CN104907113B - Method for preparing polymer microfluidic chip by assisting hot pressing via far infrared rays - Google Patents

Method for preparing polymer microfluidic chip by assisting hot pressing via far infrared rays Download PDF

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CN104907113B
CN104907113B CN201510315226.5A CN201510315226A CN104907113B CN 104907113 B CN104907113 B CN 104907113B CN 201510315226 A CN201510315226 A CN 201510315226A CN 104907113 B CN104907113 B CN 104907113B
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far infrared
micro
fluidic chip
hot pressing
far
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CN104907113A (en
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陈刚
张鲁雁
陈琪雯
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Fudan University
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Fudan University
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Abstract

The invention belongs to the technical field of microfluidic chips, and particularly relates to a method for preparing a polymer microfluidic chip by assisting hot pressing via far infrared rays. The method comprises the following steps: small thermoplastic polymer pieces which are cut to be of the size of a chip are arranged on a male die of a microfluidic chip micro structure and are sandwiched two glass pieces, and then pressure is applied; then a hot pressing device is arranged in a temperature controllable far infrared ray heating metal box provided with a far infrared ray radiation source, a fan, a thermocouple and a temperature control meter, the small polymer pieces are softened by being heated by the far infrared rays, and a bulged micro structure on the male die is pressed into the surface layer, so that a microfluidic chip substrate with a microfluidic channel is obtained after cooling and demolding; the substrate passes through a drill solution connecting hole, one surface with a channel is joined with the small polymer pieces face to face and is sandwiched between the two glass sheets, and then pressure is applied; and the substrate is placed into the temperature controllable far infrared ray heating metal box, so that a microfluidic chip finished product is obtained by assisting hot pressing via the far infrared rays. The method is rapid, simple and convenient, is simple in equipment and is low in cost, and the batch low-cost production of the polymer microfluidic chip is facilitated.

Description

A kind of far infrared assists hot pressing for the method for polymeric micro-fluidic chip
Technical field
The invention belongs to micro fluidic chip technical field is and in particular to a kind of auxiliary hot pressing of far infrared is for polymer miniflow The method of control chip.
Background technology
Micro-fluidic chip, with microchannel network as architectural feature, is the emphasis of current micro-total analysis system development.It can be The whole function such as sampling, dilution, reagent adding, reaction, separation, detection, is integrated on reused microchip, has extensively The suitability.Since nineteen ninety proposes micro-full analytical system first [1], micro-fluidic chip is just with its efficient, quick, examination Agent consumption is few, low consumption and integrated level cause the extensive concern of domestic and international relevant expert the advantages of high, examines in biological medicine, clinic The fields such as disconnected, environmental monitoring, food and medicine analysis show good application prospect [2 ~ 4], and it is wide variety of for restriction at present One of bottleneck is exactly its higher price and relatively low yield.In recent years, as the chip material and low on micro-fluidic chip basis Costs in mass process technology research receives significant attention.Micro-fluidic chip has very bright application prospect and huge city Field demand, sets up the inexpensive rapid processing new technique of its batch imperative.
Micro-fluidic chip mainly makes [4] using materials such as glass, quartz and polymer, and wherein glass and quartz is micro-fluidic Chip is generally processed using the method that photoetching is combined with chemical etching, and technology and equipment has high demands it is difficult to adopt mould large quantities of Amount produces, and price comparison is expensive, limits it and extensively applies.Then, in recent years polymeric micro-fluidic chip be developed and Pay attention to, the technology such as injection, die and casting low cost batch production [5] can be passed through using mould.For processing micro-fluidic chip Polymer have polydimethylsiloxane, lucite, Merlon, polyethylene terephthalate, polystyrene, poly- second Alkene, polrvinyl chloride, polypropylene etc. [6], wherein polydimethylsiloxane and lucite are two kinds of more common materials.Except poly- diformazan Radical siloxane belongs to the macromolecule organic silicon compound of reaction-curable, and other macromolecular materials are hot attribute plastics.Can pass through Formpiston impressing rapid batch low cost processing.Micro-fluidic chip is the reason setting up multicomponent, high flux and inexpensive detection technique Think platform, its potential application includes clinical diagnosises, disorder in screening, biological medicine analysis, food and medicine analysis and environment Monitoring etc., practical application needs a large amount of high-quality, multi-functional and inexpensive micro-fluidic chip.Polymeric micro-fluidic chip due to Batch low cost can process, have broad application prospects in terms of disposable multifunction quickly checks the exploitation of device.
