CN101247700A - Stirring type wet process machine and stirring type wet process - Google Patents
Stirring type wet process machine and stirring type wet process Download PDFInfo
- Publication number
- CN101247700A CN101247700A CNA2007100788471A CN200710078847A CN101247700A CN 101247700 A CN101247700 A CN 101247700A CN A2007100788471 A CNA2007100788471 A CN A2007100788471A CN 200710078847 A CN200710078847 A CN 200710078847A CN 101247700 A CN101247700 A CN 101247700A
- Authority
- CN
- China
- Prior art keywords
- wet process
- chemical agent
- processed
- roller
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses an agitation type wet process machine station and an agitation type wet process, therein, the agitation type wet process machine station comprises a conveying system and a plurality of nozzles. The conveying system comprises a plurality of idler wheels, the idler wheels are located on upside and downside of said conveying system conveying path, the idler wheels between upside and downside are used for driving plate shape object to be processed. The idler wheel added with vane can agitate chemical agent. The nozzle is located on upside or downside of the conveying path for spraying or supplementing chemical agent to object that is to be processed.
Description
Technical field
The present invention relates to a kind of board, particularly a kind of stirring formula wet process board and the formula of stirring wet process.
Background technology
In recent years and since science and technology progress advance by leaps and bounds and the modern to the height requirement of product portability, make compact portable electronic product become currently marketed main flow.Because the electronic product volume-diminished, but the volume of containment circuit board makes the design of circuit board and development also begin towards the littler high density circuit board development of volume also along with dwindling in the product.
The live width of general circuit plate and the spacing of lead are about 4～6mil. (1mil.=0.025mm), and the live width of high density circuit board and spacing are then about 1mil..Because the live width of high density circuit board and gap ratio general circuit plate are narrow, thus its to the requirement of process parameter than the strictness of general circuit plate.
In circuit board process, development and etch process have critical influence to the live width and the spacing of circuit board.But in present development and etching, but exist very serious " water stagnates " problem, make the live width of circuit board and spacing to reach and meet required live width of high density circuit board and spacing.
Summary of the invention
Therefore one of purpose of the present invention is, a kind of stirring formula wet process and board thereof are provided.This wet process board can be eliminated " water stagnates " problem in the wet process, comprises the quality of developing and being etched in interior wet process with lifting.
According to above-mentioned purpose of the present invention, a kind of stirring formula wet process board is proposed, comprise conveying system and a plurality of nozzle.Conveying system more comprises a plurality of rollers.Described roller is positioned at the upside and the downside of transporting path, and the upper and lower faces that the roller of the upper and lower side of rotating by being subjected to power drive is contacted with thing to be processed respectively drives thing to be processed; On roller, have blade, be used to stir chemical agent, and have a gap between blade and the thing to be processed surface.Nozzle be positioned at described transport path above or below, be used for spraying or additional chemical agent in thing to be processed.Nozzle also can be positioned on the roller except between roller.
According to above-mentioned purpose of the present invention, a kind of stirring formula wet process is proposed, this stirring formula wet process uses above-mentioned process work bench.At first, carry a plurality of things to be processed under a plurality of nozzles.Afterwards, spray chemical agent with these things to be processed of etching.Stir chemical agent at last to promote etching efficiency.
From the above, stirring formula wet process board of the present invention adds blade on roller.When roller rotates, drive blade, finished chemical agent can be taken out of, and fresh chemical agent is brought into.Except having overcome " water stagnates " phenomenon that the roller zone often has, also promote the quality and the efficient of processing.Simultaneously, by the adjustment in the gap on lobe numbers, shape, blade and thing to be processed surface and the position of nozzle, the specific demand in the time of more can satisfying different processing procedure.In addition, the present invention makes outside the precision to promote it except can be applicable to development and the wet etching processing procedure in the circuit board process, more can be applicable on other chemical processing procedure that need effectively improve processing procedure precision.
Description of drawings
Fig. 1 is the structure chart of copper clad laminate;
Fig. 2 is the oblique angle vertical view of traditional wet process board;
Fig. 3 is traditional wet process board, its chemical agent discharge path schematic diagram;
Fig. 4 is the oblique angle vertical view according to the stirring formula wet process board of a preferred embodiment of the present invention;
Fig. 5 is the schematic diagram of roller start of the present invention;
Fig. 6 is the roller structure figure according to a preferred embodiment of the present invention;
Fig. 7 is the roller structure figure according to another preferred embodiment of the present invention.
