CN102843859B - A kind of short circuit method and PCB pads encapsulation of heterogeneous networks - Google Patents
A kind of short circuit method and PCB pads encapsulation of heterogeneous networks Download PDFInfo
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- CN102843859B CN102843859B CN201210289433.4A CN201210289433A CN102843859B CN 102843859 B CN102843859 B CN 102843859B CN 201210289433 A CN201210289433 A CN 201210289433A CN 102843859 B CN102843859 B CN 102843859B
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- network
- heterogeneous networks
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- encapsulation
- pcb pads
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Abstract
The present invention is applied to pcb board design field, there is provided short circuit method and PCB the pads encapsulation of a kind of heterogeneous networks, and the PCB pads encapsulation of two pins is shorted together.The present invention realizes two conductions of heterogeneous networks on the principle design of pcb board, reduce the artificial Copper Foil that covers when pcb board is designed and process the design risk brought, conducting is realized from principle design, foolproof function is played, while the increase of the part Material Cost and part paster cost that connected in reducing conventional method Zero-ohm resistor or magnetic bead bring.
Description
Technical field
Short circuit method and PCB pads the invention belongs to pcb board design field, more particularly to a kind of heterogeneous networks are encapsulated.
Background technology
, it is necessary to two different networks are shorted to together in some special circuit designs, such as numerical model analysis electricity
Lu Zhong, analog device and digital device need separately to put, respectively(Simulation ground, digitally)Also it is separate, but finally
Need for simulation is realized by way of single-point grounding or multipoint earthing and be digitally conducting to together, reach common ground
Purpose, it is to avoid interfering between digital-to-analogue.
In printed circuit board (PCB)(Printed Circuit Board, PCB)During design, traditional method for designing one kind be
The mode of series connection Zero-ohm resistor or magnetic bead realizes two conductings of heterogeneous networks between the two networks, but can so increase by zero
Part Material Cost and part paster cost.Another kind is in PCB layouts(layout)During design, layout engineer can be by people
Two different networks are shorted together to cover Copper Foil, but due to being manual control, design risk is big, it is impossible to from principle design
Upper fool proof.
The content of the invention
The embodiment of the present invention provides a kind of short circuit method of heterogeneous networks, it is intended to solve during traditional pcb board is designed in reality
The high cost during conducting of existing two heterogeneous networks, or the big problem of design risk.
The embodiment of the present invention is achieved in that a kind of short circuit method of heterogeneous networks, by two PCB pads envelopes of pin
Dress is shorted together.
The embodiment of the present invention additionally provides a kind of PCB pads encapsulation, including two the two of heterogeneous networks pins of connection, institute
Two pin pad encapsulation are stated to be shorted together.
The embodiment of the present invention realizes two conductions of heterogeneous networks on the principle design of pcb board, reduces pcb board
It is artificial during design to cover the design risk that Copper Foil treatment brings, conducting is realized from principle design, foolproof function is played, while reducing
Connected in conventional method the increase of part Material Cost and part paster cost that Zero-ohm resistor or magnetic bead bring.
Brief description of the drawings
Fig. 1 is the PCB pad encapsulation schematic diagrams that two pin provided in an embodiment of the present invention gives tacit consent to short circuit;
Fig. 2,3 be pin in the embodiment of the present invention and heterogeneous networks connection diagram;
Fig. 4,5 be network in the embodiment of the present invention for simulation ground network, digitally network when, pin connection diagram.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In embodiments of the present invention, when pcb board is designed, the PCB pads encapsulation acquiescence of two pins is shorted together,
Realize two acquiescence conductings of heterogeneous networks.
The embodiment of the present invention designs two pins when pcb board is designed(Pin)Acquiescence short circuit(Default Short)
PCB pads encapsulation, by the first pin(Pin1)With the second pin(Pin2)Be designed to be shorted together, realize that acquiescence is led
It is logical.
As shown in figure 1, the embodiment of the present invention designs the PCB pads encapsulation of the acquiescence short circuit of a Pin1 and the pins of Pin2 two
100, wherein dash area is pad short circuit lap.
In the principle diagram design of pcb board, Pin 1 connects that to need to be conducting to together two different with Pin 2 respectively
Network N ET_A and NET_B, its connection is as shown in Fig. 2 or Fig. 3.
In fig. 2, Pin1 meets first network NET_A, Pin2 and meets the second network N ET_B, and in figure 3, Pin1 connects the second net
Network NET_B, Pin2 meet first network NET_A, in embodiments of the present invention, two kinds of connections.
The embodiment of the present invention can be applied in various two situations of different network short circuits, including simulation ground network sum
Word ground network, power ground network and place of working network, radio frequency ground network and place of working network etc..
Simulation ground network is respectively with two different networks(AGND)With digital earth mat network(DGND)As a example by, two pins
Pin1, Pin2 are connected as shown in Figure 4, Figure 5.
In embodiments of the present invention, the package size of device is unrestricted, for example can be 01005,0201,0402,
0603rd, 0805 etc..
The PCB pads designed by the embodiment of the present invention are encapsulated, including two the two of heterogeneous networks pins of connection, two
The encapsulation of pin pad is shorted together.
