CN102892249A - Processing method for single-point grounding of printed circuit board (PCB) - Google Patents
Processing method for single-point grounding of printed circuit board (PCB) Download PDFInfo
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- CN102892249A CN102892249A CN2012103091291A CN201210309129A CN102892249A CN 102892249 A CN102892249 A CN 102892249A CN 2012103091291 A CN2012103091291 A CN 2012103091291A CN 201210309129 A CN201210309129 A CN 201210309129A CN 102892249 A CN102892249 A CN 102892249A
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Abstract
The invention provides a processing method for the single-point grounding of a printed circuit board (PCB). The processing method is used for circuit design, and comprises the following steps of: providing the PCB, wherein the PCB comprises at least one signal layer and a main ground plane layer; designing a PCB via package, wherein the PCB via package is a metalized via which penetrates through the signal layers and the main ground plane layer; and conducting the metalized via and the ground plane of the main ground plane layer, and setting wiring forbidding areas isolating the metalized via on the signal layers. The metalized via is isolated from signal areas of the signal layers by the wiring forbidding areas, so that design efficiency is high; and moreover, a single-point grounding design is realized by the PCB via package, only the PCB via package is required to be called during the single-point grounding, and a layout engineer is not required to manually add a via and isolate the via from the signal area of each signal layer, so that design risks are effectively lowered, and the design efficiency is improved.
Description
Technical field
The present invention relates to the hardware electronic class, relate in particular to a kind of pcb board single-point grounding processing method.
Background technology
Along with the development of the frivolous miniaturization of electronic product, in the electronic hardware circuit design, digital-to-analogue is mixed, the low-and high-frequency Mixed Design is very general, usually need to adopt the ground of analog circuit, low-frequency channel single-point grounding to process.Single-point grounding is that each comfortable a certain point of ground wire of each circuit module is received on the main ground level.
At pcb board (Printed Circuit Board, when printed circuit board (PCB)) designing, for the single-point grounding circuit in the hardware circuit design, need layout (layout) engineer to process especially, for example, if receive main ground plane layer (Main Ground Panel) with needing simulation, near the simulation ground on other wiring layer ground need to be sliced off, directly punching is to main ground plane layer, other peripheral zone network of single-point grounding circuit discord is linked to each other, and only the connectedness of reservation and main ground plane layer realizes the single-point grounding processing.
Yet, this mode of processing artificially must be brought the risk in the design, layout engineer is when forgetting that increase is forbidden wiring region (Routing Keep out Area) or ignored the single-point grounding demand, needing on the circuit design can occur the circuit of single-point grounding not have single-point grounding, signal produces at earth-return and disturbs, and causes problems of Signal Integrity.
Therefore, be badly in need of a kind of new single-point grounding processing method that addresses the above problem.
Summary of the invention
The purpose of this invention is to provide a kind of pcb board single-point grounding processing method, this pcb board single-point grounding processing method can reduce the design risk, improves design efficiency.
For achieving the above object, the invention provides a kind of pcb board single-point grounding processing method, the single-point grounding that is used for circuit design is processed, and may further comprise the steps: a pcb board is provided, and described pcb board comprises at least one signals layer and a main ground plane layer; Design a PCB via hole encapsulation, described PCB via hole is encapsulated as a metallization via hole, and described metallization via hole runs through described signals layer and main ground plane layer; The ground level conducting of described metallization via hole and described main ground plane layer is set, and the wiring region of forbidding of the described metallization via hole of isolation is set at described signals layer.
Compared with prior art, the present invention is by forbidding wiring region signals layer setting, and will metallize rapidly via hole and signaling zone are kept apart, and design efficiency is high; On the other hand, the present invention directly designs a PCB via hole encapsulation, realize the single-point grounding design by this PCB via hole encapsulation, only need call this PCB via hole encapsulation when needing, need not the artificial increase via hole of layout engineer and isolate the signaling zone of this via hole and each signals layer, effectively reduce the design risk, improved design efficiency.
Preferably, described metallization via hole is buried via hole (Buried Via), and described pcb board also comprises upper component side and the lower component side that is positioned at described pcb board upper and lower surface, and described upper component side and lower component side cover described metallization via hole.
Preferably, described metallization via hole is through hole (Through Via), described pcb board also comprises upper component side and the lower component side that is positioned at described pcb board upper and lower surface, described metallization via hole runs through described upper component side and lower component side, and is provided with the wiring region of forbidding of the described metallization via hole of isolation on described upper component side and the lower component side.
Preferably, described pcb board is the N laminate, and described N is the integer more than or equal to 4.Be that described pcb board can be 4 laminates, 6 laminates, 8 laminates etc.
Description of drawings
Fig. 1 is the flow chart of pcb board single-point grounding processing method of the present invention.
Fig. 2 is the structure chart of the via hole of PCB described in first embodiment of the invention encapsulation.
Fig. 3 is the structure chart of the via hole of PCB described in second embodiment of the invention encapsulation.