The process technology of polymeric micro-fluidic chip mainly has hot pressing, injection and laser ablation etc. [5,6], wherein hot pressing Technology is the most commonly used, that is, on the vitrification point higher than thermoplastic polymer, makes the structure of anode membrane multiple by applying pressure Make and carry microchannel structure micro-fluidic chip substrate to prepare in thermoplastic polymer sheets, then made by heat-seal technology It encapsulates to obtain polymeric micro-fluidic chip with a piece of polymer cover plate.Hot pressing is higher to the requirement of mechanical strength of Chip mold, makes Silicon anode membrane or metal anode membrane adopt micro electro mechanical processing fabrication techniques.At present, the hot padding of polymeric micro-fluidic chip substrate Mainly adopt Electric heat oven and electric hot plate heating with the packaging by hot pressing of polymeric micro-fluidic chip, the temperature of use is significantly larger than heat The vitrification point of thermoplastic polymer, and imprint with packaging time respectively up to more than 20 minutes, need using higher pressure, Mould is damaged big, processing cost is higher.In view of current thermoplastic polymer micro-fluidic chip hot padding and packaging by hot pressing exist Problem, set up easy, quick and inexpensive thermoplastic polymer micro-fluidic chip New Machining Technology imperative.
Infrared ray is the invisible ripple that wavelength is 0.76 micron~1000 microns, and the difference according to wavelength is divided into three areas Section, i.e. near-infrared(0.76~1.40 micron), mid-infrared(1.40~3.00 microns)And far infrared(3.00~1000 microns)[7, 8].The thermogenic effects of wherein far infrared radiation irradiation object substantially exceed near-infrared radiation, and this is due to including polymer The absorption spectrum of Organic substance wavelength greatly all within the scope of 3 microns~100 microns, be in the wavelength of far infrared Same scope, absorbs very strongly to far, so far infrared radiation is very suitable for making heat source.At present, far infrared Radiation heating techniques are widely used in household warming, paint the fields such as dry, grain drying and health care.But through retrieval Domestic and foreign literature and patent, find no the report of far infrared radiation auxiliary polyalcohol micro-fluidic chip hot padding and packaging by hot pressing Road.Because far infrared radiation penetrates with radianting capacity by force, the heating to polymer is different from traditional face heating, but to sample Carry out three-dimensional heating from inside and outside synchronization, the efficiency of heating surface is high.Additionally, Heated by Far-Infrared Radiation does not have thermal inertia, firing rate is fast, Just can start or quit work in very short time, it is easy to accomplish Based Intelligent Control [7,8].
In view of these advantages of far infrared radiation, far-infrared radiation source, pressure apparatus and temperature regulating device are assembled by we Become far infrared auxiliary polyalcohol micro-fluidic chip hot-pressing system, carried out further investigation, be successfully established and be based on far infrared The polymeric micro-fluidic chip New Machining Technology of auxiliary pressure sintering.By FAR INFRARED HEATING thermoplastic polymer small pieces and miniflow Control chip substrate, and complete impressing and micro-fluidic chip substrate and the lid of polymeric micro-fluidic chip substrate under external pressure The packaging by hot pressing of piece.There are a lot of absorption bands by polymer in far infrared wave-length coverage, by force and heated using penetration capacity The far infrared of efficiency high heats to polymer pellets and polymeric micro-fluidic chip substrate, and micro-fluidic chip is greatly improved Hot padding and the efficiency of packaging by hot pressing.This chip manufacture technology has the advantages that easy and simple to handle, equipment is simple and low cost, chip , there is good application prospect in the easy automatization of forming technology in terms of the batch low cost production of polymeric micro-fluidic chip.
