CN102925080A - Book thermoplastic binding hot melt glue used at low temperature and preparation method thereof - Google Patents
Book thermoplastic binding hot melt glue used at low temperature and preparation method thereof Download PDFInfo
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- CN102925080A CN102925080A CN2012104986449A CN201210498644A CN102925080A CN 102925080 A CN102925080 A CN 102925080A CN 2012104986449 A CN2012104986449 A CN 2012104986449A CN 201210498644 A CN201210498644 A CN 201210498644A CN 102925080 A CN102925080 A CN 102925080A
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Abstract
The invention relates to hot melt glue and a preparation method thereof, and belongs to the technical field of preparation of hot melt glue. The preparation method comprises the following steps of: starting stirring and opening a heat-conduction oil heating valve; sequentially filling ethylene-vinyl acetate (EVA) resin, a filler, a wax diluents and an antioxygen according to the proportion into a reaction kettle for heating; totally melting each component; adding tackified resin to heat until the tackified resin is totally melted; vacuumizing a reaction system until the reaction system has no bubbles; adding a filter screen and discharging at a discharging port of the reaction kettle; and cooling and forming the materials to obtain a product. The book thermoplastic binding hot melt glue can be used at about 130 DEG C, and is suitable for linkage line production; compared with the traditional book thermoplastic binding hot melt glue, the using temperature is reduced by 30 DEG C to 50 DEG C, so that the production energy consumption (electric energy, heat energy and the like) is reduced, the maintenance cost of equipment is reduced, and the production efficiency is improved; and the glue performance in a glue groove is stable, energy-saving production is facilitated, and the hot melt glue is environment-friendly.
Description
Technical field
The present invention relates to a kind of hot melt adhesive and preparation method thereof, be specifically related to hot melt adhesive that the books unsewn binding uses with low temperature and preparation method thereof, belong to the hot melt adhesive preparing technical field.
Background technology
Hot melt adhesive since its not contain solvent pollution-free, curing speed is fast, processing performance is good and have a laudatory title of green sizing agent.In recent years, the hot melt adhesive development rapidly, and is of many uses.Books unsewn binding EVA(ethylene-vinyl acetate copolymer) hot melt adhesive without locking wire, is saved a procedure during book bookbinding, and is easy to operate, and is applicable to the high-speed and continuous production line, greatly improved production efficiency, thereby obtained the most general application.At present, be applied to the EVA hot melt adhesive of books unsewn binding in use, generally all use temperature is designed between 160 ℃ ~ 180 ℃, and applied at elevated temperature can cause two problems: 1) long applied at elevated temperature, need energy consumption higher, consumed in a large number electric energy, heat energy, disagreed with the production energy-saving that government promotes energetically; 2) applied at elevated temperature causes the tackifying resin degradation and decomposition of colloid the inside for a long time, decompose on the one hand the volatile matter that produces and to produce pollution to environment, on the other hand, the aging meeting of resin causes colloid carbonization to occur, affect glueability, carbonaceous deposits can make the melten gel structure deteriorate, increases maintenance of the equipment and maintenance cost, and the maintenance of equipment will affect production efficiency.
Problem for existing hot melt adhesive existence, the invention provides a kind of low temperature and use books unsewn binding hot melt adhesive, by rational selection EVA(ethylene-vinyl acetate copolymer), kind and the proportioning of tackifying resin and wax class thinner, not only guarantee the cohesive strength of hot melt adhesive, and reduced the gluing temperature of books unsewn binding hot melt adhesive, thereby guaranteed that the glue performance in the glue groove is stable, be difficult for carbonization, reduced simultaneously production energy consumption (electric energy, heat energy etc.), reduce the equipment maintenance cost, enhance productivity.
Summary of the invention
The object of the invention is to overcome the weak point of existing hot melt adhesive technology, provide a kind of low temperature to use books unsewn binding hot melt adhesive and preparation method thereof.
