CN105778826B - A kind of preparation method of low temperature high-compatibility hot fusible adhesive for package - Google Patents
A kind of preparation method of low temperature high-compatibility hot fusible adhesive for package Download PDFInfo
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- CN105778826B CN105778826B CN201610177140.5A CN201610177140A CN105778826B CN 105778826 B CN105778826 B CN 105778826B CN 201610177140 A CN201610177140 A CN 201610177140A CN 105778826 B CN105778826 B CN 105778826B
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- Prior art keywords
- vinyl acetate
- petropols
- ethylene
- compatibility
- low temperature
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09J157/02—Copolymers of mineral oil hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of preparation method of low temperature high-compatibility hot fusible adhesive for package, this method includes during feeding intake divides several times, the step of launching Petropols, ethylene-vinyl acetate copolymer and rosin resin successively in order every time, and the weight ratio of above-mentioned three in each launch process is controlled in melting saturation range；Preferably, including divide 4 times, the step of being fed intake every time by the order of 25% Petropols, 10% ethylene-vinyl acetate copolymer, 25% rosin resin.The performance test results show that the inventive method can dramatically speed up the melting speed of resin, improve the transparency, mobility and overall compatibility of glue, lift the low temperature process performance of glue finished product.
Description
Technical field
The invention belongs to PUR technical field, and in particular to a kind of preparation side of low temperature high-compatibility hot fusible adhesive for package
Method.
Background technology
Traditional Packing is with PUR mainly by ethylene-vinyl acetate copolymer (EVA), Tackifier materials, viscosity modifier, anti-
The compositions such as oxidant form, and wherein Tackifier materials are mainly selected from rosin, C5 or C9 Petropols etc., and viscosity modifier mainly selects
From paraffin, PE waxes etc..Traditional manufacturing technique method predominantly by each component, mutually mix in proportion by high-temperature fusion, extrusion molding system
, such as a kind of application number 201310269527.X patent of invention " PUR ", the invention of application number 201110395030.3 is special
Patent of invention " the PUR coating film of sharp " a kind of PUR of bonding polyolefin plastic " and application number 201310124302.5
Composition and preparation method thereof " is described；Patent of invention " Benzene-free hot-melt adhesive and its preparation side of application number 201310742801.0
Method " and the disclosed preparation of the patent of invention of application number 201310744869.2 " anti-wire drawing hot fusible adhesive for package and preparation method thereof "
Method arrives molten condition for EVA, PE and PTV first are heated into 160 DEG C, is cooled to 140 DEG C, then add Petropols and rosin tree
Fat, stirring, finally add the compositions such as PE waxes, antioxidant.
Because packaging glue is cheap, Tackifier materials are selected from the C9 Petropols with loop configuration more, and EVA is linear
Molecular structure, though belonging to organic compound, architectural difference is larger therebetween, and compatibility is generally poor, it is impossible to well
Uniformly mixing, and mainly resin is melted completely by mechanical agitation in process of production, melting speed is slow, processing temperature
Height, mixing time length, made PUR is difficult to be sufficiently formed homogeneous material, easily separated, and then performance and applying glue is influenceed during use
Fluency, fault in production is easily caused, muddy, layering, low temperature process easily occur under less than production temperature conditionss for its shaped article
Poor-performing.
The content of the invention
For disadvantages mentioned above existing for existing hot fusible adhesive for package preparation technology, it is an object of the invention to provide a kind of low
The preparation method of warm high-compatibility hot fusible adhesive for package, the method can dramatically speed up the melting speed of resin, improve glue transparency,
Mobility and overall compatibility, lift the low temperature process performance of glue finished product.
Technical solution of the present invention is as follows：
A kind of preparation method of low temperature high-compatibility hot fusible adhesive for package, it is included in during feeding intake to include and divides several times,
The step of launching Petropols, ethylene-vinyl acetate copolymer and rosin resin successively in order every time, and control and throw every time
The weight ratio of above-mentioned three is in melting saturation range during putting.