List of references
[1]Harrison DJ, Manz A, Fan Z, Ludi H, Widmer HM. Analytical Chemistry, 1992, 64, 1926~1932.
[2]Wang X, Yi L, Mukhitov N, Schrell AM, Dhumpa R, Roper MG. Journal of Chromatography A, 2015, 1382, 98~116.
[3]Su W, Gao X, Jiang L, Qin J. Journal of Chromatography A, 2015, 1377, 13~26.
[4]Ren KN, Zhou JH, Wu, HK. Accounts of Chemical Research, 2013, 46 (11), 2396~2406.
[5]Xu BB, Zhang YL, Xia H, Sun HB. Lab on A Chip, 2013, 13(9), 1677~ 1690.
[6]Chen Y, Zhang LY, Chen G. Electrophoresis, 2008, 29(9), 1801~1814.
[7] all valiant fighters, Zhang little Zhen, Wang Shuanhua, ceramic journal, 2004,25,98 ~ 101.
[8] monarch pavilion, infrared ray and far infrared, world rubber industry, 2005,56.
Content of the invention
It is an object of the invention to proposition is a kind of and process time being greatly reduced and improves the far red of chip manufacture quality Outside line assists hot pressing for the method for polymeric micro-fluidic chip.
Far infrared auxiliary hot pressing proposed by the present invention, for the method for polymeric micro-fluidic chip, concretely comprises the following steps:
(1)By the method for photoetching and selective wet chemical etching, finished surface has the raised polyalcohol microflow control of micro structure Chip substrate hot padding silicon formpiston;
(2)The thermoplastic polymer small pieces being cut into die size are placed in there is the raised silicon sun of micro-fluidic chip micro structure On mould, it is sandwiched in after-applied pressure between two sheets(2-15 kg/cm).Then, this hot-press arrangement is placed in a peace Controllable temperature FAR INFRARED HEATING metal box equipped with far-infrared radiation source, fan, thermocouple and temperature controller(80-160 ℃)In, carry out the far infrared auxiliary impressing of polymeric micro-fluidic chip substrate.Under FAR INFRARED HEATING, polymer pellets Soften, on formpiston, raised micro structure is pressed into its top layer, must have the micro-fluidic chip substrate of microchannel after cooling and demolding;
(3)Solution connection holes are bored to the position of the end of micro-fluidic chip substrate passageway, has the one side of passage same with a piece of The polymer pellets of sample ruler cun close face-to-face, are sandwiched in after-applied pressure between two sheets(2-15 kg/cm), put In the FAR INFRARED HEATING metal box for 80-140 DEG C for the temperature, obtain polyalcohol microflow control core through far infrared auxiliary packaging by hot pressing Piece finished product.
In the present invention, the controllable temperature far infrared hot pressing system of use by far-infrared radiation source, pressure apparatus, fan, Thermocouple, temperature controller and the metal box having passage are constituted, and install small fan with regulating box interior temperature in the side wall of metal box Degree.The switch of fan is controlled by being connected with the temperature controller of thermocouple, and thermocouple probe is placed in case to detect temperature therein Degree.When temperature is higher than design temperature, temperature controller can start fan, the cold air outside metal box is blasted in case, makes case Interior temperature drop, so that the temperature inside the box maintains essentially in setting value.
The present invention adopts FAR INFRARED HEATING thermoplastic polymer small pieces and micro-fluidic chip substrate, and under external pressure Complete the impressing of polymeric micro-fluidic chip substrate and the packaging by hot pressing of micro-fluidic chip substrate and cover plate.Exist by polymer A lot of absorption bands are had, using the far infrared that penetration capacity is strong and the efficiency of heating surface is high to carrying out adding in far infrared wave-length coverage Heat, is greatly improved the efficiency of micro-fluidic chip hot padding and packaging by hot pressing.
The far-infrared radiation source that the present invention uses can be far infrared bulb, far-infrared electric heated filament quartz ampoule, remote Infrared ray carbon fiber electric heating tube and halogen far-infrared electric heat pipe etc..