According to technical scheme provided by the invention, the hot melt adhesive that a kind of books unsewn binding is used with low temperature, formula rate is as follows by weight: 30 ~ 45 parts of ethylene-vinyl acetate copolymer EVA, 30 ~ 40 parts of tackifying resins, wax class thinner 12-25 part, filler 0.5-5 part and antioxidant 0.3-1.5 part;
Open and stir and the heat-conducting oil heating valve, drop into successively EVA resin, filler, wax class thinner and oxidation inhibitor heating in the proportioning in the reactor, treat that each component melts fully, add again tackifying resin, be heated to whole thawings, reaction system is evacuated to does not have bubble, adds the filter screen blowing at the reactor discharge port, through cooling forming, namely get the hot melt adhesive that the unsewn binding of product books is used with low temperature.
To count by weight proportion content be 26% ~ 40% to VA among the described ethylene-vinyl acetate copolymer EVA, and its melting index at 190 ℃ is 20 ~ 500g/10min, and density is 0.92 ~ 0.96g/cm
3
Described tackifying resin is Gum Rosin, staybelite resin, C
5The mixture of two or more among petroleum resin, the hydrogenated petroleum resin.
Described wax class is one or both the mixture in paraffin, Microcrystalline Wax, Fischer-Tropsch wax, the husky rope wax.
Described filler is one or both the mixture in calcium carbonate, titanium dioxide, the talcum powder.
Described antioxidant is one or both the mixture among CHINOX 1010, the CHINOX 1076.
The hot melt adhesive that described books unsewn binding is used with low temperature, step is as follows by weight:
(1) fusing: in reactor, add successively 30 ~ 45 parts of ethylene-vinyl acetate copolymer EVA, filler 0.5-5 part, wax class thinner 12-25 part and antioxidant 0.3-1.5 part, be heated to 130 ~ 180 ℃, with speed stirring 30 ~ 60min of 40 ~ 60r/min;
(2) secondary fusion: add 30 ~ 40 parts of tackifying resins in step (1) gained mixture, continue to be heated to 130 ~ 180 ℃ of heating, the speed of 40 ~ 60r/min stirs 20 ~ 50min, until its whole fusings, mixing and stirring;
(3) vacuumize discharging: step (2) gained mixture is vacuumized, and vacuum tightness is-0.08MPa that the pumpdown time is 10 ~ 20min, until reaction system is without bubble; Add 200 mesh filter screen blowings at the reactor discharge port, the normal temperature cooling forming namely gets the hot melt adhesive that the unsewn binding of product books is used with low temperature.
The present invention has following advantage: the books unsewn binding hot melt adhesive of gained of the present invention can use about 130 ℃, is fit to train line production, has reduced by 30 ℃ to 50 ℃ than traditional books unsewn binding hot melt adhesive use temperature.This has not only reduced production energy consumption (electric energy, heat energy etc.), reduces the equipment maintenance cost, enhances productivity; And so that the glue performance in the glue groove is stable, be difficult for carbonization, and guarantee cohesive strength, be conducive to production energy-saving, environmental protection.
Embodiment
The below further specifies the present invention with embodiment, better understands the present invention, but the present invention not only is confined to following examples.
The preparation of the hot melt adhesive that embodiment 1 books unsewn binding is used with low temperature
(1) fusing: add successively 1 part of ethylene-vinyl acetate copolymer EVA40 part, filler 0.5-5 part, 20 parts of wax class thinners and antioxidant in the reactor, be heated to 150 ℃, stir 40min with the speed of 60r/min;
(2) secondary fusion: add 36 parts of tackifying resins in step (1) gained mixture, continue to be heated to 150 ℃ of heating, the speed of 60r/min stirs 20min, until its whole fusings, mixing and stirring;
(3) vacuumize discharging: step (2) gained mixture is vacuumized, and vacuum tightness is-0.08MPa that the pumpdown time is 10min, until reaction system is without bubble; Add 200 mesh filter screen blowings at the reactor discharge port, the normal temperature cooling forming namely gets the hot melt adhesive that the unsewn binding of product books is used with low temperature.
