CN102969397A - Flocking method for reducing flocking dark fringes of polycrystalline silicon - Google Patents

Flocking method for reducing flocking dark fringes of polycrystalline silicon Download PDF

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CN102969397A
CN102969397A CN2012104535798A CN201210453579A CN102969397A CN 102969397 A CN102969397 A CN 102969397A CN 2012104535798 A CN2012104535798 A CN 2012104535798A CN 201210453579 A CN201210453579 A CN 201210453579A CN 102969397 A CN102969397 A CN 102969397A
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flocking
wool
hno
polycrystalline silicon
cell piece
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王敬蕊
蔡晓晨
陈锐
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Guodian Technology & Environment Co Ltd
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Guodian Technology & Environment Co Ltd
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Abstract

The invention discloses a flocking method for reducing flocking dark fringes of polycrystalline silicon. The method includes that polycrystalline silicon is placed in a flocking tank containing corrosive liquids for flocking, the corrosive liquid comprise HNO3, HF and alleviators, the alleviators are 0.02-0.03wt% of NH4F deionized water solutions, and the volume ratio of the HNO3, the HF and the alleviators is 5:1:(0.02-0.03). Compared with prior flocking technologies, the technological operation is simple, and the good applicability of industrial general flocking technologies is provided; surface flocking dark fringes can be apparently reduced, and the reflectivity of diffusing surfaces after silicon flocking is reduced by 0.3% to 1.5%; and the thickness reduction is reduced by 0.03g/piece to 0.04g/piece, and the battery conversion efficiency is improved by 0.13% to 0.15%.