In the present invention, described in step (2) for far infrared auxiliary pressure sintering prepare polymeric micro-fluidic chip Thermoplastic can be selected for lucite, Merlon, polystyrene, polyethylene, polrvinyl chloride, polypropylene, poly- terephthaldehyde The thermoplastics such as sour glycol ester.
The step of the present invention(2)In, the depth of described lucite micro-fluidic chip passage is 20 ~ 50 microns, bottom width 20 ~ 60 microns of degree, 50 ~ 200 microns of upper width.
The step of the present invention(3)In, the solution connection holes of the terminal position of organic glass micro-fluidic chip substrate upper channel are A diameter of 1 ~ 3 millimeter of circular aperture, introduces for sample and flows out.
The step of the present invention(2)In, described far infrared auxiliary hot padding temperature is 80-160 DEG C, is applied to polymer little Hot pressing pressure on piece is 2-15 kg/cm, and hot pressing time is 3 ~ 10 minutes.
The step of the present invention(3)In, described far infrared hot pressing bonding temperature is 80-140 DEG C, is applied to polymer miniflow Hot pressing pressure on control chip substrate and cover plate is 2-15 kg/cm, and hot pressing time is 1 ~ 5 minute.
A kind of far infrared proposed by the present invention assists the method that pressure sintering prepares polymeric micro-fluidic chip, further in detail State as follows:
Using computer aided design software design chips structure, by single decussation microchannel and and solution connection holes Constitute, mask is printed as on transparent membrane using high-resolution (as 3600 dpi) laser photocomposing system, channel portion is Black lines, width is 20 ~ 100 microns, and other parts are transparent.In oxidation-treated silicon chip(P-type, thick 500 microns, directly 4 inches of footpath, crystal orientation<100>, thick 800 nanometers of surface silica dioxide)One layer of positive photoresist is coated by spin-coating technology (Shipley S1813 photoresist, Shipley, Marlborough, MA, the U.S.), spincoating conditions be 2000 ~ 4000 revs/min, Time is 40 ~ 80 seconds.Then in 40 ~ 80 seconds adhering to and removing out the molten of residual with raising photoresist of 100 ~ 120 DEG C of baking process Agent(Exposure front baking), cover mask(Microfluxion containing design), using Karl Suss MA6/BA6 litho machine (Karl Suss, Germany) carry out contact ultraviolet exposure 30 ~ 50 seconds after, immerse 20% Microposit 351 developing agent (Shipley) 60 ~ 100 seconds, after washing away the photoresist layer of exposure part, dry in 140 ~ 160 DEG C of baking ovens and make within 20 ~ 40 minutes micro- leading to Road and solution connection holes partly unexposed photoresist hardening, then with photoresist and silicon dioxide layer as protective layer, with 60 DEG C The 40% KOH aqueous solution exposed silicon chip of etching be 20 ~ 50 microns to depth, make silicon chip formpiston after removing photoresist.
Thickness is cut into and needs to prepare the small pieces 1 of chip size for the thermoplastic polymer plate of 0.1-2 millimeter, typically long 30-100 millimeter, wide 10-20 millimeter.As shown in figure 1, be placed in polymer pellets 1 there is micro-fluidic chip micro structure projection On silicon formpiston 2, after being sandwiched between two sheets 3 and 4, by Fig. 2(B)Shown Spring driving far infrared auxiliary hot-press arrangement The pressure of 2-15 kg/cm is applied on polymer pellets 1.As shown in figure 3, this hot-press arrangement 21 is placed in an installation There is the FAR INFRARED HEATING metal with air-vent of far-infrared radiation source 20, fan 22, thermocouple 23 and temperature controller 24 In case 19, constitute controllable temperature far infrared auxiliary hot-pressing system.Small fan 22 is installed with regulating box in the side wall of metal box 19 Temperature.The switch of fan 22 is controlled by being connected with the temperature controller 24 of thermocouple 23, and thermocouple 23 is placed in case to detect it In temperature.When temperature is higher than design temperature, temperature controller 24 can start fan 22, by the cold air drum outside metal box 19 In cartonning, the temperature inside the box is made to decline, so that the temperature inside the box maintains essentially in setting value.According to the difference of polymer, set remote Infrared auxiliary hot padding temperature is 80-160 DEG C, carries out the far infrared auxiliary impressing of polymeric micro-fluidic chip substrate, impressing Time is 3 ~ 10 minutes.Under the heating of far infrared 5, polymer pellets 1 soften, raised micro structure press-in on silicon formpiston 2 Its top layer, must have the micro-fluidic chip substrate 6 of microchannel after cooling and demolding.
