CN207232322U

CN207232322U - A kind of IC classifiers

Info

Publication number: CN207232322U
Application number: CN201720983901.6U
Authority: CN
Inventors: 张朝志
Original assignee: Guangdong Leadyo Ic Testing Co Ltd
Current assignee: Guangdong Leadyo Ic Testing Co Ltd
Priority date: 2017-08-08
Filing date: 2017-08-08
Publication date: 2018-04-13
Anticipated expiration: 2027-08-08

Abstract

It the utility model is related to a kind of IC classifiers, the external high-frequency radio frequency circuit on the governor circuit of IC classifiers, the working frequency of higher is provided with high-frequency radio frequency circuit for governor circuit, so as to make governor circuit have the chip testing speed fan-out capability of higher in the case where not upgrading traditional IC classifier internal hardware, and being electrically connected to ground to the ground wire of master control PCB radio frequency PCB, to reduce the signal interference on high-frequency radio frequency circuit, the antijamming capability of IC classifiers is lifted.

Description

A kind of IC classifiers

Technical field

It the utility model is related to a kind of IC classifiers.

Background technology

As the development for more convenient and signal transmission safety and reliability wireless network that interoperates, many manufacturers are successive New RF chips are proposed, and the modulating/demodulating chip that wireless communication is needed, high/low audio amplifier all concentrate on chip In, the peripheral components of RF chips are greatly reduced, but RF chip integrations are higher, to be surveyed when RF chips dispatch from the factory test The project of examination is more, this just proposes challenge to the test machine of RF chips.Wherein most prominent challenge is exactly new RF cores The partial test project of piece needs the chip testing speed of 450MHz, and is conventionally used to carry out IC points of RF chip high speed tests Class machine, its working frequency up to 50 MHz, only up to can not meet the high-speed testing requirement of new RF chips.

The content of the invention

The purpose of this utility model is in the case where not upgrading traditional IC classifier internal hardware, makes traditional IC classifier There is the chip testing speed fan-out capability of higher.

The purpose of this utility model is achieved through the following technical solutions：

A kind of IC classifiers, including governor circuit are provided, governor circuit is equipped with master control PCB, it is characterised in that：Further include for Governor circuit provides the high-frequency radio frequency circuit of working frequency, which is electrically connected with governor circuit, high-frequency radio frequency electricity Road is equipped with radio frequency PCB, and radio frequency PCB's is electrically connected to ground to the ground wire of master control PCB.

Wherein, the radio frequency PCB is equipped with insulation board, and line layer and CLV films have all been amplexiformed in insulation board both sides successively.

Wherein, the insulation board is pet layer.

Wherein, the thickness of the pet layer is 0.25mm-0.35mm.

Wherein, the line layer is made of signal copper wire and ground wire, and on line layer, the position outside signal copper wire is all covered Lid ground wire, each ground wire is electrically connected to each other to be set with forming an entirety, signal copper wire and ground wire with layer.

Wherein, the thickness of the CLV films is 0.15mm-0.3mm.

The utility model external high-frequency radio frequency circuit on the governor circuit of IC classifiers, with high-frequency radio frequency circuit come based on The working frequency that circuit provides higher is controlled, so as to have governor circuit in the case where not upgrading traditional IC classifier internal hardware The chip testing speed fan-out capability of higher, and being electrically connected to ground to the ground wire of master control PCB radio frequency PCB, to reduce high frequency Signal interference on radio circuit, lifts the antijamming capability of IC classifiers.

Brief description of the drawings

Utility model is described further using attached drawing, but the embodiment in attached drawing does not form and the utility model is appointed What is limited, without creative efforts, can also be according to the following drawings for those of ordinary skill in the art Obtain other attached drawings.

Fig. 1 is a kind of circuit structure diagram of IC classifiers of the utility model；

Fig. 2 is the diagrammatic cross-section of radio frequency PCB.

Embodiment

IC classifiers as shown in Figure 1, the signal port of its governor circuit 1 and external high-frequency radio frequency circuit 2 are electrically connected, To obtain the working frequency of higher from high-frequency radio frequency circuit 2, make in the case where not upgrading traditional IC classifier internal hardware Governor circuit 1 has the chip testing speed fan-out capability of higher.Wherein governor circuit 1 is equipped with master control PCB, high-frequency radio frequency circuit 2 Equipped with radio frequency PCB, being electrically connected to ground to the ground wire of master control PCB for radio frequency PCB, to reduce the signal on high-frequency radio frequency circuit 2 Interference, lifts the antijamming capability of IC classifiers.

As Fig. 2, radio frequency PCB are from top to bottom divided into CLV films 23, line layer 22, insulation board 21, line layer 22 and CLV Film 23, is mutually glued between each layer, is laid with CLV films 23 in radio frequency PCB outermost layers to completely cut off line layer 22 with extraneous, so as to play With external insulation and the effect of protection, protection circuit layer 22 is disturbed from outer signals.Secondly because CLV films 23 have bending resistance Property, CLV films 23 are all set in the both sides of insulation board 21, a clamping effect, the rigidity of enhancing radio frequency PCB can be formed, it is preferable that The thickness of CLV films 23 is set to 0.24mm, and the rigidity of such radio frequency PCB is just applicable in.

Further, insulation board 21 is manufactured into pet layer using the PET material with wilful and insulating properties, the pet layer Thickness is set to 0.3mm, makes its sufficiently thick, so that insulation board 21 obtains enough electromagnetic isolation abilities, reduces by two line layers Electromagnetism mutual interference between 22.

Line layer 22 is made of signal copper wire and ground wire, and on line layer 22, the position outside signal copper wire all covers ground Line, as soon as being electrically connected to each other each ground wire to form an entirety, such ground wire surrounds signal copper wire, antijamming capability It is stronger, and in order to reduce the thickness of radio frequency PCB, signal copper wire and ground wire are set with layer.

Finally it should be noted that above example is only illustrating the technical solution of the utility model, rather than to this reality With the limitation of novel protected scope, although being explained with reference to preferred embodiment to the utility model, this area it is general Lead to it will be appreciated by the skilled person that can be to the technical solution of the utility model technical scheme is modified or replaced equivalently, without departing from this The spirit and scope of utility model technical solution.

Claims

1. a kind of IC classifiers, including governor circuit, governor circuit is equipped with master control PCB, it is characterised in that：Further include as master control electricity Road provides the high-frequency radio frequency circuit of working frequency, which is electrically connected with governor circuit, and high-frequency radio frequency circuit is equipped with Radio frequency PCB's, radio frequency PCB is electrically connected to ground to the ground wire of master control PCB.

A kind of 2. IC classifiers according to claim 1, it is characterised in that：The radio frequency PCB is equipped with insulation board, insulation board Line layer and CLV films have all been amplexiformed successively in both sides.

A kind of 3. IC classifiers according to claim 2, it is characterised in that：The insulation board is pet layer.

A kind of 4. IC classifiers according to claim 3, it is characterised in that：The thickness of the pet layer is 0.25mm- 0.35mm。

A kind of 5. IC classifiers according to claim 2, it is characterised in that：The line layer is by signal copper wire and ground wire group Into, on line layer, the position outside signal copper wire all covers ground wire, and each ground wire is electrically connected to each other to form an entirety, Signal copper wire and ground wire are set with layer.

A kind of 6. IC classifiers according to claim 2, it is characterised in that：The thickness of the CLV films is 0.15mm- 0.3mm。