CN102891092B - 可减少接触热应力的超声波邦定变幅杆 - Google Patents
可减少接触热应力的超声波邦定变幅杆 Download PDFInfo
- Publication number
- CN102891092B CN102891092B CN201110217331.7A CN201110217331A CN102891092B CN 102891092 B CN102891092 B CN 102891092B CN 201110217331 A CN201110217331 A CN 201110217331A CN 102891092 B CN102891092 B CN 102891092B
- Authority
- CN
- China
- Prior art keywords
- ultrasonic transformer
- axis
- porcelain mouth
- ultrasonic
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110217331.7A CN102891092B (zh) | 2011-07-21 | 2011-08-01 | 可减少接触热应力的超声波邦定变幅杆 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120259443.4 | 2011-07-21 | ||
CN2011202594434 | 2011-07-21 | ||
CN201120259443 | 2011-07-21 | ||
CN201110217331.7A CN102891092B (zh) | 2011-07-21 | 2011-08-01 | 可减少接触热应力的超声波邦定变幅杆 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102891092A CN102891092A (zh) | 2013-01-23 |
CN102891092B true CN102891092B (zh) | 2015-03-04 |
Family
ID=45969826
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011202752014U Expired - Fee Related CN202205722U (zh) | 2011-07-21 | 2011-08-01 | 一种带应力释放结构的超声波邦定变幅杆 |
CN201110217331.7A Expired - Fee Related CN102891092B (zh) | 2011-07-21 | 2011-08-01 | 可减少接触热应力的超声波邦定变幅杆 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011202752014U Expired - Fee Related CN202205722U (zh) | 2011-07-21 | 2011-08-01 | 一种带应力释放结构的超声波邦定变幅杆 |
Country Status (1)
Country | Link |
---|---|
CN (2) | CN202205722U (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103624355B (zh) * | 2012-12-17 | 2015-12-16 | 上海声定科技有限公司 | 焊线机变幅杆 |
CN105413996B (zh) * | 2015-10-14 | 2017-08-01 | 上海声定科技有限公司 | 瓷嘴夹持结构 |
CN105583137B (zh) * | 2015-12-22 | 2017-08-11 | 上海声定科技有限公司 | 一种瓷嘴夹持结构 |
CN110823682A (zh) * | 2019-11-01 | 2020-02-21 | 湘潭大学 | 一种用于超高温蠕变试验的夹具 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201020440Y (zh) * | 2007-04-06 | 2008-02-13 | 广州市新栋力超声电子设备有限公司 | 一种弯曲振动式超声棒 |
CN102240635A (zh) * | 2011-04-20 | 2011-11-16 | 翟宝年 | 超声波变幅杆瓷嘴夹持结构 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6841921B2 (en) * | 2002-11-04 | 2005-01-11 | Kimberly-Clark Worldwide, Inc. | Ultrasonic horn assembly stack component connector |
-
2011
- 2011-08-01 CN CN2011202752014U patent/CN202205722U/zh not_active Expired - Fee Related
- 2011-08-01 CN CN201110217331.7A patent/CN102891092B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201020440Y (zh) * | 2007-04-06 | 2008-02-13 | 广州市新栋力超声电子设备有限公司 | 一种弯曲振动式超声棒 |
CN102240635A (zh) * | 2011-04-20 | 2011-11-16 | 翟宝年 | 超声波变幅杆瓷嘴夹持结构 |
Also Published As
Publication number | Publication date |
---|---|
CN102891092A (zh) | 2013-01-23 |
CN202205722U (zh) | 2012-04-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102891092B (zh) | 可减少接触热应力的超声波邦定变幅杆 | |
CN102651443B (zh) | 用于发光二极管封装的导电基板 | |
CN102569286A (zh) | 3d功率模块封装 | |
CN211251089U (zh) | 一种带有缓冲机构的线束加工用线束定位装置 | |
CN201171105Y (zh) | 一种高清数字接口的组合胶塞 | |
CN203092934U (zh) | 低压注塑模具 | |
CN104929335A (zh) | 发泡保温结构的装饰复合板及其制作方法 | |
CN206022755U (zh) | 一种高密封性航空连接线 | |
CN205069940U (zh) | 组装式压电贾卡梳连接头以及连接线 | |
CN202486358U (zh) | 一种光纤冷接子 | |
CN103590182B (zh) | 压电陶瓷驱动片接地电极引出的压电陶瓷选针器 | |
CN203398905U (zh) | 一种汽车发电机塑料保护罩螺杆连接结构 | |
CN204858472U (zh) | 一种减震散热型母线槽 | |
CN103515756B (zh) | 线缆连接器组件及其制造方法 | |
CN102709440A (zh) | 贴片led支架、贴片led制造方法及其贴片led | |
CN209014839U (zh) | 眼镜镜腿 | |
CN206850054U (zh) | 一种公头连接器 | |
CN205248261U (zh) | 一种用于微波器件表贴封装的外壳引线及其连接结构 | |
CN205069310U (zh) | 一种降噪型非晶合金干式变压器 | |
CN218505315U (zh) | 一种液压稳定的液压机 | |
CN105390901A (zh) | 一种带缓冲机构的车用线束加工模具 | |
CN212848949U (zh) | 一种新型type c plug连接器 | |
CN213519919U (zh) | 一种功率器件及功率模块 | |
CN219351150U (zh) | 一种接线固定装置 | |
CN205217293U (zh) | 一种瓷嘴夹持结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: 200437 Room 302, building 54, No. 100, Handan Road, Shanghai Patentee after: SHANGHAI SHENGDING TECHNOLOGY Co.,Ltd. Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Cailun Road No. 2 building 213 room 1690 Patentee before: SHANGHAI SHENGDING TECHNOLOGY Co.,Ltd. |
|
CP02 | Change in the address of a patent holder |
Address after: 200438 No. 407-409, No. 1599 military road, Shanghai, Yangpu District Patentee after: SHANGHAI SHENGDING TECHNOLOGY Co.,Ltd. Address before: 200437 Room 302, building 54, No. 100, Handan Road, Shanghai Patentee before: SHANGHAI SHENGDING TECHNOLOGY Co.,Ltd. |
|
CP02 | Change in the address of a patent holder | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150304 Termination date: 20210801 |
|
CF01 | Termination of patent right due to non-payment of annual fee |