After polymeric micro-fluidic chip substrate 6 channel end bores 1 ~ 3 millimeter of circular solution connection holes, there is the one side of passage Close face-to-face with the polymer pellets 7 of a piece of same size, be sandwiched between two sheets 3 and 4(See Fig. 1(D)), by Fig. 2(B) It is public that shown Spring driving far infrared auxiliary hot-press arrangement applies 2-15 on polymeric micro-fluidic chip substrate 6 and cover plate 7 The pressure of jin/square centimeter.Then, it is placed in the controllable temperature FAR INFRARED HEATING metal box 19 that temperature is 80-140 DEG C(Fig. 3)In 1 ~ 5 minutes, obtain polymeric micro-fluidic chip finished product through far infrared auxiliary packaging by hot pressing.
Fig. 2(B)Shown Spring driving far infrared auxiliary hot-press arrangement is by two Spring driving pressure apparatus and two panels Flat 16 and 17 forms.As Fig. 2(A)Shown, each Spring driving pressure apparatus is by butterfly nut 8, train wheel bridge 9, bolt 10th, spring promotes clamping plate 11, compression spring 12, silicone rubber convex seaming chuck 13, silicone rubber convex push-down head 14 and lower plate 15 Constitute.Single Spring driving pressure apparatus can provide the pressure of 100 kilograms of highest.After screwing butterfly nut 8, it promotes train wheel bridge 9 move down, thus compression pressure spring 12 produces pressure, promote clamping plate 11, silicone rubber seaming chuck 13 and glass by spring Top board 16 is applied to hot pressing part 18(It is silicon formpiston and polymer pellets during impressing, and when encapsulating, be polymeric micro-fluidic chip Substrate and cover plate)On, complete the far infrared auxiliary impressing of polymeric micro-fluidic chip and encapsulate.
Present invention firstly provides far infrared assists hot pressing for the method for polymeric micro-fluidic chip, and it is used successfully to Heat between the hot padding of thermoplastic polymer micro-fluidic chip substrate and polymeric micro-fluidic chip substrate and polymer cover plate Press seal fills.This chip manufacture technology has the advantages that fast and convenient, equipment is simple and low cost, in polymeric micro-fluidic chip The inexpensive production aspect of batch has good application prospect.
Brief description
Fig. 1 is in the present invention(A-C)Polymeric micro-fluidic chip substrate far infrared auxiliary impressing and(D)Micro-fluidic Chip substrate and cover plate far infrared auxiliary packaging by hot pressing flow chart.
Fig. 2 is in mid and far infrared line auxiliary hot-pressing system of the present invention(A)Single Spring driving pressure apparatus and(B)Spring Far infrared is driven to assist the structural representation of hot-press arrangement.
Fig. 3 is the structural representation that in the present invention, controllable temperature far infrared assists hot-pressing system.
Fig. 4 is(A)Assist the lucite micro-fluidic chip substrate of stamping technique preparation using mid and far infrared line of the present invention Cross-sectional scanning electron microphotograph and(B)Assist the lucite of packaging by hot pressing technology preparation micro- using mid and far infrared of the present invention The electron scanning micrograph of fluidic chip passage section.
Fig. 5 is to assist the organic of packaging by hot pressing technology preparation using far infrared auxiliary impressing and far infrared in the present invention Glass micro-fluidic chips material object photo(Passage and solution connection holes are built with ink).
