CN102939544A - Pad pattern repair apparatus - Google Patents
Pad pattern repair apparatus Download PDFInfo
- Publication number
- CN102939544A CN102939544A CN2011800180136A CN201180018013A CN102939544A CN 102939544 A CN102939544 A CN 102939544A CN 2011800180136 A CN2011800180136 A CN 2011800180136A CN 201180018013 A CN201180018013 A CN 201180018013A CN 102939544 A CN102939544 A CN 102939544A
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- China
- Prior art keywords
- chamber
- substrate
- equipment
- weld pad
- stage
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Mathematical Physics (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemical Vapour Deposition (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a pad pattern repair apparatus. The present invention provides an apparatus for repairing defects in pad electrodes equipped for applying signals to one of multiple substrates, comprising a stage into the reference surface of which the substrate is loaded; a chamber where a first exhaust, a shield gas outlet, and a second exhaust are formed sequentially in the lower surface of the chamber with respect to a laser light emission hole being equipped on the stage and moving to the defect position of the pad electrode and having structure to discharge purifying gas and raw gas in the middle of the hole; ; and a clamp being installed on the stage and supporting the opposite surface of a substrate adhered closely to the reference surface, the gap between the substrate and the lower surface of the chamber varying in the inside and outside of the lower surface of the chamber. A pad pattern repair apparatus according to the present invention maintains the pressure in the area where repairing a defect is carried out at a constant level, improving a process yield.
Description
Technical field
The present invention relates to weld pad pattern prosthetic appliance, relate in particular to the weld pad pattern prosthetic appliance of repairing the defective in the weld pad electrode, weld pad pattern prosthetic appliance is installed in the colored optical filtering substrates place and is used for the input detection signal.
Background technology
Fig. 1 illustrates the structure of traditional LC D panel 10, it comprises the detection signal input weld pad 16 that contacts for probe pin visual detection and probe unit and the OLB weld pad 16 that contacts with detection signal input weld pad when total test, detection signal input weld pad is made of the TFT substrate 12 that combines with laminated form and colored optical filtering substrates 14.
The structure of TAG film, anisotropic conductive film (ACF), LDI (LCD drive IC) and glass that weld pad 16 combines with keeping stacked on top of one another.
Especially, because in carrying out probe station when test contact area at probe tip, cause scratch or because the scratch that the particulate that produces in glass scribing or glass-cutting step causes or in weld pad 16, defective occurs because of the scratch that during other substrate of load/unload, produces and particulate.
Yet because the gap between the chamber in substrate and the place that is used for repairing as tradition remains unchanged, the air in restoring area can flow out the external world because of the pressure differential between restoring area and outside thereof, reduces the technique qualification rate.
Summary of the invention
The problem that institute's wish solves
Be devoted to finish the present invention to provide by the pressure in the zone of carrying out repair-deficiency being remained on the weld pad pattern prosthetic appliance that constant level is improved the technique qualification rate.
Technological means
The problem that solves in order to solve above-mentioned institute wish the invention provides and a kind ofly is equipped to the equipment that signal is put on the defective in the weld pad electrode of one of a plurality of substrates for reparation, and comprising: stage, substrate are loaded into the reference surface of stage; Chamber, the first floss hole, blanket gas outlet and the second floss hole are formed in the lower surface of chamber in order about laser emission port, chamber is provided on the stage and moves to the defective locations of weld pad electrode, and chamber has the structure with Purge gas and unstrpped gas discharge in the centre of laser emission port; And clamp, be installed on the stage and supporting surface to the surface of the substrate that closely attaches to reference surface, wherein the gap between the lower surface of substrate and chamber is in inside and the external change of the lower surface of chamber.
Change exporting defined interior zone with blanket gas and export to from blanket gas first and second perimeter of scope of the second floss hole according to the gap between substrate of the present invention and the chamber.
According to the gap between substrate of the present invention and the chamber in the interior zone that define about blanket gas outlet be identical the second perimeter that between first and second perimeter of the scope that exports to the second floss hole from blanket gas, is equipped with clamp.
Be adjusted at gap in first and second perimeter according to substrate of the present invention and chamber about interior zone.
