CN102931177A - High-color-rendering LED light source based on red light chip direct sealing compensation - Google Patents
High-color-rendering LED light source based on red light chip direct sealing compensation Download PDFInfo
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- CN102931177A CN102931177A CN2012104216699A CN201210421669A CN102931177A CN 102931177 A CN102931177 A CN 102931177A CN 2012104216699 A CN2012104216699 A CN 2012104216699A CN 201210421669 A CN201210421669 A CN 201210421669A CN 102931177 A CN102931177 A CN 102931177A
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- 238000009877 rendering Methods 0.000 title abstract description 23
- 238000007789 sealing Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000000843 powder Substances 0.000 claims abstract description 14
- 230000018109 developmental process Effects 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 13
- 230000011218 segmentation Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000000295 complement effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 13
- 238000005538 encapsulation Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 241001484259 Lacuna Species 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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Abstract
The invention discloses a high color rendering LED light source based on red light chip direct sealing compensation, which comprises a light source substrate and a blue light chip, wherein yellow fluorescent powder is packaged on the surface of the blue light chip, the light source substrate also comprises a red light chip, the red light chip and the blue light chip are distributed on the light source substrate in a region division mode, red light emitted by adjacent red light chip regions is complementary with color light generated by the yellow fluorescent powder excited by the blue light chip regions to form high color rendering white light, the color rendering index can reach more than 90, the light efficiency can be improved by 15-30%, the power of the light source is reduced, and the application range is wider.
Description
Technical field
The present invention relates to a kind of led light source, especially directly seal the high-color development LED light source of compensation based on red light chips.
Background technology
The main method that realizes at present the high-power planar white light source is that blue light or near ultraviolet chip excite yellow fluorescent powder to realize, especially the encapsulation of multi-chip basis light source substrate, still there are several deficiencies in the light source of this encapsulation, the one, the color rendering of light source is not fine, especially illuminating product is used in the place that the crowd concentrates, can bring the familiar lacunas of light source, although there are many enterprises to attempt to obtain high-color rendering by the method for mixing red fluorescence powder, be that to sacrifice certain light efficiency be cost; The 2nd, the light efficiency of integrated chip light source is not high enough, the light decay phenomenon is more serious, can bring familiar lacunas to illuminating product, is unfavorable for extensive use.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of high-color development LED light source that directly seals compensation based on red light chips, the method that adopts red light chips directly to seal compensation obtains the light source of high light efficiency and high-color rendering, simultaneously, the overall package structure can also be carried out the staged encapsulation according to user's demand, thereby easily reaches the user to the requirement of optical property.
To achieve these goals, the technical solution used in the present invention is:
Directly seal the high-color development LED light source of compensation based on red light chips, comprise light source substrate and the blue chip that is arranged on the described light source substrate, described blue chip is packaged with yellow fluorescent powder on the surface, also comprise red light chips on the described light source substrate, described red light chips and blue chip are arranged on the light source substrate by the Region Segmentation form, the color of light that the ruddiness that send in adjacent red light chips zone and blue chip zone excite yellow fluorescent powder to produce is carried out complementation, form white light, red light chips adopts separately encapsulation, carrying out the subregion with blue chip is arranged on the light source substrate, simple and reliable for structure, the overall package structure also can be carried out the staged encapsulation according to user's request, multizone cross-excitation compensation when reaching the user optical property is required, also obtains the outstanding light source of high light efficiency and high-color rendering.
Preferably; be coated with high transparent encapsulated layer on the described red light chips region surface, can obtain the ruddiness of high colour developing, the red light chips zone adopts high transparent coating as encapsulated layer; encapsulated layer does not contain other color material; the transparency is high, prevents from mixing formed light decay by multiple fluorescent material, and other disturbs color of light so that the ruddiness that sends undopes; but also play the effect of protecting chip; practical reliable, easy and simple to handle on the technique, easily realize.
Preferably, the shape of described red light chips zone and blue chip Region Segmentation is square, circle or rectangle, use different shapes according to the different planform of lighting source, can adopt the method for Region Segmentation to realize encapsulation, the figure that regional is divided into equal proportion is arranged on the light source substrate, reaches equally the luminous efficiency that improves light source, the effect of color rendering index.