Embodiment
By describing technology contents of the present invention, structural feature in detail, being realized purpose and effect, below in conjunction with execution mode and cooperate accompanying drawing to give in detail explanation.
With reference to figure 1, the invention provides a kind of pcb board single-point grounding processing method 100, the single-point grounding that is used for circuit design is processed, and may further comprise the steps: (11) provide a pcb board, and described pcb board comprises at least one signals layer and a main ground plane layer; Design a PCB via hole encapsulation, described PCB via hole is encapsulated as a metallization via hole, and described metallization via hole runs through described signals layer and main ground plane layer; (12) the ground level conducting of this metallization via hole and described main ground plane layer is set, and the wiring region of forbidding of the described metallization via hole of isolation is set at described signals layer.
With reference to figure 2, structure chart for the encapsulation of the via hole of PCB described in the first embodiment of the invention, its pcb board 20 is eight laminates, comprise five signals layer S1, S2, S3, S4, S5, a main ground plane layer MG, a upper component side TS, a lower component side BS, described main ground plane layer MG is positioned at the 3rd layer, this PCB via hole encapsulation 200 comprises metallization via hole 21, described metallization via hole 21 is buried via hole (Buried Via), this metallization via hole 21 runs through five signals layer S1, S2, S3, S4, S5, main ground plane layer MG, described upper component side TS and lower component side BS cover this metallization via hole 21, and ground level 22 conductings of should metallize via hole 21 and described main ground plane layer MG, described signals layer S1, S2, S3, S4, be respectively arranged with on the S5 and forbid that wiring region 23 is to isolate described metallization via hole 21 and described signals layer S1, S2, S3, S4, the signaling zone of S5.
Certainly, described pcb board 20 can also be other multi-layer sheet, and such as 4 laminates, 6 laminates etc., main ground plane layer MG can be set to remove in the multi-layer sheet component side TS and any one outer internal layer of lower component side BS, is not limited to the 3rd layer.
With reference to figure 3, structure chart for the encapsulation of the via hole of PCB described in the second embodiment of the invention, be different from the first embodiment: the metallization via hole 21 ' of this PCB via hole encapsulation 200 ' is through hole (Through Via), this metallization via hole 21 ' runs through signals layer S1, S2, S3, S4, S5, main ground plane layer MG, upper component side TS and lower component side BS, and ground level 22 conductings of should metallize via hole 21 ' and described main ground plane layer MG, described signals layer S1, S2, S3, S4, arrange respectively on the S5 and forbid that wiring region 23 is to isolate described metallization via hole 21 ' and described signals layer S1, S2, S3, S4, the signaling zone of S5 arranges respectively on described upper component side TS and the lower component side BS and forbids that wiring region 23 is to isolate described metallization via hole 21 ' and upper component side TS, lower component side BS.
To sum up, the present invention is by forbidding wiring region 23 via hole 21,21 ' and remove other outer each layers of ground level 22 and keep apart, the raising design efficiency that will metallize rapidly; On the other hand, the present invention directly designs a PCB via hole encapsulation 200,200 ', realize the single-point grounding design by this PCB via hole encapsulation 200,200 ', only need call this PCB via hole encapsulation 200,200 ' during use gets final product, need not the artificial increase via hole of layout engineer and isolate signaling zone, the component side of this via hole and each signals layer, effectively reduce the design risk, improved design efficiency.
Above disclosed only is the preferred embodiments of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to the present patent application claim still belongs to the scope that the present invention is contained.
Claims (4)
1. a pcb board single-point grounding processing method is used for circuit design, it is characterized in that: may further comprise the steps:
One pcb board is provided, and described pcb board comprises at least one signals layer and a main ground plane layer;
Design a PCB via hole encapsulation, described PCB via hole is encapsulated as a metallization via hole, and described metallization via hole runs through described signals layer and main ground plane layer;
The ground level conducting of described metallization via hole and described main ground plane layer is set, and the wiring region of forbidding of the described metallization via hole of isolation is set at described signals layer.
2. pcb board single-point grounding processing method as claimed in claim 1, it is characterized in that: described metallization via hole is buried via hole, described pcb board also comprises upper component side and the lower component side that is positioned at described pcb board upper and lower surface, and described upper component side and lower first nodal section cover described metallization via hole.
3. pcb board single-point grounding processing method as claimed in claim 1, it is characterized in that: described metallization via hole is through hole, described pcb board also comprises upper component side and the lower component side that is positioned at described pcb board upper and lower surface, described metallization via hole runs through described upper component side and lower component side, and is provided with the wiring region of forbidding of the described metallization via hole of isolation on described upper component side and the lower component side.