Description

A kind of etching method that reduces the dark line of polysilicon making herbs into wool
Technical field
The present invention relates to a kind of etching method of polysilicon solar cell, particularly relate to a kind of etching method that reduces the dark line of polysilicon making herbs into wool.
Background technology
In solar battery process, the silicon chip surface matte can effectively reduce the surface reflectivity of solar cell, and it is one of key factor that affects the solar cell transformation efficiency.Compare with monocrystalline silicon, polysilicon is because grain-oriented diversity, adopt the anisotropy rot etching technique of aqueous slkali can't obtain uniform matte, can not effectively reduce the reflectivity of polysilicon, thereby the acid corrosion of isotropic is the method that generally adopts in the present polysilicon solar cell industrial production.Pattern after the making herbs into wool of polycrystalline silicic acid is relevant with the prescription of reflectivity and process for etching and sour liquid.At present industrial quarters employing process for etching is to use HF-HNO in the etching groove 3Solution carries out acid corrosion to silicon chip and prepares matte.Etching mechanism is HNO 3As strong oxidizer, in reaction, provide reaction needed hole, form one deck SiO at silicon chip surface 2, this layer SiO then 2Generate complex compound with HF acid and be removed.Yet after the making herbs into wool of polycrystalline silicic acid, silicon chip surface all can have quantity and distribute random " dark line ", and naked eyes look to be exactly the black filament of mixed and disorderly bulk, are also referred to as " staple ".These significantly reductions of dark line district minority carrier life time, EL and QE respond variation, directly have influence on the electricity conversion of polycrystal silicon cell.Studies show that dark line district is formed by the corrosion of the low angle boundary in the polysilicon chip, the quality of silicon chip directly affects what and distribution of dark line.Yet the prescription of corrosive liquid and corrosion rate are also for the quantity of dark line be distributed with impact.Reduce HF-HNO 3The content of HF in the solution can effectively reduce the quantity of dark line.This be because, dark line is connected together by corrosion Wei Keng hole and forms, reduce the content of HF in the corrosive liquid and can control etch pit to the development of the inner depth direction of silicon chip, thereby can effectively reduce because reacting the too fast hole, microcorrosion hole that produces, reach the purpose that reduces dark line.But with the HF content, the chemical polishing effect of HNO3 strengthens, and suede corrosion hole size is more shallow, and the size change is large, and the matte reflectivity increases, thereby the polycrystal silicon cell electrical property descends.
Summary of the invention
The purpose of this invention is to provide a kind of etching method that reduces the dark line of polysilicon making herbs into wool, reduce the dark line quantity of polysilicon making herbs into wool matte, improve the electrical property of battery.
Technical scheme of the present invention is such: a kind of etching method that reduces the dark line of polysilicon making herbs into wool, comprise that polysilicon chip is put into the texturing slot that contains corrosive liquid carries out making herbs into wool, and it is characterized in that: described corrosive liquid comprises component HNO 3, HF and moderator, described moderator is the NH4F deionized water solution of 0.02~0.03wt%, described HNO 3, HF and NH 4The F liquor capacity is than being 5:1:(0.02~0.03).
Preferably, described moderator is the NH of 0.03wt% 4The F deionized water solution, described HNO 3, HF and NH4F liquor capacity be than being 5:1:0.02.
The advantage of technical scheme provided by the present invention is, by at HF-HNO 3Add NH in the corrosive liquid 4F under the prerequisite that does not change the making herbs into wool pattern, can effectively reduce corrosion rate as the buffer of HF, reduces the formation in corrosion Wei Keng hole, thereby reduces the dark line of making herbs into wool, improves the electrical property of battery.The present invention compares with existing process for etching, and technological operation is simple, and has good applicability with the industrial general process for etching; Can significantly reduce the dark line of surface wool manufacturing, the diffusingsurface reflectivity reduces by 0.3~1.5% behind the silicon wafer wool making; The attenuate amount reduces by 0.03~0.04g/ sheet, and cell conversion efficiency improves 0.13~0.15%.
Description of drawings
Fig. 1 is the cell piece EL typical figure that process for etching of the present invention makes;
Fig. 2 is the cell piece EL typical figure that the prior art process for etching makes;
Embodiment
The invention will be further described below in conjunction with embodiment, but not as a limitation of the invention.
The process for etching that cell piece 1~5 adopts: use chain type polysilicon etching device to carry out polysilicon making herbs into wool, the texturing slot that polysilicon chip is contained corrosive liquid kept 100 seconds, then in succession enter in the KOH groove and residual acid, and removal porous silicon, enter the HCl groove and remove the metallic contaminants from surface ion, enter the HF groove and obtain hydrophobic surface, enter at last the drying tank oven dry.Wherein cell piece 1,2 corrosive liquids that adopt comprise component HNO 3, HF and 0.02wt% NH 4The F deionized water solution, HNO 3, HF and NH 4The F liquor capacity is than being 5:1:0.02.Cell piece 3,4 corrosive liquids that adopt comprise component HNO 3, HF and 0.025wt% NH 4The F deionized water solution, HNO 3, HF and NH 4The F liquor capacity is than being 5:1:0.025.The corrosive liquid that cell piece 5 adopts comprises component HNO 3, HF and 0.03wt% NH 4The F deionized water solution, HNO 3, HF and NH 4The F liquor capacity is than being 5:1:0.03.
The existing process for etching that cell piece 6~10 adopts, namely step is with the process for etching of cell piece 1~5, and wherein corrosive liquid only comprises component HNO 3And HF, dose volume is than being 5:1.
The process for etching of comparison sheet 1, table 2 adding moderator and matte reflectivity and the making herbs into wool attenuate amount without the moderator process for etching: after adding moderator, diffusingsurface emissivity reflectivity reduces by 0.5%, non-diffusingsurface reflectivity reduces by 0.8%, the attenuate amount is reduced to the 0.43g/ sheet from the 0.47g/ sheet, has reduced the 0.04g/ sheet.After can finding out the adding moderator, when the reflectivity of silicon chip reduced, the attenuate amount also reduced, thereby had reduced the consumption of acid in the corrosive liquid, had reduced the making herbs into wool cost.
? Diffusingsurface reflectivity (%) Non-diffusingsurface reflectivity (%) Attenuate amount (g)
Cell piece 1 26.6 29.5 0.40
Cell piece 2 26.8 28.3 0.41
Cell piece 3 26.5 27.8 0.40
Cell piece 4 26.4 28.2 0.41
Cell piece 5 26.8 28.1 0.41
5 mean values 27.9 27.8 0.43
Table 1. cell piece 1~5 making herbs into wool back reflection rate and attenuate amount
? Diffusingsurface reflectivity (%) Non-diffusingsurface reflectivity (%) Attenuate amount (g)
Cell piece 6 29.1 28.5 0.49
Cell piece 7 29.0 28.7 0.48
Cell piece 8 29.0 28.2 0.47
Cell piece 9 28.9 28.7 0.47
Cell piece 10 29.0 28.8 0.48
5 mean values 28.4 28.6 0.47
Table 2. cell piece 6~10 making herbs into wool back reflection rates and attenuate amount
Cell piece 1~10 prepares solar battery sheet according to industrial polycrystal silicon cell technological process.Test EL collection of illustrative plates, and test unit for electrical property parameters can find out that from Fig. 1 and Fig. 2 the dark line quantity of cell piece that adopts the inventive method to make significantly reduces.Can find out that from the unit for electrical property parameters table of table 3 and table 4 battery efficiency on average improves 0.13%.
Figure BDA00002393670000031
Table 3. cell piece 1~5 electrical performance data
Figure BDA00002393670000032
Table 4. cell piece 6~10 electrical performance data

