CN102891092A - 可减少接触热应力的超声波邦定变幅杆 - Google Patents
可减少接触热应力的超声波邦定变幅杆 Download PDFInfo
- Publication number
- CN102891092A CN102891092A CN2011102173317A CN201110217331A CN102891092A CN 102891092 A CN102891092 A CN 102891092A CN 2011102173317 A CN2011102173317 A CN 2011102173317A CN 201110217331 A CN201110217331 A CN 201110217331A CN 102891092 A CN102891092 A CN 102891092A
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- ultrasonic transformer
- ultrasonic
- porcelain mouth
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110217331.7A CN102891092B (zh) | 2011-07-21 | 2011-08-01 | 可减少接触热应力的超声波邦定变幅杆 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120259443 | 2011-07-21 | ||
CN2011202594434 | 2011-07-21 | ||
CN201120259443.4 | 2011-07-21 | ||
CN201110217331.7A CN102891092B (zh) | 2011-07-21 | 2011-08-01 | 可减少接触热应力的超声波邦定变幅杆 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102891092A true CN102891092A (zh) | 2013-01-23 |
CN102891092B CN102891092B (zh) | 2015-03-04 |
Family
ID=45969826
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110217331.7A Expired - Fee Related CN102891092B (zh) | 2011-07-21 | 2011-08-01 | 可减少接触热应力的超声波邦定变幅杆 |
CN2011202752014U Expired - Fee Related CN202205722U (zh) | 2011-07-21 | 2011-08-01 | 一种带应力释放结构的超声波邦定变幅杆 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011202752014U Expired - Fee Related CN202205722U (zh) | 2011-07-21 | 2011-08-01 | 一种带应力释放结构的超声波邦定变幅杆 |
Country Status (1)
Country | Link |
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CN (2) | CN102891092B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110823682A (zh) * | 2019-11-01 | 2020-02-21 | 湘潭大学 | 一种用于超高温蠕变试验的夹具 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103624355B (zh) * | 2012-12-17 | 2015-12-16 | 上海声定科技有限公司 | 焊线机变幅杆 |
CN105413996B (zh) * | 2015-10-14 | 2017-08-01 | 上海声定科技有限公司 | 瓷嘴夹持结构 |
CN105583137B (zh) * | 2015-12-22 | 2017-08-11 | 上海声定科技有限公司 | 一种瓷嘴夹持结构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040084995A1 (en) * | 2002-11-04 | 2004-05-06 | Stegelmann Norman R. | Ultrasonic horn assembly stack component connector |
CN201020440Y (zh) * | 2007-04-06 | 2008-02-13 | 广州市新栋力超声电子设备有限公司 | 一种弯曲振动式超声棒 |
CN102240635A (zh) * | 2011-04-20 | 2011-11-16 | 翟宝年 | 超声波变幅杆瓷嘴夹持结构 |
-
2011
- 2011-08-01 CN CN201110217331.7A patent/CN102891092B/zh not_active Expired - Fee Related
- 2011-08-01 CN CN2011202752014U patent/CN202205722U/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040084995A1 (en) * | 2002-11-04 | 2004-05-06 | Stegelmann Norman R. | Ultrasonic horn assembly stack component connector |
CN201020440Y (zh) * | 2007-04-06 | 2008-02-13 | 广州市新栋力超声电子设备有限公司 | 一种弯曲振动式超声棒 |
CN102240635A (zh) * | 2011-04-20 | 2011-11-16 | 翟宝年 | 超声波变幅杆瓷嘴夹持结构 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110823682A (zh) * | 2019-11-01 | 2020-02-21 | 湘潭大学 | 一种用于超高温蠕变试验的夹具 |
Also Published As
Publication number | Publication date |
---|---|
CN102891092B (zh) | 2015-03-04 |
CN202205722U (zh) | 2012-04-25 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: 200437 Room 302, building 54, No. 100, Handan Road, Shanghai Patentee after: SHANGHAI SHENGDING TECHNOLOGY Co.,Ltd. Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Cailun Road No. 2 building 213 room 1690 Patentee before: SHANGHAI SHENGDING TECHNOLOGY Co.,Ltd. |
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CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: 200438 No. 407-409, No. 1599 military road, Shanghai, Yangpu District Patentee after: SHANGHAI SHENGDING TECHNOLOGY Co.,Ltd. Address before: 200437 Room 302, building 54, No. 100, Handan Road, Shanghai Patentee before: SHANGHAI SHENGDING TECHNOLOGY Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150304 Termination date: 20210801 |