CN102896093A - Automatic sorting machine of LED (Light-Emitting Diode) wafer - Google Patents
Automatic sorting machine of LED (Light-Emitting Diode) wafer Download PDFInfo
- Publication number
- CN102896093A CN102896093A CN2012104523837A CN201210452383A CN102896093A CN 102896093 A CN102896093 A CN 102896093A CN 2012104523837 A CN2012104523837 A CN 2012104523837A CN 201210452383 A CN201210452383 A CN 201210452383A CN 102896093 A CN102896093 A CN 102896093A
- Authority
- CN
- China
- Prior art keywords
- wafer
- silicon chip
- servo amplifier
- silicon wafer
- servo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to an automatic sorting machine of an LED (Light-Emitting Diode) wafer, comprising a silicon wafer processing device, a material box processing device, a picking and welding device, a CCD (Charge Coupled Device) image processing device and a control device, wherein the silicon wafer processing device comprises a silicon wafer lifting platform, a silicon wafer clamp, a silicon wafer worktable and a top pushing device, wherein a silicon wafer to be sorted is placed into the silicon wafer framework of the silicon wafer lifting platform; in a loading process, the silicon wafer of the appointed number is lifted to a grasping position of the silicon wafer clamp; the silicon wafer clamp grasps the silicon wafer with the appointed number from the silicon wafer framework of the silicon wafer lifting platform to be conveyed into an expanding device disc of the silicon wafer worktable; in an unloading process, the expanding device disc is moved to an unloading position and the silicon wafer clamp grasps the silicon wafer from the expanding device disc to be conveyed into the silicon wafer framework of the silicon wafer lifting platform; the sampling instantaneity of a visual image is less than 10 ms; and meanwhile, the detection of defects of wafer scratches, pollution, residues and the like is realized. A sorting period is less than 10 ms, the size of the sorted wafer is in a range from 6 mil*6 mil to 80 mil*80 mil, the grade of the sorted wafer is 150-grade and the control is accurate.
Description
Technical field
The present invention relates to a kind of LED wafer automatic fraction collector, belong to the Eletronmechanical Design Technique field.
Background technology
LED wafer automatic fraction collector is the crucial production equipment on the illumination LED chip production line.At present, only have in the world the countries and regions such as the U.S., Japan, Korea S and Hong Kong to grasp technique and produce the LED chip sorter, automated production equipment on the domestic LED illumination chip production line, whole dependence on import, expensive, complex structure, complex operation needs the professional just can operate.
Summary of the invention
The problem to be solved in the present invention is for above problem, and a kind of LED wafer automatic fraction collector is provided, LED wafer automatic fraction collector structure of the present invention and simple to operate, cost is low.
For addressing the above problem, the technical solution adopted in the present invention is: a kind of LED wafer automatic fraction collector is characterized in that: described wafer automatic fraction collector comprises silicon chip treating apparatus, magazine treating apparatus, picks up and welder, ccd image treating apparatus and control device;
The silicon chip treating apparatus comprises silicon chip up-down platform, clamping fixture for silicon wafer, silicon chip workbench and ejector, treat that the silicon chip of sorting puts into the silicon chip framework of silicon chip up-down platform, during loading, the silicon chip up-down that to specify numbering is to aiming at the clamping fixture for silicon wafer crawl position, and clamping fixture for silicon wafer silicon chip of the gripping finger number of delimiting the organizational structure in the silicon chip framework of silicon chip up-down platform is delivered on the expander dish of silicon chip workbench; During unloading, the expander dish moves on to unloading position, and clamping fixture for silicon wafer is delivered in the silicon chip framework of silicon chip up-down platform from expander dish crawl silicon chip.
A kind of prioritization scheme, described magazine treating apparatus comprises magazine lifting platform, amortization work bench, film frame anchor clamps and welding bench, material box frame can move horizontally and along the Z axis vertical lift along Y-axis, film frame anchor clamps film frame of the gripping finger number of delimiting the organizational structure from the material box frame is delivered on the amortization work bench, is loaded on the welding bench from amortization work bench crawl film frame again; Be unloaded on the material box frame from amortization work bench crawl film frame again, the welding bench bottom is equipped with x axle linear electric motors, y axle linear electric motors, x axle linear electric motors, y axle linear electric motors move by row distance and the line-spacing of welding wafer respectively, make on the blue film that wafer is welded on the film frame by the spacing of setting and line-spacing.
