CN102896008A - Bonding method for micro-fluidic chip based on polymethyl methacrylate (PMMA) and other polymeric materials - Google Patents
Bonding method for micro-fluidic chip based on polymethyl methacrylate (PMMA) and other polymeric materials Download PDFInfo
- Publication number
- CN102896008A CN102896008A CN2012103959228A CN201210395922A CN102896008A CN 102896008 A CN102896008 A CN 102896008A CN 2012103959228 A CN2012103959228 A CN 2012103959228A CN 201210395922 A CN201210395922 A CN 201210395922A CN 102896008 A CN102896008 A CN 102896008A
- Authority
- CN
- China
- Prior art keywords
- micro
- bonding
- fluidic chip
- bonding method
- pmma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a bonding method for a micro-fluidic chip based on polymethyl methacrylate (PMMA) and other polymeric materials and relates to a bonding method for the micro-fluidic chip. The bonding method disclosed by the invention comprises the following steps of: respectively gluing two prefabricated wave-absorbing heating substrates with the upper surface and the lower surface of the chip; then, putting in a closed container; and performing radiation heating in the closed container by using a high-frequency electromagnet wave, wherein the microwave power is 400-1000W, the highest transient temperature range of a bonding interface is controlled to be 95-200 DEG C, and the bonding time is 30-200S, Compared with other domestic and overseas bonding methods for the polymeric micro-fluidic chip, the novel bonding method is simple in required equipment, low in process cost and few in step and can be easily popularized and applied in the field of bonding the micro-fluidic chip based on the polymeric materials.
Description
Technical field
The present invention relates to a kind of bonding method of micro-fluidic chip, be specifically related to a kind ofly based on the PMMA(polymethyl methacrylate, be commonly called as lucite) and the bonding method of the micro-fluidic chip of other organic polymer material.
Background technology
Micro-fluidic chip refers to a biological or chemical laboratory micro to a piece to be only had on several square centimeters of large thin slices by micro-processing technology and other processing method.Chemistry that chip piece makes up or biology laboratory can be with sample preparation, reaction related in chemistry and the biological field, separate, detection, the basic operation units such as cell cultivation, sorting, cracking carry out integrated.Finally, above-mentioned operating unit can be integrated on the very little chip, forms network by the microchannel, runs through whole system with controlled fluid, in order to realize the various functions of conventional chemical or biology laboratory.
This technology has efficiently, the low consumption advantage, and required sample size is few in detection, and detection time is short, and chip can be made highly sensitive effective detection to specific ion, compound, dna fragmentation etc., and testing cost is low.This technology can be widely used in the fields such as environmental protection, military affairs, medicine, biochemistry.In recent years, increasingly mature along with micro-processing technology, MEMS technology and electronic technology, micro-fluidic chip begins to integrated, microminiaturized future development.
The micro-fluidic chip of present polymerizable material at home and abroad more typical bonding mode mainly is pressure sintering, supersonic bonding method etc.The high accuracy powder compressing machine cost of pressure sintering is higher, and the time of device power-up preheating and bonding is all long, and needs to apply certain pressure in bonding process, causes easily the change of little raceway groove shape of cross section.After carrying out thermocompression bonding, the organic matter on the micro-fluidic chip can be attached on tablet press machine heat block or the pad, not easy cleaning.The supersonic bonding method need to be made energy-oriented-ridge at chip when in use, and this has increased operation and the complexity of chip fabrication technique.When the underpower of supersonic generator itself when melting energy-oriented-ridge, also need the chip preheating that heats up.Simultaneously, the same with pressure sintering, the ultrasonic bond method also need to apply in the upper and lower surface of micro-fluidic chip certain pressure usually.If it is improper to control, can increase the channel shape variable equally.In addition, also there are some problems in other the up and down sealing method of two substrate combinations, such as gluing method, stop up easily little raceway groove in adhesion process, and the hardening time of glue is also long.In a word, there are various practical problems in the bonding method of above-mentioned polymeric micro-fluidic chip in actual application.This runs counter to micro-fluidic chip and realizes universal aim by integrated, microminiaturized, thereby limits it in the application of every field.
