CN203275876U - Micromotion working platform of silicon wafer platform of a photoetching machine - Google Patents
Micromotion working platform of silicon wafer platform of a photoetching machine Download PDFInfo
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- CN203275876U CN203275876U CN 201320224100 CN201320224100U CN203275876U CN 203275876 U CN203275876 U CN 203275876U CN 201320224100 CN201320224100 CN 201320224100 CN 201320224100 U CN201320224100 U CN 201320224100U CN 203275876 U CN203275876 U CN 203275876U
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Abstract
The utility model discloses a micromotion working platform of a silicon wafer platform of a photoetching machine, which is mainly applied to semiconductor photoetching equipment. The micromotion working platform comprises a base, a micromotion working platform mover, a micromotion working platform stator, four first-type Lorentz motors and four second-type Lorentz motors, wherein the four first-type Lorentz motors are distributed at the four edges of the micromotion working platform, are symmetrical about an origin and drive the micromotion platform to move along an X direction, a Y direction and a direction rotating around a Z axis; and the four second-type Lorentz motors are respectively distributed on an X axis and a Y axis, are symmetrically distributed at the outer sides of the four groups of first-type Lorentz motors and drive the micromotion platform to move along a Z direction, a direction rotating around the X axis and a direction rotating around the Y axis. In addition, the micromotion working platform also comprises a gravity compensating structure of a closed magnetic circuit. Compared with the prior art, the micromotion working platform disclosed by the utility model has the characteristics of fewer motor types, simple assembly, compact structure, mass-center driving and low inertia of the micromotion working platform mover and the like.
Description
Technical field
The utility model relates to a kind of micro displacement workbench, relates in particular to a kind of photo-etching machine silicon chip platform micro displacement workbench, is mainly used in semiconductor lithography equipment, belongs to ultraprecise processing and checkout equipment technical field.
Background technology
Micro displacement workbench with high precision and response fast has extremely important status in Modern Manufacturing Technology, be regarded as the important symbol of a national hi-tech development level.In ultra-precision machine tool, ultra-precise micro displacement workbench is used for feed system is carried out error compensation, realizes ultraprecise processing; In large scale integrated circuit was made, ultra-precise micro displacement workbench was used for lithographic equipment and carries out microposition and little feeding; In scanning probe microscopy, ultra-precise micro displacement workbench is used for measuring sample surface morphology, carries out nanoprocessing; Aspect bioengineering, ultra-precise micro displacement workbench is used for completing the operation to cell, realizes biological operation through engineering approaches; Aspect medical science, ultra-precise micro displacement workbench is used for microsurgery, in order to alleviate doctor's burden, shortens operating time, improves success ratio.Ultra-precise micro displacement workbench also is widely used in fiber alignment, the processing of MEMS system, encapsulation and assembling, and in the galvanochemistry processing and other fields.
In semiconductor lithography equipment, photo-etching machine silicon chip platform and mask platform adopt thick smart rhythmo structure mostly, comprise a ultra-precise micro displacement workbench.This micropositioner is superimposed on the coarse motion platform, is used for the coarse motion platform is carried out accuracy compensation.The micro displacement workbench bearing accuracy has determined the exposure accuracy of litho machine, and movement velocity has determined the production efficiency of litho machine.Therefore, the developed countries such as the U.S., Japan, Europe all are considered as one of litho machine core technology to the ultra-precise micro displacement workbench technology, and China's Related product is carried out strict restriction of import.
Summarize at present domestic and international nanoscale micro displacement workbench present Research, ultra-precision stage has three classes usually, servomotor supports micro displacement workbench by ball-screw-transmission/line slideway, Piezoelectric Ceramic/flexible hinge support guide micro displacement workbench, and voice coil motor or variable reluctance motor driving/air supporting or magnetic over draft support micro displacement workbench.Front two kinds of micropositioners are due to the factors such as the frictional damping of support system is non-linear impact, can't satisfy all that lithographic equipment is high-speed, the requirement of heavy load, high dynamic perfromance.Adopt the micropositioner of voice coil motor can satisfy the requirement of lithographic equipment, but exist structural integrity poor, stage body is thicker, the high deficiency of barycenter, and its performance is subject to certain limitation.
