CN204131507U - A kind of chip built-in antenna-matching circuit device - Google Patents

A kind of chip built-in antenna-matching circuit device Download PDF

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Publication number
CN204131507U
CN204131507U CN201420412081.1U CN201420412081U CN204131507U CN 204131507 U CN204131507 U CN 204131507U CN 201420412081 U CN201420412081 U CN 201420412081U CN 204131507 U CN204131507 U CN 204131507U
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CN
China
Prior art keywords
antenna
chip
matching circuit
circuit device
chip built
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201420412081.1U
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Chinese (zh)
Inventor
陈瀚潮
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SHENZHEN VLG WIRELESS TECHNOLOGY Co Ltd
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Priority to CN201420412081.1U priority Critical patent/CN204131507U/en
Application granted granted Critical
Publication of CN204131507U publication Critical patent/CN204131507U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of chip built-in antenna-matching circuit device, it is applied in field of wireless communication, wherein the impedance matching circuit of adjustment antenna is placed in System on Chip/SoC, by the antenna of outer lines ring type near-field coupling type by Signal transmissions to receiving chip end, fixing antenna-matching circuit system is positioned in chip, the utility model is implemented by comprising all manufacture methods of antenna-matching circuit in any integrated circuit chips of placing, the utility model arrangement space that can reduce on printed circuit board (PCB) can also design universal antenna system on various action portable equipment, design to produce the new antenna having high consistency and stability.