Summary of the invention
The bonding method that the purpose of this invention is to provide a kind of micro-fluidic chip based on PMMA and other polymerizable material, it can the facilitating chip bonding technological process, shorten the chip bonding time, guarantee the micro-fluidic chip bonding quality, thereby be conducive to popularizing of micro-fluidic chip.
The objective of the invention is to be achieved by the following scheme:
Two prefabricated suction ripple heated substrates are fitted with up and down two surfaces of chip respectively, then put into closed container, with electromagnetic wave radiation heating in closed container, microwave power can be regulated in 400-1000W, bonded interface the highest instantaneous (being no more than 3 seconds) temperature range is controlled at 95-200 ℃, and bonding time is at 30-200S.
Among the present invention, described exotic material can be that fusing point is higher than 300 ℃ metal material and other high-temperature refractory, such as refractory brick.
Among the present invention, the solidification temperature of described low temperature glass slurry is between 200-700 ℃.
Among the present invention, the quality accounting of inhaling the ripple exothermic material is 20-40%, and all the other are electric slurry.
The present invention fits two prefabricated suction ripple heated substrates respectively with up and down two surfaces of chip, with electromagnetic wave radiation heating in closed container, this moment, heat was transmitted to the intersection of two substrates of chip, made it to be in of short duration semi-molten state and finished bonding.Wherein, prefabricated heated substrates is mixed with electromagnetic wave absorbent material (mixing the rank that quality can accurately control to 0.1mg), after being subject to the HIGH-POWERED MICROWAVES radiation, can produce a large amount of heat.Can accurately control to respectively the microwave power that electromagnetic generator sends and launch time watt and second level.So the semi-molten state at bonded interface place can be effectively controlled, thereby reduce the deformation quantity of little raceway groove.Electromagnetic wave launcher, two microwave absorption substrates and polymeric micro-fluidic chip all are placed in one and can prevent electromagnetic-wave leakage and have in the closed container of certain heat-blocking action.The selection of chip is lucite and other organic polymer, and the geometry of chip is unrestricted, the little channel shape variable less than 2% behind the bonding.
The present invention adopts the mode of heating using microwave, in bonding, do not need to apply external pressure, compare the bonding method of other polymeric micro-fluidic chip both at home and abroad, the equipment that this novel method needs is simple, process costs is low, step is few, be easy to apply in the bonding field of polymerizable material micro-fluidic chip, have following advantage:
1, the bonding technology that absorbing material is subject to microwave heat production mechanism and polymeric micro-fluidic chip organically combines;
The bonding technology parameter of 2, making the micro-fluidic chip of PMMA and other polymerizable material is controlled easily, so that the bonding technology flow process of micro-fluidic chip is simplified, bonding time shortens;
3, the temperature rate-of-rise in the bonding process can be regulated and control by the content of adjusting absorbing material in electromagnetic wave power and electromagenetic wave radiation time and the heated substrates;
4, the channel shape variable of the micro-fluidic chip behind the bonding is little;
5, bonding method is simple, and the bonding apparatus cost is low, is convenient to popularize;
6, the cost of the micro-fluidic chip bonding of PMMA and other polymerizable material is low.
Description of drawings
Fig. 1 is the cross sectional representation of the micro-fluidic chip before the bonding.
Fig. 2 is the cross sectional representation of the micro-fluidic chip behind the bonding.
Fig. 3 is the cross section pictorial diagram of the micro-fluidic chip before the bonding.
Fig. 4 is the cross section pictorial diagram of the micro-fluidic chip behind the bonding.
Fig. 5 is heated substrates mould schematic diagram.
Fig. 6 is the structural representation of electromagnetic wave bonding apparatus.
