CN212786035U - Circuit board and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a circuit board and electronic equipment, wherein the circuit board comprises a substrate, a magnetism isolating assembly and a component, a circuit is arranged on the substrate, the magnetism isolating assembly is arranged on the substrate and comprises a magnetism isolating layer and a conductive part, the conductive part is connected with a first surface and a second surface of the magnetism isolating layer, the conductive part is electrically connected with the circuit, the component is electrically connected with the substrate through the magnetism isolating assembly, the component is provided with an electrode, and the electrode is electrically connected with the conductive part; wherein the first surface is a surface close to the substrate and the second surface is a surface facing away from the substrate. The circuit board that this application embodiment provided passes through the setting of magnetism subassembly makes components and parts with the circuit just quilt the magnetism layer separates, the magnetism layer can show and weaken components and parts with electromagnetic radiation and interference between the circuit improve the design quality of circuit board.

Description

Circuit board and electronic equipment

Technical Field

The application relates to the technical field of communication equipment, in particular to a circuit board and electronic equipment.

Background

With the continuous development of communication technology, the functions of electronic devices are also more and more powerful. The size of most electronic devices is reduced, which results in more and more compact device layout on the circuit board of the electronic device.

For example, in the process that the current and the voltage of the inductive device on the circuit board constantly change, the radiation intensity of the inductive device in the vertical direction is very high, and the circuit at the corresponding position on the circuit board is affected, and the circuit on the circuit board may also affect the chip on the circuit board when being powered on, so that the problem of electromagnetic interference between the device and the circuit on the circuit board is serious, and the design quality of the circuit board is reduced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a circuit board and electronic equipment, and aims to solve the problem that electromagnetic interference between devices and circuits on the existing circuit board is serious.

In order to solve the above problems, the following technical solutions are adopted in the present application:

in a first aspect, an embodiment of the present application provides a circuit board, including:

a substrate on which a circuit is disposed;

the magnetism isolating assembly is arranged on the substrate and comprises a magnetism isolating layer and a conductive part, the conductive part is connected with the first surface and the second surface of the magnetism isolating layer, and the conductive part is electrically connected with the circuit;

the component is electrically connected with the substrate through the magnetism isolating assembly and is provided with an electrode which is electrically connected with the conductive part;

wherein the first surface is a surface close to the substrate and the second surface is a surface facing away from the substrate.

In a second aspect, an embodiment of the present application provides an electronic device, including the circuit board described in the first aspect.

The technical scheme adopted by the embodiment of the application can achieve the following beneficial effects:

the embodiment of the application provides a circuit board, which comprises a substrate, a magnetism isolating assembly and a component, wherein a circuit is arranged on the substrate, the magnetism isolating assembly is arranged on the substrate and comprises a magnetism isolating layer and a conductive part, the conductive part is connected with a first surface and a second surface of the magnetism isolating layer, the conductive part is electrically connected with the circuit, the component is electrically connected with the substrate through the magnetism isolating assembly, the component is provided with an electrode, and the electrode is electrically connected with the conductive part; wherein the first surface is a surface close to the substrate and the second surface is a surface facing away from the substrate. The circuit board that this application embodiment provided passes through the setting of magnetism subassembly makes components and parts with the circuit just by the magnetism layer separates, has weakened components and parts with electromagnetic radiation and interference between the circuit.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a schematic structural diagram of a magnetic isolation assembly of a circuit board according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of a magnetic shield assembly of another circuit board according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of components of another circuit board provided in the embodiment of the present application;

fig. 5 is a schematic cross-sectional structure diagram of another circuit board provided in an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a magnetic shield assembly of another circuit board according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a component of another circuit board provided in the embodiment of the present application;

fig. 8 is a schematic cross-sectional structure diagram of another circuit board according to an embodiment of the present disclosure.