4. pcb board single-point grounding processing method as claimed in claim 1, it is characterized in that: described pcb board is the N laminate, described N is the integer more than or equal to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210309129.1A CN102892249B (en) | 2012-08-27 | 2012-08-27 | Pcb board single-point grounding processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210309129.1A CN102892249B (en) | 2012-08-27 | 2012-08-27 | Pcb board single-point grounding processing method |
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| Publication Number | Publication Date |
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| CN102892249A true CN102892249A (en) | 2013-01-23 |
| CN102892249B CN102892249B (en) | 2016-04-20 |
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| CN201210309129.1A Expired - Fee Related CN102892249B (en) | 2012-08-27 | 2012-08-27 | Pcb board single-point grounding processing method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103716981A (en) * | 2013-12-30 | 2014-04-09 | 惠州Tcl家电集团有限公司 | PCB for stabilizing clock signals and wiring method for PCB |
| CN105070704A (en) * | 2015-08-17 | 2015-11-18 | 成都振芯科技股份有限公司 | Wiring structure capable of improving isolation between multichannel signals |
| CN106507581A (en) * | 2016-12-30 | 2017-03-15 | 深圳天珑无线科技有限公司 | Circuit board and its processing technique |
| TWI583297B (en) * | 2014-12-11 | 2017-05-11 | Kuang Ying Computer Equipment Co Ltd | Isolate the signal to interfere with the circuit board structure |
| CN106793467A (en) * | 2017-01-03 | 2017-05-31 | 奇酷互联网络科技（深圳）有限公司 | Realize method, single-point grounding PCB encapsulation and the printed circuit board (PCB) of single-point grounding design |
| CN110519913A (en) * | 2019-09-23 | 2019-11-29 | 努比亚技术有限公司 | A kind of method, encapsulation and printed circuit board for realizing PCB single-point grounding design |
| CN113657070A (en) * | 2021-08-10 | 2021-11-16 | 苏州悦谱半导体有限公司 | CAM system-based automatic line and hole moving detection and optimization method |
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| US20020071265A1 (en) * | 2000-12-13 | 2002-06-13 | Bruno Centola | Electromagnetic shield for printed circuit boards |
| WO2006009274A1 (en) * | 2004-07-23 | 2006-01-26 | Nec Corporation | Composite via structures and filters in multilayer printed circuit boards |
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| CN101389183A (en) * | 2007-09-10 | 2009-03-18 | 英业达股份有限公司 | Through-hole region design system and method for differential signal line |
| US20090133913A1 (en) * | 2005-10-18 | 2009-05-28 | Nec Corporation | Vertical transitions, printed circuit boards therewith and semiconductor packages with the printed circuit boards and semiconductor chip |
| CN202310268U (en) * | 2011-10-10 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Analog signal single point grounding structure for multi-layer printed circuit board (PCB) |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20020071265A1 (en) * | 2000-12-13 | 2002-06-13 | Bruno Centola | Electromagnetic shield for printed circuit boards |
| WO2006009274A1 (en) * | 2004-07-23 | 2006-01-26 | Nec Corporation | Composite via structures and filters in multilayer printed circuit boards |
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| CN202310268U (en) * | 2011-10-10 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Analog signal single point grounding structure for multi-layer printed circuit board (PCB) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103716981A (en) * | 2013-12-30 | 2014-04-09 | 惠州Tcl家电集团有限公司 | PCB for stabilizing clock signals and wiring method for PCB |
| CN103716981B (en) * | 2013-12-30 | 2017-11-17 | 惠州Tcl家电集团有限公司 | The PCB and its wiring method of stable clock signal |
| TWI583297B (en) * | 2014-12-11 | 2017-05-11 | Kuang Ying Computer Equipment Co Ltd | Isolate the signal to interfere with the circuit board structure |
| CN105070704A (en) * | 2015-08-17 | 2015-11-18 | 成都振芯科技股份有限公司 | Wiring structure capable of improving isolation between multichannel signals |
| CN105070704B (en) * | 2015-08-17 | 2017-07-28 | 成都振芯科技股份有限公司 | The wire structures of isolation between a kind of raising multi channel signals |
| CN106507581A (en) * | 2016-12-30 | 2017-03-15 | 深圳天珑无线科技有限公司 | Circuit board and its processing technique |
| CN106793467A (en) * | 2017-01-03 | 2017-05-31 | 奇酷互联网络科技（深圳）有限公司 | Realize method, single-point grounding PCB encapsulation and the printed circuit board (PCB) of single-point grounding design |
| CN106793467B (en) * | 2017-01-03 | 2019-10-25 | 奇酷互联网络科技（深圳）有限公司 | Realize method, single-point grounding PCB encapsulation and the printed circuit board of single-point grounding design |
| CN110519913A (en) * | 2019-09-23 | 2019-11-29 | 努比亚技术有限公司 | A kind of method, encapsulation and printed circuit board for realizing PCB single-point grounding design |
| CN113657070A (en) * | 2021-08-10 | 2021-11-16 | 苏州悦谱半导体有限公司 | CAM system-based automatic line and hole moving detection and optimization method |
| CN113657070B (en) * | 2021-08-10 | 2023-10-17 | 苏州悦谱半导体有限公司 | Automatic line and hole shifting detection and optimization method based on CAM system |
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| Publication number | Publication date |
|---|---|
| CN102892249B (en) | 2016-04-20 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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Granted publication date: 20160420 |
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