar disturbance carrier edge.
Background technology
Generally when carrying out Wet-type etching, at first reactant utilizes diffusion effect, by the diffusion boundary layer of thin layer, to arrive etched film surface.Then, these reactants will produce chemical reaction with the molecule of film surface, and generate various reaction products.These are positioned at the reaction product of film surface, also will utilize diffusion effect, arrive in the solution by diffusion boundary layer, then along with solution is discharged.In order to increase diffusion effect, the splash bar that utilizes magnet to drive the etching bath bottom is arranged with the stirring etching solution, but this kind mode only can be stirred the etching solution of lower floor, for the etching of large-area glass or wafer, the groove (Slot) that also can not arrive carrier is located, and can form the dead angle.Authorize the 6th, 054, No. 162 a kind of method and devices that stir etching solution of instruction of United States Patent (USP) of the people such as Jellrey C.Calio, emit bubble in the etching bath bottom, stirring etching solution, but still the groove (Slot) that can not stir carrier locates, and also can form the dead angle.
Summary of the invention
Technical problem to be solved by this invention just provides a kind of wet process Etaching device and method with splash bar disturbance carrier edge, utilizes the reciprocating type stirring of splash bar to produce microvibration, improves the etching uniformity, and promotes yield.
The present invention provides a kind of wet process Etaching device and method with splash bar disturbance carrier edge in addition, to get rid of the dead angle, flow field of carrier groove, improves the etching uniformity, and then promotes yield.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: a kind of wet process Etaching device with splash bar disturbance carrier edge, comprise the wet process etching bath, be provided with etching solution and carrier in the described wet process etching bath, described carrier is provided with a plurality of grooves, described groove is put workpiece, it is characterized in that, also comprise two splash bar groups, described two splash bar groups are arranged at respectively the both sides of described carrier, each splash bar group respectively has at least one splash bar, and described splash bar is driven by driving mechanism, is used for the described etching solution of disturbance.
As preferably, the splash bar of described splash bar group is set to one or branched.
As preferably, the splash bar of described splash bar group is formed with wide and narrow section.
As preferably, the driving mechanism of described splash bar group connects connecting rod by motor and forms.
As preferably, the driving mechanism of described splash bar group connects connecting rod by pneumatic cylinder and forms.
As the preferred scheme of another kind: a kind of wet process engraving method with splash bar disturbance carrier edge comprises that step is as follows: workpiece is placed in the groove of carrier; Be provided with in the wet process etching bath of etching solution in the carrier that is equipped with described workpiece is positioned over; And the splash bar that will be arranged at described year ambilateral two splash bar groups drives with driving mechanism, is used for the described etching solution of disturbance.
As preferably, described two splash bar groups in the same way or reverse movement.
As preferably, the stirring frequency of the splash bar of described splash bar group is per minute 5 to 20 times.
As preferably, the splash bar of described splash bar group is set to one or branched.
As preferably, the splash bar of described splash bar group is formed with wide and narrow section.
The present invention has following useful effect:
The present invention utilizes the reciprocating type stirring of splash bar, can the disturbance etching solution produce the both sides that the ripples of different directions promote workpiece, make it forward on one side, prop up backward groove on one side, make workpiece produce microvibration (Micro-vibration), can can access uniform etching solution distribution so that be positioned at each workpiece of carrier (Cassette), especially at the groove of fixation workpiece, for etching solution is difficult for being diffused into the dead angle that reaches most, use the reciprocating type stirring of splash bar, can improve the etching uniformity of workpiece.
Via the shape of adjusting further stirring frequency and splash bar, quantity and position, more can get rid of the dead angle, flow field of carrier groove, effectively reduce diffusion boundary layer thickness, and then improve the etching uniformity of workpiece.
For enabling further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, the present invention is limited.
Description of drawings
Fig. 1 is the schematic diagram of the diffusion term shelf theory of Wet-type etching of the present invention.
Fig. 2 is that the embodiment of the invention is with the schematic diagram of the wet process Etaching device of splash bar disturbance carrier edge.
Fig. 3 is the schematic diagram of another embodiment of the present invention splash bar.
Fig. 4 is the embodiment of the invention forms ripples with splash bar disturbance carrier edge schematic diagram.
Fig. 5 is the schematic diagram of the reverse disturbance of splash bar of the present invention.
