CN102890404A - 压印方法和压印系统 - Google Patents
压印方法和压印系统 Download PDFInfo
- Publication number
- CN102890404A CN102890404A CN2012102112322A CN201210211232A CN102890404A CN 102890404 A CN102890404 A CN 102890404A CN 2012102112322 A CN2012102112322 A CN 2012102112322A CN 201210211232 A CN201210211232 A CN 201210211232A CN 102890404 A CN102890404 A CN 102890404A
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- CN
- China
- Prior art keywords
- template
- film thickness
- transcription
- organic material
- residual film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP159746/2011 | 2011-07-21 | ||
JP2011159746A JP5498448B2 (ja) | 2011-07-21 | 2011-07-21 | インプリント方法及びインプリントシステム |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102890404A true CN102890404A (zh) | 2013-01-23 |
CN102890404B CN102890404B (zh) | 2015-10-21 |
Family
ID=47533946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210211232.2A Active CN102890404B (zh) | 2011-07-21 | 2012-06-21 | 压印方法和压印系统 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9541847B2 (zh) |
JP (1) | JP5498448B2 (zh) |
KR (1) | KR101375060B1 (zh) |
CN (1) | CN102890404B (zh) |
TW (1) | TWI505925B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6190138B2 (ja) * | 2013-04-02 | 2017-08-30 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
JP6333039B2 (ja) | 2013-05-16 | 2018-05-30 | キヤノン株式会社 | インプリント装置、デバイス製造方法およびインプリント方法 |
JP6120678B2 (ja) | 2013-05-27 | 2017-04-26 | キヤノン株式会社 | インプリント方法、インプリント装置及びデバイス製造方法 |
JP6315904B2 (ja) | 2013-06-28 | 2018-04-25 | キヤノン株式会社 | インプリント方法、インプリント装置及びデバイスの製造方法 |
JP5992377B2 (ja) * | 2013-08-15 | 2016-09-14 | 株式会社東芝 | モールド製造方法、モールド製造装置及びパターン形成方法 |
JP6302287B2 (ja) | 2014-03-04 | 2018-03-28 | 東芝メモリ株式会社 | インプリント装置およびパターン形成方法 |
KR102244758B1 (ko) | 2014-10-27 | 2021-04-28 | 삼성디스플레이 주식회사 | 표시 패널 및 이의 제조 방법 |
JP6562707B2 (ja) * | 2015-05-13 | 2019-08-21 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1981236A (zh) * | 2004-06-03 | 2007-06-13 | 分子制模股份有限公司 | 在纳米级制造中改变衬底的尺寸的装置、系统和方法 |
CN101101441A (zh) * | 2007-08-07 | 2008-01-09 | 山东大学 | 大面积周期阵列三维微结构制备方法 |
KR20090111562A (ko) * | 2008-04-22 | 2009-10-27 | 주식회사 에이디피엔지니어링 | 미세 패턴 임프린트 장치 |
JP2010260272A (ja) * | 2009-05-07 | 2010-11-18 | Toyo Gosei Kogyo Kk | パターン形成方法 |
JP2010274639A (ja) * | 2009-06-01 | 2010-12-09 | Toyo Gosei Kogyo Kk | 光硬化物複合体及び該光硬化物複合体を形成するための光硬化性組成物並びに光硬化物複合体の製造方法 |
CN102096315A (zh) * | 2010-12-22 | 2011-06-15 | 青岛理工大学 | 整片晶圆纳米压印的装置和方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4352706A (en) * | 1981-08-31 | 1982-10-05 | Miller Lee H | Process for applying a metallic image in register to a document of value |
US6932934B2 (en) * | 2002-07-11 | 2005-08-23 | Molecular Imprints, Inc. | Formation of discontinuous films during an imprint lithography process |
EP1617293A1 (en) * | 2004-07-14 | 2006-01-18 | Universität Kassel | A method of aligning a first article relative to a second article and an apparatus for aligning a first article relative to a second article |
JP2006165371A (ja) | 2004-12-09 | 2006-06-22 | Canon Inc | 転写装置およびデバイス製造方法 |
JP5000112B2 (ja) * | 2005-09-09 | 2012-08-15 | 東京応化工業株式会社 | ナノインプリントリソグラフィによるパターン形成方法 |
JP2007103799A (ja) * | 2005-10-06 | 2007-04-19 | Kobe Steel Ltd | 形状を転写する転写装置 |
JP5268239B2 (ja) | 2005-10-18 | 2013-08-21 | キヤノン株式会社 | パターン形成装置、パターン形成方法 |
JP4929722B2 (ja) * | 2006-01-12 | 2012-05-09 | 日立化成工業株式会社 | 光硬化型ナノプリント用レジスト材及びパターン形成法 |
KR100805229B1 (ko) * | 2006-06-07 | 2008-02-21 | 삼성전자주식회사 | 나노임프린트를 이용한 미세 패턴의 형성방법 |
KR101343106B1 (ko) * | 2006-12-04 | 2013-12-20 | 삼성디스플레이 주식회사 | 백라이트 어셈블리, 액정 표시 장치 및 도광판의 제조 방법 |
JP2010030153A (ja) * | 2008-07-29 | 2010-02-12 | Toshiba Corp | パターン形成方法及びパターン形成装置 |
