CN102830591B - Photo-etching machine silicon wafer stage driving apparatus - Google Patents
Photo-etching machine silicon wafer stage driving apparatus Download PDFInfo
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- CN102830591B CN102830591B CN201110165086.XA CN201110165086A CN102830591B CN 102830591 B CN102830591 B CN 102830591B CN 201110165086 A CN201110165086 A CN 201110165086A CN 102830591 B CN102830591 B CN 102830591B
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Abstract
The invention discloses a photo-etching machine silicon wafer stage driving apparatus comprising an installation seat. A connection rack arranged between two ends of the installation seat. A driving unit is arranged on one end of the installation seat. A connection plate has one end connected to the driving unit and the other end extending towards the connection rack. A reed has one end arranged on the connection rack and the other end connected with a roller unit. A jacking plate is arranged between the two ends of the reed. The driving unit drives the connection plate to move towards the connection rack, such that the other end of the connection plate acts forces on the jacking plate. The driving apparatus is has the advantages of simple structure, small vertical size, and recoverable vertical position. With the driving apparatus, a silicon wafer stage can be rapidly, simply and flexibly moved.
Description
Technical field
The present invention relates to photoetching machine technique field, particularly relate to a kind of photo-etching machine silicon chip platform drive unit.
Background technology
Photoetching is one very important operation in semiconductor fabrication, and it is that the graphics chip on a series of masks is transferred to the technological process on silicon chip equivalent layer successively by exposure, is considered to the core procedure in large scale integrated circuit manufacture.This series of complex and photoetching process consuming time is mainly completed by corresponding litho machine.
Conventionally in litho machine, dispose silicon wafer stage, for carrying silicon chip, for it provides motion platform, to realize the large stroke exposure of X, Y motion.And litho machine (comprises integrated, the complete machine maintenance maintenance of litho machine machine system etc.) in actual use, need regularly silicon wafer stage is moved to beyond litho machine main body or recover its original position.And silicon wafer stage to external world the interference of power have strict demand, therefore need to increase balance mass, offset the reacting force of high-speed motion to silicon wafer stage framework, add silicon wafer stage support frame and be the parts such as cable of coordinating its normal work to design, sensor, pipeline, the weight of whole silicon wafer stage is larger.For this reason, need to configure corresponding mobile device for silicon wafer stage, to guarantee to facilitate movement and the location of silicon wafer stage.
Specifically please refer to application number and be 200910055189.3 Chinese patent application, it disclosed a kind of photo-etching machine silicon chip platform mobile device on Dec 23rd, 2009.As shown in Figure 1 to Figure 3, litho machine comprises support frame 12, object lens 13, main substrate 14, silicon wafer stage 15 and silicon wafer stage mobile device 16.This support frame 12 is fixed on ground 11, and object lens 13 and main substrate 14 are arranged on support frame 12, and silicon wafer stage 15 is arranged at the below of object lens 13, moves into or shift out support frame 12 under the carrying of silicon wafer stage mobile device 16.
Silicon wafer stage mobile device 16 comprises back up pad 160, air-cushion device 161, air bag 17 and drive unit 18.Wherein, drive unit 18 consists of driving arm 181, roller 182, gearing 183, drive motor 184 and sheet spring 185.Specifically, when needs shift out support frame 12 by silicon wafer stage 15, the slow gas in release air bag 17 (comprising first, second group air bag 171,172), and the switch of opening air-cushion device 161 makes its work, to form air cushion between air-cushion device 161 and ground 11.Along with the gas in air bag 17 reduces gradually, the height of silicon wafer stage 15 declines gradually, when the height of silicon wafer stage 15 drops to a certain degree, roller 182 on drive unit 18 contacts with ground 11, drive motor 184 drives roller 182 slowly to roll on ground 11 by gearing 183, and silicon wafer stage 15 is shifted out to support frame 12.Contrary, when needs are moved into support frame 12 when interior by silicon wafer stage 15, the switch of opening air-cushion device 161 makes its work, to form air cushion between this air-cushion device 16 and ground 11, the drive motor 184 of drive unit 18 drives roller reverse rotation by gearing 183, silicon wafer stage 15 is moved in support frame 12, then air bag is inflated, until silicon wafer stage 15 is elevated to desired height.
