CN102956531B - The treatment system of treated object and the processing method of treated object - Google Patents
The treatment system of treated object and the processing method of treated object Download PDFInfo
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- CN102956531B CN102956531B CN201210286785.4A CN201210286785A CN102956531B CN 102956531 B CN102956531 B CN 102956531B CN 201210286785 A CN201210286785 A CN 201210286785A CN 102956531 B CN102956531 B CN 102956531B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a kind for the treatment of system of treated object and the processing method of treated object, the treatment system of this treated object possesses: incorporating section, storage treated object; Handling part, implements process to described treated object; Supporting part, has the maintaining part of the described treated object of multiple carrying in the stacking direction across the 1st interval; 1st conveying unit, carries out the conveyance of described treated object between described incorporating section and described supporting part, and the 1st position on described stacked direction enters described supporting part; And the 2nd conveying unit, between described handling part and described supporting part, carry out the conveyance of described treated object, 2nd position different from described 1st position on described stacked direction enters described supporting part.And described 1st position clips described 2nd position and be provided with 2 places on described stacked direction, described 1st conveying unit and described 2nd conveying unit can same time enter described supporting part.
Description
Technical field
Embodiments of the present invention relate to a kind for the treatment of system and processing method.
Background technology
In the manufacture of semiconductor device, flat-panel monitor etc., be known to the treatment system possessing the multiple single wafer handling parts processed singly by treated object (such as wafer, glass substrate etc.).And be known to following treatment system, it possesses: supporting part (buffer part), between the incorporating section being arranged on storage treated object and multiple handling part; 1st conveying unit, carries out the conveyance of treated object between incorporating section and supporting part; And the 2nd conveying unit, between multiple handling part and supporting part, carry out the conveyance (such as with reference to patent documentation 1) of treated object.
And, in order to shorten the stand-by period of the 1st conveying unit and the 2nd conveying unit, disclose the 1st conveying unit and the 2nd conveying unit can carry out receiving action or transfer operation independently of one another treatment system (such as with reference to patent documentation 2) to supporting part.
In the treatment system described in patent documentation 2, the region of the storage preset substrate before treatment is respectively provided with one with the region of receiving the substrate after processing.And, in each area, from being positioned at the maintaining part of below, be used in reception or the handing-over of treated object in order.
Therefore, some in the 1st conveying unit and the 2nd conveying unit, produces the stand-by period.
Patent documentation 1: the flat 5-326666 publication of Japanese Laid-Open
Patent documentation 2: the flat 9-74126 publication of Japanese Laid-Open
Summary of the invention
The treatment system of treated object of the present embodiment possesses: incorporating section, storage treated object; Handling part, implements process to described treated object; Supporting part, has the maintaining part of the described treated object of multiple carrying in the stacking direction across the 1st interval; 1st conveying unit, carries out the conveyance of described treated object between described incorporating section and described supporting part, and the 1st position on described stacked direction enters described supporting part; And the 2nd conveying unit, between described handling part and described supporting part, carry out the conveyance of described treated object, 2nd position different from described 1st position on described stacked direction enters described supporting part.Described 2nd conveying unit has upside grip plate and downside grip plate, and described upside grip plate and downside grip plate carry out lifting action in directions opposite each other.And described 1st position clips described 2nd position and be provided with 2 places on described stacked direction, described 1st conveying unit and described 2nd conveying unit can same time enter described supporting part.
And the processing method of the treated object that another execution mode relates to possesses: by the 1st conveying unit the incorporating section of storage treated object and have across the 1st interval in the stacking direction the described treated object of multiple carrying maintaining part supporting part between carry out the operation of the conveyance of described treated object; By the 2nd conveying unit, the operation of carrying out the conveyance of described treated object between the handling part of process and described supporting part is being implemented to described treated object; And at described handling part, the operation of process is implemented to described treated object.And, 1st position of described 1st conveying unit on described stacked direction enters described supporting part, from described 1st position different 2nd position of described 2nd conveying unit on described stacked direction enters described supporting part, described 1st position clips described 2nd position and be provided with 2 places on described stacked direction, described 1st conveying unit and described 2nd conveying unit can same time enter described supporting part, described 2nd conveying unit has upside grip plate and downside grip plate, and described upside grip plate and downside grip plate carry out lifting action in directions opposite each other.
Accompanying drawing explanation
Fig. 1 is the ideograph for illustrating treatment system 1 of the first embodiment.
Fig. 2 is the three-dimensional pattern figure for illustrating the 1st conveying unit 3, supporting part 4, the 2nd conveying unit 5.
Fig. 3 receives wafer W 1 before treatment by the 2nd conveying unit 5 from maintaining part 4a for illustrating and joins the ideograph of the wafer W 2 be disposed to maintaining part 4a.
Fig. 4 receives wafer W 1 before treatment by the 1st conveying unit 3 and the 2nd conveying unit 5 from maintaining part 4a for illustrating and joins the ideograph of the wafer W 2 be disposed to maintaining part 4a.
Fig. 5 is the position of carrying out receiving action and transfer operation for illustrating the 1st conveying unit 3, and the 2nd conveying unit 5 carries out the ideograph of the position of receiving action and transfer operation.
Fig. 6 is the three-dimensional pattern figure for illustrating treatment system 11 of the second embodiment.
Fig. 7 is the flow chart for illustrating about processing method of the third embodiment.
Embodiment
Below, with reference to accompanying drawing, execution mode is illustrated.
In addition, in the drawings and in which, same-sign is enclosed for same inscape, suitable detailed.
And, below as an example, illustrate the treatment system about the single wafer handling part possessing multiple one piece one piece ground process treated object and wafer W (silicon substrate).
(the 1st execution mode)
Fig. 1 is the ideograph for illustrating treatment system 1 of the first embodiment.
Fig. 2 is the three-dimensional pattern figure for illustrating the 1st conveying unit 3, supporting part 4, the 2nd conveying unit 5.
As shown in Figure 1, treatment system 1 is provided with incorporating section 2, the 1st conveying unit 3, supporting part 4, the 2nd conveying unit 5, handling part 6.
The wafer W 2 that incorporating section 2 is received wafer W 1 before treatment, is disposed.In addition, situation wafer W 1 before treatment, the wafer W 2 that is disposed only being generically and collectively referred to as wafer W is also had below.