Fig. 6 is to separate 10 ppm nitros using the lucite micro-fluidic chip of present invention preparation by micellar electrokinetic chromatography Benzene (a), 10 ppm 2,4-DNT (b), 10 ppm 2,4,6- trinitrotoluene (c) and 10 ppm para-nitrotoluene The chromatogram of (d).Test condition:Separation voltage is+2000 volts, sample introduction voltage is+2000 volts, sample injection time is 1 second, separates Jie Matter is 15 mmol/L borate buffer solutions and 15 mmol/L sodium lauryl sulphate mixed solutions (pH 9.2), detecting electrode It is ~ 0.65 volt (with respect to Ag/AgCl electrode) for a diameter of 320 microns of carbon electrode, detection current potential.
In figure label:1 is thermoplastic polymer small pieces, and 2 is silicon formpiston, and 3 is upper glass plate, and 4 is lower sheet glass, and 5 is remote Infrared ray, 6 is polymeric micro-fluidic chip substrate, and 7 is polymer cover plate, and 8 is butterfly nut, and 9 is steel train wheel bridge, and 10 is spiral shell Bolt, 11 promote clamping plate for spring, and 12 is compression spring, and 13 is silicone rubber convex seaming chuck, and 14 is silicone rubber convex push-down head, and 15 For steel lower plate, 16 is glass top board, and 17 is glass lower platen, and 18 is hot pressing part(It is silicon formpiston and polymer during impressing Small pieces, and when encapsulating, it is polymeric micro-fluidic chip substrate and polymer cover plate), 19 is the metal box with air-vent, and 20 is remote Infrared emitter, 21 assist hot-press arrangement for Spring driving far infrared, and 22 is fan, and 23 is thermocouple, and 24 is temperature control Device processed.
Specific embodiment
Further describe the present invention below by embodiment and accompanying drawing:
1st, far infrared auxiliary pressure sintering prepares lucite micro-fluidic chip
(1)The design of micro-fluidic chip
Single criss-crossing channels and solution using Adobe Illustrator 10.0 software design micro-fluidic chip connect Connect hole, had in the one side of medicine film in polyester transparent thin film using high-resolution (3600 dpi) laser photocomposing system and be printed as covering Film, the microchannel width on mask is 40 microns, and solution connection holes are the circular hole of 2 millimeters of diameter, wherein microchannel and molten Fluid apertures is black, and remainder is transparent.Separate 74 millimeters of microchannel length, the long millimeter of sample introduction microchannel, wherein both hand over The distance of crunode to three nearest solution connection holes is 5 millimeters.Lucite micro-fluidic chip by this Design and Machining is real Fig. 5 is shown in by thing photo.
(2)The making of silicon formpiston
In oxidation-treated silicon chip(P-type, thick 500 microns, 4 inches of diameter, crystal orientation<100>, surface silica dioxide thickness 800 nanometers)One layer of positive photoresist is coated by spin-coating technology(Shipley S1813 photoresist, Shipley, Marlborough, MA, the U.S.), spincoating conditions be 3000 revs/min, the time be 60 seconds.Then toast process 60 at 110 DEG C Second, to improve the solvent adhering to and removing out residual of photoresist, covers mask(Microfluxion containing design), using Karl Suss MA6/BA6 litho machine(Karl Suss, Germany)After carrying out contact ultraviolet exposure 40 seconds, immerse 20% Microposit 351 developing agents(Shipley)80 seconds, after washing away the photoresist layer of exposure part, dry in 150 DEG C of baking ovens and so that miniflow is led to Road and solution connection holes partly unexposed photoresist hardening, silicon chip are dipped in 5 minutes in 1 mol/L ammonium hydrogen fluoride solution and remove Silicon dioxide layer not covered by photoresist.Then etching exposed silicon chip to depth with 60 DEG C of 40% KOH aqueous solution is 40 Micron(About 2 hours), after removing photoresist, make silicon formpiston 2.