Description

A kind of chip built-in antenna-matching circuit device
Technical field
The utility model relates to a kind of chip built-in antenna-matching circuit device, belongs to field of wireless communication.
Background technology
General portable equipment antenna belongs to radial pattern antenna, traditional approach is all on the printed circuit board (PCB) of chip exterior or the body of antenna and support does antenna-matching circuit, surface structure material portions due to all portable equipments can not be all conforming material, there is almag, polycarbonate, resin/ABS, or add ABS etc. with PC, various mutual skimble-scamble material behavior, when four weekly assemblies being placed on antenna produce the change of radiation characteristic because changing the environmental conditions of surrounding, the radiation characteristic of antenna of finally changing and the impedance matching of body to chip chamber unbalance, not only produce frequency shift (FS), the impact of properties deteriorate is the easy different failures thus caused on Antenna Design producing consistency and stability in production and assembly also.
Now, the development of the microminaturization of the progress of integrated circuit technique and other element is the raising of electronic product performance, and enriching with perfect of function, the reduction of cost creates condition.Not only military use product, space flight equipment needs miniaturization, industrial products, even consumer product, especially portable microminaturization especially.This trend promotes again the microminaturization of microelectric technique conversely further.When using in portable mode, although there is no the problem of large radio signal reception aspect of performance.But due to portable equipment in long-term use, often can touch sweat and analog, there is sweat, moisture content, dust etc. and may invade in equipment, built-in aerial can be had influence on, the mainly performance of match circuit, makes the signal receiving function of built-in aerial obviously reduce.
Utility model content
In order to solve above-mentioned technical problem, the utility model provides a kind of chip built-in antenna-matching circuit device.
To achieve these goals, the utility model adopts following technical scheme: a kind of chip built-in antenna-matching circuit device, comprising: coil antenna, is the coil with multiturn coiling; Chip, its inside is placed with match circuit, and is connected to described coil antenna.
Preferably, the described match circuit mode inserted in chip is SIP system in package, or SOC system level chip.
Preferably, described match circuit is for regulating resonance frequency and the matched impedance of described coil antenna.
Preferably, described multiturn coiling is centrally axis cycle arrangement.
Preferably, described chip is connected to described coil antenna by chip pin.
Preferably, described coil antenna is connected on flexible printed wiring board.
Preferably, described coil antenna is connected to the antenna feed point on described flexible printed wiring board.
Preferably, described coil antenna is Ferrite Material at the back side of described flexible printed wiring board.
Particularly, described chip pin is by coaxial wire, or metal five metals shell fragment, or the mode of spring thimble pin, is connected to described coil antenna.
Particularly, described Ferrite Material or the diskette for portable equipment, or inhale ripple material.
Particularly, the antenna feed point on described flexible printed wiring board is by coaxial wire, or metal five metals shell fragment, or the mode of spring thimble pin, is connected to described chip pin.
The major impetus of encapsulation technology development, be the tight demand for miniaturization of electronic products, wish that small product size is compacter, integrated level is higher.Employing can the solution of silicon monolithic SOC of integrated whole system, the SOC that application CMOS technology technology realizes, and it is minimum to remain cost, the first-selection that integrated level is the highest.Many systems often need the function with mixed signal functions and simulation, and also need to apply many special devices in electronic product, and these particular device manufacture method can not applied often based on CMOS technology technology realizes.
Antenna-matching circuit directly encapsulates near field communication module and NFC system chip by the utility model, improve the design that antenna needs the match circuit additionally added, which save the plate end arrangement space of antenna block, improve and easily produce the upper unmatched personal error's factor of antenna product of assembling, further improve the consistency that antenna and inter-chip signals transmit, and improve traditional Antenna Design usefulness, make consistency and the stability of aerial radiation usefulness, because antenna-matching circuit being done on a printed circuit or the body of antenna and the first-class chip exterior of support, so just can improve traditional portable equipment antenna, the surface structure material of environment is coordinated often to make the amendment of match circuit to avoid the impedance matching unbalance of antenna.
Antenna-matching circuit directly encapsulates in the packaged chip of NFC system by the utility model, afterwards when needs improve antenna, need not additional designs match circuit again, thus save the arrangement space of antenna block, also improving antenna product not match condition, making the impact of error component that it is not easy by producing assembly crewman, further promote the consistency that antenna and inter-chip signals transmit, improve traditional Antenna Design usefulness, reach consistency and the stability of aerial radiation usefulness.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, embodiment of the present utility model is described further, wherein:
Fig. 1 is the schematic block diagram according to a specific embodiment of the present utility model;
Fig. 2 is the match circuit figure according to a specific embodiment of the present utility model;
Fig. 3 is the interface wiring diagram according to a specific embodiment of the present utility model.
Embodiment
As Fig. 1, near field communication module and NFC system, a kind of chip built-in antenna-matching circuit device, comprising: coil antenna 105, comprises the coil with multiturn coiling; Chip 101 inside is placed with match circuit 102, and is connected to described coil antenna 105.Chip pin 103,104 on chip 101 is by coaxial wire, or metal five metals shell fragment, or the mode of spring thimble pin, is connected to the antenna feed point 106,107 of external coil antenna 105.Match circuit is resonance frequency and matched impedance for regulating described coil antenna, adopt the mode in chip to be SIP system in package, or SOC system level chip is inserted in chip.Coil to be multiturn coiling be centrally axis cycle arrangement, when signal transfers to receiving chip end by the coil antenna 105 of outer lines ring type near-field coupling type.Match circuit 102 module of placing antenna here adopts SIP system in package, or the mode of SOC system level chip is placed in NFC chip 101, makes the Signal transmissions of NFC coil antenna on near-field coupling more stable.
As shown in Figure 2, a concrete match circuit near field communication module system, this match circuit is made up of resistance, inductance and electric capacity.In this match circuit, electric capacity is used for the resonance frequency of regulating winding, and resistance is used for the impedance matching of regulating winding antenna.Through adopting SIP system in package mode, fixing antenna-matching circuit is to 102 positions in 101 chips in Fig. 1.Signal by coil type near-field coupling type antenna transmission to the chip pin 103,104 of receiving chip end, its access way be via coaxial wire, metal five metals shell fragment or spring thimble pin transfer into.NFC antenna body part is connected on flexible printed wiring board after being circulated by multiturn coiling, the access point of antenna is the antenna feed point 106,107 on the coil antenna 105 of flexible printed wiring board, access way be via coaxial wire, metal five metals shell fragment or spring thimble pin transfer into.
In SIP system in package mode, there is the mode of various chip superposed.No matter adopt any stacked system, be all after each parts being carried out to test, re-use solder or other method of attachment and element layer is gathered into folds carry out again encapsulating.Its maximum advantage is the reduction of the area of circuit board, reduces the complexity of circuit board.Can also connect up, to realize the aligning of I/O more accurately at each encapsulation internal arrangement.And settle bare chip in the circuit board, generally can not reach very high precision.The number of chips of installing in module SIP, because application increases, progressively turn to the SOC adopting integrated horizontal higher, the total chip-count therefore in module will gradually reduce after being increased to some.At this moment the great shift occurred is the particular device by introducing transducer and so in module, with the function of improved system.These particular device adopt the SOC system level chip of wafer-level packaging, and adopt SMT technology to assemble.
In fig. 2, change a kind of packaged type, adopt systems-on-a-chip SOC technical method, namely be use new nano chips process technique, namely be resistance, inductance and electric capacity are changed into the mode on printed circuit pattern marking Silicon Wafer in the chips, fixing antenna-matching circuit is to 102 positions in the chip 101 in Fig. 1.In match circuit, the resonance frequency of capacitance adjustment coil, the impedance matching of resistance adjustment coil antenna.Signal by coil type near-field coupling type antenna transmission to the chip pin 103,104 of receiving chip end, its access way be via coaxial wire, metal five metals shell fragment or spring thimble pin transfer into.NFC antenna body part is connected on flexible printed wiring board after being circulated by multiturn coiling, the access point of antenna is the antenna feed point 106,107 on the coil antenna 105 of flexible printed wiring board, access way be via coaxial wire, metal five metals shell fragment or spring thimble pin transfer into.
In fig. 2, change a kind of packaged type again, embedded passive component in match circuit can be positioned on ceramic substrate or organic multilayer base board, even also can settle on the lead frames, makes embedded element meet like this and reduces parameter tolerance and the requirement reduced costs.
In another embodiment Fig. 3, chip 101 is NFC functional chip, inner for adopting sip technique package perimeter components and parts and antenna impedance matching 102 in integrated chip.The coil antenna 105 body part of NFC is done after multiturn coiling circulates by access feedback point and is connected in flexible printed wiring board 209, one back contact 208 of flexible printed wiring board, plate cabling is to another back contact 207 overleaf, coil antenna one antenna feed point 107 is forwarded to through front, this antenna feed point is via coaxial wire, metal five metals shell fragment or spring thimble pin etc. turn a chip pin 104 of the NFC chip 101 of access board end, signal resonates through the antenna impedance matching 102 of chip internal, select the concussion frequency range that needs and transmit to receive after signal finishes the numerical operation of information stream to chip core, again via another chip pin 103 of NFC chip 101 through coaxial wire, the tiebacks such as metal five metals shell fragment or spring thimble pin are to another antenna feed point 106 of coil antenna, achieve signal and use match circuit, the full instance loop of chip and antenna.
In the utility model, NFC antenna body is flexible printed wiring board 209, its back side laminating Ferrite Material or the diskette for portable equipment, or inhale ripple material, the electromagnetic interference such as anti-magnetic metal cover or the metal shell of battery making anti-portable equipment used, coil antenna is as shown in Figure 3 in flexible printed wiring board 209, and the back side of flexible printed wiring board 209 adheres on the equipment that need use.
The above, just preferred embodiment of the present utility model, the utility model is not limited to above-mentioned execution mode, as long as it reaches technique effect of the present utility model with identical means, all should belong to protection range of the present utility model.In protection range of the present utility model, its technical scheme and/or execution mode can have various different modifications and variations.Even if other technical characteristic individual is quoted in different claims, the utility model also can comprise the embodiment of these features total.

