CN101989014A - Display panel, assembling method thereof and liquid crystal display - Google Patents
Display panel, assembling method thereof and liquid crystal display Download PDFInfo
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- CN101989014A CN101989014A CN2009101653023A CN200910165302A CN101989014A CN 101989014 A CN101989014 A CN 101989014A CN 2009101653023 A CN2009101653023 A CN 2009101653023A CN 200910165302 A CN200910165302 A CN 200910165302A CN 101989014 A CN101989014 A CN 101989014A
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Abstract
The invention discloses a display panel, an assembling method thereof and a liquid crystal display. The display panel comprises a first substrate, a second substrate and a gap piece, wherein the first substrate comprises a common potential line and at least one testing line separated from the common potential line; the second substrate is configured above the first substrate; the gap piece is configured between the first substrate and the second substrate; at least one conducting particle is arranged inside the gap piece; and the common potential line is electrically connected with the testing line through the conducting particles. Because the common potential line is electrically connected with the at least one testing line, the testing line can be used as a common potential line. On one hand, the testing line is not needed to be cut and the step of cutting technology can be reduced; on the other hand, the testing line is electrically connected with the common potential line so as to further reduce the impedance of the common potential line.
Description
Technical field
The present invention relates to a kind of display panel and assemble method thereof and LCD, and particularly relate to a kind of display panel (display panel) and assemble method and LCD (Liquid Crystal Display) with at least one p-wire.
Background technology
Along with the maturation of photoelectric technology and semiconductor fabrication in recent years, (Flat PanelDisplay) is just flourish for flat-panel screens, wherein LCD is based on advantage such as its low voltage operating, radiationless line scattering, in light weight and volume be little, replaces traditional cathode-ray tube display gradually and becomes the main flow of display product in recent years.LCD mainly comprises display panel, liquid crystal layer and backlight module (back light module), and wherein display panel is made of two substrates up and down, and liquid crystal layer is disposed between this two substrates.
Generally when making display panel,, can make the size of single motherboard comprise a plurality of substrates, and after finishing detection and repairing, again motherboard is cut into a plurality of substrates in order to reach mass-produced purpose.Specifically, Figure 1A and Figure 1B are for looking synoptic diagram on the regional area of known motherboard.Please refer to Figure 1A, motherboard 10A goes up except comprising a plurality of substrates 12, comprises that also many p-wires (testing line) 14 are to detect these substrates 12.After finishing substrate 12 detections, need p-wire 14 is opened circuit so that each substrate 12 can independently operate.Because the p-wire 14 that opens circuit is in (floating) state of floating, may influence the signal and the image quality of display panel, the zone that most display panel design meeting can be excised p-wire 14 designs on motherboard 10A for example is a Cutting Road (Scribe line) 16.So, the available area of motherboard 10A can be restricted, and also may increase extra step to cut away the zone at p-wire 14 places in the technology of cutting.Above-mentioned two kinds of situations are neither to be beneficial to the lifting of output and the reduction of production cost.
In addition, in the making, during undersized display panel, in order to increase substrate 12 numbers that single motherboard 10A can cut, even with the interior zone of p-wire 14 designs at substrate.As the motherboard 10B that Figure 1B illustrated, when motherboard 10B cut into substrate 12, p-wire 14 was still stayed substrate 12 inside, just among the non-display area R corresponding to display panel.Therefore, do not need p-wire 14 designs on Cutting Road (shown in Figure 1A), to reduce the cutting step of single motherboard 10B.But, the p-wire 14 that opens circuit still is in floating state, and more close with the portion of terminal or the line areas of substrate 12, has therefore increased to disturb the signal of display panel and the possibility of image quality.
Summary of the invention
The invention provides a kind of display panel, the p-wire that can solve motherboard disturbs the problem of the signal of display panel.
The present invention provides a kind of LCD in addition, and its common potential line has good signal transmitting quality and cabling layout than tool elasticity.
The present invention provides a kind of assemble method of display panel again, the impedance in the time of can reducing common potential line transmission signals.