Another kind of prioritization scheme, described picking up with welder comprises two weldering arms and tip, the weldering arm is driven by direct-driven servo motor, can Rotate 180 °, two weldering arms are calibrated point-blank, and tip is installed in the swinging end that welds arm, and direct-driven servo motor drives 180 ° of round rotatablely moving of tip high speed of two weldering arms, when picking up wafer, suction nozzle is before picking up wafer, and the ejector thimble rises to first the precalculated position, and the blue film of wafer from silicon chip separated, suction nozzle vacuumizes, and holds wafer; Silicon chip workbench bottom is equipped with x axle linear electric motors, y axle linear electric motors, and the action of picking up and weld of tip is driven by voice coil motor, and tip vacuumizes when picking up, and picks up wafer from blue film.
Another prioritization scheme, described ccd image treating apparatus comprises silicon chip workbench image processing apparatus, welding bench image processing apparatus, silicon chip workbench image processing apparatus forms silicon chip workbench wafer images, processes the location of silicon chip workbench and the coordinate of wafer; The welding bench image processing apparatus forms the welding bench wafer images, processes the location of welding bench and the coordinate of wafer.
Further prioritization scheme, described control device comprises industrial control computer, motion control card and the 16 axle motion controllers of electrical connection;
Motion control card connects three voice coil motors, and three voice coil motors are used for controlling the whereabouts that the ejector thimble rises and two are welded arms;
16 axle motion controllers connect servo amplifier, I/O interface, encoder interfaces and spacing IN interface;
The I/O interface is connected with direct current generator, and direct current generator drives the rotation of silicon chip workbench;
16 axle motion controllers are connected with servomotor by servo amplifier, and 16 axle motion controllers are connected with servo amplifier by the network service line, finish the motion control to motor.
Further, described servo amplifier comprises the first servo amplifier, the second servo amplifier, the 3rd servo amplifier, the 4th servo amplifier, the 5th servo amplifier, the 6th servo amplifier, the 7th servo amplifier, the 8th servo amplifier, the 9th servo amplifier and the tenth servo amplifier;
The first servo amplifier connects the first rotating servo motor and the first encoder, the second servo amplifier connects the second rotating servo motor and the second encoder, the 3rd servo amplifier connects the 3rd rotating servo motor and the 3rd encoder, the 4th servo amplifier connects the 4th rotating servo motor and the 4th encoder, the 5th servo amplifier connects the 5th rotating servo motor and the 5th encoder, the 6th servo amplifier connects the 6th rotating servo motor and the 6th encoder, the 7th servo amplifier connects direct-driven servo motor, the 8th servo amplifier connects the first linear servo-actuator, the 9th servo amplifier connects the second linear servo-actuator, and the tenth servo amplifier connects the 3rd linear servo-actuator.
The present invention adopts above technical scheme, compared with prior art, has the following advantages: visual pattern sampling real-time has realized the detection of the shortcomings such as wafer cut, pollution, incompleteness simultaneously less than 10ms.Distinguishing period is less than 100ms, and the wafer size 6mil*6mil-80mil*80mil of sorting, the wafer-level of sorting are 150 grades, precise control.
The invention will be further described below in conjunction with drawings and Examples.
Description of drawings
Accompanying drawing 1 is the structured flowchart of LED wafer automatic fraction collector in the embodiment of the invention;
Accompanying drawing 2 is the circuit block diagram of control device in the embodiment of the invention.
The specific embodiment
Embodiment, as shown in Figure 1, a kind of LED wafer automatic fraction collector comprises silicon chip treating apparatus, magazine treating apparatus, picks up and welder and ccd image treating apparatus.