Claims (11)

1. a chip built-in antenna-matching circuit device, is characterized in that, comprising:
Coil antenna, comprises the coil with multiturn coiling;
Chip, its inside is placed with match circuit, and is connected to described coil antenna.
2. a kind of chip built-in antenna-matching circuit device according to claim 1, is characterized in that, the described match circuit mode inserted in chip is SIP system in package, or SOC system level chip.
3. a kind of chip built-in antenna-matching circuit device according to claim 1, is characterized in that, described match circuit is for regulating resonance frequency and the matched impedance of described coil antenna.
4. a kind of chip built-in antenna-matching circuit device according to claim 1, is characterized in that, described multiturn coiling is centrally axis cycle arrangement.
5. a kind of chip built-in antenna-matching circuit device according to claim 1, it is characterized in that, described chip is connected to described coil antenna by chip pin.
6. a kind of chip built-in antenna-matching circuit device according to claim 1, it is characterized in that, described coil antenna is connected on flexible printed wiring board.
7. a kind of chip built-in antenna-matching circuit device according to claim 1, it is characterized in that, described coil antenna is the antenna feed point be connected on flexible printed wiring board.
8. a kind of chip built-in antenna-matching circuit device according to claim 1, it is characterized in that, described coil antenna is Ferrite Material at the back side of flexible printed wiring board.
9. a kind of chip built-in antenna-matching circuit device according to claim 1, is characterized in that, chip pin is by coaxial wire, or metal five metals shell fragment, or the mode of spring thimble pin, is connected to described coil antenna.
10. a kind of chip built-in antenna-matching circuit device according to claim 8, is characterized in that, described Ferrite Material or the diskette for portable equipment, or inhales ripple material.
11. a kind of chip built-in antenna-matching circuit devices according to any one of claim 6-10, it is characterized in that, the antenna feed point on flexible printed wiring board is by coaxial wire, or metal five metals shell fragment, or the mode of spring thimble pin, be connected to described chip pin.
CN201420412081.1U 2014-07-24 2014-07-24 A kind of chip built-in antenna-matching circuit device Expired - Fee Related CN204131507U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420412081.1U CN204131507U (en) 2014-07-24 2014-07-24 A kind of chip built-in antenna-matching circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420412081.1U CN204131507U (en) 2014-07-24 2014-07-24 A kind of chip built-in antenna-matching circuit device

Publications (1)

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CN204131507U true CN204131507U (en) 2015-01-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104124989A (en) * 2014-07-24 2014-10-29 深圳市维力谷无线技术有限公司 Chip built-in antenna match circuit device
CN110651395A (en) * 2017-05-30 2020-01-03 华为技术有限公司 Multi-antenna system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104124989A (en) * 2014-07-24 2014-10-29 深圳市维力谷无线技术有限公司 Chip built-in antenna match circuit device
CN110651395A (en) * 2017-05-30 2020-01-03 华为技术有限公司 Multi-antenna system
US11011851B2 (en) 2017-05-30 2021-05-18 Huawei Technologies Co., Ltd. Multi-antenna system
CN110651395B (en) * 2017-05-30 2021-08-31 华为技术有限公司 Multi-antenna system

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C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 518102 Guangdong city of Shenzhen province Baoan District Xixiang Iron Street Gang Road oyster industry Industrial Park 1 building, 3 floor

Patentee after: SHENZHEN VLG WIRELESS TECHNOLOGY Co.,Ltd.

Address before: 518102 Guangdong city of Shenzhen province Baoan District Xixiang Iron Street Gang Road oyster industry Industrial Park 1 building, 3 floor

Patentee before: SHENZHEN VLG WIRELESS TECHNOLOGY Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150128

Termination date: 20210724