The specific embodiment
The specific embodiment one: at first, the suction ripple heated substrates of two surfacings of preparation, the mass ratio of doping absorbing material is 27%.In the preparation, in the heated substrates material, sneak into an amount of can be at the material of heat production under the microwave.Two substrate alignment of chip are covered.A slice heated substrates level is inserted in the closed container with electromagnetic wave generating device, then micro-fluidic chip (comprising substrate and cover plate) is placed on the heated substrates.Afterwards, with another sheet heated substrates horizontal cover on micro-fluidic chip.After chip and heated substrates inserted closed container, with container closure.Wherein, little raceway groove is of a size of 156 μ m * 150 μ m on the micro-fluidic chip.Electromagnetic wave power is set as 800W, is 40 seconds regularly, and bonding temperature is controlled in 95-200 ℃ the scope, starts power supply.After bonding process finishes, openable container substrate to be heated and chip cooling.After the cooling, remove the heated substrates that covers above the chip, take out chip.Through microscopic observation, behind the chip bonding, the physical dimension of little raceway groove is 150 μ m * 145 μ m.As calculated, the deformation quantity behind little raceway groove bonding is less than 2%.So far, the bonding process of micro-fluidic chip is finished.Two heated substrates can Reusability.Fig. 1 and Fig. 2 are before the bonding and the raceway groove deformation schematic diagram behind the bonding, and Fig. 3 and Fig. 4 are before the bonding and the raceway groove deformation pictorial diagram behind the bonding, and wherein Fig. 3 and Fig. 4 are the cross section of the different directions of same raceway groove.
In the present embodiment, the preparation method of described suction ripple heated substrates is: at first, according to the chip size of institute's bonding, make a heated substrates mould with exotic material, as shown in Figure 5.Then, with the cryotronics slurry with inhale after the ripple exothermic material evenly mixes, insert in the mould sintering 3-15min under 450 ℃ condition.Demolding after cooling is taken out and is namely made heated substrates.Described absorbing material can be the absorbing materials such as CNT, nanoscale carbon dust, and the amount of the absorbing material that mixes can accurately control to 0.1mg.
Because the specific embodiment is to the explaining of technical scheme, and provides concrete numerical value to get final product, so above-mentioned scope is revised as concrete numerical value.
As shown in Figure 6, the used electromagnetic wave bonding apparatus of present embodiment is comprised of heat insulating and sealing container 1, the heated substrates 6 that electromagnetic wave generating device 2, power controller 3, timer 4, K type temperature thermocouple and temperature indicator 5, anti electromagnetic wave leak.The heat insulating and sealing container 1 that described anti electromagnetic wave leaks is the shell that utilizes the microwave heating equipment that micro-wave screening material and heat-barrier material be made, and this closed container can effectively completely cut off electromagnetic radiation, prevents the injury to the operator; Simultaneously, container can prevent scattering and disappearing of heat to a certain extent under air-tight state.Heat insulating and sealing container 1 inside is provided with electromagnetic wave generating device 2 and heated substrates 6, temperature sensor (being K type thermocouple) is connected with heated substrate 6, temperature shows that can be as accurate as 0.1 spends, the in real time fluctuation of displays temperature, when unusual fluctuations appear in temperature, can artificial intervention or the termination of para-linkage implementation Process.The built-in trapezoidal objective table 8 in heat insulating and sealing container 1 bottom, objective table 8 is in order to carry heated substrates 6 and heated micro-fluidic chip 7.Wherein, the microwave high temperature resistant objective table 8 that can pass through.Electromagnetic wave generating device 2 is the microwave generating apparatus of embedded magnetic controlled pipe, is positioned at the upper right side of container, and magnetron is connected with timer 4 with the power controller 3 that is positioned at the heat insulating and sealing external container, so that intensity and the time of control microwave.Employed all parts of this device are prior art.
In the present embodiment, the selection of chip is PMMA, also can select other polymer (Merlon or Parylene), because the above-mentioned material vitrification point is low, adopt electromagnetic wave bonding technology method, use 2 microwave absorption substrates of electromagnetic wave launcher irradiation, 2 substrates that are attached to micro-fluidic chip substrate and cover plate surface discharge rapidly large calorimetric under the radiation of microwave, substrate and the cover plate of micro-fluidic chip are heated to vitrification point, everywhere in the semi-molten state, the channel shape variable of the micro-fluidic chip behind the bonding is less at bonded interface for chip at this moment.
In the present embodiment, electromagnetic wave transmitting power and the time of electromagnetic wave launcher can accurately be set.
In the present embodiment, the microwave absorbing material that mixes in the microwave absorption substrate can accurately be controlled, and can control to the 0.1mg level, and the area of substrate and volume can be made as required, so that bonding effect is adjusted and guaranteed to the heating rate of chip, bond strength can arrive 1N/cm
2More than, the deformation quantity of little raceway groove behind bonding is less than 2%.
