CN108508659A - 2D/3D switchable optical modules motherboard, detection device, detection method and preparation method - Google Patents
2D/3D switchable optical modules motherboard, detection device, detection method and preparation method Download PDFInfo
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- CN108508659A CN108508659A CN201810541266.5A CN201810541266A CN108508659A CN 108508659 A CN108508659 A CN 108508659A CN 201810541266 A CN201810541266 A CN 201810541266A CN 108508659 A CN108508659 A CN 108508659A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 163
- 238000001514 detection method Methods 0.000 title claims abstract description 56
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 238000012360 testing method Methods 0.000 claims abstract description 174
- 239000000758 substrate Substances 0.000 claims abstract description 86
- 239000000565 sealant Substances 0.000 claims abstract description 21
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims description 27
- 239000004973 liquid crystal related substance Substances 0.000 claims description 19
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 230000002159 abnormal effect Effects 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 47
- 238000000034 method Methods 0.000 description 22
- 239000002346 layers by function Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 210000003128 head Anatomy 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B30/00—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images
- G02B30/20—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images by providing first and second parallax images to an observer's left and right eyes
- G02B30/26—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images by providing first and second parallax images to an observer's left and right eyes of the autostereoscopic type
- G02B30/27—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images by providing first and second parallax images to an observer's left and right eyes of the autostereoscopic type involving lenticular arrays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133526—Lenses, e.g. microlenses or Fresnel lenses
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses 2D/3D switchable optical modules motherboard, detection device, detection method and preparation methods, including first substrate and second substrate；First substrate and the opposite side of second substrate are respectively arranged with the first transparency conducting layer and the second transparency conducting layer；2D/3D switchable optical module motherboards include multiple 2D/3D switchable opticals module areas；It is provided with sealant in the neighboring area in optics module area；Sealant forms sealing space with first substrate and second substrate；First transparency conducting layer includes mutually insulated first and second；Second position is in neighboring area；With the conducting sphere for being provided with conducting the first transparency conducting layer and the second transparency conducting layer in second overlapping sealant；First is connected with the first test cabling, and second is connected with the second test cabling.The present invention can carry out conducting sphere conduction detection after motherboard completes, the case where timely feedbacking poor flow, reduce the production of abnormal module, effectively improve back segment production capacity.
Description
Technical field
The present embodiments relate to stereo display technique more particularly to 2D/3D switchable optical modules motherboard, detection dresses
It sets, detection method and preparation method.
Background technology
In numerous technologies that 3 D stereo is shown, Naked stereoscopic displays exist due to being not necessarily to the advantages of viewer wears glasses
Favor is received in 3 D stereo display field.Currently, realizing that the major way of Naked stereo display techniques is by display surface
Before plate or after optics module is set, the pixel unit of display panel is divided into odd column pixel and even number in the horizontal direction
Row pixel utilizes viewer's left-eye image and right eye figure to provide two width different images respectively for the right and left eyes of viewer
The parallax effect of picture forms the depth of field, and then generates stereo display effect.
Fig. 1 is the structural schematic diagram of two-dimensional/three-dimensional in the prior art (2D/3D) switchable optical module, and Fig. 2 is Fig. 1
Shown 2D/3D switchable opticals module along AA ' sectional structure chart, with reference to figure 1 and Fig. 2, the 2D/3D switchable optical module packets
Include the first substrate 11 being oppositely arranged and second substrate 12；First substrate 11 and the opposite side of second substrate 12 are respectively arranged with
First transparency conducting layer 110 and the second transparency conducting layer 120,2D/3D switchable optical modules area further include viewing area 100 and enclose
Neighboring area 200 around viewing area is provided with sealant 13 in neighboring area 200, and is arranged around viewing area 100；Sealant
13 are clamped between first substrate 11 and second substrate 12, and sealing space is formed with first substrate 11 and second substrate 12；First
Transparency conducting layer 110 includes mutually insulated first 111 and second 112；It is located at neighboring area 200 for second 112；With second
The conducting sphere of conducting the first transparency conducting layer 110 and the second transparency conducting layer 120 is provided in the overlapping sealant 13 in portion 112
130.Optical functional layer 14 is provided between first substrate 11 and second substrate 12, optical functional layer 14 is in the first conductive layer 110
When being passed through test signal with the second transparency conducting layer 120, change refractive index, the emergent light of display panel is regulated and controled, is formed
The two images of corresponding right and left eyes, to realize 3D patterns.Wherein, the second conductive layer 120 is passed through test letter by conducting sphere 130
Number.