To count by weight proportion content be 26% to VA among the described ethylene-vinyl acetate copolymer EVA, and its melting index at 190 ℃ is 20 ~ 500g/10min, and density is 0.92 ~ 0.96g/cm
3
Described tackifying resin is the mixture of the equal proportion of Gum Rosin, staybelite resin.Described wax class is paraffin.Described filler is talcum powder.Described antioxidant is CHINOX 1010.
The preparation of the hot melt adhesive that embodiment 2 books unsewn bindings are used with low temperature
(1) fusing: add successively 0.3 part of ethylene-vinyl acetate copolymer EVA45 part, 1.8 parts of fillers, 23 parts of wax class thinners and antioxidant in the reactor, be heated to 180 ℃, stir 30min with the speed of 40r/min;
(2) secondary fusion: add 30 parts of tackifying resins in step (1) gained mixture, continue to be heated to 180 ℃ of heating, the speed of 40r/min stirs 20min, until its whole fusings, mixing and stirring;
(3) vacuumize discharging: step (2) gained mixture is vacuumized, and vacuum tightness is-0.08MPa that the pumpdown time is 10 ~ 20min, until reaction system is without bubble; Add 200 mesh filter screen blowings at the reactor discharge port, the normal temperature cooling forming namely gets the hot melt adhesive that the unsewn binding of product books is used with low temperature.
To count by weight proportion content be 40% to VA among the described ethylene-vinyl acetate copolymer EVA, and its melting index at 190 ℃ is 20 ~ 500g/10min, and density is 0.92 ~ 0.96g/cm
3
Described tackifying resin is Gum Rosin, staybelite resin, C
5The equal proportion mixture of petroleum resin, hydrogenated petroleum resin.Described wax class is the mixture of Fischer-Tropsch wax and Sha Suo wax.Described filler is calcium carbonate.Described antioxidant is the mixture of CHINOX 1010, CHINOX 1076.
The preparation of the hot melt adhesive that embodiment 3 books unsewn bindings are used with low temperature
(1) fusing: add successively 0.5 part of 35 parts of ethylene-vinyl acetate copolymer EVA, 2.5 parts of fillers, 22 parts of wax class thinners and antioxidant in the reactor, be heated to 130 ℃, stir 50min with the speed of 60r/min;
(2) secondary fusion: add 40 parts of tackifying resins in step (1) gained mixture, continue to be heated to 130 ℃ of heating, the speed of 60r/min stirs 50min, until its whole fusings, mixing and stirring;
(3) vacuumize discharging: step (2) gained mixture is vacuumized, and vacuum tightness is-0.08MPa that the pumpdown time is 10 ~ 20min, until reaction system is without bubble; Add 200 mesh filter screen blowings at the reactor discharge port, the normal temperature cooling forming namely gets the hot melt adhesive that the unsewn binding of product books is used with low temperature.
To count by weight proportion content be 30% to VA among the described ethylene-vinyl acetate copolymer EVA, and its melting index at 190 ℃ is 20 ~ 500g/10min, and density is 0.92 ~ 0.96g/cm
3
Described tackifying resin is hydrogenated petroleum resin.Described wax class is Microcrystalline Wax.Described filler is the mixture in calcium carbonate, the talcum powder.Described antioxidant is CHINOX 1076.
The preparation of the hot melt adhesive that embodiment 4 books unsewn bindings are used with low temperature
(1) fusing: add successively 1.3 parts of 33 parts of ethylene-vinyl acetate copolymer EVA, 2.7 parts of fillers, 25 parts of wax class thinners and antioxidants in the reactor, be heated to 160 ℃, stir 50min with the speed of 55r/min;
(2) secondary fusion: add 38 parts of tackifying resins in step (1) gained mixture, continue to be heated to 160 ℃ of heating, the speed of 55r/min stirs 50min, until its whole fusings, mixing and stirring;
(3) vacuumize discharging: step (2) gained mixture is vacuumized, and vacuum tightness is-0.08MPa that the pumpdown time is 10 ~ 20min, until reaction system is without bubble; Add 200 mesh filter screen blowings at the reactor discharge port, the normal temperature cooling forming namely gets the hot melt adhesive that the unsewn binding of product books is used with low temperature.