(3)Far infrared auxiliary hot stamping prepares lucite micro-fluidic chip substrate
The poly (methyl methacrylate) plate that thickness is 1 millimeter is cut into the small pieces 1 needing to prepare chip size(75 millimeters × 16 millis Rice).As shown in figure 1, be placed in lucite small pieces 1 having on the raised silicon formpiston 2 of micro-fluidic chip micro structure, it is sandwiched in two panels Sheet glass 3 and 4(76.2 millimeters × 25 millimeters × 1.2 millimeters)Between after, by Fig. 2(B)Shown Spring driving is far red Outside line assists hot-press arrangement to apply the pressure of 6 kg/cm, wherein flat 16 and 17 on lucite small pieces 1 Size be 120 millimeters × 78 millimeters × 3 millimeters.As shown in figure 3, this hot-press arrangement 21 is placed in one be provided with far infrared In the FAR INFRARED HEATING metal box 19 with air-vent of beta radiation source 20, fan 22, thermocouple 23 and temperature controller 24, structure Become controllable temperature far infrared auxiliary hot-pressing system.Small fan 22 is installed to adjust the temperature inside the box, fan in the side wall of metal box 19 22 switch is controlled by being connected with the temperature controller 24 of thermocouple 23, and thermocouple 23 is placed in case to detect temperature therein. When temperature is higher than design temperature, temperature controller 24 can start fan 22, the cold air outside metal box 19 is blasted in case, makes The temperature inside the box declines, thus maintaining essentially in setting value.Embodiment 1 sets far infrared auxiliary hot padding temperature as 130 DEG C, carries out The far infrared auxiliary impressing of lucite micro-fluidic chip substrate, imprint time is 5 minutes.Under the heating of far infrared 5, Lucite small pieces 1 soften, and on silicon formpiston 2, raised micro structure is pressed into its top layer, must have microchannel after cooling and demolding Lucite micro-fluidic chip substrate 6.Fig. 4 (A) is the organic glass assisting stamping technique preparation using mid and far infrared line of the present invention Glass micro-fluidic chip substrate cross-sectional scanning electron microphotograph is it is clear that the projection of silicon male mold surfaces is stamped into lucite piece In, the microchannel structural integrity of duplication.
(4)The far infrared auxiliary packaging by hot pressing of lucite micro-fluidic chip substrate and lucite cover plate
After lucite micro-fluidic chip substrate 6 channel end bores 2 millimeters of circular solution connection holes, there is the one side of passage Close face-to-face with the lucite small pieces 7 of a piece of same size, be sandwiched in two sheets 3 and 4(76.2 millimeters × 25 millimeters × 1.2 millimeters)Between(See Fig. 1(D)), by Fig. 2(B)Shown Spring driving far infrared auxiliary hot-press arrangement is in organic glass The pressure of 6 kg/cm is applied on glass micro-fluidic chip substrate 6 and cover plate 7.Then, being placed in temperature is 100 DEG C controlled Warm FAR INFRARED HEATING metal box 19(Fig. 3)In 3 minutes, through far infrared auxiliary packaging by hot pressing obtain lucite micro-fluidic chip Finished product.Fig. 4(B)It is the scanning of the lucite micro-fluidic chip passage section assisting the preparation of packaging by hot pressing technology using far infrared Electron micrograph it is seen that microchannel is complete, free from flaw between lucite micro-fluidic chip and cover plate, package quality is good Good.Fig. 5 is the micro-fluidic core of lucite assisting the preparation of packaging by hot pressing technology using far infrared auxiliary impressing and far infrared Piece material object photo, passage and solution connection holes, built with ink, have no inkblot in passage and solution connection holes with exterior domain, Chip package free from flaw is described, package quality is satisfactory.
Additionally, the lucite micro-fluidic chip of preparation is additionally operable to the separation analysis of actual sample.Fig. 6 is to use the present invention The lucite micro-fluidic chip of preparation passes through micellar electrokinetic chromatography separation Nitrobenzol, 2,4-DNT, 2,4,6- tri- nitre The chromatogram of base toluene and para-nitrotoluene is it is seen that four kinds of nitrobenzene compounds obtain good separation.
2nd, far infrared auxiliary pressure sintering prepares Merlon micro-fluidic chip
The polycarbonate plate that thickness is 1 millimeter is cut into the small pieces 1 needing to prepare chip size(75 millimeters × 16 millis Rice), by above-mentioned far infrared auxiliary heat pressing process processing Merlon micro-fluidic chip.The vitrification point of Merlon is about 140 ~ 150 DEG C, higher than the vitrification point of lucite(105℃).Merlon is prepared using far infrared auxiliary pressure sintering During micro-fluidic chip, Merlon micro-fluidic chip impressing shapes and far infrared auxiliary packaging by hot pressing temperature sets respectively For 160 and 140 DEG C, higher than the processing temperature of lucite micro-fluidic chip, other specification and technological process are auxiliary with far infrared Pressure sintering is helped to process organic glass micro-fluidic chips consistent.The Merlon micro-fluidic chip passage of processing is complete, and encapsulation is good.
