CN102881676B - 电子部件用层叠配线膜 - Google Patents

电子部件用层叠配线膜 Download PDF

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Publication number
CN102881676B
CN102881676B CN201210240349.3A CN201210240349A CN102881676B CN 102881676 B CN102881676 B CN 102881676B CN 201210240349 A CN201210240349 A CN 201210240349A CN 102881676 B CN102881676 B CN 102881676B
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China
Prior art keywords
wiring film
film
stacked wiring
leading electric
alloy
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CN201210240349.3A
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English (en)
Chinese (zh)
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CN102881676A (zh
Inventor
村田英夫
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Proterial Ltd
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Hitachi Metals Ltd
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Publication of CN102881676A publication Critical patent/CN102881676A/zh
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Publication of CN102881676B publication Critical patent/CN102881676B/zh
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201210240349.3A 2011-07-13 2012-07-11 电子部件用层叠配线膜 Active CN102881676B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-154710 2011-07-13
JP2011154710 2011-07-13

Publications (2)

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CN102881676A CN102881676A (zh) 2013-01-16
CN102881676B true CN102881676B (zh) 2015-05-27

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CN201210240349.3A Active CN102881676B (zh) 2011-07-13 2012-07-11 电子部件用层叠配线膜

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JP (1) JP2013038393A (ko)
KR (1) KR101337141B1 (ko)
CN (1) CN102881676B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6369750B2 (ja) * 2013-09-10 2018-08-08 日立金属株式会社 積層配線膜およびその製造方法ならびにＮｉ合金スパッタリングターゲット材
WO2015099156A1 (ja) * 2013-12-27 2015-07-02 三井金属鉱業株式会社 複合金属箔、キャリア付複合金属箔、これらを用いて得られる金属張積層板及びプリント配線板
JP6681019B2 (ja) * 2015-02-25 2020-04-15 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102119230A (zh) * 2008-08-14 2011-07-06 株式会社神户制钢所 显示装置、其所使用的Cu合金膜和Cu合金溅射靶

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3535755B2 (ja) * 1997-12-25 2004-06-07 キヤノン株式会社 エッチング方法
CN100517797C (zh) * 2002-10-17 2009-07-22 旭硝子株式会社 层压体、带配线的基体、有机el显示元件、有机el显示元件的连接端子及它们的制造方法
JP4470147B2 (ja) * 2003-09-16 2010-06-02 日立金属株式会社 薄膜配線層
JP4730662B2 (ja) * 2005-03-02 2011-07-20 日立金属株式会社 薄膜配線層
JP4655281B2 (ja) * 2005-03-29 2011-03-23 日立金属株式会社 薄膜配線層
JP5300156B2 (ja) * 2008-08-07 2013-09-25 Ｊｘ日鉱日石金属株式会社 無電解めっきにより銅薄膜を形成しためっき物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102119230A (zh) * 2008-08-14 2011-07-06 株式会社神户制钢所 显示装置、其所使用的Cu合金膜和Cu合金溅射靶

Also Published As

Publication number Publication date
KR20130028643A (ko) 2013-03-19
CN102881676A (zh) 2013-01-16
KR101337141B1 (ko) 2013-12-05
JP2013038393A (ja) 2013-02-21

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