CN108410402A - A kind of Express Logistics class environment-friendly type hot melt glue and the preparation method and application thereof of completely new low temperature fitting - Google Patents
A kind of Express Logistics class environment-friendly type hot melt glue and the preparation method and application thereof of completely new low temperature fitting Download PDFInfo
- Publication number
- CN108410402A CN108410402A CN201810066010.3A CN201810066010A CN108410402A CN 108410402 A CN108410402 A CN 108410402A CN 201810066010 A CN201810066010 A CN 201810066010A CN 108410402 A CN108410402 A CN 108410402A
- Authority
- CN
- China
- Prior art keywords
- hot melt
- low temperature
- friendly type
- type hot
- completely new
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09J157/02—Copolymers of mineral oil hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of Express Logistics class environment-friendly type hot melt glue and the preparation method and application thereof of completely new low temperature fitting, which is prepared by 10 30% naphthenic oil, 20 50% high molecular polymer, 5 25% low molecule toughener, 30 60% tackifying resin and 0.2 0.8% antioxidant.For express delivery PE sealing low temperature fittings down to 10 DEG C, logistics waybill low temperature is bonded down to 20 DEG C hot melt adhesive of the present invention, 10 DEG C of environment-friendly type hot melt glue lower than traditional SBC formula binding temperatures.The hot melt adhesive of the present invention overcomes the fast viscosity of low temperature and low temperature fitting sex chromosome mosaicism that existing SBC systems hot melt adhesive is unable to reach.
Description
Technical field
The invention belongs to polymeric material fields, and in particular to a kind of hot melt adhesive, more particularly to a kind of completely new low temperature fitting
Express Logistics class environment-friendly type hot melt glue and the preparation method and application thereof.
Background technology
Hot melt adhesive is widely used in fields such as logistics transportation, express deliveries, with society for shopping at network and soon
The demand for passing logistics increasingly increases, and the use of hot melt adhesive greatly accelerates production efficiency.This hot melt adhesive mainly uses SBC
System is basic raw material with SBS or SIS rubber, add a certain proportion of naphthenic oil, tackifying resin and antioxidant compounding and
At.These traditional SBC hot melt adhesives, in winter or low temp area using when be susceptible to problems with:1)Low temperature pastes
Conjunction property is poor, and the binding temperature that general courier bag hot melt adhesive requires is 0-40 DEG C, and logistics waybill binding temperature is -5-40 DEG C, low
Temperature labeling is unable to reach loglstics enterprise to be got a desired effect. 2)There are inharmonious risk, express delivery can in transportational process
Situations such as low temperature environment can be undergone, customer information leakage is be easy to cause if label falls off or can not be sent to.3)Loglstics enterprise is sent out
Exhibition is limited, and low temperature binding temperature is always without feasible solution.
Invention content
In order to overcome the disadvantages and deficiencies of the prior art, the primary purpose of the present invention is that providing a kind of for PE class express deliveries
Bag low temperature fitting sealing is down to -10 DEG C, and logistics waybill low temperature is bonded down to -20 DEG C, 40 DEG C of high temperature binding temperature, than tradition
SBC is formulated low 10 DEG C of the environment-friendly type hot melt glue of binding temperature.
Another object of the present invention is to provide the preparation methods of the logistics environment-friendly type hot melt glue of above-mentioned completely new low temperature fitting.
It is still another object of the present invention to provide the purposes of the logistics environment-friendly type hot melt glue of above-mentioned completely new low temperature fitting.
The purpose of the invention is achieved by the following technical solution.
A kind of logistics environment-friendly type hot melt glue of completely new low temperature fitting, is prepared by the ingredient of following mass percent.
Naphthenic oil:10-30%.
High molecular polymer:20-50%.
Low molecule toughener:5-25%.
Tackifying resin:30-60%.
Antioxidant:0.2-0.8%.
Low molecule toughener molecular weight is the liquid rubber within 5W.