In embodiments of the present invention, two different networks include simulation ground network sum word ground network, power ground network
With place of working network, radio frequency ground network and place of working network etc..
In embodiments of the present invention, when pin is with network connection, two the first pin connection first networks of pin, second
Pin connects the second network, or the first pin connects the second network, the second pin connection first network.
The embodiment of the present invention is mainly used in hardware electronic field, needs to lead on two different networks in circuit design
Logical situation together.When pcb board is designed, because the PCB pads encapsulation acquiescence of two pins of the first pin and the second pin is short
It is connected together, realizes the acquiescence conducting of two heterogeneous networks of first network and the second network.
The embodiment of the present invention realizes two conductions of heterogeneous networks on the principle design of pcb board, reduces pcb board
It is artificial during design to cover the design risk that Copper Foil treatment brings, conducting is realized from principle design, foolproof function is played, while reducing
Connected in conventional method the increase of part Material Cost and part paster cost that Zero-ohm resistor or magnetic bead bring.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (10)
1. a kind of short circuit method of heterogeneous networks, it is characterised in that be shorted together the PCB pads encapsulation of two pins, two
The pad shorted section of individual pin is overlapped, and realizes two acquiescence conductings of heterogeneous networks;
Wherein, when two PCB pads of pin are encapsulated into short circuit, the first pin is connected into first network, the connection of the second pin
Second network, the first network and second network are respectively different types of earth cord network.
2. the method for claim 1, it is characterised in that the heterogeneous networks are simulation ground network sum word ground network.
3. the method for claim 1, it is characterised in that the heterogeneous networks are power ground network and place of working network.
4. the method for claim 1, it is characterised in that the heterogeneous networks are radio frequency ground network and place of working network.
5. the method for claim 1, it is characterised in that the device package size of the PCB pads is 01005, or
0201, or 0402, or 0603, or 0805.
6. a kind of PCB pads encapsulation, including two the two of heterogeneous networks pin pads of connection, it is characterised in that described two
The encapsulation of pin pad is shorted together, and two pad shorted sections of pin are overlapped, and the acquiescence for realizing two heterogeneous networks is led
It is logical;
Wherein, when two PCB pads of pin are encapsulated into short circuit, the first pin is connected into first network, the connection of the second pin
Second network, the first network and second network are respectively different types of earth cord network.
7. PCB pads encapsulation as claimed in claim 6, it is characterised in that the heterogeneous networks are simulation ground network sum word
Ground network.
8. PCB pads encapsulation as claimed in claim 6, it is characterised in that the heterogeneous networks are power ground network and work
Ground network.
9. PCB pads encapsulation as claimed in claim 6, it is characterised in that the heterogeneous networks are radio frequency ground network and work
Ground network.
10. PCB pads as claimed in claim 6 encapsulation, it is characterised in that the device package size of the PCB pads is
01005, or 0201, or 0402, or 0603, or 0805.
Priority Applications (1)
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CN201210289433.4A CN102843859B (en) | 2012-08-14 | 2012-08-14 | A kind of short circuit method and PCB pads encapsulation of heterogeneous networks |
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CN201210289433.4A CN102843859B (en) | 2012-08-14 | 2012-08-14 | A kind of short circuit method and PCB pads encapsulation of heterogeneous networks |
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CN102843859A CN102843859A (en) | 2012-12-26 |
CN102843859B true CN102843859B (en) | 2017-06-06 |
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CN201210289433.4A Expired - Fee Related CN102843859B (en) | 2012-08-14 | 2012-08-14 | A kind of short circuit method and PCB pads encapsulation of heterogeneous networks |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105682361A (en) * | 2016-03-02 | 2016-06-15 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) based network connection structure |
CN110719691A (en) * | 2018-07-11 | 2020-01-21 | 中兴通讯股份有限公司 | Connection device between circuit networks, realization method, equipment and storage medium |
CN109195318B (en) * | 2018-10-26 | 2021-03-02 | 科大智能电气技术有限公司 | Method for switching multiple networks and PCB pad package |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200719779A (en) * | 2005-11-04 | 2007-05-16 | Hon Hai Prec Ind Co Ltd | Layout of printed circuit board |
US7803017B2 (en) * | 2006-09-15 | 2010-09-28 | Nokia Corporation | Simultaneous bidirectional cable interface |
CN201274608Y (en) * | 2008-09-16 | 2009-07-15 | 上海广电住金微电子有限公司 | Novel encapsulation construction substituting zero ohm SMD resistor |
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2012
- 2012-08-14 CN CN201210289433.4A patent/CN102843859B/en not_active Expired - Fee Related
Non-Patent Citations (3)
Title |
---|
电子设备中线路板的地线设计;王立华;《电子制作》;20090228(第3期);第43页 * |
电子设备中线路板的地线设计;虞握旗;《甘肃科技纵横》;20050430;第34卷(第4期);第9、119页 * |
谈谈通信设备的接地系统;朱兴海;《数字通信》;19941231(第3期);第29-33页 * |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523841 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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