Visible, above mobile device has facilitated movement and the location of silicon wafer stage, yet, but there is following shortcoming:
First, roller 182 its vertical positions of drive unit 18 are nonadjustable, when drive unit 18 is not worked, the vertical position of its roller 182 cannot be regained, easily like this contact with ground 11, cause ground 11 vibrations directly to import silicon wafer stage 15 into, and affect its kinematic accuracy.
Secondly, the driving arm 181 of drive unit 18 adopts monolithic constructions, causes the especially installation difficulty comparatively of roller 182 of this drive unit 18.
In addition, have larger friction force between these drive unit 18 all parts, in use easily loss, causes shorten serviceable life.
, photo-etching machine silicon chip platform drive unit is redesigned, to realize the movement of silicon wafer stage, real is this area one important topic for this reason.
Summary of the invention
The object of the present invention is to provide a kind of photo-etching machine silicon chip platform drive unit, to solve existing drive unit in the nonrecoverable problem in off working state bottom roller vertical position.
For solving above technical matters, the invention provides a kind of photo-etching machine silicon chip platform drive unit, comprising: mount pad, is provided with link; Driver element, is arranged at one end of described mount pad; Web joint, one end is connected in described driver element, and the other end extends to described link; Reed, one end is connected on described link, the other end connects roller unit, is extended with top board in the middle of described reed, and described drive unit drives web joint is to the motion of link direction, the other end that makes this web joint by masterpiece for described top board.
Further, described reed is segmental structure, comprises connecting rod and at least two flexible hinges, and described flexible hinge is alternately connected with described connecting rod.
Further, described roller unit comprises: motor support base, connects the other end of described reed; Motor, is arranged at one end of described motor support base; Roller main shaft, is arranged on described motor support base, and one end is connected with described electric machine main shaft; Roller, through being arranged on described roller main shaft, and symmetrical with the described roller alignment of shafts.
Further, described roller main shaft is arranged on described motor support base by clutch shaft bearing support and the second bearing bridge, and is respectively arranged with clutch shaft bearing and the second bearing between described clutch shaft bearing support, the second bearing bridge and roller main shaft.
Further, described roller unit also comprises: shaft coupling, connects described roller main shaft and electric machine main shaft.
Further, the outer facade of described roller is the face of cylinder, and its face of cylinder material adopts large rubber or the polyurethane of friction factor.
Further, the other end of described web joint is cambered surface.
Further, described photo-etching machine silicon chip platform drive unit also comprises guiding device, and it comprises: guide rail, is arranged on described mount pad; Slide block, a side has the groove matching with described guide rail, and opposite side connects described web joint.
Further, photo-etching machine silicon chip platform drive unit also comprises: ball, is arranged between described guide rail and slide block.
Further, described groove is rectangular recess or dovetail groove.
Further, described driver element is cylinder.
Visible, above photo-etching machine silicon chip platform drive unit is in the roller unit that itself is provided with vertical position and can regulates, specifically utilize a drive unit drives web joint, and then masterpiece is used for to the top board on the fixing reed in one end, make the top board actuating spring other end produce vertical deviation, and then produce vertical deviation with the roller unit on the movable contact spring other end.Like this, when drive unit is worked, the roller unit of drive unit moves downward, and contacts with ground; When drive unit is not worked, drive unit drives web joint back moves, finally make web joint no longer include masterpiece for top board, thereby reed returns to virgin state, roller unit is no longer contacted with ground, so, the vertical position of just having regained roller unit, foundation vibration just can not directly import silicon wafer stage into, thereby guarantees to realize high-precision motion performance.