However, if the conducting sphere 130 being arranged in sealant 13 is not at compressed state, or without sealant 13
When highly high, poor flow is may result in, the second transparency conducting layer 120 does not receive drive signal, makes 2D/3D switchable opticals
Module driving failure.In the detection process of existing 2D/3D switchable opticals module, the macro -graph machine in front-end process can only
Detection includes fluid sealant badness, foreign matter in box, the problems such as prism lacks, liquid crystal is insufficient, and the problem of conducting sphere poor flow
Discovery rate is zero；The test of this problem can only carry out in back-end process, i.e., can only be in 2D/3D switchable optical module motherboards
After completing cutting operation, carrying out liquid crystal Turnover testing by three-dimensional test equipment could find, when carrying out the test process, leading portion
Processing procedure has produced large-tonnage product, if the problem cannot be carried out test feedback in time, is easy for causing high-volume poor flow
Module be produced, generate batch scrap.
Invention content
A kind of 2D/3D switchable opticals module motherboard of present invention offer and its detection device, detection method are realized anti-in time
The case where presenting poor flow reduces the production of abnormal module.
In a first aspect, an embodiment of the present invention provides a kind of 2D/3D switchable opticals module motherboards, including：
The first substrate and second substrate being oppositely arranged；The first substrate and the second substrate it is opposite side difference
It is provided with the first transparency conducting layer and the second transparency conducting layer；
The 2D/3D switchable opticals module motherboard includes multiple 2D/3D switchable opticals module areas；The multiple 2D/
3D switchable optical modules area includes viewing area and the neighboring area around the viewing area；
It is provided with sealant in the neighboring area, and is arranged around the viewing area；The sealant is clamped in described
Between first substrate and the second substrate, sealing space is formed with the first substrate and the second substrate；
First transparency conducting layer in each 2D/3D switchable optical modules area includes mutually insulated first and the
Two；The second position is in the neighboring area；
First transparency conducting layer and described second is connected with being provided in the described second overlapping sealant
The conducting sphere of transparency conducting layer；
Described first is connected with the first test cabling, and described second is connected with the second test cabling.
Optionally, cylindrical mirror layer is provided between the first substrate and the second substrate, the cylindrical mirror layer is located at described
In sealing space, liquid crystal layer, the liquid crystal layer are provided between the cylindrical mirror layer and the first substrate or the second substrate
In liquid crystal molecule be filled in the sealing space.
Optionally, the first test cabling and described second in the multiple 2D/3D switchable opticals module area is surveyed
Examination cabling extends to the edge of the 2D/3D switchable opticals module motherboard.
Optionally, further include multiple first connecting pins at the edge for being set to the 2D/3D switchable opticals module motherboard
Sub and multiple second connection end, every described first is tested the cabling first connection terminal connection corresponding with one；Often
The second connection end connection corresponding with one of second test cabling described in item.
Optionally, further include：First test bus and the second test bus；The multiple 2D/3D switchable opticals module
The a plurality of first test cabling in area is connect with the first test bus, a plurality of second test cabling and described second
Bus connection is tested, the first test bus and the second test bus extend to the 2D/3D switchable opticals module
The edge of motherboard.
Optionally, further include first connecting pin at the edge for being set to the 2D/3D switchable opticals module motherboard
Son and second connection end, the first test bus are connect with first connection terminal；Second test is total
Line is connect with second connection end.
Optionally, the first test cabling and the second test cabling material are metal or metal oxide.
Second aspect, the embodiment of the present invention additionally provide a kind of detection device of 2D/3D switchable opticals module motherboard, use
In carrying out conduction detection to any 2D/3D switchable optical module motherboards of first aspect, including：
Cutting assembly, the second substrate of the edge for cutting the 2D/3D switchable opticals module motherboard expose institute
State the first test cabling and the second test cabling on first substrate；
Power supply module, for testing cabling input test signal to the first test cabling and described second, to each institute
It states 2D/3D switchable optical modules area and carries out continuity test.
Optionally, the cutting assembly includes supporting rod and the cutter head that is slidably connected on the supporting rod.
The third aspect, the embodiment of the present invention additionally provide a kind of detection method of 2D/3D switchable opticals module motherboard, use
In any 2D/3D switchable optical module motherboards of detection first aspect, including：
The second substrate for cutting the edge of the 2D/3D switchable opticals module motherboard, exposes on the first substrate
It is described first test cabling and second test cabling；
To the first test cabling and the second test cabling input test signal, testing each 2D/3D can cut
Change the conducting situation in optics module area.
Fourth aspect, the embodiment of the present invention additionally provide a kind of preparation method of 2D/3D switchable opticals module, including：
Prepare the 2D/3D switchable optical module motherboards as described in the third aspect is any；
The second substrate for cutting the edge of the 2D/3D switchable opticals module motherboard, exposes on the first substrate
It is described first test cabling and second test cabling；
To the first test cabling and the second test cabling input test signal, testing each 2D/3D can cut
Change the conducting situation in optics module area；
The 2D/3D switchable opticals module motherboard is cut, multiple 2D/3D switchable opticals modules are formed.
2D/3D switchable opticals module motherboard provided in an embodiment of the present invention and its detection device, detection method, by
The first test cabling and second is not arranged and tests for first in each optical film group area of optics module motherboard and second part
Line can carry out conducting sphere continuity test, in advance after 2D/3D switchable optical module motherboards complete to entire motherboard
The time of conduction detection, conducting sphere conduction detection cannot be carried out in front process processing procedure by solving the prior art, be also easy to produce big
The problem of measuring bad module the case where to timely feedback poor flow, reduces the production of abnormal module, improves product yield,
Effectively improve back segment production capacity.
Description of the drawings
Fig. 1 is the structural schematic diagram of 2D/3D switchable opticals module in the prior art；
Fig. 2 is sectional structure chart of the modules of 2D/3D switchable opticals shown in Fig. 1 along AA '；
Fig. 3 is a kind of 2D/3D switchable opticals module motherboard structure schematic diagram provided in an embodiment of the present invention；
Fig. 4 is cross-sectional view of the modules of 2D/3D switchable opticals shown in Fig. 3 motherboard along BB '；
Fig. 5 is the cross-sectional view of another kind 2D/3D switchable optical module motherboards provided in an embodiment of the present invention；
Fig. 6 is the vertical view of another 2D/3D switchable optical module motherboard provided in an embodiment of the present invention；
Fig. 7 is the vertical view of another 2D/3D switchable optical module motherboard provided in an embodiment of the present invention；
Fig. 8 is the vertical view of another 2D/3D switchable optical module motherboard provided in an embodiment of the present invention；
Fig. 9 is that a kind of structure of the detection device of 2D/3D switchable opticals module motherboard provided in an embodiment of the present invention is shown
It is intended to；
Figure 10 is a kind of cutting assembly structural schematic diagram provided in an embodiment of the present invention；
Figure 11 is a kind of detection method flow chart of 2D/3D switchable opticals module motherboard provided in an embodiment of the present invention；
Figure 12 is a kind of preparation method flow chart of 2D/3D switchable opticals module provided in an embodiment of the present invention.
Specific implementation mode
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limitation of the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Fig. 3 is a kind of 2D/3D switchable opticals module motherboard structure schematic diagram provided in an embodiment of the present invention,
Fig. 4 is cross-sectional view of the modules of 2D/3D switchable opticals shown in Fig. 3 motherboard along BB ', with reference to figure 1, Fig. 3
And Fig. 4, the 2D/3D switchable optical module motherboards include：The first substrate 11 and second substrate 12 being oppositely arranged；First substrate
11 and the opposite side of second substrate 12 be respectively arranged with the first transparency conducting layer 110 and the second transparency conducting layer 120；2D/3D
Switchable optical module motherboard includes multiple 2D/3D switchable opticals module areas 300；Multiple 2D/3D switchable opticals module areas
300 include viewing area 100 and the neighboring area 200 around viewing area；It is provided with sealant 13 in neighboring area 200, and surrounds
Viewing area 100 is arranged；Sealant 13 is clamped between first substrate 11 and second substrate 12, with first substrate 11 and second substrate
12 form sealing space；The first transparency conducting layer 110 in each 2D/3D switchable optical modules area 300 includes mutually insulated
First 111 and second 112；It is located at neighboring area 200 for second 112；With setting in second 112 overlapping sealant 13
There is the conducting sphere 130 of conducting the first transparency conducting layer 110 and the second transparency conducting layer 120；It is connected with the first test for first 111
Cabling 151, second is connected with the second test cabling 152.
Wherein, each 2D/3D switchable opticals module area, can be with by cutting in the 2D/3D switchable optical module motherboards
Multiple 2D/3D switchable opticals modules are formed, regulate and control the emergent light of display panel by being positioned over the light emission side of display panel,
I.e. cooperation display panel realizes the switching of 2D/3D patterns.Therefore, in the 2D/3D switchable optical module motherboards, first substrate,
Second substrate and conductive layer are both needed to use transparent material, for example, first substrate and second substrate can be used glass substrate, first
Transparent conductive metal oxide film ITO or IGZO etc. can be selected in transparency conducting layer and the second transparency conducting layer.The 2D/3D can
In switchable optics module motherboard preparation process, the first transparency conducting layer 110 can be divided into first 111 of insulation by laser dry etching
With second 112, the first test cabling 151 and second, which is tested cabling 152 and is separately connected, to insulate on the first transparency conducting layer 110
First 111 and second 112, you can it is thin to the first electrically conducting transparent that cabling 152 is tested by the first test cabling 151 and second
Film 110 and the second transparent conductive film 120 are passed through test signal, to drive the light between first substrate 11 and second substrate 12
Functional layer is learned, i.e., confirms the conducting situation of conducting sphere 130 in sealant 13 by the changes of function of optical functional layer.
2D/3D switchable opticals module motherboard provided in an embodiment of the present invention, passes through each optics in optics module motherboard
First in the areas Mo Zu and second part do not connect the first test cabling and the second test cabling, can be switched in 2D/3D
After optics module motherboard completes, i.e., conducting sphere continuity test is carried out to entire motherboard, the time of shorting advance detection, solved
The prior art cannot carry out conducting sphere conduction detection in front process processing procedure, the problem of being also easy to produce a large amount of bad modules, from
And the case where timely feedbacking poor flow, the production of abnormal module is reduced, product yield is improved, effectively improves back segment production capacity；
It can retain first test when cutting 2D/3D switchable optical module motherboards form single 2D/3D switchable opticals module and walk
Line and the second test cabling, to carry out conducting sphere continuity test in each production detection process, instead of existing detection
Process is required to the 2D/3D switchable optical module connectors of detection device connection, avoids 2D/3D switchable optical modules company
The damage for connecing device, can be improved product yield.
Fig. 5 is the cross-sectional view of another kind 2D/3D switchable optical module motherboards provided in an embodiment of the present invention,
With reference to Figure 4 and 5, optionally, cylindrical mirror layer 141 is provided between first substrate 11 and second substrate 12, cylindrical mirror layer 141 is located at sealing
In space, liquid crystal layer 142, the liquid crystal in liquid crystal layer 142 are provided between cylindrical mirror layer 141 and first substrate 11 or second substrate 12
Molecule is filled in sealing space.
Specifically, the operation principle of 2D/3D switchable optical modules made of the 2D/3D switchable optical module motherboards
For：Cylindrical mirror layer 141 and liquid crystal layer 142 form optical functional layer 14, and the liquid crystal molecule in liquid crystal layer 142 is transparent first by loading
Drive signal control on electrode layer 110 and second transparency electrode layer 120, the refractive index of liquid crystal layer 142 change, and work as liquid crystal
When the refractive index difference of refractive index and the cylindrical mirror layer 141 of layer 142, cylindrical mirror in cylindrical mirror layer 141 to the emergent light of display panel into
It goes and converges and divide as the left and right eye pattern at corresponding right and left eyes, the 3D patterns of the realization of optical functional layer 14 at this time；When the folding of liquid crystal layer 142
Penetrate rate it is identical as the refractive index of cylindrical mirror layer 141 when, optical functional layer 14 no longer has the convergence point of cylindrical mirror layer 141 as effect, this
When optical functional layer 14 realize 2D patterns.
The conducting of conducting sphere in sealant can be carried out after completing in order to facilitate 2D/3D switchable optical module motherboards
The test of situation can test first in each 2D/3D switchable opticals module area the wiring of cabling and the second test cabling
Mode carries out design appropriate.Fig. 6 is the vertical view of another 2D/3D switchable optical module motherboard provided in an embodiment of the present invention
Figure, with reference to figure 6, optionally, the first test cabling 151 and second in multiple 2D/3D switchable opticals module areas tests cabling
152 extend to the edge of 2D/3D switchable optical module motherboards.It completes as a result, in 2D/3D switchable optical module motherboards
Afterwards, it need to only be cut at motherboard edge, expose in each 2D/3D switchable opticals module area the first test cabling 151 and the
Two test cablings 152, and tested in cabling 152 to the first test cabling 151 and second and be passed through test signal and can be tested.
Optionally, the first test cabling and the second test cabling material are metal or metal oxide.
The first test cabling and the second test cabling are preferably connected in order to facilitate detection device, the embodiment of the present invention provides
Another 2D/3D switchable optical module motherboard, Fig. 7 is another 2D/3D switchable optical provided in an embodiment of the present invention
The vertical view of module motherboard, with reference to figure 7, optionally, which further includes be set to edge more
A first connection terminal 21 and multiple second connection end 22, first connection corresponding with one of every first test cabling 151
Terminal 21 connects；22 connection of second connection end corresponding with one of every second test cabling 152.By the way that connection terminal is arranged,
It can correspond to and connectivity port is set in test equipment, be connected by the matching of connection terminal and connectivity port, it can be by detection device
Automatic test is carried out to each 2D/3D switchable opticals module area in each 2D/3D switchable opticals module motherboard, is reduced manual
Connect the complicated processes that the first test cabling 151 and second in each 2D/3D switchable opticals module area tests cabling 152.
Fig. 8 is the vertical view of another 2D/3D switchable optical module motherboard provided in an embodiment of the present invention, with reference to figure 8,
2D/3D switchable optical module motherboards may also include the first test bus 251 and second test bus 252；Multiple 2D/3D can be cut
Change optics module area it is a plurality of first test cabling 151 with first test bus 251 connect, it is a plurality of second test cabling 152 and
Second test bus 252 connects, and the first test bus 251 and second tests bus 252 and extends to 2D/3D switchable optical modules
The edge of motherboard.By the first test in each 2D/3D switchable opticals module area in the 2D/3D switchable optical module motherboards
Cabling 151 and second is separately connected the first test bus 251 and second test bus 252, test after testing 152 parallel connection of bus
Process can be directly connected to the first test bus 251 and second test bus 252 by detection device, by detection device directly to the
One test bus 251 and second, which is tested in bus 252, is passed through test signal, you can to whole 2D/3D switchable opticals module areas
Detection time can be effectively reduced compared to each 2D/3D switchable opticals module area is detected one by one by carrying out unified detection.Continue to join
Fig. 8 is examined, optionally, can also one the first connection terminal 31 and one be set at the edge of 2D/3D switchable optical module motherboards
A second connection end 32, the first test bus 251 are connect with the first connection terminal 31；Second test bus 252 and second connects
Connecting terminal 32 connects.
The embodiment of the present invention additionally provides a kind of detection device of 2D/3D switchable opticals module motherboard, for this hair
The 2D/3D switchable optical module motherboards that bright embodiment provides carry out conduction detection, and Fig. 9 is one kind provided in an embodiment of the present invention
The structural schematic diagram of the detection device of 2D/3D switchable optical module motherboards, with reference to figure 9, Fig. 3 and Fig. 4, the 2D/3D is changeable
The detection device of optics module motherboard includes：Cutting assembly 91, the edge for cutting 2D/3D switchable optical module motherboards
Second substrate 12, expose first substrate 11 on first test cabling 151 and second test cabling 152；Power supply module 92 is used
In to first test cabling 151 and second test 152 input test signal of cabling, to each 2D/3D switchable opticals module area into
Row continuity test.
The detection device of 2D/3D switchable opticals module motherboard provided in an embodiment of the present invention, by cutting module, cutting
The second substrate of the edge of 2D/3D switchable optical module motherboards exposes the first test cabling and second on first substrate
Cabling is tested, power supply module is then utilized, to the first test cabling and the second test cabling input test signal, to each 2D/3D
Switchable optical module area carries out continuity test, realizes after 2D/3D switchable optical module motherboards complete, to entire
Motherboard carries out conducting sphere continuity test, and the time of shorting advance detection, solving the prior art cannot be in front process processing procedure
The problem of carrying out conducting sphere conduction detection, being also easy to produce a large amount of bad modules the case where to timely feedback poor flow, is reduced different
The production of norm group improves product yield, effectively improves back segment production capacity.
Figure 10 is a kind of cutting assembly structural schematic diagram provided in an embodiment of the present invention, with reference to figure 10, the cutting assembly 91
Including supporting rod 911 and the cutter head 912 being slidably connected on supporting rod 911.Illustratively, as shown in Figure 10, the cutting
Component 91 is mountable in the macro -graph equipment of 2D/3D switchable optical module motherboards, wherein 2D/3D switchable optical moulds
Group motherboard 101 is placed on the microscope carrier 102 of macro inspection apparatus, and is carried out position by positioning pin 103 and fixed, cutting assembly
91 are fixedly mounted on the airborne platform of macro -graph, by the cutter head 912 that is slidably connected to the 2D/3D switchable optical moulds
Group motherboard 101 is cut, which only cuts the second substrate 12 of 2D/3D switchable optical modules motherboard 101
It cuts, illustratively, the edge cut width of second substrate 12 can be 2cm, to expose the first test on first substrate 11
Cabling 151 and second tests cabling 152, is then surveyed by the first test cabling 151 and second that the connection of power supply module 92 leaks out
Cabling 152 is tried, continuity test is carried out to 2D/3D switchable optical modules motherboard 101.Cutting assembly provided by the invention can with it is macro
It sees check device as a whole, glue badness, foreign matter, prism missing, liquid crystal in box is sealed in macro inspection apparatus
While the abnormality detections such as deficiency, the test of conducting sphere conducting situation in sealant can be carried out, the program is suitable for examining automatically
Technique is surveyed, production efficiency is improved.
The embodiment of the present invention additionally provides a kind of detection method of 2D/3D switchable opticals module motherboard, and Figure 11 is this hair
The detection method flow chart for a kind of 2D/3D switchable opticals module motherboard that bright embodiment provides, below with reference to Figure 11 to the 2D/
The detection method of the detection device of 3D switchable optical module motherboards is introduced, the 2D/3D switchable optical module motherboards
Detection method includes：
S110, cut 2D/3D switchable optical module motherboards edge second substrate, expose the on first substrate
One test cabling and the second test cabling；
S120, cabling input test signal is tested to the first test cabling and second, tests each 2D/3D switchable opticals mould
The conducting situation in group area.
Specifically, can refer to Fig. 5, Fig. 9 and Figure 10, walked to the first test test of cabling 151 and second in power supply module 92
After 152 input test signal of line, the optical functional layer in each 2D/3D switchable opticals module area can be driven by test signal
Liquid crystal layer 142 in 14, such as optical functional layer 14, detects the working condition of the optical functional layer 14, you can judges each 2D/3D
The conducting situation in switchable optical module area.
The detection method of 2D/3D switchable opticals module motherboard provided in an embodiment of the present invention can be cut by cutting 2D/3D
The second substrate of the edge of optics module motherboard is changed, the first test cabling and the second test cabling on first substrate are exposed,
Then to the first test cabling and the second test cabling input test signal, each 2D/3D switchable opticals module area is led
Logical test, realizes after 2D/3D switchable optical module motherboards complete, and the conducting that conducting sphere is carried out to entire motherboard is surveyed
Examination, the time of shorting advance detection, conducting sphere conduction detection cannot be carried out in front process processing procedure by solving the prior art, easily
A large amount of bad modules are led to the problem of, the case where to timely feedback poor flow, the production of abnormal module is reduced, improves product
Yield effectively improves back segment production capacity.
The embodiment of the present invention additionally provides a kind of preparation method of 2D/3D switchable opticals module, and Figure 12 is of the invention real
A kind of flow chart of the preparation method of 2D/3D switchable opticals module of example offer is applied, with reference to figure 12, which can be switched light
Learn module preparation method include：
S210,2D/3D switchable optical module motherboards are prepared；
Wherein, the 2D/3D switchable optical module motherboards which prepares, which are 2D/3D provided in an embodiment of the present invention, to be cut
Change optics module motherboard.
S220, cut 2D/3D switchable optical module motherboards edge second substrate, expose the on first substrate
One test cabling and the second test cabling；
S230, cabling input test signal is tested to the first test cabling and second, tests each 2D/3D switchable opticals mould
The conducting situation in group area；
S240, cutting 2D/3D switchable optical module motherboards, form multiple 2D/3D switchable opticals modules.
The preparation method of 2D/3D switchable opticals module panel provided in an embodiment of the present invention can be cut by cutting 2D/3D
The second substrate of the edge of optics module motherboard is changed, the first test cabling and the second test cabling on first substrate are exposed,
Then to first test cabling and second test cabling input test signal, cutting 2D/3D switchable optical modules motherboard it
Before, continuity test is carried out to each 2D/3D switchable opticals module, realizes and has been made in 2D/3D switchable optical module motherboards
Cheng Hou carries out entire motherboard the continuity test of conducting sphere, and the time of shorting advance detection, solving the prior art cannot be preceding
The problem of carrying out conducting sphere conduction detection in segment process processing procedure, being also easy to produce a large amount of bad modules, to timely feedback poor flow
The case where, the production of abnormal module is reduced, product yield is improved, effectively improves back segment production capacity.
Note that above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The present invention is not limited to specific embodiments described here, can carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out to the present invention by above example
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
May include other more equivalent embodiments, and the scope of the present invention is determined by scope of the appended claims.
Claims (11)
1. a kind of 2D/3D switchable opticals module motherboard, which is characterized in that including：
The first substrate and second substrate being oppositely arranged；The first substrate and the opposite side of the second substrate are respectively set
There are the first transparency conducting layer and the second transparency conducting layer；
The 2D/3D switchable opticals module motherboard includes multiple 2D/3D switchable opticals module areas；The multiple 2D/3D can
Switchable optics module area includes viewing area and the neighboring area around the viewing area；
It is provided with sealant in the neighboring area, and is arranged around the viewing area；The sealant is clamped in described first
Between substrate and the second substrate, sealing space is formed with the first substrate and the second substrate；
First transparency conducting layer in each 2D/3D switchable optical modules area includes mutually insulated first and second
Portion；The second position is in the neighboring area；
With conducting first transparency conducting layer and described second transparent is provided in the described second overlapping sealant
The conducting sphere of conductive layer；
Described first is connected with the first test cabling, and described second is connected with the second test cabling.
2. 2D/3D switchable opticals module motherboard according to claim 1, which is characterized in that the first substrate and institute
It states and is provided with cylindrical mirror layer between second substrate, the cylindrical mirror layer is located in the sealing space, the cylindrical mirror layer and described first
Liquid crystal layer is provided between substrate or the second substrate, the liquid crystal molecule in the liquid crystal layer is filled in the sealing space
In.
3. 2D/3D switchable opticals module motherboard according to claim 1, which is characterized in that the multiple 2D/3D can be cut
The first test cabling and the second test cabling changed in optics module area extends to the 2D/3D switchable opticals mould
The edge of group motherboard.
4. 2D/3D switchable opticals module motherboard according to claim 3, which is characterized in that further include be set to it is described
Multiple first connection terminals at the edge of 2D/3D switchable optical module motherboards and multiple second connection ends, described in every
First test cabling, the first connection terminal connection corresponding with one；Every the second test cabling is corresponding with one described
Second connection end connects.
5. 2D/3D switchable opticals module motherboard according to claim 1, which is characterized in that further include：First test is total
Line and the second test bus；The a plurality of first test cabling and described the in the multiple 2D/3D switchable opticals module area
One test bus connection, it is a plurality of it is described second test cabling with it is described second test bus connect, it is described first test bus with
The second test bus extends to the edge of the 2D/3D switchable opticals module motherboard.
6. 2D/3D switchable opticals module motherboard according to claim 5, which is characterized in that further include be set to it is described
One first connection terminal and second connection end at the edge of 2D/3D switchable optical module motherboards, described first
Test bus is connect with first connection terminal；The second test bus is connect with second connection end.
7. according to any 2D/3D switchable optical module motherboards of claim 1-6, which is characterized in that described first surveys
It is metal or metal oxide to try cabling and the second test cabling material.
8. a kind of detection device of 2D/3D switchable opticals module motherboard, which is characterized in that for any to claim 1-7
The 2D/3D switchable optical module motherboards carry out conduction detection, including：
Cutting assembly, the second substrate of the edge for cutting the 2D/3D switchable opticals module motherboard expose described the
The first test cabling on one substrate and the second test cabling；
Power supply module, for testing cabling input test signal to the first test cabling and described second, to each 2D/
3D switchable optical modules area carries out continuity test.
9. detection device according to claim 8, which is characterized in that the cutting assembly includes supporting rod and is slidably connected
Cutter head on the supporting rod.
10. a kind of detection method of 2D/3D switchable opticals module motherboard, which is characterized in that require 1-7 to appoint for test right
2D/3D switchable optical module motherboards described in one, including：
The second substrate for cutting the edge of the 2D/3D switchable opticals module motherboard, exposes the institute on the first substrate
State the first test cabling and the second test cabling；
To the first test cabling and the second test cabling input test signal, tests each 2D/3D and light can be switched
Learn the conducting situation in module area.
11. a kind of preparation method of 2D/3D switchable opticals module, which is characterized in that including：
Prepare the 2D/3D switchable optical module motherboards as described in claim 1-7 is any；
The second substrate for cutting the edge of the 2D/3D switchable opticals module motherboard, exposes the institute on the first substrate
State the first test cabling and the second test cabling；
To the first test cabling and the second test cabling input test signal, tests each 2D/3D and light can be switched
Learn the conducting situation in module area；
The 2D/3D switchable opticals module motherboard is cut, multiple 2D/3D switchable opticals modules are formed.
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Application publication date: 20180907 |