To count by weight proportion content be 34% to VA among the described ethylene-vinyl acetate copolymer EVA, and its melting index at 190 ℃ is 20 ~ 500g/10min, and density is 0.92 ~ 0.96g/cm
3
Described tackifying resin is Gum Rosin, C
5The mixture of petroleum resin.Described wax class is Fischer-Tropsch wax.Described filler is talcum powder.Described antioxidant is the mixture of CHINOX 1010, CHINOX 1076.
The preparation of the hot melt adhesive that embodiment 5 books unsewn bindings are used with low temperature
(1) fusing: add successively 0.8 part of 38.5 parts of ethylene-vinyl acetate copolymer EVA, 2 parts of fillers, 20.2 parts of wax class thinners and antioxidant in the reactor, be heated to 170 ℃, stir 40min with the speed of 40r/min;
(2) secondary fusion: add 38.5 parts of tackifying resins in step (1) gained mixture, continue to be heated to 170 ℃ of heating, the speed of 40r/min stirs 20min, until its whole fusings, mixing and stirring;
(3) vacuumize discharging: step (2) gained mixture is vacuumized, and vacuum tightness is-0.08MPa that the pumpdown time is 10 ~ 20min, until reaction system is without bubble; Add 200 mesh filter screen blowings at the reactor discharge port, the normal temperature cooling forming namely gets the hot melt adhesive that the unsewn binding of product books is used with low temperature.
To count by weight proportion content be 38% to VA among the described ethylene-vinyl acetate copolymer EVA, and its melting index at 190 ℃ is 20 ~ 500g/10min, and density is 0.92 ~ 0.96g/cm
3
Described tackifying resin is staybelite resin, C
5The mixture of petroleum resin, hydrogenated petroleum resin.Described wax class is the mixture in paraffin, the husky rope wax.Described filler is calcium carbonate.Described antioxidant is CHINOX1010.
Application Example 1
The low temperature of getting embodiment 1 gained uses books unsewn binding hot melt adhesive and common bookbinding hot melt adhesive to carry out the salient features contrast, and comparative result is as shown in table 1.
Table 1 low temperature uses hot melt adhesive and common EVA hot melt adhesive Performance Ratio
Claims (7)
1. a books unsewn binding is characterized in that formula rate is as follows by weight: 30 ~ 45 parts of ethylene-vinyl acetate copolymer EVA, 30 ~ 40 parts of tackifying resins, wax class thinner 12-25 part, filler 0.5-5 part and antioxidant 0.3-1.5 part with the hot melt adhesive that low temperature uses;
Open and stir and the heat-conducting oil heating valve, drop into successively EVA resin, filler, wax class thinner and oxidation inhibitor heating in the proportioning in the reactor, treat that each component melts fully, add again tackifying resin, be heated to whole thawings, reaction system is evacuated to does not have bubble, adds the filter screen blowing at the reactor discharge port, through cooling forming, namely get the hot melt adhesive that the unsewn binding of product books is used with low temperature.
2. the hot melt adhesive that uses with low temperature of books unsewn binding as claimed in claim 1, it is characterized in that: to count by weight proportion content be 26% ~ 40% to VA among the described ethylene-vinyl acetate copolymer EVA, its melting index at 190 ℃ is 20 ~ 500g/10min, and density is 0.92 ~ 0.96g/cm
3
3. the hot melt adhesive that uses with low temperature of books unsewn binding as claimed in claim 1, it is characterized in that: described tackifying resin is Gum Rosin, staybelite resin, C
5The mixture of two or more among petroleum resin, the hydrogenated petroleum resin.
4. the books unsewn binding is characterized in that with the hot melt adhesive that low temperature uses as claimed in claim 1: described wax class is one or both the mixture in paraffin, Microcrystalline Wax, Fischer-Tropsch wax, the husky rope wax.