Claims (7)
1. bonding method based on the micro-fluidic chip of PMMA and other polymerizable material, it is characterized in that described bonding method comprises the steps: two prefabricated suction ripple heated substrates are fitted with up and down two surfaces of chip respectively, then put into closed container, with microwave radiation heating in closed container, microwave power is 400-1000W, the highest transient temperature scope control of bonded interface is at 95-200 ℃, and bonding time is 30-200S.
2. the bonding method of a kind of micro-fluidic chip based on PMMA and other polymerizable material according to claim 1, the material that it is characterized in that described chip is lucite, Merlon or Parylene.
3. the bonding method of a kind of micro-fluidic chip based on PMMA and other polymerizable material according to claim 1, the preparation method who it is characterized in that described suction ripple heated substrates is: at first, according to the chip size of institute's bonding, make a heated substrates mould with exotic material; Then, with the cryotronics slurry with inhale after the ripple exothermic material evenly mixes, insert in the mould sintering 3-15min under 200-700 ℃ condition; Demolding after cooling is taken out and is namely made heated substrates.
4. the bonding method of a kind of micro-fluidic chip based on PMMA and other polymerizable material according to claim 3,, it is characterized in that described exotic material is that fusing point is higher than 300 ℃ metal material or refractory brick.
5. the bonding method of a kind of micro-fluidic chip based on PMMA and other polymerizable material according to claim 3 is characterized in that the solidification temperature of described low temperature glass slurry is between 200-700 ℃.
6. the bonding method of a kind of micro-fluidic chip based on PMMA and other polymerizable material according to claim 3, the quality accounting that it is characterized in that described suction ripple exothermic material is 20-40%, all the other are electric slurry.
7. according to claim 3 or the bonding method of 6 described a kind of micro-fluidic chips based on PMMA and other polymerizable material, it is characterized in that described suction ripple exothermic material is CNT or nanoscale carbon dust.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210395922.8A CN102896008B (en) | 2012-10-18 | 2012-10-18 | Bonding method for micro-fluidic chip based on polymethyl methacrylate (PMMA) and other polymeric materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210395922.8A CN102896008B (en) | 2012-10-18 | 2012-10-18 | Bonding method for micro-fluidic chip based on polymethyl methacrylate (PMMA) and other polymeric materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102896008A true CN102896008A (en) | 2013-01-30 |
| CN102896008B CN102896008B (en) | 2014-12-10 |
Family
ID=47568669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210395922.8A Expired - Fee Related CN102896008B (en) | 2012-10-18 | 2012-10-18 | Bonding method for micro-fluidic chip based on polymethyl methacrylate (PMMA) and other polymeric materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102896008B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105833924A (en) * | 2016-03-16 | 2016-08-10 | 北京同方生物芯片技术有限公司 | Ultrasonic-bonded micro-fluidic chip and preparation method thereof |
| CN110898867A (en) * | 2019-12-04 | 2020-03-24 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of micro-fluidic chip template |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004010739A1 (en) * | 1999-04-22 | 2004-01-29 | California Institute Of Technology | Microwave bonding on thin film metal coated substrates |
| WO2004092048A1 (en) * | 2003-04-15 | 2004-10-28 | Microtechnology Centre Management Limited | Microfluidic sealing |
| CN1923887A (en) * | 2005-09-02 | 2007-03-07 | 中国科学院理化技术研究所 | Structural wave-absorbing composite material containing magnetic glass fiber and preparation method thereof |
| CN101863104A (en) * | 2010-05-26 | 2010-10-20 | 大连理工大学 | Injection molding process of plastic microfluidic chip |
| CN102190287A (en) * | 2011-03-24 | 2011-09-21 | 大连理工大学 | Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding |
| CN102391830A (en) * | 2011-08-09 | 2012-03-28 | 中国科学院宁波材料技术与工程研究所 | Application of ferrite-carbon nano-tube composite material used as wave-absorbing material at low temperature |
-
2012