The present invention proposes a kind of display panel, and it comprises first substrate, second substrate and mediated clearance item.At least one p-wire that first substrate has the common potential line and separates with equipotential line together, and second substrate is disposed at first substrate top.In addition, mediated clearance item is disposed between first substrate and second substrate, and at least one conducting particles is arranged in the mediated clearance item, and the common potential line electrically connects via conducting particles and p-wire.
In the embodiment of above-mentioned display panel, also comprise liquid crystal layer, wherein mediated clearance item for example can be sealed in liquid crystal layer between first substrate and second substrate.
The present invention provides a kind of LCD in addition, comprise backlight module, aforesaid display panel and be disposed at first substrate and second substrate between liquid crystal layer.
In the embodiment of above-mentioned display panel and LCD, first substrate also comprises a plurality of conductive connection pads, electrically connect p-wire and common potential line accordingly, and conductive connection pads electrically connects mutually via conducting particles.In addition, the material of conductive connection pads can be indium tin oxide (indium tin oxide, ITO) or indium-zinc oxide (indium zinc oxide, IZO).
In the embodiment of above-mentioned display panel and LCD, mediated clearance item can be sealed in liquid crystal layer between first substrate and second substrate.
In the embodiment of above-mentioned display panel and LCD, the material of conducting particles comprises gold.
In the embodiment of above-mentioned display panel and LCD, mediated clearance item also comprises the fixedly colloid of conducting particles.
In the embodiment of above-mentioned display panel and LCD, second substrate has common electrode, and common electrode electrically connects via conducting particles with equipotential line together.
The present invention also provides a kind of assemble method of display panel, it may further comprise the steps: first motherboard and second motherboard are provided, wherein first motherboard is suitable for being cut into a plurality of first substrates, and second motherboard is suitable for being cut into a plurality of second substrates, first substrate is corresponding second substrate respectively, and each first substrate has common potential line and at least one p-wire; Provide test signal and common potential signal to this common potential line and this p-wire respectively, wherein this test signal and this shared signal are inequality in fact; Form a plurality of mediated clearance items on first motherboard or second motherboard, wherein mediated clearance item is formed at the edge of first substrate or second substrate accordingly, and in each mediated clearance item at least one conducting particles is arranged; Engage first motherboard and second motherboard, so that mediated clearance item is between first motherboard and second motherboard, and conducting particles electrically connects common potential line and p-wire on first substrate respectively after engaging this first motherboard and this second motherboard; And cut out first substrate and second substrate respectively by first motherboard and second motherboard.
In the embodiment of the assemble method of above-mentioned display panel, the material of conducting particles comprises gold.
In the embodiment of the assemble method of above-mentioned display panel, also comprise and insert liquid crystal between first substrate and second substrate.In addition, insert liquid crystal between first substrate and second substrate after, rejoin first motherboard and second motherboard.At this moment, insert the method for liquid crystal between first substrate and second substrate can comprise the formula injection method that drips (One drop fill, ODF).In addition, the assemble method of display panel also can be engaged after first motherboard and second motherboard by mediated clearance item, liquid crystal is filled between first substrate and second substrate again.At this moment, inserting the method for liquid crystal between first substrate and second substrate can be vacuum impregnation.
In the embodiment of the assemble method of above-mentioned display panel, electrically connect before the common potential line and p-wire on first substrate via conducting particles, also comprise by p-wire first substrate is tested.
In display panel of the present invention and assemble method and LCD, common potential line and at least one p-wire are electrically connected, so p-wire can be used as the usefulness of common potential line.In other words, p-wire does not need cut, and can reduce the step of cutting technique.On the other hand, p-wire electrically connects the impedance that then further reduces the common potential line with equipotential line together.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended diagram, be described in detail below.
Description of drawings
Figure 1A and Figure 1B are for looking synoptic diagram on the regional area of known motherboard.
Fig. 2 A is the assembling flow path synoptic diagram of the display panel of embodiments of the invention.