Preferably, described red light chips zone is 1:3 with the size ratio in blue chip zone, red light chips quantity in the described red light chips zone is the 5%-15% of blue chip quantity, the method that the layout of red light chips in light source adopts geometric area to increase progressively designs and adjusts according to user's demand and the requirement of planar light source watt level, encapsulate according to this ratio combination, the white light color rendering index that produces reaches more than 90, and the light efficiency of light source also is improved simultaneously.
Preferably, the optical wavelength scope that described red light chips sends is 612nm-630nm, the optical wavelength scope that described blue chip sends is 420nm-465nm, complementary with the look wave-wave long wave paddy area coincidence that blue chip excites yellow fluorescent powder to produce by the red light wavelength crest zone that red light chips excites, obtain the white light of high-color rendering, thereby improve the color rendering index of light source.
Preferably, different power supply circuit constructions is selected according to the different operating voltage of chip in the red light chips zone on the described light source substrate and the regional circuit structure that adopts unification to be connected power supply or to power separately of blue chip.
Preferably, the operating power scope of described light source substrate is 3W-250W, designs and adjusts according to user's the demand size to light source power, and span is wide, and reliability and fail safe are stronger.
The beneficial effect that the present invention compared with prior art brings is:
The problems such as the present invention is low for the light efficiency that solves present LED white light source existence, light decay is serious, color rendering is poor, effectively prevent from mixing formed light decay by multiple fluorescent material, the method that adopts red light chips directly to seal compensation obtains the outstanding light source of high light efficiency and high-color rendering, compare with existing integration packaging product, can effectively improve the color rendering index of light source, so that color rendering index can reach more than 90, light efficiency can improve 15%-30%, reduce the power of light source, save electric energy, range of application can be wider.Simultaneously, the overall package structure can be carried out the staged encapsulation according to user's request, thereby easily reaches the user to the requirement of optical property, and encapsulating structure is simple, and technique is convenient, and the design of integrated optical source substrate is also fairly simple, easily realizes industrialization.
Description of drawings
Fig. 1 is the cross section structure schematic diagram of light source substrate encapsulation of the present invention.
Fig. 2 is square region segmenting structure schematic diagram of the present invention.
Fig. 3 is border circular areas segmenting structure schematic diagram of the present invention.
Fig. 4 is rectangular region segmenting structure schematic diagram of the present invention.
Fig. 5 is optical wavelength combined compensation principle schematic of the present invention.
Embodiment
With reference to Fig. 1, a kind of led light source, obtain the white light of high colour developing based on red light chips 4 straight envelope compensation, comprise light source substrate 1 and blue chip 2, blue chip 2 is arranged on the light source substrate 1, blue chip is packaged with yellow fluorescent powder 3 on 2 surfaces, in order to solve the poor and low technical problem of light efficiency of color rendering, on light source substrate 1, also added red light chips 4, red light chips 4 is arranged on the light source substrate 1 by the Region Segmentation form with blue chip 2, the color of light that the ruddiness that send in adjacent red light chips 4 zones and blue chip 2 zones excite yellow fluorescent powder 3 to produce is carried out complementation, form white light, red light chips 4 zones are 1:3 with the size ratio in blue chip 2 zones, red light chips 4 quantity are the 5%-15% of blue chip 2 quantity, the method that the layout of red light chips 4 in light source adopts geometric area to increase progressively designs and adjusts according to user's demand and the requirement of planar light source watt level, the white light color rendering index that compensation produces reaches more than 90, and the light efficiency of light source also improves a lot simultaneously.
Further improve; be coated with a high transparent encapsulated layer 5 on red light chips 4 region surface; it adopts the high coating of the transparency is encapsulating material; the material that does not contain other color; prevent from mixing formed light decay by multiple fluorescent material; can obtain the ruddiness of high colour developing; blue chip 2 zones are to cover yellow fluorescent powder 3, excite the generation color of light by blue chip 2, and separately encapsulation is adopted in red light chips 4 zones; other disturbs color of light to high transparent encapsulated layer 5 so that the ruddiness that sends undopes; the complementary effect of the color of light of two kinds of chip generations reaches best, but also plays the effect of protection chip, and is practical reliable; easy and simple to handle on the technique, easily realize.