The silicon chip treating apparatus comprises silicon chip up-down platform, clamping fixture for silicon wafer, silicon chip workbench and ejector, and silicon chip up-down platform liftable treats that the silicon chip of sorting puts into the silicon chip framework of silicon chip up-down platform, and the silicon chip framework can hold at most 25 silicon chips.During loading, the silicon chip up-down that will specify numbering is to aiming at the clamping fixture for silicon wafer crawl position, and clamping fixture for silicon wafer silicon chip of the gripping finger number of delimiting the organizational structure in the silicon chip framework of silicon chip up-down platform is delivered on the expander dish of silicon chip workbench; During unloading, the expander dish moves on to unloading position, and clamping fixture for silicon wafer is delivered in the silicon chip framework of silicon chip up-down platform from expander dish crawl silicon chip.
The magazine treating apparatus comprises magazine lifting platform, amortization work bench, film frame anchor clamps and welding bench, two material box frames are arranged in the magazine lifting platform, two material box frames comprise 8 magazine districts, 25 film framves that hold wafer are arranged in each magazine district, hold altogether 200 film framves, material box frame can move horizontally and along the Z axis vertical lift along Y-axis, in order to will specify the crawl position of the film frame alignment thin film frame anchor clamps of numbering performance rate.Film frame anchor clamps film frame of the gripping finger number of delimiting the organizational structure from the material box frame is delivered on the amortization work bench, is loaded on the welding bench from amortization work bench crawl film frame again; Be unloaded on the material box frame from amortization work bench crawl film frame again.Design double buffering workbench is in order to solve the conflict of loading and unloading, to improve film frame loading and unloading efficient.During welding, tip fills the compression air, guarantees that soldered wafer sticks on the blue film securely.Welding bench bottom is equipped with x axle linear electric motors, y axle linear electric motors, and in welding process, x axle linear electric motors, y axle linear electric motors move by row distance and the line-spacing of welding wafer respectively, makes on the blue film that wafer is welded on the film frame by the spacing of setting and line-spacing.Film frame anchor clamps also can be unloaded to the film frame on the amortization work bench from welding bench.
Pick up with welder and comprise two weldering arms, pick up with welder and comprise two weldering arms and tip, the weldering arm is driven by direct-driven servo motor, can Rotate 180 °, the calibration of two weldering arms point-blank, tip is installed in the swinging end of weldering arm, tip both can be used as suction nozzle, as tip usefulness, alternately carry out wafer and pick up and weld action again, direct-driven servo motor drives 180 ° of round rotatablely moving of tip high speed of two weldering arms, when picking up wafer, suction nozzle is before picking up wafer, and the ejector thimble rises to first the precalculated position, and the blue film of wafer from silicon chip separated, in order to pick up, simultaneously, suction nozzle vacuumizes, and holds wafer.Silicon chip workbench bottom is equipped with x axle linear electric motors, y axle linear electric motors, and in picking up the silicon chip process, x axle linear electric motors, y axle linear electric motors move by row distance and the line-spacing of the wafer of setting respectively, guarantee to pick up aimed wafer.The action of picking up and weld of tip is driven by voice coil motor, and tip vacuumizes when picking up, and picks up wafer from blue film; Tip inflation is pressed during welding, with wafer " welding " on blue film.
The ccd image treating apparatus comprises silicon chip workbench image processing apparatus, welding bench image processing apparatus, and silicon chip workbench image processing apparatus forms silicon chip workbench wafer images, processes the location of silicon chip workbench and the coordinate of wafer; The welding bench image processing apparatus forms the welding bench wafer images, processes the location of welding bench and the coordinate of wafer.
Accompanying drawing 2 is LED chip sorter control device block diagrams, the industrial control computer, motion control card and the 16 axle motion controllers that comprise electrical connection, industrial control computer connection monitoring terminal, keyboard and ccd image treating apparatus, and be connected with server by network communication interface.
The CPU of two double-cores is housed on the industrial control computer mainboard, and wherein, one another is used for control for the treatment of data, the parallel separator operating rate that improved of double-core.
Motion control card connects three voice coil motors, and three voice coil motors are used for controlling whereabouts and the rising of ejector thimble of weldering arm A, weldering arm B, and the motion control card of control voice coil motor is inserted on the pci bus of industrial control computer.
16 axle motion controllers connect servo amplifier, I/O interface, encoder interfaces and spacing IN interface.