As incorporating section 2, such as, the chip carrier etc. wafer W can received with layered laminate (multilayer shape) can be illustrated.Now, it can be the carrier of front openings formula for the purpose of the conveyance of wafer W, keeping that uses in microenvironment mode semiconductor factory and FOUP (Front-Opening Unified Pod: front open type wafer box) etc.And, when the face side (the picking and placeing side of wafer W) of incorporating section 2 is provided with door, the not shown opening and closing device for shutter door can be set.
In addition, although exemplified with the situation arranging 4 incorporating sections 2, the number, equipping position etc. of incorporating section 2, not by the limitation of illustrated content, can carry out suitable change.
1st conveying unit 3 carries out the conveyance of wafer W between incorporating section 2 and supporting part 4.
As shown in Figure 2, in the 1st conveying unit 3, holding device 3a, horizontal articulated robot 3b, moving part 3c is provided with.
Handle part 3a1 is provided with in maintaining part 3a.
Grip plate 3a2, the grip plate 3a3 for holding wafer W is provided with in handle part 3a1.
Grip plate 3a2 is arranged in the mode of stretching out, and 2 places of top ends are provided with the holding body 3a21 for contact wafer W periphery.And, can on grip plate 3a2 bearing wafer W.
2 places of grip plate 3a3 top ends are provided with the holding body 3a31 for contact wafer W periphery.On the position that holding body 3a21 and holding body 3a31 can be made to be in be symmetrical in wafer W center.
And, holding body 3a21 and holding body 3a31 can be made to be cylindric, and the geomery of holding body 3a21 can be formed as identical geomery with the geomery of holding body 3a31.
Grip plate 3a2 and grip plate 3a3 can be moved by not shown drive division, by making holding body 3a21 and holding body 3a31 contact wafer W periphery, thus can hold wafer W.
And handle part 3a1 is provided with 5 groups by stacked.The interval (being equivalent to an example at the 1st interval) of the interval each other of the handle part 3a1 on stacked direction (Z-direction such as, in Fig. 2) and the maintaining part 4a that is arranged on supporting part 4 is identical.The interval of the interval being arranged on the maintaining part 4a of supporting part 4 and the maintaining part that is arranged on incorporating section 2 is identical.Therefore, the multiple wafer W held by handle part 3a1 in the stacking direction (such as, 5 pieces of wafer W) can be joined to incorporating section 2 or supporting part 4 simultaneously, or receive from incorporating section 2 or supporting part 4 simultaneously.
At this, more than the number of handling part 61 of the number (the illustrative situation of Fig. 1 is 5 groups) of handle part 3a1 in the stacking direction is preferably set.Like that, the wafer W be disposed can be put back to the position of the supporting part 4 once carrying same wafer W before treatment.That is, the wafer W be disposed can be put back to the same position of supporting part 4.And, for supporting part 4, can at every turn with the reception of piece number of " number+1 of handling part 6 " handing-over carrying out wafer W before treatment and the wafer W be disposed.
That is, the 1st conveying unit 3 can transport the wafer W of more than the number of handling part 61.
And the number (the 1st conveying unit 3 once can transport piece number of wafer W) arranging handle part 3a1 is in the stacking direction preferably the number of the approximate number of the storage number of incorporating section 2.Like that, during conveyance, can not remainder be produced, therefore can realize transporting the simplification controlled.
Such as, when using FOUP as incorporating section 2, because the accommodation number of FOUP is generally 25 pieces, therefore the number of the handle part 3a1 arranged in the stacking direction can be decided to be 5 groups.
Moreover, if when the number of the handle part 3a1 arranged in the stacking direction is decided to be 5 groups, the number due to handling part 6 is 4, therefore, the wafer W be disposed can be put back to the position of the supporting part 4 once carrying same wafer W before treatment.And, for supporting part 4, can at every turn with the reception of 5 pieces of handing-over carrying out wafer W before treatment with the wafer W be disposed.
That is, in the illustrative situation of Fig. 1, full blast be that the number arranging handle part 3a1 is in the stacking direction decided to be 5 groups.
In addition, in the illustrative situation of Fig. 1, although arrange 5 groups of handle part 3a1 separately on arm 3b2, arm 3b3, also can be that the one party in arm 3b2, arm 3b3 arranges 1 group of handle part 3a1.Now, 1 group of handle part 3a1 such as can be used in the inspection of quality management etc., the process modularization etc. of a small amount of process piece number.
In addition, although exemplified with the situation making 4 holding body (2 holding body 3a21 and 2 holding body 3a31) contact wafer W periphery, holding body is more than 2.But, if use the holding body of more than 3, the holding of wafer W just can be made to stablize.
And, because known technology can be applied in other structures of holding device 3a, so omit detailed description.
Horizontal articulated robot 3b is provided with support sector 3b1, arm 3b2, arm 3b3.
Arm 3b2, arm 3b3 are arranged on above the movable part 3b11 of support sector 3b1 upper end setting.
Arm 3b2 possesses the arm 3b2a be arranged on above movable part 3b11, and is arranged on the arm 3b2b on arm 3b2a by rotating shaft.
Arm 3b3 possesses the arm 3b3a be arranged on above movable part 3b11, and is arranged on the arm 3b3b on arm 3b3a by rotating shaft.
On support sector 3b1, be provided with the not shown lifting drive division that movable part 3b11 is elevated in arrow Z-direction, and the not shown rotary driving part that movable part 3b11 is rotated up in arrow theta side.
By being made by not shown lifting drive division the position of the holding device 3a be arranged on above movable part 3b11 move, wafer W can be transferred to the optional position of incorporating section 2 and supporting part 4, or receive wafer W from the optional position of incorporating section 2 and supporting part 4.
Now, by controlling lifting drive division by not shown control part, thus the lifting action of the 1st conveying unit 3 is carried out.
In addition, below, when the position on the stacked direction of holding device 3a being moved by lifting drive division, by controlling lifting drive division by not shown control part, thus carry out the lifting action (position on the stacked direction of holding device 3a is moved) of the 1st conveying unit 3.
And, on support sector 3b1, be provided with and not shown make arm 3b2a, telescopic drive portion that arm 3b2b carries out expanding-contracting action, and not shown make arm 3b3a, telescopic drive portion that arm 3b3b carries out expanding-contracting action.
And, in the top ends of arm 3b2b, the top ends of arm 3b3b, be respectively arranged with holding device 3a.
And arm 3b2b and holding device 3a is by with having
the component 8 of shape cross sectional shape connects.Therefore, between arm 3b2b and holding device 3a, then space is formed.This space is following length and width size, and when arm 3b3 is flexible, the 5 groups of holding device 3a be arranged on arm 3b3b can pass through.
In addition, because known technology can be applied in other structures of horizontal articulated robot 3b, so omit detailed description.