- 2012-10-18 CN CN201210395922.8A patent/CN102896008B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004010739A1 (en) * | 1999-04-22 | 2004-01-29 | California Institute Of Technology | Microwave bonding on thin film metal coated substrates |
| WO2004092048A1 (en) * | 2003-04-15 | 2004-10-28 | Microtechnology Centre Management Limited | Microfluidic sealing |
| CN1923887A (en) * | 2005-09-02 | 2007-03-07 | 中国科学院理化技术研究所 | Structural wave-absorbing composite material containing magnetic glass fiber and preparation method thereof |
| CN101863104A (en) * | 2010-05-26 | 2010-10-20 | 大连理工大学 | Injection molding process of plastic microfluidic chip |
| CN102190287A (en) * | 2011-03-24 | 2011-09-21 | 大连理工大学 | Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding |
| CN102391830A (en) * | 2011-08-09 | 2012-03-28 | 中国科学院宁波材料技术与工程研究所 | Application of ferrite-carbon nano-tube composite material used as wave-absorbing material at low temperature |
Non-Patent Citations (1)
| Title |
|---|
| AA YUSSUF ETL AL: "Sealing of polymeric-microfluidic devices by using high frequency electromagnetic field and screen printing technique", 《JOURNAL OF MATERIAL PROCESSING TECHNOLOGY》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105833924A (en) * | 2016-03-16 | 2016-08-10 | 北京同方生物芯片技术有限公司 | Ultrasonic-bonded micro-fluidic chip and preparation method thereof |
| CN110898867A (en) * | 2019-12-04 | 2020-03-24 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of micro-fluidic chip template |
| CN110898867B (en) * | 2019-12-04 | 2021-04-06 | 中国科学院长春光学精密机械与物理研究所 | Preparation method of micro-fluidic chip template |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102896008B (en) | 2014-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2554572C2 (en) | Sample treatment with focused acoustic energy | |
| CN103587130A (en) | Method and device for curing fiber-reinforced resin-based composite material component by utilizing microwaves | |
| CN102886281A (en) | Micro-fluidic chip bonding device based on PMMA (polymethyl methacrylate) and other polymers | |
| CN102896008B (en) | Bonding method for micro-fluidic chip based on polymethyl methacrylate (PMMA) and other polymeric materials | |
| CN106531646B (en) | A kind of packaging method of micro-fluidic chip | |
| CN106195515B (en) | A kind of intermediate temperature setting composite material self-heating molding repair apparatus | |
| CN104907113B (en) | Method for preparing polymer microfluidic chip by assisting hot pressing via far infrared rays | |
| CN105833924A (en) | Ultrasonic-bonded micro-fluidic chip and preparation method thereof | |
| CN105666896A (en) | Composite energy field heating method | |
| CN101786161A (en) | Microwave irradiation pressurized sintering equipment and use method thereof | |
| CN104483347A (en) | Method and device for online monitoring variation of heat flux of microwave-heating material | |
| CN104140259A (en) | Method for quickly manufacturing Li2TiO3 tritium breeding small balls | |
| CN107352504A (en) | A kind of micro-fluidic MEMS chip method for packing | |
| CN104985679A (en) | Equipment and method for solidifying artificial stone by utilizing microwave heating | |
| CN103772861B (en) | A kind of responding microwave type shape memory polymer composite material and preparation method thereof | |
| CN103172018A (en) | Organic solvent auxiliary bonding method based on organic polymer material micro-fluidic chip | |
| CN103666191B (en) | Internal partition and the micro-wave oven of antiradar coatings and preparation method thereof, micro-wave oven for micro-wave oven internal partition | |
| CN106928656B (en) | Nano-silicon dioxide modified RFI epoxy resin film and preparation method thereof | |
| CN103301891A (en) | Self-heating microfluidic chip | |
| CN102910577A (en) | Microwave interface heating bonding method for micro-fluidic chip based on PMMA (Polymethyl Methacrylate) material and other organic polymers | |
| CN108273994A (en) | The preparation facilities and method of high-density molybdenum niobium alloy target | |
| CN101607688B (en) | Non-energy-oriented ridge polymer ultrasonic bonding method based on temperature compensation | |
| CN104312478B (en) | Sealant composition, display device, heating chamber and thermal-curable system | |
| CN207908993U (en) | Computer microwave curing reaction device | |
| CN206663019U (en) | A kind of efficient adhering device of superhard material grinding tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20151018 |
|
| EXPY | Termination of patent right or utility model |