In addition, also adopt the probe tip that is electrically connected to weld pad electrode and measuring resistance.
Weld pad pattern prosthetic appliance of the present invention is if dielectric film is arranged on the metal electrode of pattern, then by filling with correction, contact hole and connecting up and carry out repair-deficiency.
Weld pad pattern prosthetic appliance of the present invention is not if dielectric film is arranged on the metal electrode of pattern, then by carrying out repair-deficiency with wiring.
Weld pad pattern prosthetic appliance of the present invention if organic substance is arranged on the metal electrode of pattern, then removes organic substance.
Effect
Weld pad pattern prosthetic appliance according to the present invention is maintained at constant level with the pressure in the zone of carrying out repair-deficiency, and improves the technique qualification rate.
Description of drawings
The further understanding that presents is provided that comprises and the annexed drawings that is incorporated in the part of this instructions and consists of the part of this instructions illustrate the embodiment of presents and with the principle of instructions herein interpreted part:
Fig. 1 is the reduced graph of traditional LC D panel;
Fig. 2 and Fig. 3 illustrate the situation that weld pad pattern prosthetic appliance according to the present invention does not use clamp; And
Fig. 4 and Fig. 5 illustrate the situation of using clamp according to weld pad pattern prosthetic appliance of the present invention.
[primary clustering symbol description]
100 weld pad pattern prosthetic appliances
110 stages
120 chambers
121 laser emission ports
The outlet of 122 unstrpped gases
123 purified gas outlet
124 optical windows
125a the first floss hole
125b the second floss hole
126 outlets
130 clamps
1 first perimeter, zone
Zone 2 interior zones
3 second perimeters, zone
Embodiment
Narrate a embodiment according to weld pad pattern prosthetic device of the present invention below with reference to accompanying drawing.
As shown in Figures 2 and 3, weld pad pattern prosthetic appliance 100 according to a preferred embodiment of the present invention comprises stage 110, chamber 120 and driver part and clamp 130, and the function that will be equipped to the defect repair of signal application to weld pad 16 electrodes of the non-overlapping TFT substrate 12 of 14 of TFT substrate 12 and colored optical filtering substrates is provided.
Especially, weld pad pattern prosthetic appliance 100 relate to LCD or oled substrate (being called afterwards " substrate ") with drive the weld pad 16 that printed circuit board (PCB) (PCB) is connected and laser chemical vapor deposition (CVD) prosthetic appliance that relates to defective opening or that lack that is applied to repair in the metal electrode that occurs in weld pad 16.
The substrate 12,14 that is used for the defective of reparation weld pad 16 electrodes is loaded into the top of stage 110.For specified reference point when loading, be used in an end of the upper surface of stage 110 with reference to body 112.At this moment, reference body 112 preferably forms and crooked contacts with the end with substrate 12, one side of 14.
In other words, laser emission port 121 is formed in the chamber 120, is equipped with the laser emission port 121 of heating unit (be not presented at graphic in) to be installed in the upside of chamber 120 and as being used for the passage of Laser emission to the center of an end of chamber 120 at its topmost.Unstrpped gas outlet 122 is communicated with from extraneous gas provides the unstrpped gas of unit (be not presented at graphic in) circuit to be provided and to provide the unit to tilt to laser emission port 121 from unstrpped gas.Injection exports the 122 raw metal gases of discharging to be gathered in the bottommost of laser emission port 121 from unstrpped gas.
In chamber 120, an end that provides the external purification gas at the top place of unit that the purified gas outlet 123 of unit (be not presented at graphic in) is provided in unstrpped gas is provided allows Purge gas to flow to Purge gas to provide circuit.
In chamber 120, the optical window 124 that allows laser to pass through is installed in the top of purified gas outlet 123.By the O shape ring that the lower surface with chamber 120 contacts that optical window 124 is fixing airtight with the defence air.
In chamber 120, form respectively from laser emission port 121 beginning and be connected to the first floss hole 125a and the second floss hole 125b at the discharging unit for discharging of the lower surface of chamber 120.And with inflow direction and discharge mode that direction differs from one another and blanket gas outlet 126 is connected to blanket gas unit (be not presented at graphic in) is provided.