The I/O interface is connected with direct current generator, and direct current generator drives the rotation of silicon chip workbench.
16 axle motion controllers provide perfect encoder interfaces, and various spacing and position switch signal levels are by the spacing IN interface access of 16 axle motion controllers.16 axle motion controllers are connected with servomotor by servo amplifier, can connect at most 16 motors, industrial control computer is connected with 16 axle motion controllers by the USB mouth, and 16 axle motion controllers are connected with servo amplifier by the network service line, finish the motion control to motor.
Servo amplifier comprises the first servo amplifier, the second servo amplifier, the 3rd servo amplifier, the 4th servo amplifier, the 5th servo amplifier, the 6th servo amplifier, the 7th servo amplifier, the 8th servo amplifier, the 9th servo amplifier and the tenth servo amplifier
The first servo amplifier connects the first rotating servo motor and the first encoder, the second servo amplifier connects the second rotating servo motor and the second encoder, the 3rd servo amplifier connects the 3rd rotating servo motor and the 3rd encoder, the 4th servo amplifier connects the 4th rotating servo motor and the 4th encoder, the 5th servo amplifier connects the 5th rotating servo motor and the 5th encoder, the 6th servo amplifier connects the 6th rotating servo motor and the 6th encoder, the 7th servo amplifier connects direct-driven servo motor, the 8th servo amplifier connects the first linear servo-actuator, the 9th servo amplifier connects the second linear servo-actuator, and the tenth servo amplifier connects the 3rd linear servo-actuator;
To treat that the sorting silicon chip puts into the silicon chip framework of silicon chip up-down platform, the silicon chip up-down platform is driven by the first rotating servo motor; Clamping fixture for silicon wafer moves, and will treat that the sorting silicon chip from specifying the silicon chip framework crawl of numbering, is loaded on the silicon chip workbench, and clamping fixture for silicon wafer moves by the second rotating servo motor and drives, and jaw is driven by air pressure.During the loading and unloading silicon chip, the silicon chip workbench will lift certain height, and the silicon chip workbench rises and falls and driven by direct current generator MDC.The silicon chip workbench must be by X, Y-direction moves and rotates by the θ angle, the wafer that needs on the silicon chip to pick up could be moved under the suction nozzle of weldering arm, and the first linear servo-actuator, the second linear servo-actuator drive silicon chip workbench X, Y-direction moves, and θ rotates and driven by the 3rd rotating servo motor.Pick up before the wafer, the ejector thimble rises, and wafer is broken away from blue film, and the lifting of ejector thimble is driven by the 3rd voice coil motor.180 ° of reciprocating swing of two weldering arms are driven by direct-driven servo motor, and the drop action during weldering (suction) mouth welding (picking up) is driven by the first voice coil motor, the second voice coil motor respectively.Welding bench must be made X, and Y-direction moves, and wafer is welded to the precalculated position, the X of welding bench, and the Y motion is driven by the 3rd linear servo-actuator, the 4th linear servo-actuator.The Y-direction of finishing welding bench simultaneously moves and the lifting of Z direction, is driven by the 4th rotating servo motor and the 5th rotating servo motor respectively.During the loading and unloading of magazine film frame: the magazine lifting platform is made Y, Z motion, and the film frame that will load moves to and is registered to film frame chucking position, and the film frame of the film frame anchor clamps gripping finger number of delimiting the organizational structure is to amortization work bench, refills to be downloaded on the magazine workbench.During unloading still.Film frame anchor clamps move, and are driven by the 6th rotating servo motor.Magazine worktable lifting, amortization work bench lifting and anchor clamps crawl are controlled by pneumatic system.
LED automatic fraction collector of the present invention all control is to be finished by the computer software of the present invention's design.This software adopts the simplified form of Chinese Character interface, and is simple to operate, precise control.
Those skilled in the art will recognize that; the above-mentioned specific embodiment is exemplary; in order to make those skilled in the art can better understand content of the present invention; should not be understood as limiting the scope of the invention; so long as the improvement of doing according to technical solution of the present invention all falls into protection scope of the present invention.