5. the books unsewn binding is characterized in that with the hot melt adhesive that low temperature uses as claimed in claim 1: described filler is one or both the mixture in calcium carbonate, titanium dioxide, the talcum powder.
6. the books unsewn binding is characterized in that with the hot melt adhesive that low temperature uses as claimed in claim 1: described antioxidant is one or both the mixture among CHINOX 1010, the CHINOX 1076.
7. the described books unsewn binding of claim 1 is characterized in that step is as follows by weight with the hot melt adhesive that low temperature uses:
(1) fusing: in reactor, add successively 30 ~ 45 parts of ethylene-vinyl acetate copolymer EVA, filler 0.5-5 part, wax class thinner 12-25 part and antioxidant 0.3-1.5 part, be heated to 130 ~ 180 ℃, with speed stirring 30 ~ 60min of 40 ~ 60r/min;
(2) secondary fusion: add 30 ~ 40 parts of tackifying resins in step (1) gained mixture, continue to be heated to 130 ~ 180 ℃ of heating, the speed of 40 ~ 60r/min stirs 20 ~ 50min, until its whole fusings, mixing and stirring;
(3) vacuumize discharging: step (2) gained mixture is vacuumized, and vacuum tightness is-0.08MPa that the pumpdown time is 10 ~ 20min, until reaction system is without bubble; Add 200 mesh filter screen blowings at the reactor discharge port, the normal temperature cooling forming namely gets the hot melt adhesive that the unsewn binding of product books is used with low temperature.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012104986449A CN102925080A (en) | 2012-11-29 | 2012-11-29 | Book thermoplastic binding hot melt glue used at low temperature and preparation method thereof |
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| CN2012104986449A CN102925080A (en) | 2012-11-29 | 2012-11-29 | Book thermoplastic binding hot melt glue used at low temperature and preparation method thereof |
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| CN2012104986449A Pending CN102925080A (en) | 2012-11-29 | 2012-11-29 | Book thermoplastic binding hot melt glue used at low temperature and preparation method thereof |
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| ES2457940A1 (en) * | 2014-02-18 | 2014-04-29 | Forest Chemical Group S.A. | Hot melt adhesive (Machine-translation by Google Translate, not legally binding) |
| CN104119818A (en) * | 2014-06-26 | 2014-10-29 | 安徽图强文具股份有限公司 | Vermiculite powder-containing quick-drying hot melt adhesive for notebook bonding |
| CN104119835A (en) * | 2014-06-26 | 2014-10-29 | 安徽图强文具股份有限公司 | Non-toxic hot-melt adhesive containing bone glue and for bookbinding of notebook |
| CN104861894A (en) * | 2015-05-18 | 2015-08-26 | 湖北唯可化工材料有限公司 | Hot melt adhesive for book binding and preparation method of hot melt adhesive |
| CN105694766A (en) * | 2016-03-16 | 2016-06-22 | 苏州华周胶带有限公司 | Sizing material with high coating performance |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103387803A (en) * | 2013-07-01 | 2013-11-13 | 江苏达胜热缩材料有限公司 | Hot melt adhesive |
| CN103571391A (en) * | 2013-10-24 | 2014-02-12 | 芜湖众力部件有限公司 | Environmental-friendly non-toxic hot melt adhesive |
| CN103571391B (en) * | 2013-10-24 | 2016-04-13 | 芜湖众力部件有限公司 | A kind of Environmental-friendnon-toxic non-toxic hot melt adhesive |
| ES2457940A1 (en) * | 2014-02-18 | 2014-04-29 | Forest Chemical Group S.A. | Hot melt adhesive (Machine-translation by Google Translate, not legally binding) |
| CN104119818A (en) * | 2014-06-26 | 2014-10-29 | 安徽图强文具股份有限公司 | Vermiculite powder-containing quick-drying hot melt adhesive for notebook bonding |
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Application publication date: 20130213 |