Specifically, first the ethylene-vinyl acetate copolymer of dispensing 20~30% and random polypropylene are into reactor, heating
To 145~155 DEG C, 25~35min is stirred；The amount of grading several times, launches Petropols, ethyl vinyl acetate second in order every time again
Alkene copolymer, rosin resin, the weight ratio of three in each launch process is controlled in melting saturation range, stirring 20~
30min；PE waxes are added, remaining ethylene-vinyl acetate copolymer is added after complete melting, stirs 15~25min, are taken out true
Sky, extrusion molding.
Preferably, this method comprises the following steps：
(1) stirred in 150 DEG C of ethylene-vinyl acetate copolymers for putting into 25% and random polypropylene into reactor
30min；
(2) keeping temperature, divide 4 times, every time by 25% Petropols, 10% ethylene-vinyl acetate copolymer, 25%
Rosin resin order, circulation adds in reactor and stirs and evenly mixs, and stirs 25min every time；
(3) keeping temperature, PE waxes are continuously added into reactor, treats to melt completely, add remaining ethyl vinyl acetate second
Alkene copolymer, stir 20min；
(4) vacuumize, extrusion molding.
Preferably, the Petropols are C9 Petropols.
Preferably, the PUR is composed of the following components：Ethylene-vinyl acetate copolymer 30~40%, Petropols
20~30%, rosin resin 15~25%, PE waxes 10~20%, random polypropylene (APP) 5~10%.
Percentage described above is percetage by weight.
The present invention has following advantageous effects：
During the present invention mutually mixes for existing packing hot-fusible glue component melts, Petropols (especially ring-type C9 oil
Resin) with ethylene-vinyl acetate copolymer (linear structure) because architectural difference is big, poor compatibility, it is difficult to the work fully mixed
Skill problem, creatively using similar compatibility principle (there is compatibility i.e. in the range of certain proportion, go beyond the scope and reach full
And state, there is segregation phenomenon), added point several times using special ratios, particular order during feeding intake Petropols,
EVA, rosin resin.On the one hand, the dispensing ratio of each Petropols, EVA and rosin resin is controlled in melting saturation range,
Make three's uniform dissolution；On the other hand, the rosin resin (having ring-type and linear chain structure concurrently) of special ratios is launched, bridge can be used as
Connection the two, play fabulous lubrication and containment role, form solid phase solution, stabilising system, in the system, Petropols and
Rosin resin exists as EVA solvents, three's full and uniform mixing in strand aspect, has dramatically speeded up the dissolving speed of resin
Degree, substantially increases the transparency and mobility of PUR Miscibility, glue, and institute's glue finished product has excellent low temperature process
Performance, bonding force is strong, has good prospects for commercial application.
Performance test data：850~890mpas/180 DEG C of viscosity, 112~114 DEG C of softening point, wax cloud point 120~124
DEG C, 1~2s of hardening time, 17~19N/25mm of adhesion strength.
Embodiment
With reference to specific embodiment, the invention will be further described.
Prepare embodiment
The PUR each component weight proportion (wt%) of 1~embodiment of embodiment 5 is as shown in table 1：
Table 1
Embodiment 1
The present embodiment preparation method is as follows：
(1) 25min is stirred into reactor in the EVA and 100% of 145 DEG C of inputs 20% APP；
(2) keeping temperature, points 4 times, every time by 25% C9 Petropols, 11% EVA, 25% rosin resin it is suitable
Sequence, circulation, which is added in reactor, to be stirred and evenly mixed, and stirs 20min every time；
(3) keeping temperature, 100% PE waxes is continuously added into reactor, treats to melt completely, adds remaining EVA,
Stir 15min；
(4) 10min, extrusion molding are vacuumized.
Embodiment 2
The present embodiment preparation method is as follows：
(1) 30min is stirred into reactor in the EVA and 100% of 150 DEG C of inputs 22% APP；
(2) keeping temperature, points 4 times, every time by 25% C9 Petropols, 13% EVA, 25% rosin resin it is suitable
Sequence, circulation, which is added in reactor, to be stirred and evenly mixed, and stirs 25min every time；
(3) keeping temperature, 100% PE waxes is continuously added into reactor, treats to melt completely, adds remaining EVA,
Stir 25min；
(4) 10min, extrusion molding are vacuumized.