At this moment, blanket gas exports 126 injecting protective gas to avoid damaged substrate surface when the thin film deposition of weld pad 16.Simultaneously, because blanket gas outlet 126 is discharged outside to blanket gas with the pitch angle, and form air curtain, air curtain avoids the adduct of unreacted gas and reaction to leak.
Although be not presented at graphic in, the driver part that is installed in stage 110 places is the construction package that chamber 120 is moved towards X, Y and Z direction, it moves to laser emission port 121 defective locations of weld pad 16 electrodes.At this moment, driver part can be only mobile in X and Y-direction.
Simultaneously, the gap between the lower surface of chamber 120 and the substrate 12,14 is in inside and the external change of the lower surface of chamber 120.Thereby the discharge in the zone of carrying out defect repair and blowdown presssure maintain constant level.Reaching first and second perimeter that exports the scope of 126 to second floss hole 125b from blanket gas (zone 1, zone 3) in the interior zone (zone 2) of definition about blanket gas outlet 126, the gap between chamber 120 and the substrate 12,14 is different.
So forming the gap avoids at interior zone (zone 2) and is comprising that outside that air in the processing region in first and second perimeter (zone 1, zone 3) flows out to processing region produces the step of pressure differential when repairing the defective in weld pad 16 electrodes to have.In this embodiment, the end of supposing the TFT substrate 12 of gap from be installed in the first perimeter (zone 1) little by little increases to the colored optical filtering substrates 14 that is exposed to interior zone (zone 2) and to the stage 110 that is exposed to the second perimeter (regional 3).
Moreover, because the gap affects between chamber 120 and the substrate 12,14 is the deposition during defective in the metal electrode of repairing weld pad 16, preferably the gap in first and second perimeter (zone 1, zone 3) is adjusted about interior zone (zone 2).
Simultaneously, the major part of residual blanket gas, Purge gas and unstrpped gas is discharged by the first floss hole 125a.And when substrate 12,14 thickness are assumed to be 0.5mm, gap between chamber 120 and the substrate 12,14, being 0.5mm in the first perimeter (zone 1), is 1mm in interior zone (zone 2), is 1.5mm in the second perimeter (zone 3).At this moment, the gap between chamber 120 and the substrate 12,14 increases or reduces according to substrate 12,14 thickness.
In another different mode, in the gap between the lower surface that is formed on chamber 120 and substrate 12,14, the gap between the surface of the clamp 130 in being installed on the second perimeter (zone 3) and the lower surface of chamber 120 is identical or similar with interior zone (zone 2).Intention is controlled air-flow and pressure (with reference to figure 4 and Fig. 5) equably by maintaining in interior zone (zone 2) and the second perimeter (zone 3) in the lower surface of chamber 120 and substrate 12,14 gap.
That is to say that weld pad pattern prosthetic appliance 100 of the present invention is repaired the open area of the metal electrode that is installed in the weld pad 16 on the substrate 12 based on the method for connecting electrode in implementing the open area of depositing operation.And the order with correction, contact hole filling and wiring is carried out depositing operation.At this moment, if form dielectric film at the metal electrode of weld pad 16, carry out depositing operation with the order of correction, contact hole filling and wiring, if do not form dielectric film, then can need not to use correction and contact hole to fill to carry out defect repair by only applying wiring.In addition, if for example remaining in the organic substance of the adhesive agent on the metal electrode of weld pad 16 exists, remove organic substance in the corresponding region by applying UV laser, at this moment, with molybdenum (Mo), tungsten (W), copper (Cu), silver (Ag) and chromium (Cr) as the metal source that is used to form electrode.Moreover, for the zone of the metal electrode short circuit on substrate 12, by applying cutting technique the short-circuited region reparation is opened for electrical.And after the defective of repairing in metal electrode, the probe tip (be not presented at graphic in) that further is electrically connected to weld pad 16 electrodes by utilization and measures the weld pad electrode resistance is measured the resistance between the two ends of the metal electrode of weld pad 16 and is judged and process whether success.In addition, separate or additional hours around weld pad 16 at anisotropic conductive film (ACF), LDI (LCD drive IC) and film, can implement defect repair.