And, as an example, although exemplified with horizontal articulated robot 3b, be not limited to this.Can suitably select to make holding device 3a close to and leave the robot etc. of incorporating section 2 or supporting part 4.Such as, its also can be make holding device 3a straight line close to and leave the robot etc. of incorporating section 2 or supporting part 4.
Moving part 3c is in order to carry out the handing-over of wafer W by holding device 3a and horizontal articulated robot 3b for multiple incorporating section 2 or reception is arranged.That is, in order to make horizontal articulated robot 3b move in the front of the incorporating section 2 of regulation, locate and arrange.Moving part 3c can be such as the single-shaft variant robot etc. often said.
In addition, moving part 3c is not necessarily necessary, the number, configuration etc. of corresponding incorporating section 2 can carry out suitable setting.
At this, it is different positions that the 1st conveying unit 3 enters the position (being equivalent to an example of the 2nd position) that position (being equivalent to an example of the 1st position) on the stacked direction of supporting part 4 and the 2nd conveying unit 5 enter on the stacked direction of supporting part 4.
And as shown in aftermentioned Fig. 5, the position that the 1st conveying unit 3 enters on the stacked direction of supporting part 4 is provided with 2 places in the stacking direction, clips the 2nd conveying unit 5 and enter position on the stacked direction of supporting part 4.
And be different positions because the 1st conveying unit 3 enters the position that position on the stacked direction of supporting part 4 and the 2nd conveying unit 5 enter on the stacked direction of supporting part 4, therefore the 1st conveying unit 3, the 2nd conveying unit 5 can enter supporting part 4 same time.
Now, the 1st conveying unit 3 enters position on the stacked direction of supporting part 4 and the 2nd conveying unit 5 position entered on the stacked direction of supporting part 4 is not with the holding position of the wafer W in supporting part 4 for benchmark, but with the position of supporting part 4 outside for benchmark.Such as, be for benchmark with installed surface of the supporting part 4 of housing 7 etc.
Therefore, even if the position of the position on the stacked direction of the 1st conveying unit 3 and the 2nd conveying unit 5 still for specifying, when supporting part 4 lifting makes the holding position of wafer W change, for the holding position of regulation in supporting part 4, the position that the 1st conveying unit 3 enters from the 2nd conveying unit 5 is also different.
In addition, be described to detailed content related to this after.
Supporting part 4 is arranged between incorporating section 2 and handling part 6.
In addition, in fig. 2, in order to avoid becoming complicated, so represent the partial cross section of supporting part 4.
In supporting part 4, in order to be provided with maintaining part 4a by the interval of regulation with layered laminate (multilayer shape) bearing wafer W.In addition, the interval of the interval being arranged on the maintaining part 4a of supporting part 4 as mentioned above and the maintaining part that is arranged on incorporating section 2 is identical.Can temporary transient bearing wafer W because if arrange supporting part 4, therefore can offset the difference between the activity duration of side, incorporating section 2 and the activity duration of handling part 6 side.Therefore, the time efficiency that treatment system 1 processes can be improved.
And, the stacked direction of maintaining part 4a is provided with the moving part 4b making maintaining part 4a change in location.And, the control that not shown control part carries out moving part 4b is set, by controlling by not shown control part the lifting action (change in location on the stacked direction of maintaining part 4a) that moving part 4b carries out supporting part 4.
That is, supporting part 4 has the moving part 4b of the wafer W movement in the stacking direction that maintaining part 4a is carried, and moving part 4b can make wafer W 2 before treatment move according to the 2nd conveying unit 5 position entered on the stacked direction of supporting part 4.Now, the 2nd conveying unit 5 enters the position on the stacked direction of supporting part 4 is the position preset.In addition, be described to detailed content related to this after.
2nd conveying unit 5 carries out the conveyance of wafer W between handling part 6, supporting part 4.
Holding device 5a, horizontal articulated robot 5b is provided with in 2nd conveying unit 5.
The structure of holding device 5a can be formed as identical with the structure of aforesaid holding device 3a.Such as, be arranged on the grip plate 5a2 of handle part 5a1, grip plate 5a3, holding body 5a21, holding body 5a31 etc. and can be formed as identical with aforesaid grip plate 3a2, grip plate 3a3, holding body 3a21, holding body 3a31 etc. respectively.
But although the situation of handle part 3a1 is provided with 5 groups of stacked in the stacking direction handle part 3a1, the situation of handle part 5a1 is provided with 1 group of handle part 3a1 respectively on arm 5b2b, arm 5b3b.
The structure of horizontal articulated robot 5b can be formed as identical with the structure of aforesaid horizontal articulated robot 3b.Such as, be arranged on the support sector 5b1 on horizontal articulated robot 5b, arm 5b2 (being equivalent to an example of the 1st arm), arm 5b3 (being equivalent to an example of the 2nd arm), movable part 5b11, arm 5b2a, arm 5b2b, arm 5b3a, arm 5b3b, component 8a etc. can be formed as identical with aforesaid support sector 3b1, arm 3b2, arm 3b3, movable part 3b11, arm 3b2a, arm 3b2b, arm 3b3a, arm 3b3b, component 8 etc. respectively.
That is, the 2nd conveying unit 5 has: arm 5b2; And arm 5b3, be set to for arm 5b2 in the stacking direction across the interval (being equivalent to an example at the 2nd interval) of regulation.
And the structure for carrying out the lifting action of the 2nd conveying unit 5 also can be formed as identical with the structure of aforesaid 1st conveying unit 3.
That is, identical with the situation of the 1st conveying unit 3, by being controlled the lifting action that lifting drive division carries out the 2nd conveying unit 5 by not shown control part.
In addition, below, when making the position of the stacked direction of holding device 5a move by lifting drive division, by being controlled the lifting action (position on the stacked direction of holding device 5a is moved) that lifting drive division carries out the 2nd conveying unit 5 by not shown control part.
But, have by arranging
the component 8a of shape cross sectional shape and form space between arm 5b2b and holding device 5a, its length and width size is as follows, and when arm 5b3 stretches, the 1 group of holding device 5a be arranged on arm 5b3b can pass through.
And the not shown lifting drive division be arranged on support sector 5b1 can make the position of the holding device 5a be arranged on above movable part 5b11 only be elevated the size of regulation in arrow Z-direction.Now, not shown lifting drive division only carries out the lifting of required size, to carry out handing-over, the reception of the wafer W on the handing-over of the wafer W on supporting part 4 described later, reception and each handling part 6a ~ 6d.