Accompanying drawing explanation
Fig. 1 to Fig. 3 is an existing photo-etching machine silicon chip platform mobile device schematic diagram;
The perspective view of the photo-etching machine silicon chip platform drive unit that Fig. 4 provides for one embodiment of the invention;
The vertical view of the photo-etching machine silicon chip platform drive unit that Fig. 5 provides for one embodiment of the invention;
The structural representation of the reed of the photo-etching machine silicon chip platform drive unit that Fig. 6 provides for a preferred embodiment of the present invention;
The structural representation of the roller unit of the photo-etching machine silicon chip platform drive unit that Fig. 7 provides for a preferred embodiment of the present invention;
The structural representation of the guiding device of the photo-etching machine silicon chip platform drive unit that Fig. 8 provides for a preferred embodiment of the present invention.
Embodiment
For above-mentioned feature and advantage of the present invention can be become apparent, exemplary embodiment cited below particularly, and coordinate accompanying drawing, be described in detail below.
Litho machine (comprises integrated, the complete machine maintenance maintenance of litho machine machine system etc.) in actual use, needs regularly silicon wafer stage is moved to beyond litho machine main body or recover its original position.And the weight of silicon wafer stage is larger, need a kind of drive unit to move it and become easier, and there is the nonrecoverable problem in roller vertical position in drive unit of the prior art, this is mainly because existing drive unit self pair roller there is no any adjustment, roller only has the effect that just can produce under external force vertical force, cause it under off working state, without under External Force Acting, it is the variation that cannot realize vertical position, unfavorable to practical application, for ground, not especially in very flat situation.For this reason, the present invention has redesigned drive unit, and it has the roller end being recoverable to, and before and after the roller work, vertical position that can self-regulation roller end, makes it be more suitable for practical application.Specifically please refer to Fig. 4 and Fig. 5, it is respectively perspective view and the vertical view of the photo-etching machine silicon chip platform drive unit that the present invention's one implementation column provides.
As shown in the figure, this photo-etching machine silicon chip platform drive unit comprises mount pad 41, driver element 42, web joint 43, reed 44 and roller unit 45.Wherein mount pad 41 is provided with link 46; Driver element 42 is arranged at one end of mount pad 41; One end of web joint 43 is connected in driver element 42, and the other end extends to link 46; One end of reed 44 is connected on link 43, and the other end connects roller unit 45, and is extended with top board 47 in the middle of reed 44.As can be seen from the figure, driver element 42 drives web joint 43 to link 46 direction motions, makes the other end (end face 431) of this web joint 43 that masterpiece is used for to top board 47.
The principle of work of above drive unit is described in detail in detail below:
As shown in the figure, above drive unit in use, is installed on mount pad 41 bottom of silicon wafer stage along its vertical direction (as shown by the arrows in Figure 5).When drive unit is worked, the air cushion (not shown) inflation of silicon wafer stage (not shown) bottom, produces silicon wafer stage and suspends.Then the driver element 42 that is positioned at the drive unit of silicon wafer stage bottom drives web joints 43 to travel forward (towards link 46 motions), make its end face 431 by masterpiece for top board 47; And top board 47 is fixed on reed 44, one end of reed 44 is fixed on again on link 46, therefore under the effect of end face 431, reed 44 will produce elastic deformation, its other end drives roller unit 45 to move downward, contact with ground, it has certain vertical pretightning force simultaneously, makes roller unit and ground produce the force of rolling friction (object is to overcome air supporting and other friction force) needing.
When drive unit is not worked, driver element 42 drives web joint 43 back to move, finally make the end face 431 of web joint 43 no longer include masterpiece for top board 47, thereby reed 44 returns to virgin state, roller unit 42 is no longer contacted with ground, foundation vibration just can not directly import silicon wafer stage into like this, thereby guarantees to realize high-precision motion performance.
