CN102892249B - Pcb board single-point grounding processing method - Google Patents
Pcb board single-point grounding processing method Download PDFInfo
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- CN102892249B CN102892249B CN201210309129.1A CN201210309129A CN102892249B CN 102892249 B CN102892249 B CN 102892249B CN 201210309129 A CN201210309129 A CN 201210309129A CN 102892249 B CN102892249 B CN 102892249B
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- via hole
- pcb board
- pcb
- component side
- point grounding
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Abstract
The invention provides a kind of pcb board single-point grounding processing method, in circuit design, comprise the following steps: provide a pcb board, this pcb board comprises at least one signals layer and a main ground plane layer; Design a PCB via hole encapsulation, described PCB via hole is encapsulated as a metallization via hole, and described metallization via hole runs through described signals layer and main ground plane layer; The ground level conducting of this metallization via hole and described main ground plane layer is set, and arrange on described signals layer isolation described metallization via hole forbid wiring region.The present invention is by forbidding that the signaling zone of metallization via hole and signals layer keeps apart by wiring region, and design efficiency is high; And the present invention realizes single-point grounding design by arranging a PCB via hole encapsulation, the encapsulation of this PCB via hole only need be called during single-point grounding, the increase via hole artificial without the need to layout engineer also isolates the signaling zone of this via hole and each signals layer, significantly reduces design risk, improves design efficiency.
Description
Technical field
The present invention relates to hardware electronic class, particularly relate to a kind of pcb board single-point grounding processing method.
Background technology
Along with the development of the frivolous miniaturization of electronic product, in electronic hardware circuitry design, numerical model analysis, low-and high-frequency Mixed Design are very general, usually need the ground of analog circuit, low-frequency channel to adopt single-point grounding process.Single-point grounding is received on main ground level by a certain for each for the ground wire of each circuit module leisure point.
At pcb board (PrintedCircuitBoard, printed circuit board (PCB)) when designing, for the single-point grounding circuit in hardware circuit design, layout (layout) engineer is needed to process especially, such as, if desired main ground plane layer (MainGroundPanel) is received in analog, ground neighbouring in analog on other wiring layer is needed to slice off, direct punching is to main ground plane layer, other zone network of single-point grounding circuit discord periphery is connected, and only the connectedness of reservation and main ground plane layer realizes single-point grounding process.
But, this mode processed artificially must bring the risk in design, layout engineer is when forgetting that increase is forbidden wiring region (RoutingKeepoutArea) or ignores single-point grounding demand, there will be in circuit design needs the circuit of single-point grounding not have single-point grounding, signal produces interference on earth-return, causes problems of Signal Integrity.
Therefore, a kind of new single-point grounding processing method solved the problem is badly in need of.
Summary of the invention
The object of this invention is to provide a kind of pcb board single-point grounding processing method, this pcb board single-point grounding processing method can reduce design risk, improves design efficiency.
For achieving the above object, the invention provides a kind of pcb board single-point grounding processing method, for the single-point grounding process in circuit design, comprise the following steps: provide a pcb board, described pcb board comprises at least one signals layer and a main ground plane layer; Design a PCB via hole encapsulation, described PCB via hole is encapsulated as a metallization via hole, and described metallization via hole runs through described signals layer and main ground plane layer; The ground level conducting of described metallization via hole and described main ground plane layer is set, and arrange on described signals layer isolation described metallization via hole forbid wiring region.
Compared with prior art, the present invention forbids wiring region by arranging on signals layer, and metallization via hole and signaling zone are kept apart rapidly, design efficiency is high; On the other hand, the present invention directly designs a PCB via hole encapsulation, single-point grounding design is realized by the encapsulation of this PCB via hole, the encapsulation of this PCB via hole only need be called when needing, the increase via hole artificial without the need to layout engineer also isolates the signaling zone of this via hole and each signals layer, significantly reduce design risk, improve design efficiency.
Preferably, described metallization via hole is buried via hole (BuriedVia), and described pcb board also comprises the upper component side and lower component side that are positioned at described pcb board upper and lower surface, and described upper component side and lower component side cover described metallization via hole.