And, be arranged on the interval (interval between upside grip plate 5a2 and downside grip plate 5a2) of the stacked direction of 2 holding device 5a on arm 5b2a, arm 5b2b for being arranged on the integral multiple of the intervals of the maintaining part 4a on supporting part 4.By forming the interval of the stacked direction of 2 holding device 5a like this, can be carried in the wafer W be disposed that side holding device 5a is held on supporting part 4 arrange maintaining part 4a and retreat time, make the position on the stacked direction of opposite side holding device 5a with in order to receive position consistency when wafer W before treatment is advanced.Therefore, owing to can carry out the expanding-contracting action of arm 5b2, arm 5b3 simultaneously, so the handing-over of wafer W and the operate time required for reception can be shortened.
And, as an example, although exemplified with horizontal articulated robot 5b, be not limited to this.Can suitably select to make holding device 5a close to and leave the robot etc. of supporting part 4 or handling part 6.Such as, its also can be make holding device 5a straight line close to and leave the robot etc. of supporting part 4 or handling part 6.
In addition, after, the handover procedure of wafer W of carrying out at supporting part 4 about the 1st conveying unit 3 and the 2nd conveying unit 5, the receiving step of wafer W are described.
Handling part 6 implements various process to wafer W 1 before treatment.
Handling part 6 can arrange multiple.
Now, handling part 6a ~ 6d suitably can select handling part wafer W being implemented to various process.Such as, as handling part 6a ~ 6d, coating apparatus can be illustrated, the various film formation devices such as CVD (Chemical Vapor Deposition: chemical vapour deposition (CVD)) device, oxidation unit, the various doper such as thermal diffusion device or ion implantation apparatus, annealing device, the various diaphragm processing unit such as diaphragm apparatus for coating or diaphragm stripping off device, exposure device, the various etch processes devices such as Wet-type etching device or dry-etching device, the various ashing processing unit such as wet type ashing processing unit or dry incineration processing unit, the various decontaminating apparatus such as Wet-type washing apparatus or thermal drying device, CMP (Chemical Mechanical Polishing: chemico-mechanical polishing) device etc.But be not limited to this, suitably can change according to the process of wafer W.
And handling part 6a ~ 6d both can be the processing unit carrying out same treatment, it also can be the processing unit carrying out different disposal.Such as, handling part 6a ~ 6d both can be all etch processes device, also can relate to the processing unit of a series of process such as picture film forming, diaphragm process, etch processes, ashing process.In addition, these various processing unit can apply known technology, therefore omit detailed description.
And, also housing 7 can be set, the 1st conveying unit 3, supporting part 4, the 2nd conveying unit 5, handling part 6 are installed therein.Housing 7, in box like, is provided with not shown perforate, the front of incorporating section 2 can be communicated with the inside of housing 7.Not shown filter and Air Blast fan can be set in the top plate portion of housing 7, by Air Blast fan through the inside importing extraneous air of filter to housing 7.If make the pressure increase of housing 7 inside by importing extraneous air to the inside of housing 7, then particulate etc. can be suppressed to enter in housing 7.In addition, housing 7 not necessarily must be arranged, and suitably arranges as required.
Below, the effect about treatment system 1 is illustrated.
In addition, because the reception of the reception about the handing-over of the wafer W in incorporating section 2 and wafer W, the handing-over in the wafer W of handling part 6a ~ 6d and wafer W, known technology can be applied in the process etc. of the wafer W of handling part 6a ~ 6d, so omit the explanation about these.
Therefore, illustrate about the handing-over of the wafer W of supporting part 4 and the reception of wafer W at this.
Fig. 3 receives wafer W 1 before treatment by the 2nd conveying unit 5 from maintaining part 4a for illustrating and joins the ideograph of the wafer W 2 be disposed to maintaining part 4a.
In addition, as described later, undertaken by the 2nd conveying unit 5 receiving from maintaining part 4a wafer W 1 before treatment and in maintaining part 4a joins the wafer W 2 be disposed, moving part 4b does not carry out the lifting action of maintaining part 4a.
And then content illustrative with Fig. 1, Fig. 2 is identical about the structure of supporting part 4, the 2nd conveying unit 5.
As shown in Fig. 3 (a), by being arranged on the not shown lifting drive division of support sector 5b1, the position of the stacked direction holding the grip plate 5a2 of the upside of the wafer W 2 be disposed is positioned.Now, the lower position of the wafer W 2 be disposed is positioned in the slightly high position of the upper position of the maintaining part 4a of this wafer W of maintenance than supporting part 4.
Like this, if the grip plate 5a2 of upside is positioned at the assigned position above maintaining part 4a, so can reduce when wafer W 2 being carried on maintaining part 4a the shock produced because wafer W 2 contacts with maintaining part 4a.Therefore, when wafer W 2 is carried on maintaining part 4a, wafer W 2 can be suppressed to takeoff and position skew.
Secondly, as shown in Fig. 3 (b), the holding plate 5a2 of upside is moved to the direction of supporting part 4.The lower position being inserted into the wafer W 2 of supporting part 4 inside is positioned in the position slightly higher than the upper position of maintaining part 4a.Then, decontrol the holding of wafer W 2, by the not shown lifting drive division being arranged on support sector 5b1, the grip plate 5a2 of upside is declined, the wafer W 2 be disposed is carried on maintaining part 4a.Now, the grip plate 5a2 of upside directly declines, and is positioned in the position between maintaining part 4a and maintaining part 4a adjacent below this carrying the wafer W 2 be disposed.
At this, the grip plate 5a2 of upside and the grip plate 5a2 of downside is by not shown lifting drive division one lifting being arranged on support sector 5b1.In the lifting action of this occasion, the grip plate 5a2 of upside and the grip plate 5a2 of downside carries out rightabout action.Such as, when the grip plate 5a2 of upside rises, the grip plate 5a2 of downside then carries out the action declined.
And the interval A between the grip plate 5a2 of upside and the grip plate 5a2 of downside is the integral multiple (the illustrative situation of Fig. 3 is 2 times) of the intervals S of the maintaining part 4a being arranged on supporting part 4.By so forming the interval A between the grip plate 5a2 of upside and the grip plate 5a2 of downside, when the wafer W 2 be disposed that the holding device 5a by side holds being carried on the maintaining part 4a being arranged on supporting part 4 and retreating, position consistency when can make the position on the stacked direction of holding device 5a of opposite side and advance for receiving wafer W 1 before treatment.