The high molecular polymer is one or more of SIS, SBS, SEBS, SSBR.
The tackifying resin is modified C 5/C 9 petroleum resin or modified rosin resin.
Naphthenic oil is mainly the naphthenic oil that naphthene content is more than 30%.
The logistics environment-friendly type hot melt glue free from admixture of above-mentioned completely new low temperature fitting, physicochemical properties are stablized, and blade coating is suitble to
Resin application methods, density are 0.90~0.95g/cm3, there is good bonding to imitate logistics field courier bag, waybill fitting
Fruit.
The preparation method of the logistics environment-friendly type hot melt glue of above-mentioned completely new low temperature fitting, includes the following steps.
Naphthenic oil, high molecular polymer, low molecule toughener and antioxidant are uniformly mixed, are heated to 100~170
DEG C, it stirs to each component and is completely melt when vacuumizing;Tackifying resin is added, is heated to melting at 100~170 DEG C;It is right
Reaction system is evacuated to no bubble, is uniformly mixed the logistics environment-friendly type hot melt glue being bonded to get completely new low temperature.
The logistics environment-friendly type hot melt glue of above-mentioned completely new low temperature fitting can be used as the bonding of courier bag and logistics waybill base material
Agent.
The present invention is coordinated using the block copolymer elastomer of suitable molecular weight and the liquid rubber of low molecular weight, is that product is low
It is bonded and provides the foundation at -10 DEG C of temperature.Due to the use of low molecule toughener liquid rubber, avoid adhesive transition is oil-filled from reducing
Glass transition temperature and cause the situation weak to wood destruction, liquid rubber itself has viscosity, is carried at low temperature for adhesive
For certain peel strength.Being used cooperatively because of tackifying resin again, enhances peeling force and makes to PE classes courier bag at -10 DEG C
Reach execution, logistic label applies the binding temperature for corrugation stationery base material down to -20 DEG C, while itself opposite ring
It protects.
The present invention has the following advantages and effects with respect to the prior art.
Hot melt adhesive low temperature fitting of the present invention is 10-15 DEG C lower than current heat molten type binding temperature, and adhesive property is excellent, can reach
To preferable wood destruction effect, more environmentally friendly compared to acrylic acid glue, production efficiency is faster.
Specific implementation mode
With reference to embodiment, the present invention is described in further detail, and embodiments of the present invention are not limited thereto.
Embodiment 1.
A kind of preparation method of the Express Logistics class environment-friendly type hot melt glue of completely new low temperature fitting, includes the following steps.
20% KN4010 naphthenic oils(Kelamayi), 20% high molecular polymer (high mountainization 1126), 10% height
Molecularly Imprinted Polymer(SSBR-1205), 10% low molecule liquid rubber and 0.5% antioxidant are uniformly mixed, are heated to 120
It~170 DEG C, stirs to each component and is completely melt when vacuumizing;39.5% tackifying resin is added, is added at 120~170 DEG C
Heat extremely melts;No bubble is evacuated to reaction system, be uniformly mixed to get to can low temperature be bonded express delivery environment-friendly type
Hot melt adhesive.
The hot melt adhesive that the present embodiment is prepared is suitable for the device of blade coating, which is placed in hot melt adhesive cylinder,
170 DEG C of constant temperature to micelles are completely melt to be used, and base material glues thickness about 20g/m2, it is used for logistics field label and waybill
In, the waybill class in logistics field and two layers of tag class, binding temperature range can reach -20 DEG C -40 DEG C, compared to traditional express delivery
Glue low temperature is bonded low 10-12 DEG C or so.
Embodiment 2.
A kind of preparation method of the Express Logistics class environment-friendly type hot melt glue of completely new low temperature fitting, includes the following steps.