Fig. 2 B illustrates the assembling flow path synoptic diagram of the display panel of another embodiment of the present invention.
Fig. 3 is the schematic top plan view of the display panel of embodiments of the invention.
The diagrammatic cross-section that Fig. 4 is illustrated for the I-I ' hatching line along Fig. 3.
Fig. 5 A illustrates the partial enlarged drawing of regional A in the display panel of Fig. 3.
The diagrammatic cross-section that Fig. 5 B is illustrated along hatching line II-II ' for the display panel along Fig. 5 A.
Fig. 5 C illustrates the partial enlarged drawing into regional A in the display panel of another embodiment of the present invention.
Fig. 6 illustrates the exploded view of the LCD of the embodiment of the invention.
Description of reference numerals
10A, 10B: motherboard 12: substrate
14: p-wire 6: Cutting Road
110～150,230～250: step 300,300 ': display panel
314: p-wire 316: conductive connection pads
318: dielectric layer 318a: contact hole
330: liquid crystal layer 340,440: mediated clearance item
342: conducting particles 344: colloid
450: frame glue 600: LCD
610: backlight module 620: preceding frame
I-I ', II-II ': hatching line
P: viewing area R: non-display area
Embodiment
Fig. 2 A is the assembling flow path synoptic diagram of the display panel of the embodiment of the invention.Please, at first carry out step 110, first motherboard and second motherboard are provided earlier with reference to Fig. 2 A.First motherboard is suitable for being cut into a plurality of first substrates, and second motherboard is suitable for being cut into a plurality of second substrates.Corresponding respectively each second substrate of each first substrate, and each first substrate at least one p-wire of having the common potential line and separating with equipotential line together.In addition, can also have a plurality of conductive connection pads on first substrate, electrically connect common potential line and p-wire respectively accordingly.Generally speaking, on first motherboard, finish after the making of these first substrates, can detect each first substrate, to reach good quality management and control by above-mentioned p-wire.
Then, carry out step 120, form a plurality of mediated clearance items on first motherboard or second motherboard.Mediated clearance item can be formed at the edge of each first substrate or each second substrate accordingly, and at least one conducting particles is arranged in each mediated clearance item.For instance, the material of the conducting particles in mediated clearance item can comprise gold or other conductive materials.In addition, mediated clearance item can also comprise the colloid of fixing conducting particles or with mediated clearance item as frame glue.When mediated clearance item during as frame glue, frame glue can be around the edge of each first substrate or each second substrate, and at least one conducting particles is for example arranged in the frame glue.In addition, when mediated clearance item by conducting particles and when fixedly the colloid of conducting particles is formed, mediated clearance item for example is at least one gold size point.
Afterwards, carry out step 130, engage first motherboard and second motherboard.At this moment, first substrate can engage with its pairing second substrate respectively.With after second substrate engages, the common potential line on first substrate electrically connects p-wire via the conducting particles in the mediated clearance item at first substrate.When mediated clearance item was frame glue, first motherboard can engage by mediated clearance item with second motherboard.When mediated clearance item is gold size point or other when the mediated clearance item of conjugation can't be provided, then can additional configuration frame glue so that first motherboard is engaged with second motherboard.
Then, carry out step 140, insert liquid crystal between first substrate and second substrate.This step can be that liquid crystal is inserted in the frame glue institute region.On the practice, when engaging first motherboard and second motherboard, liquid crystal is not inserted in the frame glue institute region as yet, so each frame glue can remain with opening, so that insert liquid crystal between first substrate and second substrate.The method of inserting liquid crystal for example is to adopt vacuum impregnation.Certainly, in other embodiments, the method for inserting liquid crystal is not limited to vacuum impregnation, also can be other proper methods.In addition, with after first motherboard and the applying of second motherboard, also can select to carry out heat curing process, ultraviolet curing process or other suitable curing process so that mediated clearance item is solidified by frame glue according to the material of frame glue.