With reference to Fig. 2 to Fig. 4, in the present embodiment, red light chips 4 is square with the shape of blue chip 2 Region Segmentation, circle or rectangle, the first embodiment is for adopting as shown in Figure 2 square region to cut apart, the second embodiment is that employing border circular areas shown in Figure 3 is cut apart, the 3rd embodiment is that employing rectangular region shown in Figure 4 is cut apart, use different shapes according to the different planform of lighting source, can adopt the method for Region Segmentation to realize encapsulation, the figure that regional is divided into equal proportion is arranged on the light source substrate 1, reaches equally the luminous efficiency that improves light source, the effect of color rendering index.
With reference to Fig. 5, the principle of red light chips 4 straight envelope compensation is can effectively widen by red light chips 4 straight envelope compensation the spectral region of ruddiness, the wavelength valley regions that red light wavelength crest zone and the blue chip 2 that red light chips 4 excites excites yellow fluorescent powder 3 to produce the look ripple overlaps complementary, reach better compensation effect, thereby improve the color rendering index of light source, the chip light emitting wavelength that adopts based on this principle is respectively, the optical wavelength scope that red light chips 4 sends is 612nm-630nm, the optical wavelength scope that blue chip 2 sends is 420nm-465nm, the yellow fluorescent powder 3 that adopts simultaneously, it is subjected to blue chip 2 to excite the optical wavelength scope of generation is 580nm-590nm.
Further improve, red light chips 4 all is 0.3W with the operating power of blue chip 2, and the operating power scope of light source substrate 1 is 3W-250W, selects the quantity of chip according to the area of user's request and light source substrate 1, size to light source power designs and adjusts, and span is wide; Further, red light chips 4 zones and the blue chip 2 regional encapsulating structures that adopt unification to be connected power supply or to power separately, demand according to different process encapsulation and user, collocation structure on the light source substrate 1 can adopt multizone unified connection powered operation or zones of different to encapsulate separately power supply, concrete is red light chips 4 zones and the blue chip 2 regional separate power supplies that are connected, and reliability and fail safe are stronger.
The present embodiment is low for the light efficiency that solves the existence of LED white light source, the problems such as color rendering is poor, the structure that adopts red light chips 4 directly to encapsulate, carrying out the subregion with blue chip 2 is arranged on the light source substrate 1, simple and reliable for structure, the overall package structure also can be carried out the staged encapsulation according to user's request, the compensation of multizone cross-excitation, when reaching the user optical property required, also obtain the outstanding light source of high light efficiency and high-color rendering, red light chips 4 adopts high transparent encapsulated layer 5 to encapsulate separately simultaneously, effectively prevents from mixing formed light decay by multiple fluorescent material, compare with existing integration packaging product, can effectively improve the color rendering index of light source, light efficiency can improve 15%-30%, reduces the power of light source, save electric energy, range of application can be wider, solves well the familiar lacunas of light source, is widely used.
The above is preferred embodiment of the present invention, and the present invention is not limited to above-mentioned execution mode, as long as it reaches technique effect of the present invention with identical means, all should belong to protection scope of the present invention.
Claims (9)
1. directly seal the high-color development LED light source of compensation based on red light chips, comprise light source substrate (1) and be arranged in blue chip (2) on the described light source substrate (1), described blue chip (2) is packaged with yellow fluorescent powder (3) on the surface, it is characterized in that: also comprise red light chips (4) on the described light source substrate (1), described red light chips (4) is arranged on the light source substrate (1) by the Region Segmentation form with blue chip (2), the coloured light that the ruddiness that send in red light chips (4) zone and blue chip (2) the zone institute yellow fluorescent powder that excites (3) produces carries out complementation, the formation white light.
2. the high-color development LED light source that directly seals compensation based on red light chips according to claim 1 is characterized in that: be coated with high transparent encapsulated layer (5) on described red light chips (4) region surface.
3. the high-color development LED light source that directly seals compensation based on red light chips according to claim 1 is characterized in that: the shape of described red light chips (4) zone and blue chip (2) Region Segmentation is square, circle or rectangle.
4. the high-color development LED light source that directly seals compensation based on red light chips according to claim 3 is characterized in that: described red light chips (4) zone is 1:3 with the size ratio in blue chip (2) zone.