Now, such as, at the end of the wafer W 2 be disposed is carried on the decline of the grip plate 5a2 of the upside of maintaining part 4a, can become as upper/lower positions, namely below the wafer W before treatment 1 that supporting part 4 carries and slightly form gap between the grip plate 5a2 of downside.
If can be positioned on such position by the grip plate 5a2 of downside, when so receiving wafer W 1 from maintaining part 4a, the shock produced because wafer W 1 contacts with the grip plate 5a2 of downside just can be reduced.Therefore, when receiving wafer W 1, wafer W 1 can be suppressed to takeoff and position skew.
And, if carry out one-time positioning action in the stacking direction, just can carry out the expanding-contracting action of arm 5b2, arm 5b3 in this position, so handing-over and the operate time needed for reception of wafer W 1, W2 can be shortened.Such as, compared with the situation positioning action respectively in the stacking direction with arm 5b2, arm 5b3, the operate time of about 25% can be shortened.
In addition, the interval A between the grip plate 5a2 of upside and the grip plate 5a2 of downside is not limited to 2 times of the intervals S of maintaining part 4a, as long as the integral multiple of the intervals S of maintaining part 4a.
Secondly, as shown in Fig. 3 (c), the grip plate 5a2 of upside is moved to the direction left from supporting part 4.
And, in order to receive wafer W 1 before treatment from supporting part 4, so make the grip plate 5a2 of downside move to the direction of supporting part 4.
The grip plate 5a2 inserting the downside of supporting part 4 inside is positioned at the below of wafer W 1 before treatment.Then, make the grip plate 5a2 of downside increase by the not shown lifting drive division being arranged on support sector 5b1, wafer W 1 before treatment is carried on the grip plate 5a2 of downside.Now, the grip plate 5a2 of downside directly rises, and is positioned in the position between the maintaining part 4a of the wafer W before treatment 1 that carrying receives to some extent and maintaining part 4a adjacent above this.The wafer W before treatment 1 that the grip plate 5a2 of downside carries is held by not shown holding body 5a21, holding body 5a31.
Secondly, as shown in Fig. 3 (d), the grip plate 5a2 of downside is moved to the direction left from supporting part 4.Like this, the wafer W 2 of carrying out being disposed, the handing-over of wafer W before treatment 1, reception.In addition, throughout reason portion 6a ~ 6d also can be undertaken being disposed by same action wafer W 2, the handing-over of wafer W before treatment 1, reception.
Fig. 4 receives wafer W 1 before treatment by the 1st conveying unit 3 and the 2nd conveying unit 5 from maintaining part 4a for illustrating and joins the ideograph of the wafer W 2 be disposed to maintaining part 4a.
As shown in Figure 4, receive wafer W 1 before treatment by the 2nd conveying unit 5 from maintaining part 4a to carry out at position P1.And, join to maintaining part 4a the wafer W 2 be disposed by the 2nd conveying unit 5 and carry out at position P2.Now, A is spaced apart, i.e. 2S between position P1 and position P2.After the handing-over of the wafer W 2 be disposed and the reception of wafer W before treatment 1 terminate, made the amount of the intervals S of the position only rising maintaining part 4a of maintaining part 4a by moving part 4b.Now, by controlling moving part 4b by not shown control part, thus the vertical motion of supporting part 4 is carried out.
In addition, the position of maintaining part 4a rising, both can be carry out after the receiving action of every order 2 conveying units 5 and transfer operation terminate, also can be receiving action and transfer operation repeatedly several times after only to rise the integral multiple of intervals S.
Now, maintaining part 4a rises or declines is carry out when receiving action and transfer operation terminate and the 1st conveying unit 3 and the 2nd conveying unit 5 retreat from supporting part 4.
In addition, below, when being made the change in location of maintaining part 4a by moving part 4b, by controlling moving part 4b by not shown control part, thus carry out the lifting action of supporting part 4.
Thus, the 2nd conveying unit 5 can carry out next receiving action and transfer operation at position P1 and position P2.That is, the 2nd conveying unit 5 can carry out receiving action and transfer operation at same position (position P1, position P2) always.In a word, the 2nd conveying unit 5 can be limited in the scope of regulation for supporting part 4 actuating range in the stacking direction.
Secondly, the action of the 1st conveying unit 3 is illustrated.Such as, due to the amount of maintaining part 4a intervals S of a rising maintaining part 4a after the receiving action of every order 2 conveying units 5 and transfer operation terminate, the wafer W 2 be disposed therefore then is carried at the maintaining part 4a of position more than P2.When piece number of the wafer W 2 be disposed that the maintaining part 4a of position more than P2 carries is more than during for the stacked and quantity of the handle part 3a1 arranged the situation of more than 5 pieces (Fig. 4 is illustrative be), received the wafer W 2 be disposed from supporting part 4 by the 1st conveying unit 3.That is, carry out at the scope B of position more than P2 the action being received the wafer W 2 be disposed by the 1st conveying unit 3.
In addition, the receiving action of the wafer W of the 1st conveying unit 3 and transfer operation can be identical with the receiving action of the wafer W of illustrative 2nd conveying unit 5 of Fig. 3 and transfer operation.
And after the wafer W before treatment 1 carried at undermost maintaining part 4a is received by the 2nd conveying unit 5, supporting part 4 declines, and the position of the maintaining part 4a of the superiors becomes the position of position P2.Now, carry out at the scope C of position below P1 the action being received the wafer W 2 be disposed by the 1st conveying unit 3.
In addition, scope B, scope C are following scopes, even if when the 2nd conveying unit 5 enters supporting part 4, the 1st conveying unit 3 also can not be interfered the 2nd conveying unit 5 and enter supporting part 4.
On the other hand, even if when wafer W 1 before treatment being joined to maintaining part 4a by the 1st conveying unit 3, also carry out at scope B or scope C the action being joined wafer W 1 before treatment by the 1st conveying unit 3.
Like this, because the transfer operation of position the 1st conveying unit 3 carries out receiving action or to(for) supporting part 4 is different from the position that the 2nd conveying unit 5 carries out receiving action or transfer operation, so the 1st conveying unit 3 and the 2nd conveying unit 5 (such as simultaneously) can enter supporting part 4 same time.Therefore, can suppress to produce the stand-by period in the 1st conveying unit 3 and the 2nd conveying unit 5.And, can the 1st conveying unit 3 and the 2nd conveying unit 5 be controlled respectively with being independent of each other.
Fig. 5 is the ideograph carrying out the position (entering the position of supporting part 4) of receiving action and transfer operation for illustrating position (entering the position of supporting part 4) that the 1st conveying unit 3 carries out receiving action and transfer operation and the 2nd conveying unit 5.