Afterwards, carry out step 150, cut first motherboard and second motherboard.In this step, first motherboard and second motherboard can cut out a plurality of first substrates and a plurality of second substrate respectively.In addition, can constitute display panel jointly via formed first substrate, second substrate and liquid crystal layer therebetween after assembling first motherboard and second motherboard and the cutting.It should be noted, in the assemble method of the display panel of present embodiment, also can carry out step 140.Replace, can after engaging and cutting first motherboard and second motherboard, then insert liquid crystal, or display panel shipment to downstream manufacturers that will not insert liquid crystal be inserted liquid crystal by downstream manufacturers again.
Fig. 2 B illustrates the assembling flow path synoptic diagram of the display panel of another embodiment of the present invention.Please refer to Fig. 2 B, in the assembling flow path of the display panel of present embodiment, step 110 to step 120 with identical described in the foregoing description, in this no longer repeat specification.In the present embodiment, after the completing steps 120, carry out step 230 earlier, insert liquid crystal between first substrate and second substrate.At this moment, the mode of inserting liquid crystal for example be adopt the formula injection method that drips (One drop fill, ODF).When mediated clearance item was frame glue, frame glue can fully center on the edge of first substrate or second substrate, so that liquid crystal splashes in frame glue institute region.Certainly, when mediated clearance item was not frame glue, first substrate or second substrate edges can additional configuration have frame glue.
Then, carry out step 240, first motherboard is engaged with second motherboard.At this moment, first substrate can engage with its pairing second substrate respectively.With after second substrate engages, the common potential line on first substrate electrically connects p-wire via the conducting particles in the mediated clearance item at first substrate.When mediated clearance item is not frame glue, can dispose at least one mediated clearance item and frame glue on first substrate simultaneously so that first motherboard is engaged with second motherboard.Thereupon, carry out step 250, cut out first substrate and second substrate respectively, to form a plurality of display panels by first motherboard and second motherboard.In addition, with after first motherboard and the applying of second motherboard, also can select to carry out heat curing process, ultraviolet curing process or other suitable curing process according to the material of mediated clearance item by frame glue so that mediated clearance item is solidified.
Hold above-mentionedly, in the assemble method of display panel of the present invention, the p-wire on first motherboard can be together electrically connects and for first substrate use that cuts out, so p-wire does not need to excise on first motherboard with equipotential line.Therefore, the present invention helps to reduce the cutting man-hour in the technology of display panel and promotes efficient.The embodiment of LCD that below proposes display panel of the present invention and use this display panel is to explain.
Fig. 3 is the schematic top plan view of the display panel of the embodiment of the invention, and the diagrammatic cross-section that Fig. 4 is illustrated for the I-I ' hatching line along Fig. 3.Please be simultaneously with reference to Fig. 3 and Fig. 4, the display panel 300 of present embodiment comprises first substrate 310, second substrate 320 and mediated clearance item 340.At least one p-wire 314 that first substrate 310 has common potential line 312 and separates with equipotential line 312 together.Second substrate 320 is disposed at first substrate, 310 tops.Mediated clearance item 340 and has at least one conducting particles 342 in the mediated clearance item 340 between first substrate 310 and second substrate 320.Illustrate a plurality of conducting particless 342 among Fig. 4 and be example, and can also comprise the fixedly colloid of conducting particles 342 in the mediated clearance item 340.In addition, second substrate 320 for example has common electrode 322, and common electrode 322 electrically connects with equipotential line 312 together via conducting particles 342.If display panel 300 is when being display panels, configurable between first substrate 310 and second substrate 320 have one deck liquid crystal layer 330.Yet the step of configuration liquid crystal layer 330 is not limited to be undertaken by the manufacturer of display panel 300, and can be undertaken by downstream manufacturers.