Claims (6)
1. LED wafer automatic fraction collector, it is characterized in that: described wafer automatic fraction collector comprises silicon chip treating apparatus, magazine treating apparatus, picks up and welder, ccd image treating apparatus and control device;
Described silicon chip treating apparatus comprises silicon chip up-down platform, clamping fixture for silicon wafer, silicon chip workbench and ejector, treat that the silicon chip of sorting puts into the silicon chip framework of silicon chip up-down platform, during loading, the silicon chip up-down that to specify numbering is to aiming at the clamping fixture for silicon wafer crawl position, and clamping fixture for silicon wafer silicon chip of the gripping finger number of delimiting the organizational structure in the silicon chip framework of silicon chip up-down platform is delivered on the expander dish of silicon chip workbench; During unloading, the expander dish moves on to unloading position, and clamping fixture for silicon wafer is delivered in the silicon chip framework of silicon chip up-down platform from expander dish crawl silicon chip.
2. a kind of LED wafer automatic fraction collector as claimed in claim 1, it is characterized in that: described magazine treating apparatus comprises magazine lifting platform, amortization work bench, film frame anchor clamps and welding bench, material box frame can move horizontally and along the Z axis vertical lift along Y-axis, film frame anchor clamps film frame of the gripping finger number of delimiting the organizational structure from the material box frame is delivered on the amortization work bench, is loaded on the welding bench from amortization work bench crawl film frame again; Be unloaded on the material box frame from amortization work bench crawl film frame again, the welding bench bottom is equipped with x axle linear electric motors, y axle linear electric motors, x axle linear electric motors, y axle linear electric motors move by row distance and the line-spacing of welding wafer respectively, make on the blue film that wafer is welded on the film frame by the spacing of setting and line-spacing.
3. a kind of LED wafer automatic fraction collector as claimed in claim 1, it is characterized in that: described picking up with welder comprises two weldering arms and tip, the weldering arm is driven by direct-driven servo motor, can Rotate 180 °, the calibration of two weldering arms point-blank, tip is installed in the swinging end of weldering arm, direct-driven servo motor drives 180 ° of round rotatablely moving of tip high speed of two weldering arms, when picking up wafer, suction nozzle is before picking up wafer, and the ejector thimble rises to first the precalculated position, and the blue film of wafer from silicon chip separated, suction nozzle vacuumizes, and holds wafer; Silicon chip workbench bottom is equipped with x axle linear electric motors, y axle linear electric motors, and the action of picking up and weld of tip is driven by voice coil motor, and tip vacuumizes when picking up, and picks up wafer from blue film.
4. such as claim 1,2 or 3 described a kind of LED wafer automatic fraction collectors, it is characterized in that: described ccd image treating apparatus comprises silicon chip workbench image processing apparatus, welding bench image processing apparatus, silicon chip workbench image processing apparatus forms silicon chip workbench wafer images, processes the location of silicon chip workbench and the coordinate of wafer; The welding bench image processing apparatus forms the welding bench wafer images, processes the location of welding bench and the coordinate of wafer.
5. a kind of LED wafer automatic fraction collector as claimed in claim 4, it is characterized in that: described control device comprises industrial control computer, motion control card and the 16 axle motion controllers of electrical connection;
Described motion control card connects three voice coil motors, and three voice coil motors are used for controlling the whereabouts that the ejector thimble rises and two are welded arms;
16 axle motion controllers connect servo amplifier, I/O interface, encoder interfaces and spacing IN interface;
The I/O interface is connected with direct current generator, and direct current generator drives the rotation of silicon chip workbench;
16 axle motion controllers are connected with servomotor by servo amplifier, and 16 axle motion controllers are connected with servo amplifier by the network service line, finish the motion control to motor.