Rectangle in Fig. 5 represents maintaining part 4a, and W0 is the situation of non-bearing wafer, and W1 is the situation carrying wafer W 1 before treatment, and W2 is the situation carrying the wafer W 2 be disposed.The rectangle of one group of longitudinal 1 row represents maintaining part 4a, changes highly and the 50a ~ 50f drawn represents the state after being elevated by conveying unit 5.Such as, 50e represents that maintaining part 4a drops to minimum state, and 50f represents the state again risen.
And, receive wafer W 1 before treatment by the 2nd conveying unit 5 from maintaining part 4a and carry out at position P1.Join to maintaining part 4a the wafer W 2 be disposed by the 2nd conveying unit 5 to carry out at position P2.
And, as an example, receive from maintaining part 4a the wafer W 2 be disposed by the 1st conveying unit 3 and carry out at position B1, position C1.And, as an example, join wafer W 1 before treatment by the 1st conveying unit 3 to maintaining part 4a and carry out at position B2, position C2.
Namely, 1st conveying unit 3 enters position on the stacked direction of supporting part 4 (such as, position B1, position C1, position B2, position C2) clip the 2nd conveying unit 5 and enter position on the stacked direction of supporting part 4 (such as, position P1, position P2), be provided with 2 places in the stacking direction.
Therefore, as described later, the stand-by period that the 1st conveying unit 3 and the 2nd conveying unit 5 produce can be suppressed significantly.
As shown in Figure 5, when initial condition 50a, at the position C2 being positioned at scope C of position below P1, the handing-over of wafer W 1 before treatment can be carried out by the 1st conveying unit 3.
And, when scope C can carry the maintaining part 4a of wafer W 1 before treatment in addition, as shown in state 50b, make the position of maintaining part 4a rises.Then, just the handing-over of wafer W 1 before treatment can be carried out at position C2 further by the 1st conveying unit 3.
As mentioned above (with reference to Fig. 4), end process the handing-over of wafer W 2 complete and after the reception of wafer W before treatment 1, moving part 4b makes the amount of the intervals S of the position only rising maintaining part 4a of maintaining part 4a in the 2nd conveying unit 5 at every turn.
Therefore, as shown in state 50c, when the scope B of position more than P2 has the maintaining part 4a that can carry wafer W 1 before treatment, the handing-over of wafer W 1 before treatment can be carried out at position B2 by the 1st conveying unit 3.
Now, the 1st conveying unit 3 can not join wafer W 1 before treatment to the maintaining part 4a at interval of the arm being positioned at the 2nd conveying unit 5.
Such as, when scope B carries out the handing-over of wafer W 1 before treatment by the 1st conveying unit 3, because be spaced apart 2S (2 layers), so wafer W 1 before treatment can not be joined to being positioned at the maintaining part 4a of the superiors and the maintaining part 4a below it between P1 and P2.At that rate, as shown in state 50e, even if after the position of the position of the maintaining part 4a of the superiors just in-position P2, also can join to the maintaining part 4a being positioned at the superiors wafer W 2 be disposed by the 2nd conveying unit 5.That is, the 2nd conveying unit 5 can be suppressed to become wait state.
And as shown in state 50d, after the wafer W before treatment 1 carried at undermost maintaining part 4a is received by the 2nd conveying unit 5, as shown in state 50e, the position of the maintaining part 4a of the superiors is declined to become the position of position P2.At that time, when scope C have can by the 1st conveying unit 3 receive be disposed wafer W 2, the reception of the wafer W 2 be disposed can be carried out at position C1 by the 1st conveying unit 3.
And, as shown in state 50f, when scope B have can by the 1st conveying unit 3 receive be disposed wafer W 2, the reception of the wafer W 2 be disposed can be carried out at scope B by the 1st conveying unit 3.
Now, no matter in any one situation of state 50a ~ 50f, the position P1 receiving wafer W 1 before treatment from maintaining part 4a by the holding device 5a of the 2nd conveying unit 5 side and the position P2 joining to maintaining part 4a the wafer W 2 be disposed by the holding device 5a of the 2nd conveying unit 5 opposite side is certain.
In addition, as an example, although exemplified with the situation of being carried out the reception of the wafer W 2 be disposed or the handing-over of wafer W before treatment 1 at position B1, position C1, position B2, position C2 by the 1st conveying unit 3, the position of reception or handing-over is not limited to this.The position being positioned at scope B, scope C suitably can be selected in the position received or join.Such as, according to the number of maintaining part 4a, the conveyance time etc. once being received or join piece number of wafer, the processing time of each handling part 6a ~ 6d, the conveyance time of the 1st conveying unit 3 and the 2nd conveying unit 5 by the 1st conveying unit 3, can suitably select the position being positioned at scope B, scope C.
According to the present embodiment, the position of due to the 1st conveying unit 3 supporting part 4 being carried out to receiving action or transfer operation is different from the position that the 2nd conveying unit 5 carries out receiving action or transfer operation, and therefore the 1st conveying unit 3 and the 2nd conveying unit 5 can enter supporting part 4 same time.And the 1st conveying unit 3 position entered on the stacked direction of supporting part 4 clips the 2nd conveying unit 5 and enters position on the stacked direction of supporting part 4, is provided with 2 places in the stacking direction.Therefore, due to the 1st conveying unit 3 and the 2nd conveying unit 5 can be suppressed to produce the stand-by period, so can productivity be improved.
And, not for the control of the complexity that prevents the 1st conveying unit 3 and the 2nd conveying unit 5 from interfering, therefore can control the 1st conveying unit 3 and the 2nd conveying unit 5 respectively with being independent of each other.
(the 2nd execution mode)
Fig. 6 is the three-dimensional pattern figure for illustrating treatment system 11 of the second embodiment.
As shown in Figure 6, in treatment system 11, identical with aforesaid treatment system 1 not shown incorporating section, the 1st conveying unit 3, supporting part 4, the 2nd conveying unit 5, handling part 6 is provided with.And, above supporting part 4, the 2nd conveying unit 5, handling part 6, be provided with supporting part 14, the 4th conveying unit 15, handling part 16, be provided with the 3rd conveying unit 20 and supporting part 21 simultaneously.That is, treatment system 11 respectively both layers possess supporting part 4, the 2nd conveying unit 5, handling part 6 set by treatment system 1.
Now, supporting part 14, the 4th conveying unit 15, handling part 16 can be identical with aforesaid supporting part 4, the 2nd conveying unit 5, handling part 6.
