CN102904547B - Saw器件、saw振荡器以及电子设备 - Google Patents

Saw器件、saw振荡器以及电子设备 Download PDF

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Publication number
CN102904547B
CN102904547B CN201210254019.XA CN201210254019A CN102904547B CN 102904547 B CN102904547 B CN 102904547B CN 201210254019 A CN201210254019 A CN 201210254019A CN 102904547 B CN102904547 B CN 102904547B
Authority
CN
China
Prior art keywords
saw
base substrate
saw chip
chip
saw device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210254019.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN102904547A (zh
Inventor
山中国人
小幡直久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN102904547A publication Critical patent/CN102904547A/zh
Application granted granted Critical
Publication of CN102904547B publication Critical patent/CN102904547B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H03B5/326—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator the resonator being an acoustic wave device, e.g. SAW or BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/0585—Holders or supports for surface acoustic wave devices consisting of an adhesive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CN201210254019.XA 2011-07-28 2012-07-20 Saw器件、saw振荡器以及电子设备 Expired - Fee Related CN102904547B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-165798 2011-07-28
JP2011165798A JP5765119B2 (ja) 2011-07-28 2011-07-28 Ｓａｗデバイス、ｓａｗ発振器および電子機器

Publications (2)

Publication Number Publication Date
CN102904547A CN102904547A (zh) 2013-01-30
CN102904547B true CN102904547B (zh) 2015-10-14

Family

ID=47576622

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210254019.XA Expired - Fee Related CN102904547B (zh) 2011-07-28 2012-07-20 Saw器件、saw振荡器以及电子设备

Country Status (3)

Country Link
US (2) US8773214B2 (enExample)
JP (1) JP5765119B2 (enExample)
CN (1) CN102904547B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5765119B2 (ja) * 2011-07-28 2015-08-19 セイコーエプソン株式会社 Ｓａｗデバイス、ｓａｗ発振器および電子機器
JP6296154B2 (ja) * 2014-05-20 2018-03-20 株式会社村田製作所 弾性波デバイス及びその製造方法
KR102262431B1 (ko) 2015-02-03 2021-06-08 삼성디스플레이 주식회사 액정 표시 장치
US11050011B2 (en) * 2017-12-18 2021-06-29 Raytheon Technologies Corporation Sensor assembly for gas turbine engines
DE102018104669A1 (de) * 2018-03-01 2019-09-05 Dionex Softron Gmbh Verwendung einer akustischen Welle in einem Chromatographiesystem

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6229249B1 (en) * 1998-08-31 2001-05-08 Kyocera Corporation Surface-mount type crystal oscillator
CN1337091A (zh) * 1999-02-08 2002-02-20 松下电器产业株式会社 弹性表面波装置及其制造方法
JP2009027306A (ja) * 2007-07-18 2009-02-05 Epson Toyocom Corp 弾性表面波デバイス

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5788325U (enExample) * 1980-11-20 1982-05-31
JPS5788325A (en) 1980-11-21 1982-06-02 Ansonii Hiyuuson Buraian Method of and apparatus for arranging distribution liquid into liquid
JP2002026656A (ja) * 2000-07-11 2002-01-25 Seiko Epson Corp Ｓａｗ発振器
JP3904073B2 (ja) 2002-02-12 2007-04-11 セイコーエプソン株式会社 弾性表面波装置
JP4267527B2 (ja) * 2003-08-20 2009-05-27 日本電波工業株式会社 表面実装用の水晶発振器
JP2005136938A (ja) 2003-10-09 2005-05-26 Seiko Epson Corp 弾性表面波素子片、弾性表面波デバイスおよび弾性表面波デバイスを用いた装置
JP5157641B2 (ja) * 2008-01-28 2013-03-06 セイコーエプソン株式会社 圧電発振器及び送信機
US8384486B2 (en) * 2007-07-18 2013-02-26 Seiko Epson Corporation Piezoelectric oscillator and transmitter
JP2011071838A (ja) * 2009-09-28 2011-04-07 Shin-Etsu Chemical Co Ltd 弾性表面波素子
JP5765119B2 (ja) * 2011-07-28 2015-08-19 セイコーエプソン株式会社 Ｓａｗデバイス、ｓａｗ発振器および電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6229249B1 (en) * 1998-08-31 2001-05-08 Kyocera Corporation Surface-mount type crystal oscillator
CN1337091A (zh) * 1999-02-08 2002-02-20 松下电器产业株式会社 弹性表面波装置及其制造方法
JP2009027306A (ja) * 2007-07-18 2009-02-05 Epson Toyocom Corp 弾性表面波デバイス

Also Published As

Publication number Publication date
CN102904547A (zh) 2013-01-30
US20130027144A1 (en) 2013-01-31
US8773214B2 (en) 2014-07-08
US9252706B2 (en) 2016-02-02
JP5765119B2 (ja) 2015-08-19
US20140266483A1 (en) 2014-09-18
JP2013030994A (ja) 2013-02-07

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Granted publication date: 20151014

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