The applicant has applied for a kind of 6DOF micro displacement workbench (application number: 200710118130.5) on June 29th, 2007, a kind of six-freedom micro displacement worktable that is applied in photo-etching machine silicon chip platform is provided, employing without the voice coil motor of frictional damping as drives structure, although greatly improved bearing accuracy, but this structural volume is large, structure is not compact, can not adapt to well the needs of double-platform switching system.
The utility model content
The utility model aims to provide a kind of six-freedom micro displacement worktable that can be applicable in photo-etching machine silicon chip platform, this micro displacement workbench is used for the positioning error of compensation photo-etching machine silicon chip platform and realizes the function of litho machine leveling and focusing, to realize the demand of wafer hi-Fix, also can be used in ultraprecise processing and detection to realize six-freedom motion, have simple in structure, compact, the characteristics such as barycenter drives, and micropositioner mover inertia is little.
The technical solution of the utility model is as follows:
A kind of photo-etching machine silicon chip platform micro displacement workbench contains pedestal, the micro displacement workbench mover, and the micro displacement workbench stator is characterized in that: this micro displacement workbench also comprises the first Lorentz motor and the second Lorentz motor; Described the first Lorentz motor is realized in surface level along directions X, Y-direction and is moved around the three degree of freedom that Z axis rotates; Described the second Lorentz motor is realized along the Z direction, is rotated and move around the three degree of freedom that Y-axis is rotated around X-axis; Described the first Lorentz motor adopts four, the layout that is square, and the coil of this kind motor is exerted oneself in surface level; Described the second Lorentz motor adopts four, and the second Lorentz motor correspondence respectively is arranged in outside each the first Lorentz motor, the layout that is square, and the coil of this kind motor is vertically exerted oneself;
The permanent magnet of the permanent magnet of four the first Lorentz motors, yoke and permanent magnet skeleton and four the second Lorentz motors, yoke and permanent magnet skeleton form the mover part of micro displacement workbench jointly; The coil of four the first Lorentz motors and four the second Lorentz motors and coil rack and micropositioner pedestal form the stationary part of micro displacement workbench jointly.
a kind of photo-etching machine silicon chip platform micro displacement workbench described in the utility model, be further characterized in that: described micro displacement workbench also comprises one group of gravity compensation structure, the gravity compensation structure is positioned at the micro displacement workbench centre, this group gravity compensation structure comprises at least three permanent magnet units and a gravity compensation dividing plate, each permanent magnet unit is comprised of permanent magnet and yoke, permanent magnet unit along annular be distributed on the vertical central axis of micropositioner around, the upper surface of permanent magnet unit and permanent magnet skeleton links together, the gravity compensation dividing plate is positioned at the bottom of permanent magnet unit, and link together with the micro displacement workbench coil rack, leave the gap between described permanent magnet unit and gravity compensation dividing plate.
A kind of photo-etching machine silicon chip platform micro displacement workbench described in the utility model, it is characterized in that: described micro displacement workbench also comprises three inside two-dimension displacement survey sensor assemblies that are positioned at micro displacement workbench, and each two-dimension displacement survey sensor assembly comprises two-dimension displacement survey sensor, laser head, sensor installation seat and laser head mount pad; Each two-dimension displacement survey sensor is arranged on sensor installation seat, and sensor installation seat is arranged on the bottom of micro displacement workbench coil rack; Laser head is arranged in the laser head mount pad, and the laser head mount pad is arranged on the bottom of permanent magnet skeleton, and makes laser head and the corresponding layout of two-dimension displacement survey sensor, and leaves the gap.