Wherein, Reference numeral:
100 dielectric layers, 200 copper sheets
110,210 conveying systems, 112,212 circuit boards
114 rollers, 120,220 nozzles
130,230 chemical agents, 216 rollers
218 blades
Embodiment
Below will notion of the present invention is described, but the present invention not limit to the processing procedure that is used for circuit board with the processing procedure of circuit board as example.In fact, because the progress and the development of science and technology in recent years, wet process is from being applied to circuit board in early days, stride the field of foot to other industries, now, no matter be in the manufacturing of semiconductor, LCD or electric slurry display panel, all can see the example of wet process successful Application on these industries.Therefore, the present invention also can be applied on above-mentioned these industries, to promote the processing procedure quality of these industries.
The manufacturing of circuit board is made type according to it and can be divided into machining, wet process and image transfer three major types.Wherein wet process mainly is meant the processing procedure that relates to chemical agent in processing procedure.Wet process comprises that plating, development, etching, stripping, cleaning, degreasing, ultrasonic waves are cleaned, de-smear and chemical roughen etc.Wherein, especially with develop and these two processing procedures of etching to the live width of circuit board and having the greatest impact of spacing.And the present invention to produce outside the highdensity circuit board, can also improve the quality of other relevant wet process except promoting the quality of development and etch process.
Figure 1 shows that the structure chart of copper clad laminate, circuit board mainly is to utilize to develop and be etched in to produce required circuit on the copper clad laminate.Among the figure, copper clad laminate comprises dielectric layer 100 and is positioned at the copper sheet 200 of both sides.Dielectric layer 100 is made of resin and glass fibre.The thickness of copper sheet 200 has multiple thickness such as 5 μ m, 9 μ m, 12 μ m, 18 μ m, 35 μ m, 50 μ m and 70 μ m.General thickness commonly used is 35 μ m.
In circuit board process, can on the copper sheet of copper clad laminate, form one deck eurymeric or minus photoresistance earlier, via exposure manufacture process with predefined design transfer on the light shield to photoresistance, again via the non-exposed area territory dissolving of developing manufacture process with the exposure area of eurymeric photoresistance or minus photoresistance.Afterwards, in etch process, the copper sheet of no photoresistance cover part is etched away, form circuit.At last, via the striping processing procedure photoresistance on the circuit is removed again.
In above-mentioned processing procedure, development and etch process are being played the part of critical role.Good development and etching can form circuit with on the accurate copper sheet of transferring to copper clad laminate of each trickle feature in the predetermined circuit pattern.Therefore, the circuit board to circuit line width and spacing are had relatively high expectations as high density circuit board, often also needs to develop preferably and etching technique.But in present wet process, but extensively exist very serious " water stagnates " problem, have influence on the quality of etching and development, make the live width of circuit board and spacing to reach and meet required live width of high density circuit board and spacing.
Below will be with description of drawings " water stagnates " problem.Fig. 2 is shown as the oblique angle vertical view of traditional wet process board.At the wet process board of Fig. 2, comprise conveying system 110 and a plurality of nozzle 120.Conveying system 110 is used for carrying circuit board to be processed.Nozzle 120 is used for spraying the required chemical agent 130 of processing, and in development and etch process, chemical agent 130 herein is generally developer solution and etching solution.Conveying system 110 among the figure can comprise a plurality of rollers 114.Roller 114 is positioned at the upside and the downside of the transport path of conveying system 110, is used to drive circuit board 112 between the roller 114 of upper and lower side, circuit board is sent to the below of nozzle 120.The chemical agent 130 of nozzle 120 ejection high pressure is on circuit board.Utilize the physical impact power that high pressure causes and the reactivity of 130 pairs of circuit boards of chemical agent that circuit board is processed, for example develop and etching.Because the relation of nozzle 120 ejection pressure, therefore, chemical agent 130 also has very big a part of chemical agent 130 to enter roller 114 regions of circuit board front and back except being sprayed on the circuit board.Push effect because the front and back nozzle forms, surface tension of liquid and the roller formed obstacle that is staggered is so the chemical agent 130 in this zone is not easy to flow.Thereby, gathered the quite chemical agent 130 of height in this zone, the accumulation phenomena of this chemical agent is commonly referred to as " water stagnates " phenomenon.
As shown in Figure 3, accumulating in this regional chemical agent 130 can be discharged by circuit board 112 both sides.But can cause the flow velocity of the chemical agent 130 in the middle of being positioned at different like this with the flow velocity that is positioned at both sides, chemical agent 130 in the middle of being positioned at is because the obstruction of roller 114 makes flow velocity slow than the flow velocity of both sides, thereby cause circuit board in the middle of being positioned to develop or etching not enough, and the circuit board that is positioned at both sides develops or etching is excessive.Overcame the method for this problem, be that the orientation of board jet pipe is identical with the direction of conveying in the past, and the pressure of the jet pipe in the middle of being positioned at is higher than the jet pipe of both sides.Improving the reaction rate of zone line chemical agent, crossing the compensating action (Offset) of erosion phenomenon as both sides, this mode be to can effectively solving more than the live width 2mil. by the difference of jet pipe ejection pressure, but to reaching below the live width 2mil..Just can't overcome the stagnant phenomenon of the following water of live width 2mil..Therefore, the angle of the quality transmission (Mass Transfer) of the present invention from Chemical Engineering proposes one and stirs formula wet process board.This stirring formula wet process board installs blade additional on roller, with the speed of increase chemical agent circulation, and by number, shape and the blade of adjusting the roller blade and the clearance distance of thing to be processed, further adjust the uniformity of chemical reaction rate.So, can not only eliminate " water stagnates " problem, also can promote and develop and etched quality and efficient.
