CN201838590U

CN201838590U - Twin-wafer high-color-rendering-property warm white light packaging structure

Info

Publication number: CN201838590U
Application number: CN2010205810553U
Authority: CN
Inventors: 扬州; 杨子明
Original assignee: SHENZHEN RISHANG OPTO-ELECTRONICS CO LTD
Current assignee: Rishang Optoelectronics Co., Ltd.
Priority date: 2010-10-27
Filing date: 2010-10-27
Publication date: 2011-05-18
Anticipated expiration: 2020-10-27

Abstract

The utility model provides an LED packaging structure capable of generating high-color-rendering-property warm white light and a warm white lamp obtained by the aid of the LED packaging structure. The LED packaging structure comprises a wafer support, a red light LED wafer and a blue light LED wafer, wherein the wafer support is provided with two pairs of pins, the blue light LED wafer and the red light LED wafer are respectively electrically connected with one pair of pins, and the blue light LED wafer and the red light LED wafer are connected in parallel. In the technical scheme, the LED packaging structure adopts the red wafer to replace red fluorescent powder, resolves the problem of low brightness and color shifting, leads effect of an LED to be close to the requirement of filament lamps, and accordingly can be applied to household illumination and decorative lighting.

Description

Twin lamella high-color rendering warm white encapsulating structure

Technical field

The utility model application relates to a kind of encapsulating structure that obtains the high-color rendering warm white, and the warm white lamp of a kind of low colour temperature high-color rendering that obtains thus, belongs to the LED lighting technical field.

Background technology

Along with the lifting of light-emitting diode (LED) chip and encapsulation technology, white light LEDs progressively is subjected to people's favor as the general lighting light source.It has series of advantages such as low pressure, low-power consumption, high reliability, long-life, fields such as LED street lamp, LED light fixture have been widely used in, be a kind of green new light sources that meets country's " energy-saving and emission-reduction " policy, be expected to replace fluorescent lamp and the incandescent lamp that dominates at lighting field at present.Fluorescent lamp need utilize mercury vapour as discharge medium in luminescence process, and human body is produced harm, and incandescent lamp makes white light LEDs be a a progressive step again to general lighting especially room lighting because electro-optical efficiency is low.

Yet the color rendering of white light LEDs is the technical bottleneck of restriction its inlet chamber intraoral illumination, particularly reading lighting, medical illumination.For a long time, rare-earth garnet (YAG:Ce3+) yellow fluorescent powder that people adopt InGaN base blue-light LED chip and Ce3+ to activate makes up and prepares cold white light LEDs (Tc＞5,000K), can realize that color rendering index is higher than 80, but preparation warm white LED (Tc＜5, in the time of 000K), because the unbalanced people of making of white light LEDs spectrum are difficult to realize simultaneously low colour temperature and high-color rendering technically.

The preparation method of existing low colour temperature White LED with high color rendering property comprises: (1) RGB three primary colors chip hybrid becomes white light; (2) the near ultraviolet LED chip excites RGB fluorescent material; (3) blue-light LED chip excitated fluorescent powder; But these methods all exist weak point:

1.RGB the three primary colors chip hybrid becomes white light:

This method is regulated the proportioning of three primary colors with integrated being encapsulated within the individual devices of red, green, blue three-color LED power-type chip, can obtain versicolor light in theory.Can produce the broad band white light by the operating current of adjusting the three-color LED chip, that is to say the white light LEDs that can obtain low colour temperature high-color rendering by the integrated method of multicore sheet.The shortcoming of this method is the encapsulating structure more complicated, and circuit is realized difficulty, the white light less stable, and cost is than higher.Because the quantum efficiency difference of three kinds of color led chips of red, green, blue is different with the variation of temperature and drive current separately, and decay in time is also different, so the colourity instability of output white light.In order to make it stable, need add feedback circuit respectively to three kinds of colors and compensate, so encapsulating structure and circuit more complicated.

2, near ultraviolet LED chip excitated fluorescent powder:

Adopt the near ultraviolet LED (400nm) of high brightness to excite the RGB three primary colors fluorescent powder, produce the red, green, blue three primary colors, and can form white light by the proportioning of adjusting three-color phosphor.

The advantage of this method is: (1) under low colour temperature situation, the color rendering index height; (2) photochromic adjustable with colour temperature.Its shortcoming is: the power-type near ultraviolet LED chip of (1) high-luminous-efficiency is not easy to make, and costs an arm and a leg; (2) encapsulating material (as silica gel etc.) is aging easily under the irradiation of ultraviolet light, the lost of life; (3) near ultraviolet excitated RGB fluorescent material light conversion efficiency is not high; (4) there is the potential safety hazard of ultraviolet leakage.