Claims (2)

1. an etching method that reduces the dark line of polysilicon making herbs into wool comprises that polysilicon chip is put into the texturing slot that contains corrosive liquid carries out making herbs into wool, and it is characterized in that: described corrosive liquid comprises component HNO 3, HF and moderator, described moderator is the NH of 0.02~0.03wt% 4The F deionized water solution, described HNO 3, HF and NH 4The F liquor capacity is than being 5:1:(0.02~0.03).
2. the etching method of the dark line of minimizing polysilicon making herbs into wool according to claim 1, it is characterized in that: described moderator is the NH of 0.03wt% 4The F deionized water solution, described HNO 3, HF and NH 4The F liquor capacity is than being 5:1:0.02.
CN2012104535798A 2012-11-13 2012-11-13 Flocking method for reducing flocking dark fringes of polycrystalline silicon Pending CN102969397A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105274626A (en) * 2015-10-10 2016-01-27 浙江晶科能源有限公司 Treatment liquid for optimizing black silicon surface structure and treatment method

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5587103A (en) * 1996-01-17 1996-12-24 Harris Corporation Composition, and method for using same, for etching metallic alloys from a substrate
DE102007061687A1 (en) * 2007-12-19 2009-06-25 Cpi Chemiepark Institut Gmbh Method for soft etching of silicon substrate using mineral acid mixture, which comprises mineral acid comprising sulfuric acid, nitric acid and hydrofluoric acid, water-binding agent and an added fluoride ion containing buffer
CN101717937A (en) * 2009-12-24 2010-06-02 浙江向日葵光能科技股份有限公司 Acid corrosion solution used for preparing monocrystalline silicon suede and use method thereof
CN102330091A (en) * 2011-07-27 2012-01-25 常州时创能源科技有限公司 Additive for polycrystalline silicon wafer acidity texture preparation liquid and use method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5587103A (en) * 1996-01-17 1996-12-24 Harris Corporation Composition, and method for using same, for etching metallic alloys from a substrate
DE102007061687A1 (en) * 2007-12-19 2009-06-25 Cpi Chemiepark Institut Gmbh Method for soft etching of silicon substrate using mineral acid mixture, which comprises mineral acid comprising sulfuric acid, nitric acid and hydrofluoric acid, water-binding agent and an added fluoride ion containing buffer
CN101717937A (en) * 2009-12-24 2010-06-02 浙江向日葵光能科技股份有限公司 Acid corrosion solution used for preparing monocrystalline silicon suede and use method thereof
CN102330091A (en) * 2011-07-27 2012-01-25 常州时创能源科技有限公司 Additive for polycrystalline silicon wafer acidity texture preparation liquid and use method thereof

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Title
徐华天: "多晶硅表面暗纹的形成以及消除技术研究", 《半导体光电》 *
王坤霞等: "表面钝化对多晶硅绒面形貌的影响", 《光子学报》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105274626A (en) * 2015-10-10 2016-01-27 浙江晶科能源有限公司 Treatment liquid for optimizing black silicon surface structure and treatment method

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Application publication date: 20130313