Wherein, description of reference numerals is as follows:
1 wet process etching bath
2 splash bar groups
21 splash bars
211 narrow sections
212 wide sections
22 driving mechanisms
221 connecting rods
222 pneumatic cylinders
3 carriers
31 grooves
4 workpiece
The A ripples
The B ripples
The a reactant
The b diffusion boundary layer
The c film
The d reaction product
Embodiment
See also Fig. 1, when carrying out Wet-type etching, at first reactant a utilizes diffusion effect, by the diffusion boundary layer b of thin layer, to arrive etched film c surface.Then these reactants a will produce chemical reaction with the molecule on film c surface, and generate various reaction product d.The reaction product d that these are positioned at film c surface also will utilize diffusion effect, arrive in the solution by diffusion boundary layer b, then along with solution is discharged.Formula as can be known according to the mass transport (Mass Transfer) of fluid, equipment uses the Paddle agitating mode, to increase the value of W (vibration frequency or angular frequency), can reduce diffusion boundary layer thickness (δ), and then improve diffusion rate and final etch-rate.Wherein D is diffusion constant, and V is viscosity (Kinetic Viscosity).
Thickness of diffusion layer δ=1.61D
1/3V
1/6(w)
-1/2
See also Fig. 2, the invention provides a kind of wet process Etaching device with splash bar disturbance carrier edge, comprise wet process etching bath 1 and two splash bar groups 2, be provided with etching solution (figure slightly) in the described wet process etching bath 1, the material of etching solution does not limit.Described wet process etching bath 1 interior middle place is provided with carrier 3, and described carrier 3 is provided with a plurality of grooves 31, and described groove 31 can need etched workpiece 4 in order to put, and the structure of carrier 3 is existing technology, so do not given unnecessary details.Described workpiece 4 can be glass or wafer etc.
Described two splash bar groups 2 are arranged at respectively the both sides of described carrier 3, and described two splash bar groups 2 are positioned at wet process etching bath 1, and two splash bar groups 2 are arranged at respectively left side and the right side of described carrier 3 as shown in Figure 2.Each splash bar group 2 respectively has at least one splash bar 21, and the shape of splash bar 21 does not limit, and can be the body of rod of straight shape, also can be the body of rod of meander-like, and the shape of splash bar 21 can change in response to elasticity of demand ground.Described splash bar 21 is driven with driving mechanism 22, and the structure of driving mechanism 22 does not also limit, and such as being comprised of connection connecting rods such as motor or pneumatic cylinders, the driving mechanism 22 that present embodiment discloses connects connecting rod 221 by pneumatic cylinder 222 and forms.Can utilize 21 1 groups of splash bars that driving mechanism 22 drives two splash bar groups 2 forward, one group back and forth stir backward etching solution.The direction that the splash bar 21 of two splash bar groups 2 moves does not limit, the splash bar 21 of two splash bar groups 2 can be in the same way or reverse movement, for example the splash bar 21 of two splash bar groups 2 can one group forward, one group of movement backward, also can two groups simultaneously forward or backward movements, the movement that the splash bar 21 of two splash bar groups 2 is reverse, the effect of disturbance is stronger.The speed that the splash bar 21 of two splash bar groups 2 moves and direction all can flexibly be adjusted in response to difference needs.
The splash bar 21 of each splash bar group 2 can be set to one, two or branched, and the quantity of splash bar 21 does not limit, but can not be too much, otherwise the meeting stroke is not enough, and the disturbance power is too little, and two splash bar groups 2 respectively are provided with a splash bar 21 as shown in Figure 2.The stirring frequency of the splash bar 21 of described splash bar group 2 is per minute 5 to 20 times.As shown in Figure 3, splash bar 21 also can form the width that does not wait, part is wider, part is narrower, that is each splash bar 21 is formed with narrow 211 and wide 212, makes splash bar 21 can produce different disturbance effects, and wide 212 resistance is large, the disturbance effect is large, narrow 211 resistance is little, the disturbance effect is little, in order to flexibly adjust the width size of splash bar 21 in response to the different demands of workpiece 4.
The present invention carries a kind of wet process engraving method with splash bar disturbance carrier edge in addition, comprises that step is as follows:
Be provided with in the wet process etching bath 1 of etching solution in the described carrier 3 that is equipped with workpiece 4 is positioned over; And
The splash bar 21 that is arranged at two splash bar groups 2 of described carrier 3 both sides is driven by driving mechanism 22, be used for the described etching solution of disturbance.