Description of reference numerals:

1-a substrate; 2-a magnetic isolation component; 21-a magnetic spacer layer; 22-a conductive portion; 3, components and parts; 31-pad.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to 8, an embodiment of the present application provides a circuit board, including:

the magnetic isolation device comprises a substrate 1, a magnetic isolation assembly 2 and a component 3, wherein a circuit is arranged on the substrate 1, the circuit can be an audio signal line, a power supply circuit and the like, the magnetic isolation assembly 2 is arranged on the substrate 1, the magnetic isolation assembly 2 comprises a magnetic isolation layer 21 and a conductive part 22, the conductive part 22 is connected with a first surface and a second surface of the magnetic isolation layer 21, the conductive part 22 is electrically connected with the circuit, the component 3 is electrically connected with the substrate 1 through the magnetic isolation assembly 2, the component 3 is provided with an electrode, and the electrode is electrically connected with the conductive part 22; wherein the first surface is a surface close to the substrate 1, and the second surface is a surface away from the substrate 1, and then the component 3 and the circuit are separated by the magnetic separating layer 21, so that the electromagnetic interference between the component 3 and the circuit is reduced.

Specifically, the component 3 may be at least one of an inductor, a crystal device, and an IC chip. When the component 3 is an inductor, the inductor may be an inductor with a voltage boosting or reducing circuit, such as a power management IC or a power amplifier, and a coil inside the inductor generates a magnetic field when a current passes through the inductor, and the electromagnetic radiation intensity of the inductor in the direction perpendicular to the substrate 1 is the maximum in the process that the voltage and the current on the inductor continuously change, which greatly affects the circuit arrangement on the substrate 1 at the position opposite to the inductor. In the magnetic isolation assembly 2, the magnetic isolation layer 21 is arranged between the inductor and the corresponding line, so that the inductor and the line are isolated by the magnetic isolation layer 21, and the magnetic isolation layer 21 can obviously reduce the electromagnetic radiation and interference of the inductor to the line, thereby ensuring the normal operation of the line.

In addition, the component 3 can also be a crystal device, the crystal device belongs to a sensitive device and is easily interfered by lines of a circuit board, and the three-layer circuit board in the projection area of the crystal device is enabled to be empty by a common circuit board, namely, the three-layer circuit board in the projection area cannot have any line, so that signals output by the crystal device are prevented from being interfered by the lines. In the present application, the magnetism isolating component 2 is disposed between the crystal device and the corresponding circuit by disposing the magnetism isolating layer 21, and then the crystal device and the circuit are isolated by the magnetism isolating layer 21, and the magnetism isolating layer 21 can significantly reduce the electromagnetic radiation and interference of the circuit or GND noise to the crystal device, thereby ensuring the normal signal transmission of the crystal device.

Similarly, the component 3 may also be an IC chip, such as an IC chip of an electronic compass, a hall sensor, and the like, which also needs to avoid the interference of the circuit on the circuit board. The magnetism isolating layer 21 of the magnetism isolating component 2 can be arranged between the IC chip and the corresponding circuit, at this time, the IC chip and the circuit are isolated by the magnetism isolating layer 21, and the magnetism isolating layer 21 can obviously weaken the electromagnetic radiation and interference of the circuit to the IC chip, and ensure the normal operation of the IC chip. For example, a flip leather sheath is used on many current electronic devices, a magnet is generally arranged in the flip leather sheath, and when the flip leather sheath is flipped to the back of the electronic device, if the magnetism isolating component 2 is not arranged, the magnet in the flip leather sheath may trigger the front screen of the electronic device to act; and after the magnetism isolating component 2 is arranged between the magnet in the flip leather sheath and the screen, the screen can be prevented from being triggered mistakenly, and the use experience of a user is improved.

The circuit board that this application embodiment provided passes through the setting of magnetism subassembly 2 will magnetism isolating layer 21 set up in between components and parts 3 and the corresponding circuit, make components and parts 3 with the circuit just by magnetism isolating layer 21 separates, conductive part 22 can with components and parts are connected to base plate 1, magnetism isolating layer 21 can show and weaken components and parts 3 with electromagnetic radiation and interference between the circuit improve the design quality of circuit board.

Optionally, the magnetism isolating layer 21 includes at least one of a nanocrystalline magnetism isolating layer or a superconducting ceramic magnetism isolating layer. Specifically, the nanocrystalline material has the characteristic of an ultrafine crystal structure, and has a metal insulator transition effect, so that nanocrystalline metal powder can be used as an insulator, and a good magnetic isolation effect is achieved; the superconducting ceramics have zero resistance at critical temperature, strong diamagnetism and good magnetism isolating effect.