15% KN4006 naphthenic oils(Kelamayi), 20% high molecular polymer (high mountainization 1126), 10% it is low
Molecule liquid rubber and 10% high molecular polymer(SSBR-1205), 0.5% antioxidant (BASF, antioxidant 1726)It is mixed
It closes uniformly, is heated to 120~170 DEG C, stirs to each component and be completely melt when vacuumizing;Add 44.5% thickening tree
Fat is heated to melting at 120~170 DEG C;No bubble is evacuated to reaction system, is uniformly mixed to get to can be low
Temperature fitting logistics environment-friendly type hot melt glue.
The hot melt adhesive that the present embodiment is prepared is suitable for the device of blade coating, which is placed in hot melt adhesive cylinder,
160 DEG C of constant temperature to micelles are completely melt to be used, and glue width about 10mm, gluing thickness 120g/m2-150 g/m2, complete
In virgin material or neutral material stream courier bag, binding temperature can reach -10 DEG C -35 DEG C, be bonded compared to traditional logistics waybill low temperature low
10 DEG C or so.
Claims (4)
1. a kind of preparation method of the Express Logistics class environment-friendly type hot melt glue of completely new low temperature fitting, it is characterised in that by following steps
Composition:The naphthenic oil of 10-30%, the high molecular polymer of 20-50%, the low molecule toughener of 5-25% and 0.2-0.8%
Antioxidant uniformly mixes, is heated to 120~170 DEG C, stirs to each component and be completely melt when vacuumizing;Add 30-
60% tackifying resin is heated to melting at 120~170 DEG C;No bubble is evacuated to reaction system, is stirred
It is even to be bonded express delivery environment-friendly type hot melt glue to get to completely new low temperature;
The percentage is the percentage that each ingredient accounts for that completely new low temperature is bonded environment-friendly type hot melt collagen material gross mass;
The tackifying resin is modified C 5/C 9 petroleum resin or modified rosin resin.
2. naphthenic oil described in is mainly the naphthenic oil that naphthene content is more than 30%.
3. the preparation method of the logistics environment-friendly type hot melt glue of completely new low temperature fitting according to claim 1, it is characterised in that:
The high molecular polymer is one or more of SIS, SBS, SEBS, SSBR.
4. the preparation method of the logistics environment-friendly type hot melt glue of completely new low temperature fitting according to claim 1, it is characterised in that:
The low molecule toughener molecular weight is the liquid rubber within 5W.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810066010.3A CN108410402A (en) | 2018-01-24 | 2018-01-24 | A kind of Express Logistics class environment-friendly type hot melt glue and the preparation method and application thereof of completely new low temperature fitting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810066010.3A CN108410402A (en) | 2018-01-24 | 2018-01-24 | A kind of Express Logistics class environment-friendly type hot melt glue and the preparation method and application thereof of completely new low temperature fitting |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108410402A true CN108410402A (en) | 2018-08-17 |
Family
ID=63126299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810066010.3A Withdrawn CN108410402A (en) | 2018-01-24 | 2018-01-24 | A kind of Express Logistics class environment-friendly type hot melt glue and the preparation method and application thereof of completely new low temperature fitting |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108410402A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110527467A (en) * | 2019-08-28 | 2019-12-03 | 佛山市南海骏驰新材料有限公司 | A kind of heat molten type velcro glue and its production technology |
CN111777986A (en) * | 2020-07-13 | 2020-10-16 | 广东荣嘉新材料科技有限公司 | Hot melt adhesive capable of improving waste discharge effect and preparation method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103045139A (en) * | 2013-01-21 | 2013-04-17 | 无锡市万力粘合材料有限公司 | Hot melt adhesive composition for back voucher of express mail service and method for preparing same |
WO2016109350A1 (en) * | 2014-12-30 | 2016-07-07 | Dougherty William R | Additive for caustic removable hot melt adhesives and formulations containing the same |