A kind of photo-etching machine silicon chip platform micro displacement workbench described in the utility model is characterized in that: described the first Lorentz motor and the second Lorentz motor are square Lorentz motor.
The utlity model has following advantage and beneficial effect: eight Lorentz motors of this micro displacement workbench are realized six-freedom motion, realize the design of overdriving that DOF (degree of freedom) redundance resolves, and with the Lorentz motor arrangement on the vibration nodal point of mover, the flexible mode of having avoided micropositioner is excited on the impact of stability of control system and control accuracy, the final purpose that realizes improving stability of control system and control accuracy; On the angle of assembling, have that motor type is few, assembling is simple, a compact conformation, the characteristics such as barycenter drives and micropositioner mover inertia is little.In addition, the gravity compensation structure has the effect every magnetic, makes micro displacement workbench of the present utility model can be applicable to can not be subject to the impact in the floating worktable of magnetic magnetic field on the floating worktable of magnetic.
Description of drawings
The tomograph with the micro displacement workbench of housing that Fig. 1 provides for the utility model.
The tomograph of the micro displacement workbench of the removal housing that Fig. 2 provides for the utility model.
Fig. 3 is the position of the first Lorentz motor of the present utility model and the second Lorentz motor.
Fig. 4 is two-dimension displacement survey sensor measuring system structural representation of the present utility model.
Fig. 5 is gravity compensation structural drawing of the present utility model.
Fig. 6 is the first electromagnetic force structure of driving unit schematic diagram (cut-open view).
Fig. 7 is the second electromagnetic force structure of driving unit schematic diagram (cut-open view).
Fig. 8 is the schematic diagram that micro displacement workbench is realized the directions X motion.
Fig. 9 is the schematic diagram that micro displacement workbench is realized the Y-direction motion.
Figure 10 is that micro displacement workbench is realized the schematic diagram around the Z rotation.
Figure 11 is the schematic diagram that micro displacement workbench is realized the motion of Z direction.
Figure 12 is that micro displacement workbench is realized the schematic diagram around the X rotation.
Figure 13 is that micro displacement workbench is realized the schematic diagram around the Y rotation.
In figure: 1-micropositioner pedestal; The 2-housing; The 3-sucker; 4-micro displacement workbench coil rack; First group of two-dimension displacement survey sensor module of 5a-; Second group of two-dimension displacement survey sensor module of 5b-; The 3rd group of two-dimension displacement survey sensor module of 5c-; 6-permanent magnet skeleton; First group of 7a-the first Lorentz motor; Second group of 7b-the first Lorentz motor; The 3rd group of 7c-the first Lorentz motor; The 4th group of 7d-the first Lorentz motor; First group of 8a-the second Lorentz motor; Second group of 8b-the second Lorentz motor; The 3rd group of 8c-the second Lorentz motor; The 4th group of 8d-the second Lorentz motor; 9-gravity compensation yoke; 10-gravity compensation permanent magnet; 11-gravity compensation dividing plate; 14-the first Lorentz motor coil assembly; The main permanent magnet of 16-first; The main permanent magnet of 17-second; The main permanent magnet of 18-the 3rd; The main permanent magnet of 19-the 4th; The attached permanent magnet of 20-first; The attached permanent magnet of 21-second; 22-the first iron yoke; 23-the second iron yoke; 29-the second Lorentz motor coil supporting seat; 30-the second Lorentz motor coil assembly; The main permanent magnet of 31-first; The main permanent magnet of 32-second, the main permanent magnet of 33-the 3rd; The main permanent magnet of 34-the 4th; The attached permanent magnet of 35-first; The attached permanent magnet of 36-second; 37-the first iron yoke; 38-the second iron yoke; 41-two-dimension displacement survey sensor; The 42-laser head; The 43-sensor installation seat; 44-laser head mount pad.