It should be noted that, the present invention does not limit the material of reed 44, as long as it has good elastic performance, such as the material of reed 44, can adopt high strength steel (as spring steel etc.).In addition, the structure of reed 44 is also unrestricted, can be whole piece structure, can be also segmental structure.But preferably, easily adopt segmental structure, comprise connecting rod and at least two flexible hinges, and flexible hinge is alternately connected with connecting rod.Specifically please refer to Fig. 6, it is the structural representation of reed 44 in the better implementation column of the present invention one.
As shown in the figure, this reed 44 consists of 444,445 and three connecting rods 441,442 and 443 of two flexible hinges.Wherein flexible hinge 445 guarantees that connecting rod 443 can be out of shape by turnable elastic, and its effect is the out-of-flatness of auto-compensation ground, guarantees that roller unit 45 and ground contact all the time realization and drive.Flexible hinge 444 guarantees that connecting rod 442 can be out of shape by turnable elastic, and its effect is to realize the vertical withdrawal of roller unit 45.So, when out-of-flatness appears in ground, connecting rod 443 can guarantee that roller unit 45 contacts all the time with ground around flexible hinge 445 turnable elastic distortion, thereby realize, drives easily and fast silicon wafer stage to move in and out.Certainly, the present invention does not limit the quantity of flexible hinge at this, and they can be for more than 3 or 3, but considers from cost angle, and 2 flexible hinges are the implementations of the above function of simple realization the most.
In addition, in background technology, mention, the roller end of existing drive unit adopts monolithic construction, causes the especially installation difficulty comparatively of roller of this drive unit; And between drive unit all parts, there is larger friction force, in use easily loss, causes shorten serviceable life.For this reason, in the better implementation column of the present invention one, redesign roller unit, made it have good assembling convenience, and reduced the friction force between its each parts, extended its serviceable life.Specifically please refer to Fig. 4 and Fig. 7.
This roller unit 45 comprises motor support base 451, motor 452, roller main shaft 453 and roller 454, and wherein motor support base 451 is for connecting reed 44; Motor 452 is arranged at one end of motor support base 451; Roller main shaft 453 is arranged on motor support base 451, and one end is connected with electric machine main shaft 4521; Roller 454 passes and is arranged on roller main shaft 453, and with roller main shaft 453 Central Symmetries.Wherein motor 452 can adopt the synthetic of electric rotating machine or electric rotating machine and speed reduction unit, so that driving power to be provided.Like this, when drive unit is worked, first the roller 454 of roller unit 45 contacts with ground, reaches after requirement, and motor 452 driving rollss 454 rotate, thereby realize fast and easy, drive silicon wafer stage to move in and out.
Preferably, roller main shaft 453 is arranged on motor support base 451 by clutch shaft bearing support 455 and the second bearing bridge 456, and is respectively arranged with clutch shaft bearing 457 and the second bearing 458 between clutch shaft bearing support 455, the second bearing bridge 456 and roller main shaft 453.Specifically as shown in the figure, bearing 457 is located and is separately fixed on bearing bridge 455 and bearing bridge 456 by the face of cylinder with bearing 458, roller 454 is between two bearing bridge, and locate and be fastened on roller main shaft 453 by the face of cylinder, roller main shaft 453 two ends, are then arranged on bearing bridge 455 and bearing bridge 456 on the medial surface of motor support base 451 by face of cylinder positioning supports on two bearings 457,458.The assembling respectively of bearing bridge 455 and bearing bridge 456 has guaranteed the easy for installation of roller main shaft 453, makes this drive unit have good assembling convenience.
Wherein, preferably, the existence of bearing 457,458 has reduced the friction force that roller main shaft bears, and preferably, bearing 457,458 adopts the rolling friction elements such as needle roller, ball, further to reduce friction, has extended the serviceable life of drive unit.
