CN102938447A - 有机el设备制造装置 - Google Patents

有机el设备制造装置 Download PDF

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Publication number
CN102938447A
CN102938447A CN2012103256735A CN201210325673A CN102938447A CN 102938447 A CN102938447 A CN 102938447A CN 2012103256735 A CN2012103256735 A CN 2012103256735A CN 201210325673 A CN201210325673 A CN 201210325673A CN 102938447 A CN102938447 A CN 102938447A
Authority
CN
China
Prior art keywords
substrate
evaporation
conveyance
manufacturing installation
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012103256735A
Other languages
English (en)
Chinese (zh)
Inventor
若林雅
韮泽信广
弓场贤治
浅田干夫
落合行雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008227488A external-priority patent/JP4768001B2/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN102938447A publication Critical patent/CN102938447A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN2012103256735A 2008-09-04 2009-08-17 有机el设备制造装置 Pending CN102938447A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008227477 2008-09-04
JP2008-227477 2008-09-04
JP2008-227488 2008-09-04
JP2008227488A JP4768001B2 (ja) 2008-09-04 2008-09-04 有機ｅｌデバイス製造装置及び同製造方法並びに成膜装置及び成膜方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN200910165277A Division CN101667630A (zh) 2008-09-04 2009-08-17 有机el设备制造装置和其制造方法以及成膜装置和成膜方法

Publications (1)

Publication Number Publication Date
CN102938447A true CN102938447A (zh) 2013-02-20

Family

ID=42179151

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2012103256735A Pending CN102938447A (zh) 2008-09-04 2009-08-17 有机el设备制造装置
CN201110020657.0A Expired - Fee Related CN102157708B (zh) 2008-09-04 2009-08-17 有机el设备制造装置和制造方法及成膜装置和成膜方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201110020657.0A Expired - Fee Related CN102157708B (zh) 2008-09-04 2009-08-17 有机el设备制造装置和制造方法及成膜装置和成膜方法

Country Status (3)

Country Link
KR (2) KR101119790B1 (ko)
CN (2) CN102938447A (ko)
TW (2) TWI424784B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101036123B1 (ko) * 2010-06-10 2011-05-23 에스엔유 프리시젼 주식회사 박막 증착 장치
KR101293024B1 (ko) * 2011-11-11 2013-08-05 에스엔유 프리시젼 주식회사 평판패널 제조장치
JP6937549B2 (ja) * 2016-06-10 2021-09-22 株式会社ジャパンディスプレイ 発光素子の製造装置
JP6830772B2 (ja) 2016-08-04 2021-02-17 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法
US20200083453A1 (en) * 2017-03-17 2020-03-12 Applied Materials, Inc. Methods of handling a mask device in a vacuum system, mask handling apparatus, and vacuum system
KR20190124610A (ko) * 2018-04-26 2019-11-05 캐논 톡키 가부시키가이샤 기판 반송 시스템, 전자 디바이스 제조장치 및 전자 디바이스 제조방법
KR102236103B1 (ko) * 2019-04-15 2021-04-05 주식회사 아테코 테스트 트레이 비전 검사기능이 구비된 전자부품 테스트 핸들러
WO2022090778A1 (en) * 2020-10-30 2022-05-05 Applied Materials, Inc. Vacuum tilting table and vacuum tilting table module for a substrate processing system and method for substrate loading and unloading in a vacuum processing system
JP7242626B2 (ja) * 2020-12-10 2023-03-20 キヤノントッキ株式会社 成膜装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634686B2 (en) * 2001-10-03 2003-10-21 Applied Materials, Inc. End effector assembly
TWI232242B (en) * 2002-05-23 2005-05-11 Anelva Corp Substrate processing apparatus and processing method
JP4257497B2 (ja) 2003-02-26 2009-04-22 株式会社日立ハイテクノロジーズ 真空蒸着方法及び真空蒸着装置、並びにこの真空蒸着方法により製造したｅｌパネル
TWI270311B (en) * 2004-01-06 2007-01-01 Delta Optoelectronics Inc The film fabricating method of the organic electroluminescent device and the film forming apparatus thereof
JP4538650B2 (ja) * 2004-06-18 2010-09-08 京セラ株式会社 蒸着装置
KR100761100B1 (ko) * 2006-02-08 2007-09-21 주식회사 아바코 유기발광소자의 증착막 형성방법 및 장치
JP4859485B2 (ja) 2006-02-27 2012-01-25 三菱重工業株式会社 有機半導体製造装置
JP2007332458A (ja) 2006-05-18 2007-12-27 Sony Corp 蒸着装置および蒸着源ならびに表示装置の製造方法
JP5203584B2 (ja) * 2006-08-09 2013-06-05 東京エレクトロン株式会社 成膜装置、成膜システムおよび成膜方法
JP2008177071A (ja) * 2007-01-19 2008-07-31 Sony Corp 表示装置の製造装置および表示装置の製造方法
KR100842020B1 (ko) 2007-03-16 2008-06-27 세메스 주식회사 유기 박막 증착 장치 및 방법

Also Published As

Publication number Publication date
TW201028034A (en) 2010-07-16
CN102157708B (zh) 2014-09-03
KR20100028479A (ko) 2010-03-12
CN102157708A (zh) 2011-08-17
TW201408133A (zh) 2014-02-16
KR20110081128A (ko) 2011-07-13
KR101092163B1 (ko) 2011-12-13
KR101119790B1 (ko) 2012-03-23
TWI424784B (zh) 2014-01-21

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130220