CN102945837A - 一种半导体模块结构以及该结构中键合线的连接固定方法 - Google Patents

一种半导体模块结构以及该结构中键合线的连接固定方法 Download PDF

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CN102945837A
CN102945837A CN2012104117778A CN201210411777A CN102945837A CN 102945837 A CN102945837 A CN 102945837A CN 2012104117778 A CN2012104117778 A CN 2012104117778A CN 201210411777 A CN201210411777 A CN 201210411777A CN 102945837 A CN102945837 A CN 102945837A
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王豹子
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Xi'an Zhongche Yongji Electric Co Ltd
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Abstract

本发明所公开的半导体模块结构及该结构中键合线的连接固定方法,通过在芯片及DBC基板与键合线的键合点处设置弹性胶体,并使得弹性胶体在键合脚与弧线底部堆积形成胶点。在模块工作的过程中,可以有效减小甚至消除键合线弧线的周期性振动,从而避免键合线键合脚与弧线起点处出现断裂的情况,保证模块的可靠性,延长模块的使用寿命。

Description

一种半导体模块结构以及该结构中键合线的连接固定方法
技术领域
本发明属于电力半导体模块制造技术领域,具体涉及一种半导体模块结构以及该结构中键合线的连接固定方法。
背景技术
键合线键合的过程,实质是键合机的焊具牵引着键合线,焊具在设备产生的超声能控制下,分别将芯片的电极表面、DBC基板覆铜层表面的金属镀层与键合线表面的原子激活,完成芯片及DBC基板与键合线的键合,实现芯片的电路连接。
铝线键合是电力半导体模块封装常用的芯片电连接方法。铝线键合具有键合点小,对芯片损坏性小,连接灵活等优点。但在电力半导体模块封装中,键合铝线受通流能力限制,经常多条键合铝线集中在一起,相互之间间距较小,而模块的灌封胶体固化后呈现弹性,因此在通流状态下,键合铝线受电磁场和灌封弹性胶体的作用,键合铝线弧线部分会出现周期性振动,特别对于高频大电流模块,键合铝线的振动频率和振动幅度会更大。因铝线的材质较软,若模块经常在高频大电流状态下工作,键合铝线就很容易在键合脚和弧线起点处出现断裂,从而导致模块失效,影响模块的可靠性,降低模块的使用寿命。
因此,有必要提出一种能够有效消除或者降低键合铝线的周期性振动,以解决电力半导体模块键合铝线连接封装中的技术难题。
发明内容
有鉴于此,本发明提供一种能够有效消除或降低键合铝线的周期性震荡的半导体模块结构以及该结构中键合线的连接固定方法,从而避免键合铝线键合脚与弧线起点处出现断裂的情况,保证模块的可靠性,延长模块的使用寿命。
根据本发明的目的提出的一种半导体模块结构,包括DBC基板,设置于所述DBC基板上的焊料层与芯片,以及一端与所述芯片焊接固定另一端与所述DBC基板焊接固定的键合线;所述芯片、DBC基板与所述键合线焊接处形成键合点,所述键合点处设置有弹性胶体,且所述弹性胶体在键合脚处以及所述键合线的弧线底部堆积形成胶点。
优选的,所述弹性胶体为硅橡胶。
优选的,所述弹性胶体在所述键合脚与所述弧线底部堆积形成的胶点的高度为1-5mm。
优选的,所述弹性胶体在所述键合脚与所述弧线底部堆积形成的胶点的高度为1-3mm。
优选的,所述弹性胶体在所述键合脚与所述弧线底部堆积形成的胶点的高度为2mm。
一种键合线的连接固定方法,用于连接固定所述的半导体模块结构,包括以下步骤:
通过键合机的焊具牵引键合线,焊具在设备产生的超声能控制下,分别将芯片的电极表面、DBC基板覆铜层表面的金属镀层与键合线表面的原子激活,完成芯片及DBC基板与键合线的键合;
采用弹性胶体在第一步骤中产生的键合点处进行点胶操作;
弹性胶体在芯片及DBC基板与键合线的键合脚以及键合线的弧线底部堆积形成胶点;
在常温或高温下固化弹性胶体。
与现有技术相比,本发明所述的半导体模块结构以及该结构中键合线的连接固定方法的优点是:目前不存在能有效克服键合铝线弧线部分出现的周期性振动的方法,键合铝线容易在键合脚和弧线起点处出现断裂,从而导致模块失效,影响模块的可靠性。本发明所公开的半导体模块结构以及该结构中键合线的连接固定方法,通过在芯片及DBC基板与键合线的键合点处设置弹性胶体,并使得弹性胶体在键合脚与弧线底部堆积形成胶点。在模块工作的过程中,可以有效减小甚至消除键合线的周期性振动,从而避免键合线键合脚与弧线起点处出现断裂的情况,保证模块的可靠性,延长模块的使用寿命。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明公开的一种半导体模块结构的示意图。
图中的数字或字母所代表的相应部件的名称:
1、DBC基板 2、焊料层 3、芯片 4、键合线 5、胶点 6、键合脚 7、键合点
具体实施方式