Although below provide detailed description of the present invention with reference to the preferred embodiments of the present invention, scope of the present invention is not implemented example and limits.Therefore, the knowledgeable that usually knows of the technical field of the invention should be appreciated that in every way modifications and changes the present invention and does not deviate from know-why of the present invention and category.
Claims (8)
1. equipment of be used for repairing the defective in being equipped to the weld pad electrode of the one that signal is put on a plurality of substrates comprises:
Stage, described substrate is loaded into the reference surface of described stage;
Chamber, the first floss hole, blanket gas outlet and the second floss hole are formed in the lower surface of described chamber in order about laser emission port, described chamber is provided on the described stage and moves to the defective locations of described weld pad electrode, and described chamber has the structure with Purge gas and unstrpped gas discharge in the centre of described laser emission port; And
Clamp, be installed on the described stage and supporting surface to the surface of the substrate that closely attaches to described reference surface,
Gap between the lower surface of wherein said substrate and described chamber is in inside and the external change of the lower surface of described chamber.
2. equipment as claimed in claim 1, the described gap between wherein said substrate and the described chamber change exporting defined interior zone with described blanket gas and export to from described blanket gas first and second perimeter of scope of described the second floss hole.
3. equipment as claimed in claim 1, the described gap between wherein said substrate and the described chamber export with described blanket gas in the defined interior zone with the second perimeter that between first and second perimeter of the scope that exports to described the second floss hole from described blanket gas, is equipped with clamp be identical.
4. equipment as claimed in claim 2 or claim 3, wherein said substrate and described chamber are adjusted described first and second perimeter with respect to the described gap of described interior zone.
5. equipment as claimed in claim 1 wherein also adopts the probe tip that is electrically connected to described weld pad electrode and measuring resistance.
6. equipment as claimed in claim 1, wherein when dielectric film is arranged on the metal electrode of pattern, by with revise, contact hole is filled and repair-deficiency is carried out in wiring.
7. equipment as claimed in claim 1 is not wherein when dielectric film is arranged on the metal electrode of pattern, by carrying out repair-deficiency with wiring.
8. equipment as claimed in claim 1 wherein when organic substance is arranged on the metal electrode of pattern, then removes organic substance.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100032185A KR101069809B1 (en) | 2010-04-08 | 2010-04-08 | Pad pattern repair apparatus |
| KR10-2010-0032185 | 2010-04-08 | ||
| PCT/KR2011/002423 WO2011126307A2 (en) | 2010-04-08 | 2011-04-06 | Pad pattern repair apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102939544A true CN102939544A (en) | 2013-02-20 |
| CN102939544B CN102939544B (en) | 2016-09-28 |
Family
ID=44763409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180018013.6A Active CN102939544B (en) | 2010-04-08 | 2011-04-06 | Pad pattern repair apparatus |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5529335B2 (en) |
| KR (1) | KR101069809B1 (en) |
| CN (1) | CN102939544B (en) |
| TW (1) | TWI450372B (en) |
| WO (1) | WO2011126307A2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108570660A (en) * | 2017-03-14 | 2018-09-25 | Hb技术有限公司 | Film forming device |
| CN108570665A (en) * | 2017-03-14 | 2018-09-25 | Hb技术有限公司 | Film forming device |
| CN108570664A (en) * | 2017-03-14 | 2018-09-25 | Hb技术有限公司 | Film forming device |
