CN102938447A - 有机el设备制造装置 - Google Patents
有机el设备制造装置 Download PDFInfo
- Publication number
- CN102938447A CN102938447A CN2012103256735A CN201210325673A CN102938447A CN 102938447 A CN102938447 A CN 102938447A CN 2012103256735 A CN2012103256735 A CN 2012103256735A CN 201210325673 A CN201210325673 A CN 201210325673A CN 102938447 A CN102938447 A CN 102938447A
- Authority
- CN
- China
- Prior art keywords
- substrate
- evaporation
- conveyance
- manufacturing installation
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 238000009434 installation Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 137
- 238000001704 evaporation Methods 0.000 claims abstract description 119
- 230000008020 evaporation Effects 0.000 claims abstract description 119
- 239000000463 material Substances 0.000 claims abstract description 27
- 230000008021 deposition Effects 0.000 claims description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 238000009834 vaporization Methods 0.000 abstract 7
- 230000008016 vaporization Effects 0.000 abstract 7
- 238000000034 method Methods 0.000 description 70
- 230000015572 biosynthetic process Effects 0.000 description 18
- 238000005755 formation reaction Methods 0.000 description 18
- 238000007747 plating Methods 0.000 description 16
- 238000000151 deposition Methods 0.000 description 12
- 238000007738 vacuum evaporation Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008227477 | 2008-09-04 | ||
JP2008-227477 | 2008-09-04 | ||
JP2008-227488 | 2008-09-04 | ||
JP2008227488A JP4768001B2 (ja) | 2008-09-04 | 2008-09-04 | 有機elデバイス製造装置及び同製造方法並びに成膜装置及び成膜方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910165277A Division CN101667630A (zh) | 2008-09-04 | 2009-08-17 | 有机el设备制造装置和其制造方法以及成膜装置和成膜方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102938447A true CN102938447A (zh) | 2013-02-20 |
Family
ID=42179151
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012103256735A Pending CN102938447A (zh) | 2008-09-04 | 2009-08-17 | 有机el设备制造装置 |
CN201110020657.0A Expired - Fee Related CN102157708B (zh) | 2008-09-04 | 2009-08-17 | 有机el设备制造装置和制造方法及成膜装置和成膜方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110020657.0A Expired - Fee Related CN102157708B (zh) | 2008-09-04 | 2009-08-17 | 有机el设备制造装置和制造方法及成膜装置和成膜方法 |
Country Status (3)
Country | Link |
---|---|
KR (2) | KR101119790B1 (ko) |
CN (2) | CN102938447A (ko) |
TW (2) | TWI424784B (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101036123B1 (ko) * | 2010-06-10 | 2011-05-23 | 에스엔유 프리시젼 주식회사 | 박막 증착 장치 |
KR101293024B1 (ko) * | 2011-11-11 | 2013-08-05 | 에스엔유 프리시젼 주식회사 | 평판패널 제조장치 |
JP6937549B2 (ja) * | 2016-06-10 | 2021-09-22 | 株式会社ジャパンディスプレイ | 発光素子の製造装置 |
JP6830772B2 (ja) | 2016-08-04 | 2021-02-17 | 株式会社ジャパンディスプレイ | 積層膜の製造装置、及び積層膜の製造方法 |
US20200083453A1 (en) * | 2017-03-17 | 2020-03-12 | Applied Materials, Inc. | Methods of handling a mask device in a vacuum system, mask handling apparatus, and vacuum system |
KR20190124610A (ko) * | 2018-04-26 | 2019-11-05 | 캐논 톡키 가부시키가이샤 | 기판 반송 시스템, 전자 디바이스 제조장치 및 전자 디바이스 제조방법 |
KR102236103B1 (ko) * | 2019-04-15 | 2021-04-05 | 주식회사 아테코 | 테스트 트레이 비전 검사기능이 구비된 전자부품 테스트 핸들러 |
WO2022090778A1 (en) * | 2020-10-30 | 2022-05-05 | Applied Materials, Inc. | Vacuum tilting table and vacuum tilting table module for a substrate processing system and method for substrate loading and unloading in a vacuum processing system |
JP7242626B2 (ja) * | 2020-12-10 | 2023-03-20 | キヤノントッキ株式会社 | 成膜装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6634686B2 (en) * | 2001-10-03 | 2003-10-21 | Applied Materials, Inc. | End effector assembly |
TWI232242B (en) * | 2002-05-23 | 2005-05-11 | Anelva Corp | Substrate processing apparatus and processing method |
JP4257497B2 (ja) | 2003-02-26 | 2009-04-22 | 株式会社日立ハイテクノロジーズ | 真空蒸着方法及び真空蒸着装置、並びにこの真空蒸着方法により製造したelパネル |
TWI270311B (en) * | 2004-01-06 | 2007-01-01 | Delta Optoelectronics Inc | The film fabricating method of the organic electroluminescent device and the film forming apparatus thereof |
JP4538650B2 (ja) * | 2004-06-18 | 2010-09-08 | 京セラ株式会社 | 蒸着装置 |
KR100761100B1 (ko) * | 2006-02-08 | 2007-09-21 | 주식회사 아바코 | 유기발광소자의 증착막 형성방법 및 장치 |
JP4859485B2 (ja) | 2006-02-27 | 2012-01-25 | 三菱重工業株式会社 | 有機半導体製造装置 |
JP2007332458A (ja) | 2006-05-18 | 2007-12-27 | Sony Corp | 蒸着装置および蒸着源ならびに表示装置の製造方法 |
JP5203584B2 (ja) * | 2006-08-09 | 2013-06-05 | 東京エレクトロン株式会社 | 成膜装置、成膜システムおよび成膜方法 |
JP2008177071A (ja) * | 2007-01-19 | 2008-07-31 | Sony Corp | 表示装置の製造装置および表示装置の製造方法 |
KR100842020B1 (ko) | 2007-03-16 | 2008-06-27 | 세메스 주식회사 | 유기 박막 증착 장치 및 방법 |
-
2009
- 2009-08-04 TW TW098126272A patent/TWI424784B/zh not_active IP Right Cessation
- 2009-08-04 TW TW102140479A patent/TW201408133A/zh unknown
- 2009-08-17 KR KR1020090075500A patent/KR101119790B1/ko active IP Right Grant
- 2009-08-17 CN CN2012103256735A patent/CN102938447A/zh active Pending
- 2009-08-17 CN CN201110020657.0A patent/CN102157708B/zh not_active Expired - Fee Related
-
2011
- 2011-06-16 KR KR1020110058421A patent/KR101092163B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201028034A (en) | 2010-07-16 |
CN102157708B (zh) | 2014-09-03 |
KR20100028479A (ko) | 2010-03-12 |
CN102157708A (zh) | 2011-08-17 |
TW201408133A (zh) | 2014-02-16 |
KR20110081128A (ko) | 2011-07-13 |
KR101092163B1 (ko) | 2011-12-13 |
KR101119790B1 (ko) | 2012-03-23 |
TWI424784B (zh) | 2014-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130220 |