Fig. 5 A illustrates the partial enlarged drawing of regional A in the display panel of Fig. 3, does not wherein illustrate second substrate.In addition, Fig. 5 B has wherein illustrated second substrate for the diagrammatic cross-section that the display panel along Fig. 5 A is illustrated along hatching line II-II '.Please refer to Fig. 5 A and Fig. 5 B, first substrate 310 can also comprise a plurality of conductive connection pads 316.Each conductive connection pads 316 electrically connects p-wire 314 and common potential line 312 accordingly.In fact, can be coated with dielectric layer 318 on p-wire 314 and the common potential line 312.Simultaneously, can have on the dielectric layer 318, so that each conductive connection pads 316 electrically connects pairing p-wire 314 and common potential line 312 by contact hole 318a corresponding to a plurality of contact hole 318a on p-wire 314 and the common potential line 312.The material of conductive connection pads 316 can be indium tin oxide or indium-zinc oxide.In addition, in other embodiments, the material of conductive connection pads 316 also can be selected other conductive material for use.
In the present embodiment, the material of the conducting particles 342 in the mediated clearance item 340 for example comprises gold, and by conducting particles 342 each conductive connection pads 316 is electrically connected mutually.For example, mediated clearance item 340 can be made up of frame glue 344 and the one or more conducting particless 342 that intersperse among in the frame glue 344, and it is formed at the edge of first substrate 310 and second substrate 320.In other words, the mediated clearance item 340 that is scattered with conducting particles 342 can also can only be formed at the subregion at first substrate 310 and second substrate, 320 edges intactly around the edge of first substrate 310 and second substrate 320.When mediated clearance item 340 during intactly around first substrate 310 and second substrate, 320 edges, liquid crystal layer 330 can be sealed between first substrate 310 and second substrate 320 by mediated clearance item 340.
If mediated clearance item 340 only is made up of one or more conducting particles 342, but not frame glue, then mediated clearance item 340 also can only be formed at the subregion at first substrate 310 and second substrate, 320 edges.Can electrically connect common potential line 312 and p-wire 314 on first substrate 310 by mediated clearance item 340, even the common electrode 322 on the common potential line 312 and second substrate 320 is electrically connected.Certainly can also include the fixedly colloid of conducting particles in the mediated clearance item 340.
Furthermore, electrically connect mutually because conductive connection pads 316 is passed through conducting particles 342, so common potential line 312 also can be electrically connected to each other with p-wire 314.On the practice, can dispose one or many p-wires 314 in the display panel 300, any one or many can be passed through conducting particles 342 electric connection common potential lines 312 in these p-wires 314.Simultaneously, the setting of conducting particles 342 also can make the common electrode 322 on second substrate 320 electrically connect with equipotential line 312 together.So, p-wire 314 can be included in the scope of display panel 300.In addition, p-wire 314 is together with more helping to reduce whole impedance after equipotential line 312 parallel connections.
Fig. 5 C illustrates the partial enlarged drawing into regional A in the display panel of another embodiment of the present invention.Please refer to Fig. 5 C, display panel 300 ' is roughly the same with display panel 300, and the mediated clearance item 440 that wherein is disposed at display panel 300 ' is the gold size point.In addition, the frame glue 450 that also comprises the edge that is disposed at substrate (not indicating) in the display panel 300 '.Mediated clearance item 440 is disposed on the conductive connection pads 312, and mediated clearance item 440 comprises gold particle and colloid at least.Gold particle in the mediated clearance item 440 electrically connects these conductive connection pads 316, that is common potential line 312 can electrically connect with p-wire 314.Thus, the impedance of common potential line 312 can reduce effectively.
On the practice, mediated clearance item 440 is in order to electrically connecting conductive connection pads 316, and the relation between itself and the frame glue 450 does not limit.Present embodiment is to overlap with mediated clearance item 440 and frame glue 450 to be example, and mediated clearance item 440 can be positioned at outside 450 regions of frame glue in other embodiments, also can be positioned within 450 regions of frame glue.In addition,, need not have conducting particles in the frame glue 450, and only be formed during with gold size point by photocuring colloid or heat curing colloid as mediated clearance item 440.