Supporting part 21 can be equally with supporting part 4 supporting part of the maintaining part 21a with bearing wafer W.The wafer W 2 that supporting part 21 temporarily can carry wafer W 1 before treatment, be disposed.
3rd conveying unit 20 can transport the wafer W before treatment 1 being carried on supporting part 21, the wafer W 2 be disposed to supporting part 14, or is carried on the wafer W 2 be disposed of supporting part 14 to supporting part 21 conveyance.
In addition, in the 3rd conveying unit 20, be provided with 5 groups of handle part 20a1s same with the maintaining part 3a1 being arranged on the 1st conveying unit 3, this maintaining part 20a1 is stacked in the stacking direction.And, be provided with single-shaft variant robot 20b1,20b2, substitute the horizontal articulated robot 3b being arranged on the 1st conveying unit 3.
In addition, the 3rd conveying unit 20, supporting part 21 are not necessarily necessary, the wafer W 2 that also can transport wafer W 1 before treatment by the 1st conveying unit 3 to supporting part 14, be disposed.
And although exemplified with the situation by She Zhi both layers such as handling parts, the number of plies is not limited to 2.Now, the treatment system of the layer possessing more than 3 can be formed.In addition, when formation possesses the treatment system of the layer of more than 3, as long as by elongated for the conveying distance of the 3rd conveying unit 20.
And the process of lower floor both can have been made identical with the process on upper strata, also can be process the wafer W 2 be disposed in lower floor further on upper strata.
Even if the position that in the present embodiment, the 1st conveying unit 3 position of supporting part 4 being carried out to receiving action or transfer operation and the 2nd conveying unit 5 carry out receiving action or transfer operation also can be different position.And the position that the 3rd conveying unit 20 position of supporting part 14 being carried out to receiving action or transfer operation and the 4th conveying unit 15 carry out receiving action or transfer operation is different position.
Therefore, can prevent the 1st conveying unit 3 and the 2nd conveying unit 5 from interfering respectively and prevent the 3rd conveying unit 20 and the 4th conveying unit 15 from interfering.Its result, can control the 1st conveying unit 3, the 2nd conveying unit 5, the 3rd conveying unit 20, the 4th conveying unit 15 with being independent of each other respectively, even therefore by the treatment system 11 of the complexity of handling part She Zhi both layers, it also can be suppressed to control to become complicated.Such as, now, because the control for each conveying unit can be carried out individually, therefore, even if when increasing the number of plies or increasing the number of each layer handling part, also can the load of inhibitory control aspect increase.Therefore, the problems such as the delay of generating routine time can be suppressed.
(the 3rd execution mode)
Secondly, processing method of the third embodiment is illustrated.
Fig. 7 is the flow chart for illustrating processing method of the third embodiment.
As shown in Figure 7, processing method of the third embodiment such as can use aforesaid treatment system 1,11 to carry out.
Processing method of the third embodiment such as can be carried out by following program.
First, wafer W 1 before treatment is received by the 1st conveying unit 3 from incorporating section 2.
Secondly, wafer W 1 before treatment is transported by the 1st conveying unit 3 from incorporating section 2 to supporting part 4.
Secondly, wafer W 1 before treatment is joined by the 1st conveying unit 3 to supporting part 4.Now, the 1st conveying unit 3 enters the position (being equivalent to an example of the 2nd position) that position (being equivalent to an example of the 1st position) on the stacked direction of supporting part 4 and the 2nd conveying unit 5 enter on the stacked direction of supporting part 4 is different positions.
Secondly, wafer W 1 before treatment is received by the 2nd conveying unit 5 from supporting part 4.Now, the 1st conveying unit 3 enters the position that position on the stacked direction of supporting part 4 and the 2nd conveying unit 5 enter on the stacked direction of supporting part 4 is different positions.
Secondly, wafer W 1 before treatment is transported by the 2nd conveying unit 5 from supporting part 4 to handling part 6.
Secondly, join wafer W 1 before treatment by the 2nd conveying unit 5 to handling part 6, receive the wafer W 2 be disposed from handling part 6.And, at handling part 6 to being implemented process by the wafer W before treatment 1 joined.
Secondly, the wafer W 2 be disposed is transported from handling part 6 to supporting part 4 by the 2nd conveying unit 5.
Secondly, the wafer W 2 be disposed is joined to supporting part 4 by the 2nd conveying unit 5.Now, the 1st conveying unit 3 enters the position that position on the stacked direction of supporting part 4 and the 2nd conveying unit 5 enter on the stacked direction of supporting part 4 is different positions.
Secondly, the wafer W 2 be disposed is received from supporting part 4 by the 1st conveying unit 3.Now, the 1st conveying unit 3 enters the position that position on the stacked direction of supporting part 4 and the 2nd conveying unit 5 enter on the stacked direction of supporting part 4 is different positions.
Secondly, the wafer W 2 be disposed is transported from supporting part 4 to incorporating section 2 by the 1st conveying unit 3.
Secondly, the wafer W 2 be disposed is joined to incorporating section 2 by the 1st conveying unit 3.
Afterwards, can process wafer W 1 before treatment by repeating aforesaid program.
That is, processing method of the third embodiment such as can possess following operation: received the incorporating section 2 of treated object and wafer W by the 1st conveying unit 3 and between the interval specified is with the supporting part 4 of layered laminate bearing wafer W, is being carried out the operation of wafer W conveyance; By the 2nd conveying unit, the operation of carrying out wafer W conveyance between the handling part 6 of process and supporting part 4 is being implemented to wafer W; And at handling part 6, the operation of process is implemented to wafer W 1 before treatment.And the 1st conveying unit 3 can be made to enter, and position that position on the stacked direction of supporting part 4 and the 2nd conveying unit 5 enter on the stacked direction of supporting part 4 is different position.
Now, the position entered on the stacked direction of supporting part 4 due to the 1st conveying unit 3 is different from the position that the 2nd conveying unit 5 enters on the stacked direction of supporting part 4, and therefore the 1st conveying unit 3 and the 2nd conveying unit 5 can enter supporting part 4 same time.
And the 2nd conveying unit 5 position entered on the stacked direction of supporting part 4 is the position preset, also can possesses and enter the position on the stacked direction of supporting part 4 according to the 2nd conveying unit 5 and the operation of wafer W before treatment 1 movement that supporting part 4 is carried.
And, multiple handling part 6 is set, is being undertaken in the operation of wafer W conveyance by the 1st conveying unit 3, the 1st conveying unit 3 also can be made to transport the wafer W of more than the number of handling part 61.