6. a kind of LED wafer automatic fraction collector as claimed in claim 5, it is characterized in that: described servo amplifier comprises the first servo amplifier, the second servo amplifier, the 3rd servo amplifier, the 4th servo amplifier, the 5th servo amplifier, the 6th servo amplifier, the 7th servo amplifier, the 8th servo amplifier, the 9th servo amplifier and the tenth servo amplifier;
Described the first servo amplifier connects the first rotating servo motor and the first encoder, the second servo amplifier connects the second rotating servo motor and the second encoder, the 3rd servo amplifier connects the 3rd rotating servo motor and the 3rd encoder, the 4th servo amplifier connects the 4th rotating servo motor and the 4th encoder, the 5th servo amplifier connects the 5th rotating servo motor and the 5th encoder, the 6th servo amplifier connects the 6th rotating servo motor and the 6th encoder, the 7th servo amplifier connects direct-driven servo motor, the 8th servo amplifier connects the first linear servo-actuator, the 9th servo amplifier connects the second linear servo-actuator, and the tenth servo amplifier connects the 3rd linear servo-actuator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210452383.7A CN102896093B (en) | 2012-11-13 | 2012-11-13 | Automatic sorting machine of LED (Light-Emitting Diode) wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210452383.7A CN102896093B (en) | 2012-11-13 | 2012-11-13 | Automatic sorting machine of LED (Light-Emitting Diode) wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102896093A true CN102896093A (en) | 2013-01-30 |
| CN102896093B CN102896093B (en) | 2014-06-25 |
Family
ID=47568751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210452383.7A Expired - Fee Related CN102896093B (en) | 2012-11-13 | 2012-11-13 | Automatic sorting machine of LED (Light-Emitting Diode) wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102896093B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103213840A (en) * | 2013-04-01 | 2013-07-24 | 上海功源电子科技有限公司 | Automatic material separating machine |
| CN103531677A (en) * | 2013-09-22 | 2014-01-22 | 潍坊永昱电控科技有限公司 | Dual-welding-arm system for automatic LED (Light Emitting Diode) wafer sorting machine |
| CN103633006A (en) * | 2013-12-11 | 2014-03-12 | 中国电子科技集团公司第二研究所 | Wafer chip jacking mechanism |
| CN107093571A (en) * | 2017-03-22 | 2017-08-25 | 无锡圆方半导体测试有限公司 | Wafer collator |
| CN108212824A (en) * | 2017-12-25 | 2018-06-29 | 北京石油化工学院 | A kind of LED wafer automatic fraction collector and its control system |
| CN110174065A (en) * | 2019-06-17 | 2019-08-27 | 湖南农业大学 | Fruit size lossless detection method based on orthogonal binocular machine vision |
| CN112563163A (en) * | 2020-11-18 | 2021-03-26 | 青岛中科墨云智能有限公司 | Novel high-precision LED semiconductor wafer automatic sorting machine |
| CN113441413A (en) * | 2021-06-04 | 2021-09-28 | 盐城东紫光电科技有限公司 | Have LED equipment of surveying and picking up function concurrently |
| CN114472188A (en) * | 2022-04-02 | 2022-05-13 | 山东泓瑞光电科技有限公司 | Method and device for controlling LED and semiconductor laser chip silicon wafer workbench |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101412027A (en) * | 2007-10-16 | 2009-04-22 | 鸿劲科技股份有限公司 | Automatic testing and sorting machine for wafer |
| CN101540291A (en) * | 2009-03-23 | 2009-09-23 | 常州新区爱立德电子有限公司 | Automatic sorting machine for semiconductor chip |
| CN201871496U (en) * | 2010-07-27 | 2011-06-22 | 威控自动化机械股份有限公司 | Crystalline grain sorting device of wafers |
| US20120093299A1 (en) * | 2010-10-14 | 2012-04-19 | Rigaku Corporation | Analyzing apparatus |
| CN102674001A (en) * | 2012-04-28 | 2012-09-19 | 惠州市得天自动化设备有限公司 | Full-automatic 180-degree double-swing-arm double-welding-head material taking system of chip sorting machine |
-
2012
- 2012-11-13 CN CN201210452383.7A patent/CN102896093B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101412027A (en) * | 2007-10-16 | 2009-04-22 | 鸿劲科技股份有限公司 | Automatic testing and sorting machine for wafer |
