CN102843859A

CN102843859A - Short connection method and printed circuit board (PCB) pad package for different networks

Info

Publication number: CN102843859A
Application number: CN2012102894334A
Authority: CN
Inventors: 胡在成
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2012-08-14
Filing date: 2012-08-14
Publication date: 2012-12-26
Anticipated expiration: 2032-08-14
Also published as: CN102843859B

Abstract

The invention is suitable for the design field of printed circuit board (PCB) boards and provides a short connection method and a PCB pad package for different networks. PCB pad packages of two pins are in short connection. The short connection method achieves the conduction of two different networks based on the principle design of the PCB boards, reduces design risks caused by manually covering copper foils in design of the PCB boards, achieves conduction from the principle design to have the fool-proof function, and simultaneously prevents part material cost and part paster cost from increasing due to series connection of zero ohmic resistors or magnetic beads in a traditional method.

Description

A kind of short circuit method of heterogeneous networks and the encapsulation of PCB pad

Technical field

The invention belongs to the pcb board design field, relate in particular to a kind of short circuit method and encapsulation of PCB pad of heterogeneous networks.

Background technology

In some special circuit design; Need two various network be shorted to together, for example in the Digital Analog Hybrid Circuits, analogue device and digital device need separately be put; Ground separately (simulation ground, digitally) is also separate; But finally still need realize simulation ground through the mode of single-point grounding or multipoint earthing and digitally be conducting to together, reach the purpose on common ground, avoid the phase mutual interference between the digital-to-analogue.

At printed circuit board (PCB) (Printed Circuit Board; When PCB) designing; Traditional design method is a kind of to be that the mode of series connection Zero-ohm resistor or magnetic bead between these two networks realizes the conducting of two heterogeneous networks, but can increase part Material Cost and part paster cost like this.Another kind is when PCB layout (layout) designs, and layout engineer can be through the people for covering Copper Foil with two various network short circuits together, but owing to be artificial control, design has a big risk, can not be from fool proof on the principle design.

Summary of the invention

The embodiment of the invention provides a kind of short circuit method of heterogeneous networks, is intended to solve the cost height when realizing the conducting of two heterogeneous networks in the design of traditional P CB plate, perhaps designs the problem that has a big risk.

The embodiment of the invention is achieved in that a kind of short circuit method of heterogeneous networks, with the PCB pad of two pins encapsulation short circuit together.

The embodiment of the invention also provides a kind of PCB pad encapsulation, comprises two pins that connect two heterogeneous networks, and said two pin pads encapsulation short circuit together.

The embodiment of the invention has realized the conduction of two heterogeneous networks on the principle design of pcb board; The people is covered Copper Foil to handle the design risk of bringing when having reduced the pcb board design; Realize conducting from principle design; Play foolproof function, reduced the part Material Cost that series connection Zero-ohm resistor in the conventional method or magnetic bead bring and the increase of part paster cost simultaneously.

Description of drawings

Fig. 1 is the PCB pad encapsulation sketch map of the two pins acquiescences short circuit that provides of the embodiment of the invention;

Fig. 2, the 3rd, the sketch map that is connected of the pin in the embodiment of the invention and heterogeneous networks;

Fig. 4, the 5th, the network in the embodiment of the invention is for the simulation zone network, digitally during network, and pin connects sketch map.

Embodiment

In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.

In embodiments of the present invention, when pcb board designs, the PCB pad encapsulation of two pins is given tacit consent to short circuit together, realized the acquiescence conducting of two heterogeneous networks.

When the embodiment of the invention designs at pcb board, design the PCB pad encapsulation of one two pin (Pin) acquiescence short circuit (Default Short), with first pin (Pin1) and second pin (Pin2) be designed to short circuit together, realize giving tacit consent to conducting.

As shown in Figure 1, the PCB pad encapsulation 100 of the acquiescence short circuit of Pin1 of embodiment of the invention design and Pin2 two pins, wherein dash area is a pad short circuit lap.

When the principle diagram design of pcb board, Pin 1 and Pin 2 are connected two the various network NET_A and the NET_B that need be conducting to together respectively, and it meets method such as Fig. 2 or shown in Figure 3.

In Fig. 2, Pin1 meets the first network N ET_A, and Pin2 meets the second network N ET_B, and in Fig. 3, Pin1 meets the second network N ET_B, and Pin2 meets the first network N ET_A, and in embodiments of the present invention, two kinds connect method and all can.

The embodiment of the invention can be applied in the situation of various two various network short circuits, comprises simulation zone network and network digitally, power ground network and place of working network, radio frequency zone network and place of working network etc.

With two various network be respectively the simulation zone network (AGND) and digitally network (DGND) be example, two pin Pin1, Pin2 connect like Fig. 4, shown in Figure 5.

In embodiments of the present invention, the package size of device is unrestricted, for example can be 01005,0201,0402,0603,0805 etc.

PCB pad encapsulation through embodiment of the invention design comprises two pins that connect two heterogeneous networks, and two pin pad encapsulation short circuits together.

In embodiments of the present invention, two various network comprise simulation zone network and network digitally, power ground network and place of working network, radio frequency zone network and place of working network etc.

In embodiments of the present invention, when pin was connected with network, first pin of two pins connected first network, and second pin connects second network, also can be that first pin connects second network, and second pin connects first network.

The embodiment of the invention is mainly used in the hardware electronic field, need be with two various network conductings situation together on circuit design.When pcb board designs, be in the same place because of the PCB pad encapsulation acquiescence short circuit of two pins of first pin and second pin, realized the acquiescence conducting of first network and two heterogeneous networks of second network.

The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.

Claims

1. the short circuit method of a heterogeneous networks is characterized in that, with the PCB pad of two pins encapsulation short circuit together.

2. the method for claim 1 is characterized in that, when the PCB pad with two pins encapsulates short circuit, first pin is connected first network, and second pin connects second network.

3. the method for claim 1 is characterized in that, when the PCB pad with two pins encapsulates short circuit, first pin is connected second network, and second pin connects first network.

4. the method for claim 1 is characterized in that, said heterogeneous networks is simulation zone network and network digitally.

5. the method for claim 1 is characterized in that, said heterogeneous networks is power ground network and place of working network.

6. the method for claim 1 is characterized in that, said heterogeneous networks is radio frequency zone network and place of working network.

7. the method for claim 1 is characterized in that, the device package size of said PCB pad is 01005, perhaps 0201, perhaps 0402, perhaps 0603, perhaps 0805.

8. a PCB pad encapsulation comprises two pin pads that connect two heterogeneous networks, it is characterized in that, said two pin pads encapsulation short circuit together.

9. PCB pad encapsulation as claimed in claim 8 is characterized in that first pin of said two pins connects first network, and second pin connects second network.

10. PCB pad encapsulation as claimed in claim 8 is characterized in that first pin of said two pins connects second network, and second pin connects first network.

11. PCB pad as claimed in claim 8 encapsulation is characterized in that, said heterogeneous networks is simulation zone network and network digitally.

12. PCB pad encapsulation as claimed in claim 8 is characterized in that said heterogeneous networks is power ground network and place of working network.

13. PCB pad encapsulation as claimed in claim 8 is characterized in that said heterogeneous networks is radio frequency zone network and place of working network.

14. PCB pad as claimed in claim 8 encapsulation is characterized in that the device package size of said PCB pad is 01005, perhaps 0201, perhaps 0402, perhaps 0603, perhaps 0805.