3, blue-light LED chip excitated fluorescent powder

This is a method commonly used at present, is divided into following several different situation again:

3.1, blue-ray LED excites monochromatic fluorescent material

At present, the preparation method of white light LEDs main flow is that blue-light LED chip excites the YAG:Ce3+ yellow fluorescent powder.The advantage of this method is to obtain luminous flux and the higher white light of luminous efficiency; Shortcoming is the white light that is difficult to obtain low colour temperature high-color rendering, owing to lack the ruddiness composition in the spectrum, so colour temperature height and color rendering is poor.At present, the scheme that blue-light LED chip and YAG:Ce3+ yellow fluorescent powder mix is difficult to be implemented in 4, the low colour temperature that 000K is following and the white light LEDs of Ra＞80 high-color renderings.

3.2 blue-ray LED excites the Two Colour Fluorescence powder

Adopt blue-light LED chip to excite white light yellow and that red fluorescence powder obtains, but because the conversion efficiency of red fluorescence powder is lower at present, and under same operating current, the shortcoming of this method is that the conversion efficiency of powder is not high, luminous efficiency have much room for improvement.The red fluorescence powder here mainly is to improve color rendering, and red fluorescence powder generally is sulfide, silicates, nitride formation.Red fluorescence powder can reduce the efficient of wafer excitated fluorescent powder, so reduced brightness, and fluorescent material easily decays, also can cause (promptly look wafts, and causes high-color rendering warm up white lamp for X, Y) value drift, decay greatly, phenomenons such as look drift.

3.3 blue-ray LED excites three-color phosphor

Adopt blue-light LED chip to excite β-SiAlON:Eu green emitting phosphor, Ca-α-SiAlON:Eu yellow fluorescent powder and CaAlSiN3:Eu red fluorescence powder, obtained colour temperature from cold be 80 white light to warm adjustable in vain, color rendering index in vain.The advantage of this method is the adjustable color temperature that can obtain certain limit by the ratio of adjusting three kinds of fluorescent material; Shortcoming is that the conversion efficiency of fluorescent material is not high, and powder is difficult for mixing etc.

3.4 blue-ray LED excites four look fluorescent material

Excite the nitrogen oxide/Nitride phosphor (β-SiAlON:Eu green emitting phosphor, Ca-α-SiAlON:Eu yellow fluorescent powder, CaAlSiN3:Eu red fluorescence powder and the dark blue fluorescent material of BaSi2O2N2:Eu) of four kinds of mixing to prepare under the colour temperature of wide swings (2 by blue-ray LED, 900～7, the 000K) white light LEDs of high color rendering index (CRI) (more than 95).Particularly having obtained colour temperature Tc is 2, and 900K and color rendering index Ra are 98 white light LEDs, and light efficiency is also higher, and this is the white light LEDs of different color rendering indexs under the different-colour that obtains by the ratio of regulating four kinds of fluorescent material to reach 28 lm/W..

Adopt blue-ray LED to excite the nitrogen oxide/Nitride phosphor of four kinds of mixing, its advantage is the white light LEDs that can obtain under the situation of low colour temperature than high color rendering index (CRI), and colour temperature is adjustable, and shortcoming is that the fluorescent material technology of preparing that adopts of this method is immature, and multiple powder mixes comparatively difficulty.

Summary of the invention

The utility model application promptly is at warming up the existing above-mentioned weak point of white lamp technical field, the warm white lamp that a kind of twin lamella high-color rendering warm white encapsulating structure is provided and obtains thus at high-color rendering at present.

The mentality of designing of the utility model application is that the fluorescent material at redness exists unsettled phenomenon, adopt red wafer to substitute red fluorescence powder, because red wafer has good light decay, and it is Wavelength stabilized, be difficult for taking place color drift phenomenon, excite yellow fluorescent powder with red-light LED wafer and blue-ray LED wafer, thereby produce warm white.

Specifically, twin lamella high-color rendering warm white encapsulating structure described in the utility model, it is characterized in that: described LED encapsulating structure comprises chip support, red-light LED wafer, blue-ray LED wafer, and the annexation of each several part is as described below:

1) described chip support has two pairs of pins;

2) described blue-ray LED wafer and red-light LED wafer respectively are electrically connected with a pair of pin, and be in parallel between blue-ray LED wafer and the red-light LED wafer.