In addition, p-wire 314 provides many barss circuit, drives a plurality of pixels on first substrate 310, and comprises sweep signal or data line at least.Shown in Fig. 5 A and Fig. 5 B, p-wire 314 electrically connects by contact hole 318a and corresponding conductive connection pads 316, and signal is sent to adjacent display panel (not illustrating) by conductive connection pads 316.Therefore at first substrate 310 with before second substrate 320 engages, having the p-wire 314 that the present invention designs provides the signal that is different in essence in common electric potential line 312.But with after second substrate 320 engages, p-wire 314 will electrically connect with common electric potential line 312 by mediated clearance item 440 and conductive connection pads 316 at first substrate 310, and have the signal identical with common electric potential line 312.
Fig. 6 illustrates the exploded view of the LCD of the embodiment of the invention.Please refer to Fig. 6, LCD 600 comprises the display panel 300 of backlight module 610 and Fig. 3.Wherein, display panel 300 has foregoing structure.In the present embodiment, when display panel 300 is display panels, so display panel 300 is disposed on the backlight module 610.Certainly, display panel 300 also can be replaced by the member of other spirit according to the invention.In addition, LCD 600 also can have preceding frame 620, uses so that display panel 300 more firm being configured on the backlight module 610.
In sum, in display panel of the present invention and assemble method thereof and the LCD, be originally after finishing test, not had the p-wire of purposes to electrically connect with equipotential line together.Thus, dispose the part of p-wire on the motherboard and need not excise, can simplify cutting technique step so that the process time of display panel shorten more.In addition, can reduce the impedance of common potential line integral body after common potential line and p-wire electrically connect, and then improve the quality of display panel and LCD.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; those of ordinary skill in the technical field under any; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention defines and is as the criterion when looking appended claim.
Claims (10)
1. display panel comprises:
First substrate, at least one p-wire that has the common potential line and separate with this common potential line;
Second substrate is disposed at this first substrate top; And
Mediated clearance item is disposed between this first substrate and this second substrate, wherein in this mediated clearance item at least one conducting particles is arranged, and this common potential line electrically connects via this conducting particles and this p-wire.
2. display panel as claimed in claim 1, wherein this first substrate also comprises a plurality of conductive connection pads, electrically connects this p-wire and this common potential line accordingly, a plurality of conductive connection pads electrically connect mutually via this conducting particles.
3. display panel as claimed in claim 1 also comprises liquid crystal layer, and wherein this mediated clearance item is sealed in this liquid crystal layer between this first substrate and this second substrate.
4. display panel as claimed in claim 1, wherein this second substrate has common electrode, and this common electrode electrically connects via this conducting particles and this common potential line.
5. LCD comprises:
Backlight module; And
Display panel is disposed on this backlight module, and this display panel comprises:
First substrate, at least one p-wire that has the common potential line and separate with this common potential line;
Second substrate is disposed at this first substrate top;
Liquid crystal layer is disposed between this first substrate and this second substrate; And
Mediated clearance item is disposed between this first substrate and this second substrate, wherein in this mediated clearance item at least one conducting particles is arranged, and this common potential line electrically connects via this conducting particles and this p-wire.
6. LCD as claimed in claim 5, wherein this first substrate also comprises a plurality of conductive connection pads, electrically connects this p-wire and this common potential line accordingly, a plurality of conductive connection pads electrically connect mutually via this conducting particles.
7. LCD as claimed in claim 5, wherein this mediated clearance item is sealed in this liquid crystal layer between this first substrate and this second substrate.
8. LCD as claimed in claim 5, wherein this second substrate has common electrode, and this common electrode electrically connects via this conducting particles and this common potential line.