In addition, preferably, roller unit 45 also comprises shaft coupling 459, in order to connect roller main shaft 453 and electric machine main shaft 4521.Specifically, as shown in the figure, shaft coupling 459 is located the main shaft of motor 452 4521 and roller main shaft 453 is fastenedly connected by the face of cylinder, issuable eccentric error problem while having solved 457,458 installation of two bearings.
Preferably, the outer facade of roller 454 is the face of cylinder, and its face of cylinder material adopts rubber that friction factor is large or polyurethane etc., and object is the vertical pretightning force needing while reducing to drive.
Please continue to refer to Fig. 5, in invention one better implementation column, the end face 431 of web joint 43 is cambered surface.Certainly, the present invention is not at this as limit, and its end face 431 can be also the end face of other any shapes.
In addition, it should be noted that, because one end of web joint 43 is connected with driver element 42, the other end may be subject to External Force Acting and be offset in motion process.Therefore in the better implementation column of the present invention one, set up guiding device 48 on mount pad 41, to guide the movement locus of web joint 43.Specifically, as shown in Fig. 5 and Fig. 8, wherein Fig. 8 is the schematic cross-section of A-A face in Fig. 5.This guiding device 48 comprises guide rail 81 and slide block 82, and its middle guide 81 is arranged on mount pad 41, and a side of slide block 82 has the groove 821 matching with guide rail 81, and opposite side connects web joint 43.So, slide block 82 is arranged on guide rail 81 by its groove 821, and while moving along guide rail 81 under the effect of web joint 43, can not depart from guide rail 81, thus the rectilinear motion of guiding web joint 43.Preferably, between guide rail 81 and slide block 82, ball 83 is set, the friction force of being brought to reduce motion.In addition, the present invention is in this shape of confinement groove 821 not, and it can be rectangular recess or dovetail groove etc.
In addition, in the better implementation column of the present invention one, driver element 42 is cylinder.Certainly, it can select the driving arrangements such as motor, but linear electric motors are relatively expensive, can bring Cost Problems; And electric rotating machine need to increase and transfer straight-line device by rotatablely moving to, this has brought much inconvenience to installation.Therefore from cost and angle easy for installation, the present invention preferably selects cylinder to realize driver element 42.
In sum, the drive unit tool that above implementation column provides has the following advantages:
(1) structure cylinder list, vertical size is little, and vertical position is recoverable;
(2) reed of multi-segment structure can be set, thereby the out-of-flatness of auto-compensation ground guarantees that roller and ground contact all the time realization and drive;
(3) whole drive unit is easy for installation, and friction force is little, can realize quick, easy mobile silicon wafer stage freely.
More than show and described ultimate principle of the present invention, principal character and advantage of the present invention.Those skilled in the art should understand; the present invention is not restricted to the described embodiments; what in above-described embodiment and instructions, describe is principle of the present invention; the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these changes and improvements all fall in claimed scope of the present invention.The protection domain that the present invention requires is defined by appending claims and equivalent thereof.
Claims (11)
1. a photo-etching machine silicon chip platform drive unit, comprises reed, and described reed one end is connected with roller unit, it is characterized in that, also comprises:
Mount pad, is provided with link, and described link is connected with the other end of described reed;
Driver element, is arranged at one end of described mount pad;
Web joint, one end is connected in described driver element, and the other end extends to described link;
In the middle of described reed, be extended with top board, and described drive unit drives web joint is to the motion of link direction, the other end that makes this web joint by masterpiece for described top board.
2. photo-etching machine silicon chip platform drive unit according to claim 1, is characterized in that, described reed is segmental structure, comprises connecting rod and at least two flexible hinges, and described flexible hinge is alternately connected with described connecting rod.
3. photo-etching machine silicon chip platform drive unit according to claim 1, is characterized in that, described roller unit comprises:
Motor support base, connects the other end of described reed;
Motor, is arranged at one end of described motor support base;
Roller main shaft, is arranged on described motor support base, and one end is connected with described electric machine main shaft;
Roller, through being arranged on described roller main shaft, and symmetrical with the described roller alignment of shafts.