| CN101540291A (en) * | 2009-03-23 | 2009-09-23 | 常州新区爱立德电子有限公司 | Automatic sorting machine for semiconductor chip |
| CN201871496U (en) * | 2010-07-27 | 2011-06-22 | 威控自动化机械股份有限公司 | Crystalline grain sorting device of wafers |
| US20120093299A1 (en) * | 2010-10-14 | 2012-04-19 | Rigaku Corporation | Analyzing apparatus |
| CN102674001A (en) * | 2012-04-28 | 2012-09-19 | 惠州市得天自动化设备有限公司 | Full-automatic 180-degree double-swing-arm double-welding-head material taking system of chip sorting machine |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103213840A (en) * | 2013-04-01 | 2013-07-24 | 上海功源电子科技有限公司 | Automatic material separating machine |
| CN103531677A (en) * | 2013-09-22 | 2014-01-22 | 潍坊永昱电控科技有限公司 | Dual-welding-arm system for automatic LED (Light Emitting Diode) wafer sorting machine |
| CN103633006A (en) * | 2013-12-11 | 2014-03-12 | 中国电子科技集团公司第二研究所 | Wafer chip jacking mechanism |
| CN103633006B (en) * | 2013-12-11 | 2016-08-17 | 中国电子科技集团公司第二研究所 | Chip wafer jacking mechanism |
| CN107093571A (en) * | 2017-03-22 | 2017-08-25 | 无锡圆方半导体测试有限公司 | Wafer collator |
| CN108212824A (en) * | 2017-12-25 | 2018-06-29 | 北京石油化工学院 | A kind of LED wafer automatic fraction collector and its control system |
| CN110174065A (en) * | 2019-06-17 | 2019-08-27 | 湖南农业大学 | Fruit size lossless detection method based on orthogonal binocular machine vision |
| CN112563163A (en) * | 2020-11-18 | 2021-03-26 | 青岛中科墨云智能有限公司 | Novel high-precision LED semiconductor wafer automatic sorting machine |
| CN113441413A (en) * | 2021-06-04 | 2021-09-28 | 盐城东紫光电科技有限公司 | Have LED equipment of surveying and picking up function concurrently |
| CN114472188A (en) * | 2022-04-02 | 2022-05-13 | 山东泓瑞光电科技有限公司 | Method and device for controlling LED and semiconductor laser chip silicon wafer workbench |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102896093B (en) | 2014-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102896093B (en) | Automatic sorting machine of LED (Light-Emitting Diode) wafer | |
| CN109822217B (en) | Automatic laser welding system | |
| CN108380509B (en) | Machine vision-based LED lamp panel sorting and detecting system | |
| CN102183739B (en) | Device for moving electric energy meter between meter case and multi-epitope tooling board | |
| CN202174585U (en) | Robot loading and unloading device for electric energy meter | |
| CN104227422A (en) | Automatic testing, riveting and laser carving production line for wired charger | |
| CN113794083A (en) | Automatic pin inserting equipment for carrier | |
| CN204449907U (en) | Riveted radium carving equipment tested automatically by a kind of band line formula charger | |
| CN105057222A (en) | Flexible material sorting system | |
| CN104690433B (en) | A kind of full-automatic wafer scribing machine | |
| CN105382368A (en) | Welding device for battery microphone | |
| CN110044909A (en) | A kind of rotor welding point defect detection device and method based on image procossing | |
| CN108372132A (en) | A kind of defective work detects separator automatically | |
| CN216085670U (en) | Automatic pin inserting equipment for carrier | |
| CN108435697B (en) | Automatic lens cleaning and spin-drying device and method | |
| CN207698776U (en) | A kind of fully automatic manipulator equipment | |
| CN103531677A (en) | Dual-welding-arm system for automatic LED (Light Emitting Diode) wafer sorting machine | |
| CN209175746U (en) | A kind of four axis robot of compact | |
| CN208390475U (en) | A kind of rejected product detects separator automatically | |
| CN208613249U (en) | A kind of eyeglass cleans spin-drying device automatically | |
| CN208265304U (en) | A kind of PCB substrate transfer device with automatic identification function | |
| CN202828221U (en) | Lens conveying and packing machine | |
| CN216310188U (en) | FLASH wafer automatic detection machine | |
| CN211516622U (en) | Automatic screw locking device | |
| CN215816778U (en) | Automatic pressfitting machine of terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140625 Termination date: 20151113 |
|
| EXPY | Termination of patent right or utility model |