Fig. 4 is shown as the oblique angle vertical view according to the stirring formula wet process board of a preferred embodiment of the present invention.In Fig. 4, stir formula wet process board and comprise conveying system 210 and a plurality of nozzle 220.Conveying system 210 comprises a plurality of rollers 216, has blade on the roller 216, so it can also stir chemical agent 230 except the function with aforementioned drive circuit board 212, promotes the flow velocity that is positioned at circuit board zone line chemical agent 230.So can eliminate " water stagnates " phenomenon of the chemical agent 230 flow velocity inequalities that are positioned at middle chemical agent 230 and are positioned at both sides, promote and develop and etched quality, make the live width and the spacing of final products circuit board can be lower than 2mil, reach the desired specification of high density circuit board.
In addition, traditional board as shown in Figure 2 can't set up nozzle 120 above roller 114.Because roller 114 can cause chemical agent 130 impulsive force inequalities, have influence on the quality of processing.But stirring formula wet process board of the present invention can optionally set up the nozzle of wide-angle, low-pressure and big flow above roller.This nozzle can provide fresh chemical agent to promote the efficient of processing.
Fig. 5 is according to the schematic diagram of the roller start of a preferred embodiment of the present invention.When roller 216 was rotating, the blade 218 of roller 216 can effectively be taken finished chemical agent 230 out of, allows new chemical agent 230 can enter the processing conversion zone.
Below will further specify the influence that the roller start is flowed to chemical agent with quality equation of transfer formula.The chemical agent that promoted by blade can be considered as channel flow (Open Channel Flow), below is the quality equation of transfer formula of chemical agent:
Sh
AB=0.027Re
0.8Sc1/3 (turbulent flow) ... formula (1)
In formula (1)-(4), kc is that matter passes coefficient, and De is an equivalent diameter, D
ABBe diffusion coefficient, ub is a mean flow rate, and ρ is a fluid density, and μ is the liquid coefficient of viscosity.Roller is when rotating, and the blade on it can stir chemical agent, and the axial velocity of chemical agent is increased.According to formula (3) and formula (2), liquid mean flow rate (ub) increases, and the Reynolds number is increased, and following the Sherwood number also can increase.Therefore, matter passes coefficient (kc) increases.
N
A=k
c(C
A ∞-C
A *) ... ... ... ... .. formula (5)
In formula (5), N
ABe matter biography amount, C
A ∞Be the concentration of liquid in full phase (Bulk Phase), C
A *Be the concentration of liquid at the desire machined surface.By showing in the formula (5), matter passes the increase (kc) of coefficient, makes matter biography amount N
AIncrease.Therefore, the surface of the easier arrival of the active ingredient in chemical agent thing to be processed increases the efficient of chemical agent processing.
Fig. 6 is the roller structure figure according to one embodiment of the invention.In preferred embodiment, the number of roller 216 blades 218 is six, and the external form of blade 218 is a vertical type, has certain interval between roller blade and thing to be processed surface.But at other embodiment, blade also can increase the number of its blade, the external form that changes blade and the distance of blade and thing surface gap to be processed according to actual needs, makes the quality of processing procedure reach preferableization.Be illustrated in figure 7 as roller 216 structure charts according to another preferred embodiment of the present invention.Among Fig. 7, the blade 218 of roller is designed to arc, to increase the ability of stirring chemical agent.
Also say so, stirring formula wet process board equipment of the present invention, except on roller, installing blade additional, make outside the quality transmission more rapidly of chemical agent, more applicable different process work bench, operating parameter below the change more than at least four kinds, reach impartial reaction rate, for example the live width or the spacing of circuit board are further dwindled, to meet the design specification of a new generation: (1) sets up the nozzle of wide-angle, low-pressure and big flow in addition above the roller of board, make that the chemical agent in the processing procedure is more evenly distributed; (2) lobe numbers on the change roller; (3) shape of the blade on the variation roller; (4) gap length on adjustment blade and thing to be processed surface.
By the invention described above preferred embodiment as can be known, use the present invention and have following advantage.
