CN102950657B - 脆性材料基板断裂装置 - Google Patents

脆性材料基板断裂装置 Download PDF

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Publication number
CN102950657B
CN102950657B CN201210168407.6A CN201210168407A CN102950657B CN 102950657 B CN102950657 B CN 102950657B CN 201210168407 A CN201210168407 A CN 201210168407A CN 102950657 B CN102950657 B CN 102950657B
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CN
China
Prior art keywords
substrate
bed plate
pair
line
blade
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201210168407.6A
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English (en)
Chinese (zh)
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CN102950657A (zh
Inventor
菅田充
村上健二
武田真和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN102950657A publication Critical patent/CN102950657A/zh
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Publication of CN102950657B publication Critical patent/CN102950657B/zh
Expired - Fee Related legal-status Critical Current
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  • Engineering & Computer Science (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
CN201210168407.6A 2011-08-26 2012-05-28 脆性材料基板断裂装置 Expired - Fee Related CN102950657B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-184297 2011-08-26
JP2011184297A JP5548172B2 (ja) 2011-08-26 2011-08-26 脆性材料基板ブレイク装置

Publications (2)

Publication Number Publication Date
CN102950657A CN102950657A (zh) 2013-03-06
CN102950657B true CN102950657B (zh) 2016-03-09

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ID=47760329

Family Applications (1)

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CN201210168407.6A Expired - Fee Related CN102950657B (zh) 2011-08-26 2012-05-28 脆性材料基板断裂装置

Country Status (4)

Country Link
JP (1) JP5548172B2 (ko)
KR (1) KR101449106B1 (ko)
CN (1) CN102950657B (ko)
TW (1) TWI488230B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015034112A (ja) * 2013-08-09 2015-02-19 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
JP6268917B2 (ja) * 2013-10-25 2018-01-31 三星ダイヤモンド工業株式会社 ブレイク装置
JP6243699B2 (ja) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
JP6528356B2 (ja) * 2014-03-28 2019-06-12 三星ダイヤモンド工業株式会社 樹脂シートの分断方法
JP2016040079A (ja) * 2014-08-12 2016-03-24 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及び分断装置
JP6481465B2 (ja) * 2014-08-21 2019-03-13 三星ダイヤモンド工業株式会社 複合基板のブレイク方法
KR101669503B1 (ko) * 2016-09-19 2016-10-26 김성규 SiC 링의 제조방법
JP6460267B2 (ja) * 2018-01-29 2019-01-30 三星ダイヤモンド工業株式会社 ブレーク装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61215008A (ja) * 1985-03-20 1986-09-24 株式会社日立製作所 セラミツク基板の分割方法
JPH08268728A (ja) * 1995-01-30 1996-10-15 Futaba Corp 基板切断装置
JP2010149495A (ja) * 2008-11-26 2010-07-08 Laser Solutions Co Ltd 基板割断装置
CN101792254A (zh) * 2009-01-30 2010-08-04 三星钻石工业股份有限公司 脆性材料基板的断开装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4287090B2 (ja) 2002-01-15 2009-07-01 Ｔｏｗａ株式会社 樹脂封止済基板の切断用治具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61215008A (ja) * 1985-03-20 1986-09-24 株式会社日立製作所 セラミツク基板の分割方法
JPH08268728A (ja) * 1995-01-30 1996-10-15 Futaba Corp 基板切断装置
JP2010149495A (ja) * 2008-11-26 2010-07-08 Laser Solutions Co Ltd 基板割断装置
CN101792254A (zh) * 2009-01-30 2010-08-04 三星钻石工业股份有限公司 脆性材料基板的断开装置

Also Published As

Publication number Publication date
KR101449106B1 (ko) 2014-10-08
TW201310515A (zh) 2013-03-01
KR20130023067A (ko) 2013-03-07
CN102950657A (zh) 2013-03-06
JP2013043414A (ja) 2013-03-04
JP5548172B2 (ja) 2014-07-16
TWI488230B (zh) 2015-06-11

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Granted publication date: 20160309

Termination date: 20190528

CF01 Termination of patent right due to non-payment of annual fee