-
2018
- 2018-01-24 CN CN201810066010.3A patent/CN108410402A/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103045139A (en) * | 2013-01-21 | 2013-04-17 | 无锡市万力粘合材料有限公司 | Hot melt adhesive composition for back voucher of express mail service and method for preparing same |
WO2016109350A1 (en) * | 2014-12-30 | 2016-07-07 | Dougherty William R | Additive for caustic removable hot melt adhesives and formulations containing the same |
Non-Patent Citations (1)
Title |
---|
沃丁柱等: "《复合材料大全》", 31 January 2000, 化学工业出版社 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110527467A (en) * | 2019-08-28 | 2019-12-03 | 佛山市南海骏驰新材料有限公司 | A kind of heat molten type velcro glue and its production technology |
CN111777986A (en) * | 2020-07-13 | 2020-10-16 | 广东荣嘉新材料科技有限公司 | Hot melt adhesive capable of improving waste discharge effect and preparation method thereof |
CN111777986B (en) * | 2020-07-13 | 2021-12-28 | 广东荣嘉新材料科技有限公司 | Hot melt adhesive capable of improving waste discharge effect and preparation method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102181248B (en) | Hot-melt pressure-sensitive adhesive for polyethylene materials and preparation method thereof | |
CN102286257B (en) | Special high temperature resistant adhesive resins for steel-plastic composite pipe and preparation method thereof | |
CN108047998B (en) | EVA hot melt adhesive for bonding UHMWPE (ultrahigh molecular weight polyethylene) products and preparation method thereof | |
CN102304330B (en) | Clean and environmentally-friendly hot melt adhesive capable of being operated at low temperature as well as preparation method and application thereof | |
CN102838949A (en) | Back glue for books and magazines and production method thereof | |
CN101709201A (en) | Method for preparing polystyrene-polyisoprene-polystyrene ternary segmented copolymer hot melt pressure-sensitive adhesive | |
CN110734719A (en) | Modified hot-melt pressure-sensitive adhesive and preparation method thereof | |
CN106633965B (en) | A kind of weather-proof high extension roofing self-adhering polymer waterproof roll and preparation method thereof | |
CN101864259A (en) | SIS (Styrene-Isoprene-Styrene) hot melt adhesive for car light adhesion and preparation method thereof | |
CN103320067B (en) | For quick-binding hot-fusible pressure-sensitive adhesive and the preparation method of express delivery waterproof bag | |
CN108410402A (en) | A kind of Express Logistics class environment-friendly type hot melt glue and the preparation method and application thereof of completely new low temperature fitting | |
CN109852291A (en) | Adhesive bookbinding carries on the back the universal hot melt adhesive in side and production method | |
CN103666369A (en) | Hot-melt adhesive with excellent heat resistance and hot-melt adhesive tape | |
CN105349088A (en) | Novel hot-melt adhesive and preparation method thereof | |
CN106520021A (en) | Hot melt adhesive used for pipeline anticorrosion, preparation method thereof, and thermal shrinkable sleeve | |
CN107099265A (en) | A kind of Hot melt adhesive for automobile interior trim part and preparation method thereof | |
CN104293255B (en) | A kind of high glue strong HDPE self-adhesive coiled material hot-fusible pressure-sensitive adhesive and preparation method thereof | |
CN1317529A (en) | Adhesive for coating on steel pipe | |
CN108395872A (en) | A kind of environment-friendly type hot melt glue and the preparation method and application thereof being bonded biodegradable courier bag | |
CN101824293B (en) | Hot-melt adhesive for preventing corrosion of repaired mouth of gas pipeline and preparation method thereof | |
CN107523231B (en) | Low Temperature Thermal mounts film and its preparation method and application | |
CN112126390B (en) | Film-coated box sealing adhesive and preparation method thereof | |
CN104789142A (en) | Special polyethylene protection membrane for glass | |
CN104449494A (en) | SIS-b-PEO hot-melt pressure-sensitive adhesive and preparation method thereof | |
CN103361011B (en) | A kind of adhesive compound and a kind of joint sealing sealing tape |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180817 |
|
WW01 | Invention patent application withdrawn after publication |