Preferably, described metallization via hole is through hole (ThroughVia), described pcb board also comprises the upper component side and lower component side that are positioned at described pcb board upper and lower surface, described metallization via hole runs through described upper component side and lower component side, and described upper component side and lower component side are provided with the described metallization via hole of isolation forbid wiring region.
Preferably, described pcb board is N laminate, described N be more than or equal to 4 integer.Namely described pcb board can be 4 laminates, 6 laminates, 8 laminates etc.
Accompanying drawing explanation
Fig. 1 is the flow chart of pcb board single-point grounding processing method of the present invention.
Fig. 2 is the structure chart of the via hole of PCB described in first embodiment of the invention encapsulation.
Fig. 3 is the structure chart of the via hole of PCB described in second embodiment of the invention encapsulation.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized object and effect, accompanying drawing is coordinated to be explained in detail below in conjunction with execution mode.
With reference to figure 1, the invention provides a kind of pcb board single-point grounding processing method 100, for the single-point grounding process in circuit design, comprise the following steps: (11) provide a pcb board, described pcb board comprises at least one signals layer and a main ground plane layer; Design a PCB via hole encapsulation, described PCB via hole is encapsulated as a metallization via hole, and described metallization via hole runs through described signals layer and main ground plane layer; (12) the ground level conducting of this metallization via hole and described main ground plane layer is set, and arrange on described signals layer isolation described metallization via hole forbid wiring region.
With reference to figure 2, for the structure chart of the via hole of PCB described in first embodiment of the invention encapsulation, its pcb board 20 is eight laminates, comprise five signals layer S1, S2, S3, S4, S5, a main ground plane layer MG, a upper component side TS, a lower component side BS, described main ground plane layer MG is positioned at third layer, this PCB via hole encapsulation 200 comprises metallization via hole 21, described metallization via hole 21 is buried via hole (BuriedVia), this metallization via hole 21 runs through five signals layer S1, S2, S3, S4, S5, main ground plane layer MG, described upper component side TS and lower component side BS covers this metallization via hole 21, and ground level 22 conducting of this metallization via hole 21 and described main ground plane layer MG, described signals layer S1, S2, S3, S4, S5 is respectively arranged with and forbids that wiring region 23 is to isolate described metallization via hole 21 and described signals layer S1, S2, S3, S4, the signaling zone of S5.
Certainly, described pcb board 20 can also be other multi-layer sheet, and as 4 laminates, 6 laminates etc., main ground plane layer MG can be set to any one internal layer outside the upper component side TS and lower component side BS of removing in multi-layer sheet, is not limited to third layer.
With reference to figure 3, for the structure chart of the via hole of PCB described in second embodiment of the invention encapsulation, be different from the first embodiment: the metallization via hole 21 ' of this PCB via hole encapsulation 200 ' is through hole (ThroughVia), this metallization via hole 21 ' runs through signals layer S1, S2, S3, S4, S5, main ground plane layer MG, upper component side TS and lower component side BS, and ground level 22 conducting of this metallization via hole 21 ' and described main ground plane layer MG, described signals layer S1, S2, S3, S4, S5 is arranged respectively and forbids that wiring region 23 is to isolate described metallization via hole 21 ' and described signals layer S1, S2, S3, S4, the signaling zone of S5, described upper component side TS and lower component side BS is arranged respectively and forbids that wiring region 23 is to isolate described metallization via hole 21 ' and upper component side TS, lower component side BS.
To sum up, the present invention by forbid wiring region 23 rapidly by the via hole 21 of metallizing, 21 ' and removing ground level 22 outside other each layers keep apart, improve design efficiency; On the other hand, the present invention directly designs a PCB via hole encapsulation 200,200 ', single-point grounding design is realized by this PCB via hole encapsulation 200,200 ', this PCB via hole encapsulation 200,200 ' only need be called during use, the increase via hole artificial without the need to layout engineer also isolates signaling zone, the component side of this via hole and each signals layer, significantly reduce design risk, improve design efficiency.
Above disclosedly be only the preferred embodiments of the present invention, certainly can not limit the interest field of the present invention with this, therefore according to the equivalent variations that the present patent application the scope of the claims is done, still belong to the scope that the present invention is contained.