See also Fig. 4, the groove 31 of carrier 3 can be put needs etched workpiece 4(such as glass or wafer), the splash bar 21 of splash bar group 2 that wherein is positioned at the left side promotes forward etching solution and forms ripples A, and then the left side that promotes workpiece 4 moves forward, and makes etching solution arrive workpiece 4 surfaces in the groove 31.On the contrary, the splash bar 21 that is positioned at the splash bar group 2 on right side promotes backward etching solution and forms ripples B, and then the right side of promotion workpiece 4 is mobile backward, makes workpiece 4 surfaces in the etching solution arrival groove 31.Thereby can effectively reduce diffusion boundary layer thickness, and etching solution is entered be difficult for most being diffused into the dead angle that reaches in the groove 31, and then improve the etching uniformity of workpiece 4.
See also Fig. 5, splash bar 21 moving directions of two splash bar groups 2 are with shown in Figure 4 opposite, the splash bar 21 that wherein is positioned at the splash bar group 2 in left side promotes backward etching solution and forms ripples A, and then the left side of promotion workpiece 4 is mobile backward, makes workpiece 4 surfaces in the etching solution arrival groove 31.On the contrary, the splash bar 21 that is positioned at the splash bar group 2 on right side promotes forward etching solution and forms ripples B, and then the right side that promotes workpiece 4 moves forward, and makes etching solution arrive workpiece 4 surfaces in the groove 31.So repeatedly disturbance is to improve the etching uniformity of workpiece 4.
The present invention utilizes the reciprocating type stirring of splash bar, can the disturbance etching solution produce the both sides that the ripples of different directions promote workpiece, make it forward on one side, prop up backward groove on one side, make workpiece produce microvibration, can access uniform etching solution distribution so that be positioned at each workpiece of carrier, especially at the groove of fixation workpiece, for etching solution is difficult for being diffused into the dead angle that reaches most, use the reciprocating type stirring of splash bar, can improve the etching uniformity of workpiece.
The above only is preferred embodiment of the present invention, non-ly is intended to limit to claim scope of the present invention, so the equivalence of such as using specification of the present invention and accompanying drawing content to do changes, all in like manner all is contained in the claim scope of the present invention, closes and gives Chen Ming.
Claims (10)
1. wet process Etaching device with splash bar disturbance carrier edge, comprise the wet process etching bath, be provided with etching solution and carrier in the described wet process etching bath, described carrier is provided with a plurality of grooves, and described groove is put workpiece, it is characterized in that, also comprise two splash bar groups, described two splash bar groups are arranged at respectively the both sides of described carrier, and each described splash bar group respectively has at least one splash bar, described splash bar is driven by driving mechanism, is used for the described etching solution of disturbance.
2. the wet process Etaching device with splash bar disturbance carrier edge as claimed in claim 1 is characterized in that, the described splash bar of each described splash bar group is set to one or branched.
3. the wet process Etaching device with splash bar disturbance carrier edge as claimed in claim 1 is characterized in that, the described splash bar of each described splash bar group is formed with narrow and wide section.
4. the wet process Etaching device with splash bar disturbance carrier edge as claimed in claim 1 is characterized in that, the described driving mechanism of each described splash bar group connects connecting rod by motor and forms.
5. the wet process Etaching device with splash bar disturbance carrier edge as claimed in claim 1 is characterized in that, the described driving mechanism of each described splash bar group connects connecting rod by pneumatic cylinder and forms.
6. the wet process engraving method with splash bar disturbance carrier edge is characterized in that, comprises that step is as follows:
Workpiece is placed in the groove of carrier;
Be provided with in the wet process etching bath of etching solution in the described carrier that is equipped with described workpiece is positioned over; And
The splash bar that is arranged at described year ambilateral two splash bar groups is driven with driving mechanism, be used for the described etching solution of disturbance.
7. the wet process engraving method with splash bar disturbance carrier edge as claimed in claim 6 is characterized in that, the described splash bar of described two splash bar groups moves in the same way or oppositely.
8. the wet process engraving method with splash bar disturbance carrier edge as claimed in claim 6 is characterized in that, the stirring frequency of the described splash bar of each described splash bar group is per minute 5 to 20 times.