现有的键合铝线受电磁场和灌封弹性胶体的作用,键合铝线弧线部分会出现周期性振动,由于铝线的材质较软,模块经常在高频大电流状态下工作,键合铝线易在键合脚和弧线起点处出现断裂,从而导致模块失效,影响模块的可靠性等诸多问题。
本发明针对现有技术中的不足,提出的一种可以有效的减少甚至消除键合线键合脚与弧线起点处的周期性振动,保证模块使用寿命的半导体模块结构以及该结构中键合线的连接固定方法,通过在芯片及DBC基板与键合线的键合点处设置弹性胶体,通过弹性胶体的作用,可以有效缓冲或消除振动,避免出现键合脚与弧线起点处的断裂情况,保证模块的有效性及使用寿命。
请参考图1,图1为本发明公开的一种半导体模块结构的示意图。如图所示,本发明公开的一种半导体模块结构,包括DBC基板1,设置于DBC基板1上的焊料层2与芯片3,以及一端与芯片3焊接固定另一端与DBC基板1焊接固定的键合线4;芯片3、DBC基板1与键合线4焊接处形成键合点7,键合点7处设置有弹性胶体,弹性胶体在键合脚6与键合线的弧线底部堆积形成胶点5,弧线底部即在弧线起点位置处。由于弹性胶体具有一定的弹性,当电力半导体模块工作在高频大电流状态下时,虽然键合线弧线部分也会产生高频振动,但键合脚与键合线弧线底部的堆积胶体能够有效的减弱甚至消除键合脚和键合线弧线底部的振动振幅,可防止键合线在键合脚与键合线弧线起点处断裂而导致模块失效,降低键合线在电磁场作用下的振动,保证了模块的可靠性,延长模块的使用寿命,减小使用成本。
其中,弹性胶体可为硅橡胶。硅橡胶具有优良的耐高温、低温性能,适合工作环境温度范围为-70℃~280℃,固化后既柔软又有韧性,弹性性能较好,可有效的缓冲振动。此外,硅橡胶耐化学腐蚀性能好,抗油、防水、耐热老化与耐气候老化,以及耐臭氧、氧、光等,使用寿命较长,且具有高绝缘性能,便于在半导体模块中的使用。
此外,弹性胶体除采用硅橡胶外还可采用硅胶或其他弹性胶体,可有效缓冲振动即可,具体不做限制。
一种键合线的连接固定方法,用于连接固定半导体模块结构,包括以下步骤:
S1:通过键合机的焊具牵引键合线,焊具在设备产生的超声能控制下,分别将芯片的电极表面、DBC基板覆铜层表面的金属镀层与键合线表面的原子激活,完成芯片及DBC基板与键合线的键合;
S2:采用弹性胶体在第一步骤中产生的键合点处进行点胶操作;
S3:弹性胶体在芯片及DBC基板与键合线的键合脚以及键合线的弧线底部堆积形成胶点;
S4:在常温或高温下固化弹性胶体。
根据该连接固定方法处理后得到的半导体模块结构,可以有效减小甚至消除周期性振动,从而避免键合脚与弧线起点处出现断裂的情况,保证模块的可靠性,延长模块的寿命。
胶点堆积的高度对半导体模块的结构及其性能也存在相应的影响。因此胶点堆积的高度也是本发明的重要技术点。
下面将通过具体实施方式对本发明的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1
弹性胶体在键合脚6与弧线的底部堆积形成的胶点3的高度为1mm,其堆积形状不做限定。
胶点的堆积高度相对较小,一方面可以减少弹性胶体的使用量,另一方面,可避免弹性胶体堆积过多对半导体模块的其他性能产生影响,影响半导体模块的使用。
实施例2
其余与实施例1相同,不同之处在于,弹性胶体在键合脚与弧线底部堆积形成的胶点的高度为5mm,其堆积形状不做限定。
胶点的堆积高度相对较高,可以提高弹性胶体的弹性性能,保证键合脚及弧线底部的连接有效性,避免出现键合脚及弧线起点处的断裂情况,保证半导体模块的有效性,提高半导体模块的使用寿命,减少使用成本。
实施例3
其余与实施例1相同,不同之处在于,弹性胶体在键合脚与弧线底部堆积形成的胶点的高度为3mm,其堆积形状不做限定。
胶点的堆积高度相对较高,可以提高弹性胶体的弹性性能,保证键合脚及弧线底部的连接有效性,避免出现断裂情况,保证半导体模块的有效性,提高半导体模块的使用寿命,减少使用成本。
实施例4
其余与实施例1相同,不同之处在于,弹性胶体在键合脚与弧线底部堆积形成的胶点的高度为2mm。
该实施例为本发明最优的实施例,通过将胶点的高度设定为2mm,一方面弹性胶体的使用量较少,使用成本较低,另一方面,2mm的胶点高度可充分的将键合脚及弧线底部有效固定,且其弹性程度已经满足缓冲与消除振动的要求,在保证半导体模块有效性的同时,又节省了弹性胶体的使用量。
实施例5
其余与实施例1相同,不同之处在于,弹性胶体在键合脚与弧线底部堆积形成的胶点的高度为5mm,其堆积形状不做限定。
胶点的堆积高度相对较高,可以提高弹性胶体的弹性性能,保证键合脚及弧线底部的连接有效性,避免出现断裂情况,保证半导体模块的有效性,提高半导体模块的使用寿命,减少使用成本。
此外,除上述实施例提及的胶点高度外,胶点高度还可为1.5mm、2.5mm、3.5mm、4.5mm等,具体高度视情况而定,在此不做限制。
目前不存在能有效克服键合铝线弧线部分出现的周期性振动的方法,键合铝线容易在键合脚和弧线起点处出现断裂,从而导致模块失效,影响模块的可靠性。本发明所公开的半导体模块结构以及该结构中键合线的连接固定方法,通过在芯片及DBC基板与键合线的键合点处设置弹性胶体,并使得弹性胶体在键合脚与弧线底部堆积形成胶点。在模块工作的过程中,可以有效减小甚至消除键合铝线的周期性振动,从而避免键合铝线键合脚与弧线起点处出现断裂的情况,保证模块的可靠性,延长模块的使用寿命。
对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下,在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (6)