Claims (4)
1. a pcb board single-point grounding processing method, in circuit design, is characterized in that: comprise the following steps:
There is provided a pcb board, described pcb board comprises at least one signals layer and a main ground plane layer;
Design a PCB via hole encapsulation, the encapsulation of this PCB via hole comprises metallization via hole, described metallization via hole runs through described signals layer and main ground plane layer, and the ground level conducting of this metallization via hole and described main ground plane layer, described signals layer is provided with and forbids that wiring region is to isolate the signaling zone of described metallization via hole and described signals layer;
When needing to realize single-point grounding design, call the encapsulation of this PCB via hole.
2. pcb board single-point grounding processing method as claimed in claim 1, it is characterized in that: described metallization via hole is buried via hole, described pcb board also comprises the upper component side and lower component side that are positioned at described pcb board upper and lower surface, and described upper component side and lower component side cover described metallization via hole.
3. pcb board single-point grounding processing method as claimed in claim 1, it is characterized in that: described metallization via hole is through hole, described pcb board also comprises the upper component side and lower component side that are positioned at described pcb board upper and lower surface, described metallization via hole runs through described upper component side and lower component side, and described upper component side and lower component side are provided with the described metallization via hole of isolation forbid wiring region.
4. pcb board single-point grounding processing method as claimed in claim 1, is characterized in that: described pcb board is N laminate, described N be more than or equal to 4 integer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210309129.1A CN102892249B (en) | 2012-08-27 | 2012-08-27 | Pcb board single-point grounding processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210309129.1A CN102892249B (en) | 2012-08-27 | 2012-08-27 | Pcb board single-point grounding processing method |
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| Publication Number | Publication Date |
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| CN102892249A CN102892249A (en) | 2013-01-23 |
| CN102892249B true CN102892249B (en) | 2016-04-20 |
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| CN201210309129.1A Expired - Fee Related CN102892249B (en) | 2012-08-27 | 2012-08-27 | Pcb board single-point grounding processing method |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103716981B (en) * | 2013-12-30 | 2017-11-17 | 惠州Tcl家电集团有限公司 | The PCB and its wiring method of stable clock signal |
| TWI583297B (en) * | 2014-12-11 | 2017-05-11 | Kuang Ying Computer Equipment Co Ltd | Isolate the signal to interfere with the circuit board structure |
| CN105070704B (en) * | 2015-08-17 | 2017-07-28 | 成都振芯科技股份有限公司 | The wire structures of isolation between a kind of raising multi channel signals |
| CN106507581A (en) * | 2016-12-30 | 2017-03-15 | 深圳天珑无线科技有限公司 | Circuit board and its processing technique |
| CN106793467B (en) * | 2017-01-03 | 2019-10-25 | 奇酷互联网络科技（深圳）有限公司 | Realize method, single-point grounding PCB encapsulation and the printed circuit board of single-point grounding design |
| CN110519913A (en) * | 2019-09-23 | 2019-11-29 | 努比亚技术有限公司 | A kind of method, encapsulation and printed circuit board for realizing PCB single-point grounding design |
| CN113657070B (en) * | 2021-08-10 | 2023-10-17 | 苏州悦谱半导体有限公司 | Automatic line and hole shifting detection and optimization method based on CAM system |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202310268U (en) * | 2011-10-10 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Analog signal single point grounding structure for multi-layer printed circuit board (PCB) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6670559B2 (en) * | 2000-12-13 | 2003-12-30 | International Business Machines Corp. | Electromagnetic shield for printed circuit boards |
| US7705695B2 (en) * | 2004-07-23 | 2010-04-27 | Nec Corporation | Composite via structures and filters in multilayer printed circuit boards |
| WO2007046271A1 (en) * | 2005-10-18 | 2007-04-26 | Nec Corporation | Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor element |
| CN1980532A (en) * | 2005-11-30 | 2007-06-13 | 英业达股份有限公司 | Arc-shape winding system and method |
| CN101389183A (en) * | 2007-09-10 | 2009-03-18 | 英业达股份有限公司 | Through-hole region design system and method for differential signal line |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202310268U (en) * | 2011-10-10 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Analog signal single point grounding structure for multi-layer printed circuit board (PCB) |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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