9. the wet process engraving method with splash bar disturbance carrier edge as claimed in claim 6 is characterized in that, the described splash bar of each described splash bar group is set to one or branched.
10. the wet process engraving method with splash bar disturbance carrier edge as claimed in claim 6 is characterized in that, the described splash bar of each described splash bar group is formed with narrow and wide section.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100131996A TWI418655B (en) | 2011-09-06 | 2011-09-06 | Wet bench sidewall paddle agitation method and apparatus |
| TW100131996 | 2011-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102983061A true CN102983061A (en) | 2013-03-20 |
Family
ID=47856951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103192076A Pending CN102983061A (en) | 2011-09-06 | 2012-08-31 | Wet process etching device and method using stirring rod to disturb carrier edge |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102983061A (en) |
| TW (1) | TWI418655B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200413087A (en) * | 2003-01-20 | 2004-08-01 | Taiwan Semiconductor Mfg | System and method of homogeneous fluid mixing |
| US20070151844A1 (en) * | 2005-11-23 | 2007-07-05 | Semitool, Inc. | Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces |
| CN101247700A (en) * | 2007-02-16 | 2008-08-20 | 和旺昌喷雾股份有限公司 | Stirring type wet process machine and stirring type wet process |
| JP2008192766A (en) * | 2007-02-02 | 2008-08-21 | Sharp Corp | Wet etching apparatus |
-
2011
- 2011-09-06 TW TW100131996A patent/TWI418655B/en active
-
2012
- 2012-08-31 CN CN2012103192076A patent/CN102983061A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200413087A (en) * | 2003-01-20 | 2004-08-01 | Taiwan Semiconductor Mfg | System and method of homogeneous fluid mixing |
| US20070151844A1 (en) * | 2005-11-23 | 2007-07-05 | Semitool, Inc. | Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces |
| JP2008192766A (en) * | 2007-02-02 | 2008-08-21 | Sharp Corp | Wet etching apparatus |
| CN101247700A (en) * | 2007-02-16 | 2008-08-20 | 和旺昌喷雾股份有限公司 | Stirring type wet process machine and stirring type wet process |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201311932A (en) | 2013-03-16 |
| TWI418655B (en) | 2013-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1674217A (en) | Processing apparatus | |
| CN108441417A (en) | Bacterial clump picking instrument | |
| KR101068113B1 (en) | Apparatus for etching a glass substrate | |
| CN102134552B (en) | Nucleic acid hybridization method and nucleic acid hybridization instrument utilizing same | |
| CN103774147A (en) | Etching method and etching device with nozzle group reciprocating in etching region | |
| CN202011219U (en) | Digital printing machine and digital printing system | |
| CN201728201U (en) | Base plate cleaning device | |
| CN102315092B (en) | Wet etching apparatus and method thereof | |
| CN201915086U (en) | Nucleic acid hybridization oven | |
| CN102983061A (en) | Wet process etching device and method using stirring rod to disturb carrier edge | |
| TWI473904B (en) | Method for homogeneous reacting of chemical liquid and substrate surface and apparatus thereof | |
| CN114177860A (en) | Efficient pharmaceutical reaction kettle stirring equipment and use method thereof | |
| CN103731996A (en) | Etching method and device for workpiece conducting reciprocating motion in etching region | |
| CN109571218A (en) | Grinding agent sprays control structure, work piece cut system and spraying method | |
| CN106974059B (en) | Ice cream 3D printer | |
| CN204320728U (en) | There is the experiment semiconductor cleaning apparatus of agitating function | |
| CN209790403U (en) | pharmaceutical preparation 3D printer | |
| JP5388635B2 (en) | High pressure cleaning liquid jet cleaning system | |
| CN103010747B (en) | Transmit integrating apparatus and transfer approach thereof | |
| CN107774223B (en) | Mixing reactor | |
| CN214781507U (en) | Spray swinging device and etching system | |
| CN207002225U (en) | A kind of efficiently quick liquid filling device | |
| CN200954491Y (en) | Two-side spraying-disc type uniform low liquid-feeding machine | |
| CN209292507U (en) | A kind of plating line anode and cathode three-dimensional moving device | |
| CN205849318U (en) | Household mixer rod |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130320 |