(1) " water stagnates " phenomenon be can eliminate, development and etched quality promoted to make highdensity circuit board.
(2) can increase the efficient that chemical agent is processed.
Though the present invention discloses as above by a preferred embodiment; but it is not to be used for limiting the present invention; for those skilled in the art; without departing from the spirit and scope of the present invention; when can doing various changes and retouching, so protection scope of the present invention is when with being as the criterion that claim was limited.
Claims (9)
1. one kind is stirred formula wet process board, it is characterized in that, comprises:
One conveying system, described conveying system comprise a plurality of rollers with blade, and described roller is positioned at the upside and the downside of described transporting path, are used to drive thing to be processed and stir a chemical agent; And
A plurality of nozzles, be positioned at described transport path above or below, be used for spraying or replenish described chemical agent in described thing to be processed.
2. wet process board as claimed in claim 1 is characterized in that, the number of blades of each described roller is six.
3. wet process board as claimed in claim 1 is characterized in that, described blade external form is a vertical type.
4. wet process board as claimed in claim 1 is characterized in that, described blade external form is an arc.
5. wet process board as claimed in claim 1 is characterized in that, has a gap between the surface of described blade and described thing to be processed.
6. wet process board as claimed in claim 1 is characterized in that, described nozzle is between the described roller or on the described roller.
7. one kind is stirred formula wet process board, it is characterized in that, comprises:
One conveying system, described conveying system comprises a plurality of rollers with blade, be positioned at the upside and the downside of described transporting path, be used to drive the thing to be processed on the described transport path and stir chemical agent, have a gap between the surface of described blade and described thing to be processed; And
A plurality of nozzles, be positioned at described transport path above or below, be used for replenishing described chemical agent in described thing to be processed.
8. wet process board as claimed in claim 7 is characterized in that, described nozzle is between the described roller or on the described roller.
9. one kind is stirred the formula wet process, it is characterized in that, uses wet process board as claimed in claim 1, comprises:
Carry a plurality of things to be processed under a plurality of nozzles;
Spray a chemical agent with the described thing to be processed of etching; And
Stir described chemical agent to promote etching efficiency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100788471A CN101247700A (en) | 2007-02-16 | 2007-02-16 | Stirring type wet process machine and stirring type wet process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100788471A CN101247700A (en) | 2007-02-16 | 2007-02-16 | Stirring type wet process machine and stirring type wet process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101247700A true CN101247700A (en) | 2008-08-20 |
Family
ID=39947821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100788471A Pending CN101247700A (en) | 2007-02-16 | 2007-02-16 | Stirring type wet process machine and stirring type wet process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101247700A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983061A (en) * | 2011-09-06 | 2013-03-20 | 弘塑科技股份有限公司 | Wet process etching device and method using stirring rod to disturb carrier edge |
-
2007
- 2007-02-16 CN CNA2007100788471A patent/CN101247700A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983061A (en) * | 2011-09-06 | 2013-03-20 | 弘塑科技股份有限公司 | Wet process etching device and method using stirring rod to disturb carrier edge |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100713235B1 (en) | Apparatus for treating surface of thin plate | |
| CN100390931C (en) | Substrate processing device and method, and pattern forming method | |
| CN102453915B (en) | Etching apparatus and method of applying same in etching substrate | |
| CN207340309U (en) | A kind of copper-clad plate Etaching device | |
| JP2008219043A (en) | Solution treatment apparatus and solution treatment method | |
| CN101155477A (en) | Liquid medicine processing device | |
| CN101247700A (en) | Stirring type wet process machine and stirring type wet process | |
| US6077359A (en) | Procedure and device for the chemical and electrolytic treatment of printed circuit boards and conductor films | |
| KR20160057956A (en) | Etching device | |
| KR200482351Y1 (en) | Apparatus for thin filming resist layer | |
| KR20140001903U (en) | Apparatus for thin filming resist layer | |
| CN115418640B (en) | Sheet metal surface etching treatment equipment | |
| TWI280218B (en) | Agitated machine for wet process | |
| JP2011023378A (en) | Surface treatment device of substrate material | |
| JP2011023379A (en) | Surface treatment device of substrate material | |
| JP4046697B2 (en) | Double-sided etching system | |
| JP2010199455A (en) | Surface treating apparatus for substrate material | |
| KR20210018401A (en) | Apparatus for thin filming resist layer | |
| KR20140004866U (en) | Apparatus for thin filming resist layer | |
| JP2008214690A (en) | Stirring type wet production process machine stand | |
| TW200528193A (en) | Processing device for substrate surface | |
| TWI834399B (en) | Developing device | |
| TWI345260B (en) | Resist elimination device | |
| JP7369227B2 (en) | developing device | |
| CN112198771A (en) | Developing etching spraying device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20080820 |
|
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |