KR20090028347A - Flat panel display repair apparatus and flat panel display array inspection/repair apparatus - Google Patents

Abstract

A substrate repair apparatus and substrate inspection/repair apparatus can minimize the movement of gantry by using X direction moving means and the secondary mobile tool. The stage(310) mounts the substrate in which the electrical defect of pattern is discovered. The repair meanses(333a,334a,333b,334b) repairs deformity. The gantry moves the repair means from the top of substrate to Y direction. The X direction mobile tool moves gantry X. In the state where the secondary mobile tool is mounted on gantry, repair means are moved to X direction or Y.

Description

Board repair apparatus and board inspection / repair apparatus {FLAT PANEL DISPLAY REPAIR APPARATUS AND FLAT PANEL DISPLAY ARRAY INSPECTION / REPAIR APPARATUS}

The present invention relates to a substrate repair apparatus and a substrate inspection / repair apparatus, and more particularly, to a substrate repair apparatus and a substrate inspection / repair apparatus capable of moving in the X direction by itself while the repair means is mounted on the gantry.

Generally, flat panel displays are categorized into cathode ray tube (CRT) displays and liquid crystal displays (LCDs). Among them, LCDs have low power consumption and are light in weight. Is getting.

A flat panel display such as an LCD is composed of an array substrate, an opposing substrate, a liquid crystal layer, etc. Among these, a plurality of pixel electrodes arranged in a matrix shape and a plurality of scan lines and columns arranged along rows of the plurality of pixel electrodes. A plurality of signal lines are formed along the line.

Here, the array substrate inspection is to space the modulator (Modulator) by a predetermined gap on the TFT array substrate and then apply a voltage to the modulator while the light is emitted from the light source while maintaining the gap, and the light reflected from the modulator to the lens By short-circuit (short) and disconnection (electrical failure) of the signal wiring formed on the TFT array substrate by detecting the light reflected from the modulator by a CCD camera which condenses the light reflected by the lens and converts the reflected light focused through the lens into an analog image signal. Open) is determined.

In addition, the substrate repair is classified into a short circuit repair and a disconnection repair, and a short circuit repair may cause a defect in which electrical signal lines overlap in a manufacturing process of an array substrate. When a defect occurs, a correct image may not be formed. Therefore, the overlapped signal lines are cut so as not to overlap each other, and the disconnection repair is performed by connecting the connection wires separately when the existing wires are disconnected, but adding the connection wires to the upper part of the existing wires.

The array inspection apparatus used in the manufacturing process of such a conventional flat panel display panel (hereinafter referred to as a 'substrate') is a situation that various models have been developed. Referring to FIG. 1, the array inspection apparatus 100 will be described. A stage 110 for mounting a substrate P to be inspected and a known inspection means 130 for performing electrical inspection of a pattern of the substrate as described above. ), A gantry 120 for moving the inspection means 130 in the Y direction, and an X-direction guide rail 140 for allowing the gantry 120 to move in the X direction.

As such, when the electrical inspection of the substrate is completed, the defective portion is repaired. FIG. 2 shows a conventional substrate repair apparatus 200. The substrate repair apparatus includes a stage 210 for mounting a substrate P to be repaired, repair means 231 and 237 for repairing the defect, and a repair means. The gantry 220 to move in the Y direction, and the X-direction guide rail 240 to allow the gantry to move in the X direction.

Referring to Figure 3 will be briefly described a conventional substrate repair means 230. The substrate repair means includes a laser oscillator 231 and an optical head 237. The optical head 237 includes a beam shaper 232, a mirror 233, a beam slit 234, an objective lens 235, a chamber 236, and the like.

The beam shaper 232 flattens the laser beam irradiated from the laser oscillator, and the beam slit 234 adjusts the shape and size of the beam irradiated according to the processing object.

In addition, the chamber 236 is a component that supplies a metal source gas at a predetermined distance from the substrate. The chamber may be provided with an exhaust unit for exhausting residual gas after thin film formation.

A method of repairing a substrate using the conventional repair apparatus configured as described above will be described with reference to FIG. 4.

First, the defect of a board | substrate is inspected using the inspection apparatus shown in FIG. 1, and the information is transmitted to a repair apparatus. The repair apparatus repairs the defect of the substrate using the repair means according to the transmitted information.

More specifically, first, the gantry 220 is moved along the X direction guide rail 240. Next, the moving member 221 is moved to move the repair means 230 to the position where the first defect D1 is located, and then repair the first defect D1 using a laser.

After the first defect D1 is repaired, the gantry 220 and the moving member 221 are moved again to repair the second defect D2 and the remaining defects D3 and D4.

However, the conventional repair apparatus configured as described above has a problem that the tack time is very long because the gantry and / or the moving member must be moved by the number of defects.

In addition, the repair time is relatively longer than the inspection of the substrate, there is also a problem that the process accumulation occurs. In order to overcome this problem, a repair apparatus may be combined with two repair apparatuses, but a large cost and space are required for the equipment.

In addition, since the board inspection and repair are performed in different equipment, it is inevitably required to transfer the board from the inspection stage to the repair stage, which causes damage to the substrate.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate repair apparatus and a substrate inspection / repair apparatus which can move in the X direction by itself while the repair means is mounted on the gantry.

In order to solve the above technical problem, the substrate repair apparatus according to the present invention includes: a stage for placing a substrate on which an electrical defect of a pattern is found; A plurality of repair means for repairing the defect; A gantry for moving the repair means in the Y direction from the upper portion of the substrate; X direction moving means for moving the gantry in the X direction; And an auxiliary movement means for moving the repair means in the X direction while being mounted on the gantry.

In addition, the repair means, the laser oscillator for oscillating the laser beam; A chamber disposed at a predetermined distance from the substrate and generating a reaction by irradiating the laser beam to a metal source gas; And a gas supply unit supplying the metal source gas to the chamber.

In addition, the X-direction moving means preferably comprises an X-direction guide rail for moving the gantry in the X direction.

Particularly, the auxiliary movement means includes an X direction auxiliary rail for moving the repair means in the X direction while being mounted on the gantry.

In addition, the substrate inspection and repair apparatus according to the present invention includes a stage for mounting a substrate on which a pattern is formed; Inspection means for performing an electrical inspection of the pattern to determine whether there is a defect; A first gantry for moving the inspection means in the Y direction from the top of the substrate; Repair means for repairing the substrate in accordance with the information determined by the inspection means; A second gantry for moving the repair means in the Y direction from the top of the substrate; X-direction moving means for moving the first and second gantry in the X direction; And an auxiliary movement means for moving the repair means in the X direction while being mounted on the second gantry.

In addition, at least one inspection means is mounted to the first gantry, and at least two repair means are mounted to the second gantry, preferably more than the inspection means.

The repair means may also include a laser oscillator for oscillating a laser beam; A chamber disposed at a predetermined distance from the substrate and generating a reaction by irradiating the laser beam to a metal source gas; And a gas supply unit supplying the metal source gas to the chamber.

In addition, the X-direction moving means includes an X-direction guide rail for moving the first and second gantry in the X direction, and a drive source for driving each gantry.

In particular, the auxiliary movement means preferably comprises an X-direction auxiliary rail for moving the repair means in the X direction while being mounted on the second gantry.

According to the present invention, since the repair means can move in the X direction by itself while mounted on the gantry, the movement of the gantry can be minimized. Thus, tack times and process run times can be reduced.

In addition, the inspection of the array of the substrate and the repair of the substrate according to the inspection result can be performed using a single device. As a result, the number of necessary equipment is reduced and the area of clean room equipment is reduced, thereby reducing the investment cost. Also, there is an effect that the probability of substrate defects caused by foreign substances or damages can be reduced during the movement.

In addition, by providing more repair means than the inspection means, there is an effect that can eliminate the process backlog.

Hereinafter, with reference to the accompanying drawings will be described the configuration and operation of the embodiment according to the present invention.

FIG. 5 illustrates a substrate inspection / repair device 300 capable of performing both substrate inspection and repair in one equipment.

The present embodiment 300 includes a stage 310 for mounting a substrate, an inspection means 323, a first gantry 321, a repair means 333a, 334a, 333b, 334b, and a second gantry 331. ), X direction moving means, and auxiliary moving means.

The inspection means 323 is a known element for performing an electrical inspection of the substrate.

The first gantry 321 is a component for moving the inspection means 323 in the Y direction from the top of the substrate. The inspection means is movable in the Y direction in the first gantry by the moving member 322.

The repair means 333a, 334a, 333b, 334b may be configured in the same manner as the known repair means shown in FIG. However, in this embodiment, a pair of repair means 333a, 334a, 333b, and 334b is provided in the second gantry 331.

The first gantry 321 and the second gantry 331 move in the direction by the X-direction moving means, the X-direction moving means is composed of a drive source (not shown) and the guide rail 340.

In particular, the present embodiment 300 is provided with an auxiliary movement means for moving the pair of repair means (333a, 334a, 333b, 334b) in the X direction, respectively, mounted on the second gantry 331, The auxiliary movement means is also composed of a drive source (not shown) and the X-direction auxiliary rail.

6 illustrates a process of performing an electrical inspection of the substrate according to the embodiment. As shown, the first gantry 321 and the movable member is used to perform electrical inspection of the substrate while moving the inspection means in the X and Y directions. In order to explain the process of repairing defects, it is assumed that a large number of defects are found as a result of the inspection.

7 illustrates a process of repairing a substrate using the above embodiment.

As shown in FIG. 6, the information obtained by the electrical inspection of the substrate is stored in a controller (not shown), and the controller controls and repairs the repair means.

More specifically, first, the second gantry 331 moves along the X-direction guide rail 340, and the first repair means 333a moves along the second gantry 331 to make a first defect. Move to the position (D11). In this state, the first defect D11 is repaired.

Next, in the state where the second gantry 331 is not moved, the second defect is caused by moving the first repair means 333a to the position of the second defect D12 using only the movable member and the X-direction auxiliary rail. Repair (D12).

Next, the second gantry 331 moves along the X direction guide rail 340, and the second repair means 333b moves along the second gantry 331 to position the third defect D21. Go to. In this state, the third defect D21 is repaired.

Next, while the second gantry 331 is not moved, the second repair means 333b is moved to the position of the fourth defect D22 using only the movable member and the X-direction auxiliary rail 335b. To repair the fourth defect D22.

In the same manner, the second gantry is moved to repair the fifth and sixth defects, and the second gantry is moved to repair the seventh and eighth defects.

That is, according to this embodiment, the first and second defects, the third and fourth defects, the fifth and sixth defects, the seventh and eighth defects, the seventh and eighth defects do not move the position of the gantry and the auxiliary movement Repair is possible by the means.

In addition, the pair of repair means is dedicated to each other by dividing the substrate from side to side.

This embodiment is a substrate inspection / repair apparatus capable of performing substrate inspection and repair together. Based on this, the substrate inspection is separately performed by the inspection apparatus shown in FIG. 1, and the apparatus for performing repair only by transferring the inspected substrate can be configured. In this case, in the embodiment shown in FIG. 5, the first gantry 321, the moving member 322 and the inspection means 323 coupled thereto will be lacking.

Although the detailed description of the present invention described above has been described with reference to the preferred embodiment of the present invention, the protection scope of the present invention is not limited to the above embodiment, and those skilled in the art will appreciate It will be understood that various modifications and changes can be made in the present invention without departing from the spirit and scope of the invention.

1 schematically illustrates a conventional array inspection apparatus.

2 schematically illustrates a conventional substrate repair apparatus.

FIG. 3 specifically illustrates the repair means shown in FIG. 2.

4 illustrates a process of repairing a substrate using the apparatus shown in FIG. 2.

5 shows a substrate inspection / repair apparatus according to the present invention.

FIG. 6 illustrates a process of inspecting a substrate using the apparatus shown in FIG. 5.

FIG. 7 illustrates a process of repairing a substrate using the apparatus shown in FIG. 5.

Claims (11)

A stage for placing the substrate on which the electrical defect of the pattern is found; Repair means for repairing the defect; A gantry for moving the repair means in the Y direction from the top of the substrate; X direction moving means for moving the gantry in the X direction; And And an auxiliary movement means for moving the repair means in the X direction or the Y direction when the repair means is mounted on the gantry. The method of claim 1, And at least one said repair means is mounted on said gantry. The method of claim 1, The repair means, A laser oscillator for oscillating a laser beam; And And an optical system for irradiating the laser beam to the substrate. The method of claim 3, wherein A gas supply unit supplying a metal source gas; And And a chamber disposed at a predetermined distance from the substrate and generating a reaction by irradiating the laser source to the metal source gas. The method of claim 1, The repair means may be any one of a module repair means, a cell repair means, an array repair means, a depo repair means, and a set repair means for a finished product. Substrate repair apparatus made. A stage for mounting a substrate on which a pattern is formed; Inspection means for performing an electrical inspection of the pattern to determine whether there is a defect; A first gantry for moving the inspection means in the Y direction from the top of the substrate; Repair means for repairing the substrate in accordance with the information determined by the inspection means; A second gantry for moving the repair means in the Y direction from the top of the substrate; X-direction moving means for moving the first and second gantry in the X direction; And Subsidiary moving means for moving the repair means in the X direction or the Y direction while being mounted to the second gantry; substrate inspection / repair apparatus comprising a. The method of claim 6, And at least one inspection means is mounted on the first gantry. The method of claim 7, wherein At least two repair means may be mounted to the second gantry, and a larger number than the inspection means may be mounted. The method of claim 6, The repair means, A laser oscillator for oscillating a laser beam; And And an optical system for irradiating the laser beam to the substrate. The method of claim 9, A gas supply unit supplying a metal source gas; And And a chamber disposed at a predetermined distance from the substrate and generating a reaction by irradiating the laser source to the metal source gas. The method of claim 6, The repair means may be any one of a module repair means, a cell repair means, an array repair means, a depo repair means, and a set repair means for a finished product. Substrate repair apparatus made.

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