5. according to claim 1 to 4 each described high-color development LED light sources that directly seal compensation based on red light chips, it is characterized in that: red light chips (4) quantity in described red light chips (4) zone is the 5%-15% of blue chip quantity.
6. the high-color development LED light source that directly seals compensation based on red light chips according to claim 1, it is characterized in that: the optical wavelength scope that described red light chips (4) sends is 612nm-630nm.
7. the high-color development LED light source that directly seals compensation based on red light chips according to claim 1, it is characterized in that: the optical wavelength scope that described blue chip (2) sends is 420nm-465nm.
8. the high-color development LED light source that directly seals compensation based on red light chips according to claim 1 is characterized in that: the upper red light chips (4) of described light source substrate (1) zone and the regional circuit structure that adopts unification to be connected power supply or to power separately of blue chip (2).
9. according to claim 1 or the 8 described high-color development LED light sources that directly seal compensation based on red light chips, it is characterized in that: the operating power scope of described light source substrate (1) is 3W-250W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210421669.9A CN102931177B (en) | 2012-10-29 | 2012-10-29 | High-color-rendering LED light source based on red light chip direct sealing compensation |
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| CN201210421669.9A CN102931177B (en) | 2012-10-29 | 2012-10-29 | High-color-rendering LED light source based on red light chip direct sealing compensation |
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| CN102931177A true CN102931177A (en) | 2013-02-13 |
| CN102931177B CN102931177B (en) | 2015-02-04 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109273434A (en) * | 2017-07-18 | 2019-01-25 | 吕朝妮 | The high-color development LED light source of compensation is directly sealed based on red light chips |
| JP2019054098A (en) * | 2017-09-14 | 2019-04-04 | 株式会社グリーンウェル | White led element reduced in blue light, and white led unit with white led elements arranged and mounted on wiring board |
| WO2020000513A1 (en) * | 2018-06-27 | 2020-01-02 | 朗昭创新控股（深圳）有限公司 | Led light source manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101592291A (en) * | 2009-06-26 | 2009-12-02 | 惠州市斯科电气照明有限公司 | LED lamp preparation method that a kind of colour temperature is adjustable and LED lamp |
| CN201845774U (en) * | 2010-08-27 | 2011-05-25 | 苏州科医世凯半导体技术有限责任公司 | High color rendering white light LED module |
| CN102192424A (en) * | 2010-03-12 | 2011-09-21 | 东芝照明技术株式会社 | Light emitting device and illumination apparatus |
-
2012
- 2012-10-29 CN CN201210421669.9A patent/CN102931177B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101592291A (en) * | 2009-06-26 | 2009-12-02 | 惠州市斯科电气照明有限公司 | LED lamp preparation method that a kind of colour temperature is adjustable and LED lamp |
| CN102192424A (en) * | 2010-03-12 | 2011-09-21 | 东芝照明技术株式会社 | Light emitting device and illumination apparatus |
| CN201845774U (en) * | 2010-08-27 | 2011-05-25 | 苏州科医世凯半导体技术有限责任公司 | High color rendering white light LED module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109273434A (en) * | 2017-07-18 | 2019-01-25 | 吕朝妮 | The high-color development LED light source of compensation is directly sealed based on red light chips |
| JP2019054098A (en) * | 2017-09-14 | 2019-04-04 | 株式会社グリーンウェル | White led element reduced in blue light, and white led unit with white led elements arranged and mounted on wiring board |
| WO2020000513A1 (en) * | 2018-06-27 | 2020-01-02 | 朗昭创新控股（深圳）有限公司 | Led light source manufacturing method |
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| CN102931177B (en) | 2015-02-04 |
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Effective date of registration: 20161017 Address after: Guangdong province Zhongshan City Linsen road 528400 Xiaolan Town No. 1 building 1-10 building /11 building 12-15 (an additional 2 business premises Yucheng Xiaolan Town Three Street No. 6 Xiaolan Town Nantai Street No. 1) Patentee after: Zhongshan M.L.S. Electronics Co., Ltd. Address before: No. 1 road 528415 Guangdong province Linsen Zhongshan Xiaolan Town Patentee before: MLS Co., Ltd. |
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