Optionally, the conductive portion 22 includes a first conductive portion disposed on the first surface, a second conductive portion disposed on the second surface, and a third conductive portion communicating the first conductive portion and the second conductive portion.

Specifically, the first conductive portion is disposed behind the first surface, and since the first surface of the magnetism isolating layer 21 is close to the substrate 1, the first conductive portion can be directly electrically connected to the substrate 1; after the second conductive part is disposed on the second surface, since the component 3 is close to the second surface, the component 3 needs to be electrically connected to the substrate 1, at this time, the second conductive part may be electrically connected to the component 3, and the third conductive part connects the first conductive part and the second conductive part to form a connection path between the component 3 and the substrate 1.

Alternatively, referring to fig. 1, 2, 3 and 5, the third conductive portion is disposed at a side of the magnetism isolating layer 21.

In particular, the component 3 is generally electrically connected to other components through the electrodes, which may include a plurality of pads 31. The embodiment of the application provides components and parts 3 is close to one side of second surface is provided with a plurality ofly pad 31, the quantity of pad 31 can be two, three, four, five or more, the concrete quantity of pad 31 can be according to components and parts 3's size and connection require to confirm, and is a plurality of pad 31 can evenly distributed on components and parts 3, in order to improve components and parts 3 with the joint strength and the connection efficiency of base plate 1. The magnetic isolation assembly 2 is provided with a plurality of conductive parts 22 welded corresponding to the pads 31, and the conductive parts 22 can electrically connect each pad 31 to the substrate 1 so as to ensure the connection stability of the component 3 and the substrate 1.

In a specific embodiment, referring to fig. 1 and 2, the component 3 is an inductor, two pads 31 are disposed on the left and right sides of the component 3, the conductive portions 22 are disposed on both the left and right sides of the magnetic separator layer 21, the two pads 31 are disposed opposite to the two conductive portions 22, the first conductive portion of the two conductive portions 22 is disposed between the substrate 1 and the magnetic separator layer 21, the second conductive portion of the two conductive portions 22 is disposed between the component 3 and the magnetic separator layer 21 and is respectively welded to the two pads 31, and the two third conductive portions are disposed on both the left and right sides of the magnetic separator layer 21 and respectively communicate the first conductive portion and the second conductive portion on both the left and right sides. The component 3 is now electrically connected to the substrate 1 and the magnetically isolating layer 21 is just between the component 3 and the substrate 1, which avoids electromagnetic radiation and interference between the component 3 and the lines on the substrate 1.

In a specific embodiment, referring to fig. 3, 4 and 5, the component 3 is a crystal device, the cross section of the component 3 is quadrilateral, four corners of the component 3 are provided with four bonding pads 31, the size of the magnetic isolation layer 21 is the same as that of the component 3, the magnetic isolation layer 21 is also quadrilateral, the conductive parts 22 are arranged at four corners of the magnetic isolation layer 21, the four bonding pads 31 are arranged opposite to the four conductive parts 22, the first conductive parts of the four conductive parts 22 are arranged between the substrate 1 and the magnetic isolation layer 21, the second conductive parts of the four conductive parts 22 are arranged between the component 3 and the magnetic isolation layer 21 and are respectively welded with the four bonding pads 31, and the four third conductive parts are arranged at the sides of the four corners of the magnetic isolation layer 21 and respectively communicate the first conductive parts and the second conductive parts of the four corners. The component 3 is now electrically connected to the substrate 1 and the magnetically isolating layer 21 is just between the component 3 and the substrate 1, which avoids electromagnetic radiation and interference between the component 3 and the lines on the substrate 1.

Alternatively, referring to fig. 6 to 8, a through hole is provided on the magnetism isolating layer 21, and the third conductive portion is provided in the through hole.

