CN102954676A - Method and equipment for removing alkaline solution on devices - Google Patents
Method and equipment for removing alkaline solution on devices Download PDFInfo
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- CN102954676A CN102954676A CN2011102461390A CN201110246139A CN102954676A CN 102954676 A CN102954676 A CN 102954676A CN 2011102461390 A CN2011102461390 A CN 2011102461390A CN 201110246139 A CN201110246139 A CN 201110246139A CN 102954676 A CN102954676 A CN 102954676A
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- air knife
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Abstract
The invention provides a method for removing alkaline solution on devices by the aid of an air knife in a wet process. The method includes: treating compressed air to enable the same to reach a preset temperature before the compressed air is supplied to the air knife, and using the air knife for exhausting air to the devices to effectively remove the alkaline solution thereon. The invention further provides corresponding equipment. According to the method and the equipment, the air knife can be kept unblocked for a longer time.
Description
Technical field
The present invention relates to wet process, more specifically, relate in the wet process remaining in the processing of the alkaline solution on the device.
Background technology
In the wet process, the cleaning (calling rear cleaning in the following text) after the cleaning (calling front cleaning in the following text) before the diffusion and the diffusion all relates to and utilizes alkaline solution cleaning device.
Take solar cell as example, the processing of crystalline silicon is just comprised front cleaning and rear cleaning.The making herbs into wool of front cleaning, purpose are to remove the silicon chip surface mechanical damage layer; Remove greasy dirt and the metal impurities on surface; Reduce reflection of light, strengthen silicon chip to sun Optical Absorption, improve photogenerated current density, thereby improve the conversion efficiency of solar cell.Briefly, making herbs into wool is exactly to utilize low concentration alkali solution crystalline silicon to be had the anisotropic etch characteristic of different corrosion rates in the different crystal orientation, in the silicon chip surface corrosion, and then forms the surface topography that pyramid gathers.Silicon chip through making herbs into wool is processed as can not before it enters follow-up acid cleaning process its surface being dried up, then can cause the channelling of chemicals on the one hand, on the other hand because the physical characteristic of the easy crystallization of alkali easily forms a large amount of color spots or little informal voucher at silicon chip.Similarly, in the rear cleaning process, as can not better processing the alkaline matter on the silicon chip, Similar Problems can appear.
At present, generally be to dry up alkaline residues on the silicon chip by air knife.Air knife generally comprises cutter pipe, air inlet and gas outlet.Compressed air enters the air knife pipe by air inlet, is blown on the silicon chip by the gas outlet, thereby dries up the alkaline solution that remains on the silicon chip.But, this routine by the method for compressed air by the air knife drying alkaline residues, be prone to the air knife clogging.In the situation that air knife stops up, the alkaline residues on the silicon chip just can't be removed effectively, thus can occur aforesaid chemicals channelling, and silicon chip on form the situations such as a large amount of color spots or informal voucher.
Summary of the invention
For effectively solving above-mentioned and other problem, the invention provides a kind of method of in wet process, utilizing the alkaline solution on the air knife removal devices, the alkaline solution in processing with effective removal solar cell silicon wafer and other wet process on the device.Described method is included in to be sent into compressed air before the air knife, processes described compressed air and makes it arrive preset temperature, and wherein said air knife is discharged air to device.
Preferably, in the described method, described compressed air enters before the air knife, heats described compressed air and makes it arrive preset temperature.
The present invention also provide a kind of in wet process the equipment of the alkaline solution on the removal devices, described equipment comprises the air knife with air knife pipe and inlet suction port, wherein, described equipment also is included in compressed air and enters and process described compressed air before the air knife and make it arrive the air temperature regulator of preset temperature.
Preferably, in the described equipment, described air temperature regulator is air heater, so that compressed air is heated to preset temperature.
Preferably, in described method and the described equipment, preset temperature is between 40 ° of C to 50 ° of C; 45 ° of C more preferably.
Preferably, in described method and the described equipment, described device is wafer, electronic circuit; Wherein, described wafer is preferably silicon chip.
Compare with routine techniques, use method of the present invention and/or utilize equipment of the present invention, can make the unimpeded state of air knife keep the more time.
Description of drawings
Fig. 1 is the schematic diagram according to the equipment for the alkaline solution on the wet process removal devices of the present invention.
The specific embodiment
Set forth the present invention below in conjunction with the specific embodiment, need to prove, following embodiment and any example all are schematic and nonrestrictive.It will be appreciated by those skilled in the art that, in conjunction with the following description of the present invention, can make amendment and be out of shape screen printing apparatus of the present invention, and not break away from spirit of the present invention and scope.
Fig. 1 is the schematic diagram according to equipment of the present invention, and this equipment is used for the alkaline solution on the wet process removal devices.As shown in the figure, this equipment comprises air temperature regulator 20, air knife 10, and the pipeline 201 that connects air temperature regulator 20 and air knife 10.Air temperature regulator 20 receives the compressed air that sends, and it is processed, so that its temperature is preset temperature.Afterwards, air temperature regulator 20 is sent the compressed air of preset temperature into air knife 10 by pipeline 201, and wherein, pipeline 201 is connected with air knife pipe (not shown) by the air inlet (not shown) of air knife 10.Air knife 10 will blow to device with air subsequently, so that the alkaline solution on the device is dried up.
At this, described device can be wafer, for example silicon chip; Also can be electronic device, such as printed circuit board (PCB) etc.This preset temperature preferably between 40 ° of C to 50 ° of C, 45 ° of C more preferably.In this example, this first temperature can be compressed-air actuated temperature in the routine techniques, and for example 17 ° of C also can be other temperature.In the situation that compressed-air actuated temperature is lower than preset temperature, air is heated to preset temperature from the first temperature, so, air temperature regulator 20 can be air heater.