And, undertaken in the operation of wafer W conveyance by the 1st conveying unit 3, the 1st conveying unit 3 also can be made to transport the wafer W of the approximate number number of the storage number of incorporating section 2.In a word, can receive multiple wafer W in incorporating section 2, the number of the wafer W that the 1st conveying unit 3 once transports is the approximate number that the maximum number of wafer W can be received in incorporating section 2.
In addition, because content illustrated in each key element in each operation and the effect in aforesaid treatment system 1,11 etc. is identical, so omit detailed description.
Above, execution mode is illustrated.But the present invention is not limited to these and describes.
About aforesaid execution mode, as long as possess feature of the present invention, industry technical staff suitably to inscape carry out add, delete or design alteration, or carry out operation add, omit or condition change, be also contained in scope of the present invention.
Such as, the shape, size, material, configuration, number etc. of each key element that treatment system 1,11 possesses are not limited to illustrative content, can carry out suitable change.
And, although as the treated object processed in treatment system 1,11 exemplified with wafer, be not limited to this.As treated object, such as, can be can with plate body, electronic unit, the electric component etc. such as glass substrate, printed circuit board, ceramic substrate, light memory media of layered laminate storage.The process carried out at handling part 6 is also not limited to aforesaid content, can carry out suitable change according to treated object.
And, as holding device 3a, 5a, although exemplified with the holding device holding treated object, be not limited to this.As holding device, such as, can suitably select can carry out to treated object the holding device that keeps Yu decontrol as electrostatic jaw, vacuum cup etc.
And, although be above-below direction exemplified with the stacked direction of supporting part 4, be not limited to this.Such as, the stacked direction of supporting part 4 both can be horizontal direction, also can be the direction tilted relative to horizontal direction.
And each key element that aforesaid each execution mode possesses can combine in situation as much as possible, as long as comprise feature of the present invention, the technology these combined is also contained in scope of the present invention.
Claims (7)
1. a treatment system for treated object, is characterized by, and possesses:
Incorporating section, storage treated object;
Handling part, implements process to described treated object;
Supporting part, has the maintaining part of the described treated object of multiple carrying in the stacking direction across the 1st interval;
1st conveying unit, carries out the conveyance of described treated object between described incorporating section and described supporting part, and the 1st position on described stacked direction enters described supporting part;
And the 2nd conveying unit, between described handling part and described supporting part, carry out the conveyance of described treated object, 2nd position different from described 1st position on described stacked direction enters described supporting part,
Described 2nd conveying unit has upside grip plate and downside grip plate,
Described upside grip plate and described downside grip plate carry out lifting action in directions opposite each other, and described 1st position clips described 2nd position and be provided with 2 places on described stacked direction,
Described 1st conveying unit and described 2nd conveying unit can same time enter described supporting part.
2. the treatment system of treated object according to claim 1, is characterized by,
Described supporting part has the moving part making carried described treated object movement on described stacked direction,
Described moving part makes carried described treated object move at described stacked direction when described 1st conveying unit and described 2nd conveying unit retreat from described supporting part.
3. the treatment system of treated object according to claim 2, is characterized by,
Described 2nd position is the position preset,
Described moving part makes carried described treated object move according to described 2nd position.
4., according to the treatment system of the treated object in claims 1 to 3 described in any 1, it is characterized by,
Described handling part is provided with multiple,
The described treated object of described more than the number of described handling part 1 of 1st conveying unit conveyance.
5. the treatment system of treated object according to claim 1, is characterized by,
Multiple described treated object can be received in described incorporating section,
The number of the described treated object simultaneously transported by described 1st conveying unit is the approximate number of the maximum number of the described treated object of described incorporating section storage.
6. the treatment system of treated object according to claim 1, is characterized by,
Described 2nd conveying unit has: the 1st arm; And the 2nd arm, be set to for described 1st arm in the stacking direction across the 2nd interval,
Described 1st conveying unit does not join described treated object to the described maintaining part being positioned at described 2nd interval.
7. a processing method for treated object, is characterized by, and possesses:
By the 1st conveying unit the incorporating section of storage treated object and have across the 1st interval in the stacking direction the described treated object of multiple carrying maintaining part supporting part between carry out the operation of the conveyance of described treated object;
By the 2nd conveying unit, the operation of carrying out the conveyance of described treated object between the handling part of process and described supporting part is being implemented to described treated object;
And at described handling part, the operation of process is implemented to described treated object,
1st position of described 1st conveying unit on described stacked direction enters described supporting part,
From described 1st position different 2nd position of described 2nd conveying unit on described stacked direction enters described supporting part,
Described 1st position clips described 2nd position and be provided with 2 places on described stacked direction,
Described 1st conveying unit and described 2nd conveying unit can same time enter described supporting part,
Described 2nd conveying unit has upside grip plate and downside grip plate,
Described upside grip plate and downside grip plate carry out lifting action in directions opposite each other.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2011-177245 | 2011-08-12 | ||
| JP2011177245 | 2011-08-12 | ||
| JP2012-135543 | 2012-06-15 | ||
| JP2012135543A JP6122256B2 (en) | 2011-08-12 | 2012-06-15 | Processing system and processing method |
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| CN102956531B true CN102956531B (en) | 2015-10-14 |
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| JP2017183665A (en) * | 2016-03-31 | 2017-10-05 | 芝浦メカトロニクス株式会社 | Substrate carrier device, substrate processing apparatus, and substrate processing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6053686A (en) * | 1998-02-09 | 2000-04-25 | Asm Japan K.K. | Device and method for load locking for semiconductor processing |
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| JP3734294B2 (en) * | 1995-09-04 | 2006-01-11 | 大日本スクリーン製造株式会社 | Substrate transfer device |
| JP3779393B2 (en) * | 1996-09-06 | 2006-05-24 | 東京エレクトロン株式会社 | Processing system |
| JP5100179B2 (en) | 2007-03-30 | 2012-12-19 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| KR100964870B1 (en) * | 2008-06-09 | 2010-06-23 | 세메스 주식회사 | Substrate processing apparatus and method for transferring substrate of the same |
| JP5548430B2 (en) * | 2008-11-26 | 2014-07-16 | 株式会社日立国際電気 | Substrate processing apparatus and semiconductor device manufacturing method |
| JP4973675B2 (en) * | 2009-02-26 | 2012-07-11 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
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| US6053686A (en) * | 1998-02-09 | 2000-04-25 | Asm Japan K.K. | Device and method for load locking for semiconductor processing |
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