Embodiment 3
The present embodiment preparation method is as follows：
(1) 30min is stirred into reactor in the EVA and 100% of 150 DEG C of inputs 25% APP；
(2) keeping temperature, points 4 times, every time by 25% C9 Petropols, 10% EVA, 25% rosin resin it is suitable
Sequence, circulation, which is added in reactor, to be stirred and evenly mixed, and stirs 25min every time；
(3) keeping temperature, 100% PE waxes is continuously added into reactor, treats to melt completely, adds remaining EVA,
Stir 20min；
(4) 10min, extrusion molding are vacuumized.
Embodiment 4
The present embodiment preparation method is as follows：
(1) 30min is stirred into reactor in the EVA of 150 DEG C of inputs 28%；
(2) keeping temperature, points 4 times, every time by 25% C9 Petropols, 12% EVA, 25% rosin resin it is suitable
Sequence, circulation, which is added in reactor, to be stirred and evenly mixed, and stirs 25min every time；
(3) keeping temperature, 100% wax is continuously added into reactor, treats to melt completely, adds remaining EVA, stir
Mix 20min；
(4) 10min, extrusion molding are vacuumized.
Embodiment 5
The present embodiment preparation method is as follows：
(1) in 155 DEG C of inputs 30% EVA and stir into reactor 35min；
(2) keeping temperature, points 4 times, every time by 25% C9 Petropols, 12% EVA, 25% rosin resin it is suitable
Sequence, circulation, which is added in reactor, to be stirred and evenly mixed, and stirs 25min every time；
(3) keeping temperature, 100% wax is continuously added into reactor, treats to melt completely, adds remaining EVA, stir
Mix 25min；
(4) 10min, extrusion molding are vacuumized.
Performance test
Using national standard in industry and conventional detection method, 1~embodiment of embodiment, 5 made thermofusible is carried out every
Performance test, and contrasted with commercially available same hot melt adhesive product, as shown in table 2：
The testing performance index of table 2
From upper table performance test data, compared with comparative example, 180 DEG C of viscosity of PUR of the embodiment of the present invention are integrally bright
Showing reduces, at service temperatures good fluidity；Softening point is suitable；Wax cloud point reduces, and transparency is good, and PUR component compatibility obtains
To significantly improve；Curing rate is fast；Adhesion strength increase, it was demonstrated that PUR has excellent adhesive property, with bonding object parent
With joint efforts well, low temperature process performance is excellent.
Wherein, the made PUR good fluidity of embodiment 3, softening point and wax cloud point are minimum, and hardening time is short, adhesion strength
Highest, it is most preferred embodiment.
Raw material involved by above example and reagent are commercially available prod, and institute is that this area is routinely set using industrial equipment
It is standby.
Described above is only the preferred embodiment of the present invention, and the invention is not restricted to above example.It is appreciated that ability
The oher improvements and changes that field technique personnel directly export or associated without departing from the spirit and concept in the present invention,
It is considered as being included within protection scope of the present invention.
Claims (5)
1. a kind of preparation method of low temperature high-compatibility hot fusible adhesive for package, it is characterised in that some comprising point during feeding intake
It is secondary, launch Petropols, ethylene-vinyl acetate copolymer successively in order every time and the step of rosin resin, and control every
The weight ratio of above-mentioned three is in melting saturation range in secondary launch process.
2. the preparation method of the low temperature high-compatibility hot fusible adhesive for package described in as requested 1, it is characterised in that：First dispensing 20~
30% ethylene-vinyl acetate copolymer and random polypropylene is heated to 145~155 DEG C into reactor, and stirring 25~
35min；The amount of grading several times, launches Petropols, ethylene-vinyl acetate copolymer, rosin resin, control in order every time again
The weight ratio of three stirs 20~30min in melting saturation range in each launch process；PE waxes are added, treat to melt completely
After add remaining ethylene-vinyl acetate copolymer, stir 15~25min, vacuumize, extrusion molding.
3. the preparation method of low temperature high-compatibility hot fusible adhesive for package according to claim 2, it is characterised in that including with
Lower step：
(1) 30min is stirred into reactor in 150 DEG C of ethylene-vinyl acetate copolymers for putting into 25% and random polypropylene；
(2) keeping temperature, divide 4 times, press 25% Petropols, 10% ethylene-vinyl acetate copolymer, 25% pine every time
The order of botany bar gum, circulation, which is added in reactor, to be stirred and evenly mixed, and stirs 25min every time；
(3) keeping temperature, PE waxes are continuously added into reactor, treats to melt completely, added remaining ethene-vinyl acetate and be total to
Polymers, stir 20min；
(4) vacuumize, extrusion molding.