With described twin lamella high-color rendering warm white encapsulating structure deexcitation yellow fluorescent powder, thereby obtain the warm white lamp of low colour temperature high-color rendering.

Described encapsulating structure is characterized in that: described blue-ray LED wafer is high-power or the low-power LED wafer.

Described encapsulating structure is characterized in that: described red-light LED wafer is high light large power or low-power LED wafer.

Described encapsulating structure is characterized in that: described chip support is the twin lamella led support.

Described encapsulating structure is characterized in that: described twin lamella led support comprise 3528 twin lamella led supports, 1204 twin lamella led supports or, 5050 twin lamella led supports or 0603 twin lamella led support.

The utility model also protects a kind of high-color rendering to warm up white lamp, it is characterized in that: the warm white light fixture of described high-color rendering has described encapsulating structure.

The described twin lamella high-color rendering of the utility model application warm white encapsulating structure and the warm white lamp of the high-color rendering that obtains thus have following advantage:

1, the warm white lamp of existing high-color rendering, the use red fluorescence powder excites, brightness is low, look wafts seriously, do not accepted by market, and use red wafer to substitute red fluorescence powder, solve the phenomenon of the low and look drift of brightness, made the effect of LED approach the requirement of incandescent lamp, thereby can use lighting of home and lamp decoration is used;

2, the white light that obtains has the effect of low colour temperature and high-color rendering, has solved insurmountable problem in the conventional art, and particularly having obtained colour temperature Tc is 2, and 900K and color rendering index Ra are 98 white light LEDs, and light efficiency is also higher;

3, simple and practical, can prepare various light fixtures, to adapt to different occasions.

Description of drawings

Accompanying drawing is the schematic diagram of the described twin lamella high-color rendering of the utility model application warm white encapsulating structure, wherein, 1 is that LED wafer, 2 is that red-light LED wafer, 3 is that blue-ray LED wafer, 21 is that the first positive pin, 22 is that the first negative pin, 31 is that the second positive pin, 32 is the second negative pin.

Embodiment

Below in conjunction with accompanying drawing twin lamella high-color rendering warm white encapsulating structure described in the utility model is described in detail; purpose is better to understand the described technology contents of the utility model application for the public; rather than to the restriction of the described technology contents of the utility model application; in fact; in the utility model spirit, any increase and decrease, replacement and the improvement of being done is all within the utility model application technical scheme required for protection.

Specifically, twin lamella high-color rendering warm white encapsulating structure described in the utility model, comprise chip support 1, red-light LED wafer 2, blue-ray LED wafer 3, wherein, described chip support has two pairs of pins, is respectively first positive pin two 1, first negative pin two 2, second positive pin 31, the second negative pin 32; Described red-light LED wafer 2 and blue-ray LED wafer 3 respectively are electrically connected with a pair of pin, and be in parallel between red-light LED wafer 2 and the blue-ray LED wafer 3.

Preferred implementation as LED encapsulating structure described in the utility model, described blue-ray LED wafer is high-power or the low-power LED wafer, described red-light LED wafer is high light large power or low-power LED wafer, described chip support is the twin lamella led support, for example can be 3528 twin lamella led supports, 1204 twin lamella led supports or, 5050 twin lamella led supports or 0603 twin lamella led support.As luminescence unit, excite yellow fluorescent powder with described LED encapsulating structure, produce the warm white of high-color rendering.The utility model also protects a kind of high-color rendering to warm up white lamp, and wherein, the warm white light fixture of described high-color rendering has described LED encapsulating structure.

Technical scheme described in the utility model uses red wafer to substitute red fluorescence powder, has solved the phenomenon of the low and look drift of brightness, makes the effect of LED approach the requirement of incandescent lamp, thereby can use lighting of home and lamp decoration is used.

Claims

1. twin lamella high-color rendering warm white encapsulating structure, it is characterized in that: described LED encapsulating structure comprises chip support, red-light LED wafer, blue-ray LED wafer, and the annexation of each several part is as described below:

1) described chip support has two pairs of pins;

2. encapsulating structure according to claim 1 is characterized in that: described blue-ray LED wafer is high-power or the low-power LED wafer.

3. encapsulating structure according to claim 1 is characterized in that: described red-light LED wafer is high light large power or low-power LED wafer.

4. encapsulating structure according to claim 1 is characterized in that: described chip support is the twin lamella led support.

5. encapsulating structure according to claim 4 is characterized in that: described twin lamella led support comprises 3528 twin lamella led supports, 1204 twin lamella led supports, 5050 twin lamella led supports or 0603 twin lamella led support.