3rd, far infrared auxiliary pressure sintering prepares polystyrene micro-fluidic chip
The polystyrene board that thickness is 1 millimeter is cut into the small pieces 1 needing to prepare chip size(75 millimeters × 16 millis Rice), by above-mentioned far infrared auxiliary heat pressing process processing polystyrene micro-fluidic chip.The vitrification point of polystyrene is about 100 DEG C, the slightly below vitrification point of lucite(105℃).Polystyrene is prepared using far infrared auxiliary pressure sintering micro- During fluidic chip, chip far infrared auxiliary impressing shapes and packaging by hot pressing temperature is respectively set as 120 DEG C and 100 DEG C, It is slightly below the processing temperature of lucite micro-fluidic chip, other specification and technological process and far infrared auxiliary pressure sintering processing Lucite micro-fluidic chip is consistent.The Merlon micro-fluidic chip water white transparency of processing, passage is complete, and encapsulation is good, no Crack.

Claims (5)

1. a kind of far infrared assists hot pressing for the method for polymeric micro-fluidic chip it is characterised in that concretely comprising the following steps:
(1)By the method for photoetching and selective wet chemical etching, finished surface has the raised polymeric micro-fluidic chip of micro structure Substrate hot padding silicon formpiston;
(2)The thermoplastic polymer small pieces being cut into die size are placed in there is the raised silicon formpiston of micro-fluidic chip micro structure On, it is sandwiched in after-applied pressure between two sheets:2 ~ 15 kg/cm, then, this hot-press arrangement are placed in one and are provided with In the controllable temperature FAR INFRARED HEATING metal box of far-infrared radiation source, fan, thermocouple and temperature controller, at 80 ~ 160 DEG C Carry out the far infrared auxiliary impressing of polymeric micro-fluidic chip substrate;Under FAR INFRARED HEATING, polymer pellets soften, sun On mould, raised micro structure is pressed into its top layer, must have the micro-fluidic chip substrate of microchannel after cooling and demolding;
(3)Solution connection holes are bored to the position of the end of micro-fluidic chip substrate passageway, has the one side of passage and a piece of same size Polymer pellets close face-to-face, be sandwiched in after-applied pressure between two sheets:2 ~ 15 kg/cm, are placed in temperature For, in 80 ~ 140 DEG C of FAR INFRARED HEATING metal box, assisting packaging by hot pressing through far infrared, obtaining final product polymeric micro-fluidic chip Finished product.
2. far infrared according to claim 1 assists hot pressing for the method for polymeric micro-fluidic chip, and its feature exists It is far infrared bulb, far-infrared electric heated filament quartz ampoule, far infrared carbon fiber electric heating tube in far-infrared radiation source used Or halogen far-infrared electric heat pipe.
3. far infrared according to claim 1 assists hot pressing for the method for polymeric micro-fluidic chip, and its feature exists In using far infrared assist pressure sintering preparation polymeric micro-fluidic chip material be lucite, Merlon, polyphenyl Ethylene, polyethylene, polrvinyl chloride, polypropylene or polyethylene terephthalate.
4. far infrared according to claim 1 assists hot pressing for the method for polymeric micro-fluidic chip, and its feature exists In step(2)In, the depth of described lucite micro-fluidic chip passage is 20 ~ 50 microns, 20 ~ 60 microns of bottom width, on 50 ~ 200 microns of portion's width.
5. far infrared according to claim 1 assists hot pressing for the method for polymeric micro-fluidic chip, and its feature exists In step(3)In, the solution connection holes of the terminal position of organic glass micro-fluidic chip substrate upper channel are the circle of 1 ~ 3 millimeter of diameter Shape aperture.
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