Embodiment
The tomograph of a kind of photo-etching machine silicon chip platform micro displacement workbench that Fig. 1, Fig. 2 and Fig. 3 provide for the utility model.A kind of photo-etching machine silicon chip platform micro displacement workbench contains pedestal 1, and micro displacement workbench mover, micro displacement workbench stator, this micro displacement workbench also comprise the first Lorentz motor and the second Lorentz motor; The first Lorentz motor realizes in surface level along directions X, Y-direction and moves around the three degree of freedom that Z axis rotate, and the realization of the second Lorentz motor is along the Z direction, rotate and move around the three degree of freedom that Y-axis is rotated around X-axis.
adopt four groups of the first Lorentz motors in the present embodiment, corresponding in twos, the layout that is square, and the coil of this kind motor is exerted oneself in surface level, first group of 7a of two groups of motor the first Lorentz motors arranging along X-direction and the 3rd group of 7c of the first Lorentz motor, first of the first Lorentz motor group of inclined to one side X-axis of 7a right side wherein, the 3rd group of 7c of the first Lorentz motor inclined to one side X-axis left side and two groups of motors are arranged about origin symmetry, in addition, second group of 7b of the first Lorentz motor and the 4th group of 7d of the first Lorentz motor arrange along Y direction, wherein second of the first Lorentz motor group of inclined to one side Y-axis of 7b is right, the 4th group of 7d of a first Lorentz motor inclined to one side Y-axis left side and two groups of motors are arranged about origin symmetry, these four groups of motors are simultaneously about origin symmetry, the 4th group of 7d of first group of 7a of the first Lorentz motor, the first Lorentz motor second group 7, the 3rd group of 7c of the first Lorentz motor and the first Lorentz motor realizes micro displacement workbench directions X, Y-direction and motion of rotating three degree of freedom around Z axis in surface level jointly.
in the present embodiment, the second Lorentz motor adopts four, the second Lorentz motor correspondence respectively is arranged in outside each the first Lorentz motor, layout is square, be respectively first group of 8a of the second Lorentz motor, second group of 8b of the second Lorentz motor, the 3rd group of 8c of the second Lorentz motor and the 4th group of 8d of the second Lorentz motor, and the coil of this kind motor is vertically exerted oneself, be arranged on four limits of micropositioner pedestal upper surface, realize that micro displacement workbench is in the Z direction, the motion of the three degree of freedom that rotates and rotate around Y-axis around X-axis.
The permanent magnet of the permanent magnet of four the first Lorentz motors, yoke and permanent magnet skeleton and four the second Lorentz motors,, yoke and permanent magnet skeleton form the mover part of micro displacement workbench jointly; The coil of four the first Lorentz motors and four the second Lorentz motors and coil rack and micropositioner pedestal form the stationary part of micro displacement workbench jointly.
In addition, as shown in Figure 1, the present embodiment micro displacement workbench also comprises a housing 2, and the mover of described micro displacement workbench part and stationary part are arranged in housing 2 inside, and the mover partial fixing of housing 2 and described micro displacement workbench together; 2 four sides of described housing are mirror surface and vertical with surface level, and adjacent two sides are orthogonal, and upper surface is provided with a circular groove, in sucker 3 is housed, as objective table, be fixed thereon the surface by loading.
The described micro displacement workbench of Fig. 4 also comprises three groups of two-dimension displacement survey sensor modules, i.e. first group of two-dimension displacement survey sensor module 5a, second group of two-dimension displacement survey sensor module 5b and the 3rd group of two-dimension displacement survey sensor module 5c; Every group of two-dimension displacement survey sensor measured the position of the displacement of two degree of freedom of micropositioner mover, and three groups of two-dimension displacement survey sensor modules are arranged in the micropositioner pedestal upper surface, arranges one group along X-axis, is arranged symmetrically with two groups along Y-axis.This two-dimension displacement survey sensor module comprises two-dimension displacement survey sensor 41, laser head 42, sensor installation seat 43 and laser head mount pad 44, each two-dimension displacement survey sensor 41 is arranged on sensor installation seat 43, and sensor installation seat 43 is arranged on the bottom of micro displacement workbench coil rack 4; Laser head 42 is arranged in laser head mount pad 44, and laser head mount pad 44 is arranged on the bottom of micro displacement workbench coil rack 4, and makes laser head 42 with two-dimension displacement survey sensor 41 positioned opposite and leave the gap; Each two-dimension displacement survey sensor module is measured the displacement of two degree of freedom of micropositioner mover.