9. the assemble method of a display panel comprises:
First motherboard and second motherboard are provided, wherein this first motherboard is suitable for being cut into a plurality of first substrates, and this second motherboard is suitable for being cut into a plurality of second substrates, respectively corresponding a plurality of second substrates of a plurality of first substrates, and respectively this first substrate has common potential line and at least one p-wire;
Provide test signal and common potential signal to this common potential line and this p-wire respectively, wherein this test signal and this shared signal are inequality in fact;
Form a plurality of mediated clearance items on this first motherboard or this second motherboard, wherein a plurality of mediated clearance items are formed at the edge of a plurality of first substrates or a plurality of second substrates accordingly, and respectively in this mediated clearance item at least one conducting particles are arranged;
Engage this first motherboard and this second motherboard, so that this mediated clearance item is between this first motherboard and this second motherboard, and a plurality of conducting particles is engaging respectively this common potential line and this p-wire on this first substrate of electric connection accordingly behind this first motherboard and this second motherboard; And
Cut out a plurality of first substrates and a plurality of second substrate respectively by this first motherboard and this second motherboard.
10. the assemble method of display panel as claimed in claim 9 also comprises and inserts liquid crystal between a plurality of first substrates and a plurality of second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101653023A CN101989014A (en) | 2009-08-05 | 2009-08-05 | Display panel, assembling method thereof and liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101653023A CN101989014A (en) | 2009-08-05 | 2009-08-05 | Display panel, assembling method thereof and liquid crystal display |
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| Publication Number | Publication Date |
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| CN101989014A true CN101989014A (en) | 2011-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101653023A Pending CN101989014A (en) | 2009-08-05 | 2009-08-05 | Display panel, assembling method thereof and liquid crystal display |
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| CN (1) | CN101989014A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102681238A (en) * | 2012-05-30 | 2012-09-19 | 深圳市华星光电技术有限公司 | Liquid crystal display device, panel and manufacturing method of panel |
| CN108508659A (en) * | 2018-05-30 | 2018-09-07 | 张家港康得新光电材料有限公司 | 2D/3D switchable optical modules motherboard, detection device, detection method and preparation method |
| CN109188743A (en) * | 2018-11-14 | 2019-01-11 | 惠科股份有限公司 | The production method and display device of display panel |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1740852A (en) * | 2004-08-06 | 2006-03-01 | 三星电子株式会社 | The substrate and the manufacture method thereof that are used for display board |
| CN1773357A (en) * | 2004-11-08 | 2006-05-17 | 三星电子株式会社 | Thin film transistor array panel to improve connection with test line |
| CN1832181A (en) * | 2006-02-28 | 2006-09-13 | 友达光电股份有限公司 | Display substrate |
| US20090185106A1 (en) * | 2008-01-18 | 2009-07-23 | Chi Mei Optoelectronics Corp. | Display panel, assembling method thereof and liquid crystal display |
-
2009
- 2009-08-05 CN CN2009101653023A patent/CN101989014A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1740852A (en) * | 2004-08-06 | 2006-03-01 | 三星电子株式会社 | The substrate and the manufacture method thereof that are used for display board |
| CN1773357A (en) * | 2004-11-08 | 2006-05-17 | 三星电子株式会社 | Thin film transistor array panel to improve connection with test line |
| CN1832181A (en) * | 2006-02-28 | 2006-09-13 | 友达光电股份有限公司 | Display substrate |
| US20090185106A1 (en) * | 2008-01-18 | 2009-07-23 | Chi Mei Optoelectronics Corp. | Display panel, assembling method thereof and liquid crystal display |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102681238A (en) * | 2012-05-30 | 2012-09-19 | 深圳市华星光电技术有限公司 | Liquid crystal display device, panel and manufacturing method of panel |
| WO2013177825A1 (en) * | 2012-05-30 | 2013-12-05 | 深圳市华星光电技术有限公司 | Liquid crystal display device, panel and panel manufacturing method |
| CN108508659A (en) * | 2018-05-30 | 2018-09-07 | 张家港康得新光电材料有限公司 | 2D/3D switchable optical modules motherboard, detection device, detection method and preparation method |
| CN109188743A (en) * | 2018-11-14 | 2019-01-11 | 惠科股份有限公司 | The production method and display device of display panel |
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Application publication date: 20110323 |