In the situation that do not use equipment of the present invention, for example compressed air of 17 ° of C is delivered directly to air knife, then air knife will blockage phenomenon about 12 hours; By contrast, use equipment of the present invention, compressed air is heated to for example 45 ° of C from 17 ° of C, is transported to air knife again, just can make to carry compressed-air actuated air knife to keep unimpeded in 168 hours and do not stop up.
The method of utilizing the alkaline solution on the air knife removal devices in wet process provided by the present invention can be applicable to equipment as schematically shown in Figure 1, but not as limit.The method comprises to be processed compressed air, makes it arrive preset temperature from the first temperature; Wherein this first temperature can be compressed-air actuated temperature in the routine techniques, such as 17 ° of C, also can be other temperature.Subsequently, the compressed air that temperature is processed to preset temperature is admitted to air knife, is discharged towards device by air knife, thereby dries up alkaline solution on the device.
According to the present invention, described device can be wafer, for example silicon chip; Also can be electronic device, such as printed circuit board (PCB) etc.And preferably, preset temperature is between 40 ° of C to 50 ° of C, and more preferably, preset temperature is 45 ° of C.
In compressed air being processed the process that makes its temperature reach preset temperature, if compressed-air actuated the first temperature is lower than preset temperature (for example being aforesaid 17 ° of C), then make it arrive preset temperature to heating this compressed air; Otherwise then reducing this compressed-air actuated temperature makes it arrive preset temperature.
Claims (12)
1. method of in wet process, utilizing the alkaline solution on the air knife removal devices, described method comprises sends compressed air into air knife, discharges air by air knife to device, it is characterized in that, before described compressed air enters air knife, process described compressed air and make it arrive preset temperature.
2. method according to claim 1 is characterized in that, described preset temperature is between 40 ° of C to 50 ° of C.
3. method according to claim 2 is characterized in that, described preset temperature is 45 ° of C.
4. method according to claim 1 is characterized in that, described device is wafer, electronic circuit.
5. method according to claim 4 is characterized in that, described wafer is silicon chip.
6. method according to claim 1 is characterized in that, before described compressed air enters air knife, heats described compressed air and makes it arrive preset temperature.
7. the equipment of the alkaline solution on the removal devices in wet process, described equipment comprises the air knife with air knife pipe and inlet suction port, it is characterized in that, described equipment also is included in compressed air and enters and process described compressed air before the air knife and make it arrive the air temperature regulator of preset temperature.
8. equipment according to claim 7 is characterized in that, described preset temperature is between 40 ° of C to 50 ° of C.
9. equipment according to claim 8 is characterized in that, described preset temperature is 45 ° of C.
10. equipment according to claim 7 is characterized in that, described device is wafer, electronic circuit.
11. equipment according to claim 10 is characterized in that, described wafer is silicon chip.
12. equipment according to claim 7 is characterized in that, described air temperature regulator is air heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102461390A CN102954676A (en) | 2011-08-25 | 2011-08-25 | Method and equipment for removing alkaline solution on devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102461390A CN102954676A (en) | 2011-08-25 | 2011-08-25 | Method and equipment for removing alkaline solution on devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102954676A true CN102954676A (en) | 2013-03-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102461390A Pending CN102954676A (en) | 2011-08-25 | 2011-08-25 | Method and equipment for removing alkaline solution on devices |
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| CN (1) | CN102954676A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107771002A (en) * | 2016-08-15 | 2018-03-06 | 湖南中车时代电动汽车股份有限公司 | Electric machine controller cooling system and the method applied to the system |
Citations (5)
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|---|---|---|---|---|
| CN2489282Y (en) * | 2001-06-01 | 2002-05-01 | 山东泰山生力源集团股份有限公司 | Bottle dryer |
| CN101249718A (en) * | 2008-04-03 | 2008-08-27 | 汕头市东和机械有限公司 | Modified air blade device of plastic film or plastic sheet production equipment |
| JP2010177422A (en) * | 2009-01-29 | 2010-08-12 | Toppan Printing Co Ltd | Substrate drier |
| JP2010258035A (en) * | 2009-04-21 | 2010-11-11 | Shibaura Mechatronics Corp | Processing apparatus of substrate |
| CN102082208A (en) * | 2010-12-15 | 2011-06-01 | 苏州聚晶科技有限公司 | Air knife device for drying solar cell plates through blowing |
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2011
- 2011-08-25 CN CN2011102461390A patent/CN102954676A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2489282Y (en) * | 2001-06-01 | 2002-05-01 | 山东泰山生力源集团股份有限公司 | Bottle dryer |
| CN101249718A (en) * | 2008-04-03 | 2008-08-27 | 汕头市东和机械有限公司 | Modified air blade device of plastic film or plastic sheet production equipment |
| JP2010177422A (en) * | 2009-01-29 | 2010-08-12 | Toppan Printing Co Ltd | Substrate drier |
| JP2010258035A (en) * | 2009-04-21 | 2010-11-11 | Shibaura Mechatronics Corp | Processing apparatus of substrate |
| CN102082208A (en) * | 2010-12-15 | 2011-06-01 | 苏州聚晶科技有限公司 | Air knife device for drying solar cell plates through blowing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107771002A (en) * | 2016-08-15 | 2018-03-06 | 湖南中车时代电动汽车股份有限公司 | Electric machine controller cooling system and the method applied to the system |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20130306 |