| CN111710301A (en) * | 2020-07-13 | 2020-09-25 | 京东方科技集团股份有限公司 | Display panel, preparation method and repair method thereof, and display device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102661935B1 (en) * | 2016-10-31 | 2024-04-26 | 엘지디스플레이 주식회사 | Atmosphereic pressure plasma irradiation apparatus, method of manufacturing display panel using the same and display panel |
| KR102067626B1 (en) * | 2016-12-14 | 2020-01-17 | 국민대학교산학협력단 | Laser chemical vapor deposition apparatus and method for forming thin film using the same |
| JP7292138B2 (en) * | 2019-07-23 | 2023-06-16 | 株式会社ジャパンディスプレイ | Display device repair system |
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| JP2005179705A (en) * | 2003-12-17 | 2005-07-07 | Sony Corp | Laser cvd apparatus |
| KR20080017767A (en) * | 2006-08-22 | 2008-02-27 | 삼성전자주식회사 | Apparatus of coating photoresist |
| KR20090028347A (en) * | 2007-09-14 | 2009-03-18 | 주식회사 코윈디에스티 | Flat panel display repair apparatus and flat panel display array inspection/repair apparatus |
| KR20090068824A (en) * | 2007-12-24 | 2009-06-29 | 주식회사 코윈디에스티 | Repair method for photo mask and apparatus of photo mask repair |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4334308B2 (en) * | 2003-09-24 | 2009-09-30 | オムロンレーザーフロント株式会社 | Wiring correction device |
| JP2005109223A (en) * | 2003-09-30 | 2005-04-21 | Sanyo Electric Co Ltd | Semiconductor device and display unit |
| JP4596118B2 (en) * | 2003-12-08 | 2010-12-08 | ソニー株式会社 | Laser CVD equipment |
-
2010
- 2010-04-08 KR KR1020100032185A patent/KR101069809B1/en active IP Right Grant
-
2011
- 2011-04-06 CN CN201180018013.6A patent/CN102939544B/en active Active
- 2011-04-06 WO PCT/KR2011/002423 patent/WO2011126307A2/en active Application Filing
- 2011-04-06 JP JP2013503677A patent/JP5529335B2/en active Active
- 2011-04-07 TW TW100111970A patent/TWI450372B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005179705A (en) * | 2003-12-17 | 2005-07-07 | Sony Corp | Laser cvd apparatus |
| KR20080017767A (en) * | 2006-08-22 | 2008-02-27 | 삼성전자주식회사 | Apparatus of coating photoresist |
| KR20090028347A (en) * | 2007-09-14 | 2009-03-18 | 주식회사 코윈디에스티 | Flat panel display repair apparatus and flat panel display array inspection/repair apparatus |
| KR20090068824A (en) * | 2007-12-24 | 2009-06-29 | 주식회사 코윈디에스티 | Repair method for photo mask and apparatus of photo mask repair |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108570660A (en) * | 2017-03-14 | 2018-09-25 | Hb技术有限公司 | Film forming device |
| CN108570665A (en) * | 2017-03-14 | 2018-09-25 | Hb技术有限公司 | Film forming device |
| CN108570664A (en) * | 2017-03-14 | 2018-09-25 | Hb技术有限公司 | Film forming device |
| CN111710301A (en) * | 2020-07-13 | 2020-09-25 | 京东方科技集团股份有限公司 | Display panel, preparation method and repair method thereof, and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5529335B2 (en) | 2014-06-25 |
| TW201203484A (en) | 2012-01-16 |
| CN102939544B (en) | 2016-09-28 |
| TWI450372B (en) | 2014-08-21 |
| WO2011126307A2 (en) | 2011-10-13 |
| JP2013524018A (en) | 2013-06-17 |
| KR101069809B1 (en) | 2011-10-04 |
| WO2011126307A3 (en) | 2011-12-29 |
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Effective date of registration: 20190710 Address after: Gyeonggi Do, South Korea Co-patentee after: Suzhou Keyun Laser Technology Co., Ltd. Patentee after: Coinst Corporation Address before: South Korea Gyeonggi Do Anyang Patentee before: Cowindst Co. Ltd |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210408 Address after: No.818 Wusong Road, Guoxiang street, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou Keyun Laser Technology Co.,Ltd. Address before: Han Guojingjidao Patentee before: COWINDST Co.,Ltd. Patentee before: Suzhou Keyun Laser Technology Co.,Ltd. |
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| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 215100 no.668, Songwei Road, Guoxiang street, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Keyun Laser Technology Co.,Ltd. Address before: No.818 Wusong Road, Guoxiang street, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: Suzhou Keyun Laser Technology Co.,Ltd. |