1.一种半导体模块结构,包括DBC基板,设置于所述DBC基板上的焊料层与芯片,以及一端与所述芯片焊接固定另一端与所述DBC基板焊接固定的键合线;所述芯片、DBC基板与所述键合线焊接处形成键合点,其特征在于,所述键合点处设置有弹性胶体,且所述弹性胶体在键合脚处以及所述键合线的弧线底部堆积形成胶点。
2.如权利要求1所述的半导体模块结构,其特征在于,所述弹性胶体为硅橡胶。
3.如权利要求1或2所述的半导体模块结构,其特征在于,所述弹性胶体在所述键合脚与所述弧线底部堆积形成的胶点的高度为1-5mm。
4.如权利要求3所述的半导体模块结构,其特征在于,所述弹性胶体在所述键合脚与所述弧线底部堆积形成的胶点的高度为1-3mm。
5.如权利要求4所述的半导体模块结构,其特征在于,所述弹性胶体在所述键合脚与所述弧线底部堆积形成的胶点的高度为2mm。
6.一种键合线的连接固定方法,用于连接固定权利要求1所述的半导体模块结构,其特征在于,包括以下步骤:
通过键合机的焊具牵引键合线,焊具在设备产生的超声能控制下,分别将芯片的电极表面、DBC基板覆铜层表面的金属镀层与键合线表面的原子激活,完成芯片及DBC基板与键合线的键合;
采用弹性胶体在第一步骤中产生的键合点处进行点胶操作;
弹性胶体在芯片及DBC基板与键合线的键合脚以及键合线的弧线底部堆积形成胶点;
在常温或高温下固化弹性胶体。
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