US8345242B2 (en) * | 2008-10-28 | 2013-01-01 | Molecular Imprints, Inc. | Optical system for use in stage control |
JP2010182824A (ja) * | 2009-02-04 | 2010-08-19 | Toshiba Corp | 磁気ランダムアクセスメモリの製造方法及び混載メモリの製造方法 |
JP4892026B2 (ja) | 2009-03-19 | 2012-03-07 | 株式会社東芝 | パターン形成方法 |
NL2004735A (en) * | 2009-07-06 | 2011-01-10 | Asml Netherlands Bv | Imprint lithography apparatus and method. |
JP5662741B2 (ja) * | 2009-09-30 | 2015-02-04 | キヤノン株式会社 | インプリント装置および物品の製造方法 |
JP4963718B2 (ja) * | 2009-10-23 | 2012-06-27 | キヤノン株式会社 | インプリント方法及びインプリント装置、それを用いた物品の製造方法 |
CN102763040B (zh) * | 2010-02-19 | 2016-05-11 | Asml荷兰有限公司 | 光刻设备、器件制造方法和相关的数据处理设备以及计算机程序产品 |
NL2005992A (en) * | 2010-03-22 | 2011-09-23 | Asml Netherlands Bv | Imprint lithography. |
NL2007176A (en) * | 2010-08-18 | 2012-02-21 | Asml Netherlands Bv | Substrate for use in metrology, metrology method and device manufacturing method. |
US8741199B2 (en) | 2010-12-22 | 2014-06-03 | Qingdao Technological University | Method and device for full wafer nanoimprint lithography |
TW201228807A (en) * | 2011-01-13 | 2012-07-16 | Moser Baer India Ltd | Method of imprinting a texture on a rigid substrate using flexible stamp |
JP5535162B2 (ja) * | 2011-09-21 | 2014-07-02 | 株式会社東芝 | パターン形成装置、パターン形成方法及びパターン形成用プログラム |
US8703406B2 (en) * | 2012-07-12 | 2014-04-22 | Transfer Devices Inc. | Method of forming large-area masters for replication of transfer lithography templates |
JP5723337B2 (ja) * | 2012-09-07 | 2015-05-27 | 株式会社東芝 | パターン形成方法及びパターン形成装置 |
JP2014229670A (ja) * | 2013-05-20 | 2014-12-08 | 株式会社東芝 | パターン形成方法及びパターン形成装置 |
-
2011
- 2011-07-21 JP JP2011159746A patent/JP5498448B2/ja not_active Expired - Fee Related
-
2012
- 2012-06-08 TW TW101120810A patent/TWI505925B/zh active
- 2012-06-21 KR KR1020120066633A patent/KR101375060B1/ko active IP Right Grant
- 2012-06-21 CN CN201210211232.2A patent/CN102890404B/zh active Active
- 2012-06-21 US US13/529,617 patent/US9541847B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1981236A (zh) * | 2004-06-03 | 2007-06-13 | 分子制模股份有限公司 | 在纳米级制造中改变衬底的尺寸的装置、系统和方法 |
CN101101441A (zh) * | 2007-08-07 | 2008-01-09 | 山东大学 | 大面积周期阵列三维微结构制备方法 |
KR20090111562A (ko) * | 2008-04-22 | 2009-10-27 | 주식회사 에이디피엔지니어링 | 미세 패턴 임프린트 장치 |
JP2010260272A (ja) * | 2009-05-07 | 2010-11-18 | Toyo Gosei Kogyo Kk | パターン形成方法 |
JP2010274639A (ja) * | 2009-06-01 | 2010-12-09 | Toyo Gosei Kogyo Kk | 光硬化物複合体及び該光硬化物複合体を形成するための光硬化性組成物並びに光硬化物複合体の製造方法 |
CN102096315A (zh) * | 2010-12-22 | 2011-06-15 | 青岛理工大学 | 整片晶圆纳米压印的装置和方法 |
Also Published As
Publication number | Publication date |
---|---|
US9541847B2 (en) | 2017-01-10 |
US20130020741A1 (en) | 2013-01-24 |
JP5498448B2 (ja) | 2014-05-21 |
CN102890404B (zh) | 2015-10-21 |
TW201309458A (zh) | 2013-03-01 |
KR101375060B1 (ko) | 2014-03-17 |
TWI505925B (zh) | 2015-11-01 |
KR20130011914A (ko) | 2013-01-30 |
JP2013026436A (ja) | 2013-02-04 |
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Effective date of registration: 20170804 Address after: Tokyo, Japan Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Patentee before: Toshiba Corp. |
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Address after: Tokyo, Japan Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Patentee before: Japanese businessman Panjaya Co.,Ltd. Address after: Tokyo, Japan Patentee after: Kaixia Co.,Ltd. Address before: Tokyo, Japan Patentee before: TOSHIBA MEMORY Corp. |
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Effective date of registration: 20220105 Address after: Tokyo, Japan Patentee after: Japanese businessman Panjaya Co.,Ltd. Address before: Tokyo, Japan Patentee before: TOSHIBA MEMORY Corp. |
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