Specifically, referring to fig. 7, the component 3 is an IC chip, the cross section of the component 3 is a quadrangle, nine bonding pads 31 are arranged on the side of the component 3 close to the second surface, the bonding pads 31 may be BGA pads, the size of the magnetic spacer layer 21 is the same as that of the component 3, and is also quadrilateral, see figure 6, nine through-holes are formed in the magnetic isolating layer 21, nine conductive parts 22 are correspondingly arranged at nine through-holes, nine bonding pads 31 and nine conductive parts 22 are oppositely arranged, nine conductive parts 22 are arranged, a first conductive part is close to the substrate 1, nine conductive parts 22 are close to the second conductive part of each component 3 and is respectively welded with the nine bonding pads 31, and nine third conductive parts are respectively arranged in the nine through-holes and are communicated with the nine first conductive parts and the second conductive parts. The component 3 is electrically connected to the substrate 1, and the magnetism isolating layer 21 is just between the component 3 and the substrate 1, so that electromagnetic radiation and interference between the component 3 and a circuit on the substrate 1 are avoided.

Optionally, the lines comprise surface lines and inner lines. Specifically, the substrate 1 may be a single-layer substrate or a multilayer substrate. When the substrate 1 is a multilayer substrate, the multilayer substrate may also be provided with a circuit to improve the signal and power transmission efficiency of the substrate 1. After the magnetic shielding layer 21 is disposed between the component 3 and the substrate 1, the magnetic shielding layer 21 can reduce electromagnetic interference between the component 3 and a circuit on the substrate 1, where the circuit may be a surface layer circuit facing the component 3 or an inner layer circuit facing the component 3.

The embodiment of the application also provides a chip mounting method for the circuit board, which comprises the following steps:

s101, arranging a magnetism isolating assembly on a substrate;

s102, arranging a component on one side, far away from the substrate, of the magnetism isolating assembly, wherein the component is electrically connected with the substrate through a conductive part, and the magnetism isolating layer is located between the component and a circuit of the substrate.

According to the circuit board mounting method, the magnetism isolating layer is arranged between the component and the corresponding circuit through the arrangement of the magnetism isolating assembly, so that the component and the circuit are separated by the magnetism isolating layer, the magnetism isolating layer can obviously weaken electromagnetic radiation and interference between the component and the circuit, and the design quality of the circuit board is improved. And the method for pasting the patch is simple in process and simple and convenient to operate, and is beneficial to large-scale industrial production and application.

The embodiment of the application also provides electronic equipment which comprises the circuit board.

In particular, the circuit board is used as a main control component of the electronic device, and can transmit and control signals on the electronic device. And the magnetic isolation function between the components and the circuits of the circuit board can improve the design quality of the circuit board and ensure the stable operation of the electronic equipment.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A circuit board, comprising:

a substrate on which a circuit is disposed;

the magnetism isolating assembly is arranged on the substrate and comprises a magnetism isolating layer and a conductive part, the conductive part is connected with the first surface and the second surface of the magnetism isolating layer, and the conductive part is electrically connected with the circuit;

the component is electrically connected with the substrate through the magnetism isolating assembly and is provided with an electrode which is electrically connected with the conductive part;

wherein the first surface is a surface close to the substrate and the second surface is a surface facing away from the substrate.

2. The circuit board of claim 1, wherein the magnetic spacer layer comprises at least one of a nanocrystalline magnetic spacer layer or a superconducting ceramic magnetic spacer layer.

3. The circuit board of claim 1, wherein the conductive portion comprises a first conductive portion disposed on the first surface, a second conductive portion disposed on the second surface, and a third conductive portion that communicates the first conductive portion and the second conductive portion.

4. The circuit board of claim 3, wherein the third conductive portion is disposed at a side of the magnetism-separating layer.

5. The circuit board of claim 3, wherein the magnetic separator layer is provided with a through hole, and the third conductive portion is disposed in the through hole.

6. The circuit board of claim 1, wherein the component comprises at least one of an inductor, a crystal device, and an IC chip.

7. The circuit board according to claim 1, wherein the electrode is disposed on a side of the component close to the second surface, the electrode includes a plurality of pads, and the magnetic isolation assembly is provided with a plurality of conductive portions soldered to the pads.

8. The circuit board of claim 7, wherein the plurality of pads are evenly distributed on the component.

9. The circuit board of claim 1, wherein the traces comprise surface traces and inner traces.

10. An electronic device, characterized in that it comprises a circuit board according to any one of claims 1-9.

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