4. the preparation method of the low temperature high-compatibility hot fusible adhesive for package according to any one of claims 1 to 3, its feature exist
In：The Petropols are C9 Petropols.
5. the preparation method of the low temperature high-compatibility hot fusible adhesive for package according to any one of claims 1 to 3, its feature exist
It is composed of the following components in the PUR：Ethylene-vinyl acetate copolymer 30~40%, Petropols 20~30%, rosin tree
Fat 15~25%, PE waxes 10~20%, random polypropylene 5~10%.
Percentage described above is percetage by weight.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177140.5A CN105778826B (en) | 2016-03-25 | 2016-03-25 | A kind of preparation method of low temperature high-compatibility hot fusible adhesive for package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610177140.5A CN105778826B (en) | 2016-03-25 | 2016-03-25 | A kind of preparation method of low temperature high-compatibility hot fusible adhesive for package |
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| Publication Number | Publication Date |
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| CN105778826A CN105778826A (en) | 2016-07-20 |
| CN105778826B true CN105778826B (en) | 2018-01-23 |
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| CN201610177140.5A Active CN105778826B (en) | 2016-03-25 | 2016-03-25 | A kind of preparation method of low temperature high-compatibility hot fusible adhesive for package |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108395854A (en) * | 2017-10-19 | 2018-08-14 | 朱俊帆 | A kind of hot fusible adhesive for package |
| CN110540818B (en) * | 2019-09-18 | 2021-12-24 | 杭州之江新材料有限公司 | Non-reactive polyolefin hot melt adhesive, preparation method and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1186834A (en) * | 1997-01-03 | 1998-07-08 | H·B·富勒许可和金融公司 | Hot melt adhesive |
| CN1351104A (en) * | 2000-10-26 | 2002-05-29 | 中国石油化工股份有限公司 | Hot fusible adhesive for package |
| CN102504725A (en) * | 2011-10-11 | 2012-06-20 | 浙江固特热熔胶有限公司 | Book side glue and production method thereof |
| CN102925080A (en) * | 2012-11-29 | 2013-02-13 | 无锡市万力粘合材料有限公司 | Book thermoplastic binding hot melt glue used at low temperature and preparation method thereof |
| CN103725226A (en) * | 2013-12-30 | 2014-04-16 | 日邦树脂(无锡)有限公司 | Benzene-free hot-melt adhesive and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2724272B2 (en) * | 1992-08-10 | 1998-03-09 | 凸版印刷株式会社 | Hot melt adhesive composition for bookbinding |
-
2016
- 2016-03-25 CN CN201610177140.5A patent/CN105778826B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1186834A (en) * | 1997-01-03 | 1998-07-08 | H·B·富勒许可和金融公司 | Hot melt adhesive |
| CN1351104A (en) * | 2000-10-26 | 2002-05-29 | 中国石油化工股份有限公司 | Hot fusible adhesive for package |
| CN102504725A (en) * | 2011-10-11 | 2012-06-20 | 浙江固特热熔胶有限公司 | Book side glue and production method thereof |
| CN102925080A (en) * | 2012-11-29 | 2013-02-13 | 无锡市万力粘合材料有限公司 | Book thermoplastic binding hot melt glue used at low temperature and preparation method thereof |
| CN103725226A (en) * | 2013-12-30 | 2014-04-16 | 日邦树脂(无锡)有限公司 | Benzene-free hot-melt adhesive and preparation method thereof |
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| CN105778826A (en) | 2016-07-20 |
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Address after: 214000 No. 6, Dongting Chunlei Road, Xishan Economic Development Zone, Wuxi City, Jiangsu Province Patentee after: Lisennoco Materials (Wuxi) Co.,Ltd. Address before: No. 6, Chunlei Road, Dongting, Xishan District, Wuxi City, Jiangsu Province, 214000 Patentee before: LI-BOND RESIN (WUXI) Co.,Ltd. |