4. photo-etching machine silicon chip platform drive unit according to claim 3, it is characterized in that, described roller main shaft is arranged on described motor support base by clutch shaft bearing support and the second bearing bridge, and is respectively arranged with clutch shaft bearing and the second bearing between described clutch shaft bearing support, the second bearing bridge and roller main shaft.
5. photo-etching machine silicon chip platform drive unit according to claim 3, is characterized in that, described roller unit also comprises:
Shaft coupling, connects described roller main shaft and electric machine main shaft.
6. photo-etching machine silicon chip platform drive unit according to claim 3, is characterized in that, the outer facade of described roller is the face of cylinder, and its face of cylinder material adopts large rubber or the polyurethane of friction factor.
7. photo-etching machine silicon chip platform drive unit according to claim 1, is characterized in that, the other end of described web joint is cambered surface.
8. photo-etching machine silicon chip platform drive unit according to claim 1, is characterized in that, also comprises guiding device, and it comprises:
Guide rail, is arranged on described mount pad;
Slide block, a side has the groove matching with described guide rail, and opposite side connects described web joint.
9. photo-etching machine silicon chip platform drive unit according to claim 8, is characterized in that, also comprises:
Ball, is arranged between described guide rail and slide block.
10. photo-etching machine silicon chip platform drive unit according to claim 8, is characterized in that, described groove is rectangular recess or dovetail groove.
11. photo-etching machine silicon chip platform drive units according to claim 1, is characterized in that, described driver element is cylinder.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110165086.XA CN102830591B (en) | 2011-06-17 | 2011-06-17 | Photo-etching machine silicon wafer stage driving apparatus |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110165086.XA CN102830591B (en) | 2011-06-17 | 2011-06-17 | Photo-etching machine silicon wafer stage driving apparatus |
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| CN102830591A CN102830591A (en) | 2012-12-19 |
| CN102830591B true CN102830591B (en) | 2014-08-20 |
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| CN201110165086.XA Active CN102830591B (en) | 2011-06-17 | 2011-06-17 | Photo-etching machine silicon wafer stage driving apparatus |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3521928A4 (en) * | 2016-09-30 | 2019-10-09 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Device for moving workpiece platform |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108983552B (en) * | 2017-05-31 | 2020-01-24 | 上海微电子装备（集团）股份有限公司 | Moving-in and moving-out mechanism and photoetching machine workpiece table moving-in and moving-out device |
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| EP1821000A2 (en) * | 2006-02-20 | 2007-08-22 | Isel Co., Ltd. | Friction drive unit |
| TWM333594U (en) * | 2007-11-22 | 2008-06-01 | C Sun Mfg Ltd | Platform of light exposure machine |
| CN101609263A (en) * | 2009-07-22 | 2009-12-23 | 上海微电子装备有限公司 | Photo-etching machine silicon chip platform mobile device and adopt the litho machine of this mobile device |
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| DE69817750T2 (en) * | 1997-07-22 | 2004-07-01 | Asml Netherlands B.V. | SUPPORT DEVICE WITH GAS BEARING |
| JP4298178B2 (en) * | 2001-02-08 | 2009-07-15 | 株式会社新川 | Work fixing device for bonding equipment |
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| EP1821000A2 (en) * | 2006-02-20 | 2007-08-22 | Isel Co., Ltd. | Friction drive unit |
| TWM333594U (en) * | 2007-11-22 | 2008-06-01 | C Sun Mfg Ltd | Platform of light exposure machine |
| CN101609263A (en) * | 2009-07-22 | 2009-12-23 | 上海微电子装备有限公司 | Photo-etching machine silicon chip platform mobile device and adopt the litho machine of this mobile device |
Non-Patent Citations (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP3521928A4 (en) * | 2016-09-30 | 2019-10-09 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Device for moving workpiece platform |
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