Micro displacement workbench described in the utility model also comprises one group of gravity compensation structure, and the gravity compensation structure is positioned at the micro displacement workbench centre; Fig. 5 is gravity compensation structural drawing of the present utility model, this gravity compensation structure comprises fixed part and supporting part, fixed part is to comprise gravity compensation yoke 9 and gravity compensation permanent magnet 10, gravity compensation permanent magnet 10 is embedded in described yoke 9, gravity compensation permanent magnet 10 magnetizes vertically, bottom surface is the S utmost point, and upper bottom surface is the N utmost point; Supporting part is comprised of gravity compensation dividing plate 11.The gravity compensation yoke 9 of fixed part and gravity compensation permanent magnet 10 are positioned at the top of support section gravity compensation dividing plate.
Fig. 6 is the structure cut-open view of the first Lorentz motor.The first Lorentz motor comprises up and down two parts set of permanent magnets and coil block, and hot-wire coil and skeleton and leave the gap between two parts permanent magnet of up and down; Every part set of permanent magnets is comprised of main permanent magnet and attached permanent magnet, and embodiment comprises the first main permanent magnet 16, the second main permanent magnet 17, the 3rd main permanent magnet 18, the 4th main permanent magnet 19, the first attached permanent magnet 20 and the second attached permanent magnet 21.In upper part set of permanent magnets, be followed successively by the first main permanent magnet 16, the first attached permanent magnet 20 and the second main permanent magnet 17 along X-direction, each main permanent magnet and each attached permanent magnet are adhesively fixed on the surface of the first iron yoke 22; In lower part set of permanent magnets, be followed successively by the 3rd main permanent magnet 18, the second attached permanent magnet 21 and the 4th main permanent magnet 19 along X-direction, each main permanent magnet and each attached permanent magnet are adhesively fixed on the surface of the second iron yoke 23.The magnetizing direction of the first main permanent magnet 16 and the 3rd main permanent magnet 18 is the Z axis negative direction, the magnetizing direction of the second main permanent magnet 17 and the 4th main permanent magnet 19 is the Z axis positive dirction, and the magnetizing direction of the first attached permanent magnet 20 is that the magnetizing direction of X-axis negative direction, the second attached permanent magnet 21 is the X-axis positive dirction.Each attached permanent magnet is mutually vertical with the magnetic direction of each main permanent magnet, and each permanent magnet of top and the bottom has consisted of respectively the Halbach array format, and forms closed magnetic path.
Fig. 7 is the cut-open view of the second Lorentz motor.The second Lorentz motor comprises up and down two parts set of permanent magnets and coil block, and hot-wire coil and skeleton and leave the gap between two parts permanent magnet of up and down; Every part set of permanent magnets is comprised of main permanent magnet and attached permanent magnet, and embodiment comprises the first main permanent magnet 31, the second main permanent magnet 32, the 3rd main permanent magnet 33, the 4th main permanent magnet 34, the first attached permanent magnet 35 and the second attached permanent magnet 36.
In upper part set of permanent magnets, be followed successively by the first main permanent magnet 31, the first attached permanent magnet 35 and the second main permanent magnet 32 along X-direction, each main permanent magnet and each attached permanent magnet are adhesively fixed on the surface of the first iron yoke 37; In lower part set of permanent magnets, be followed successively by the 3rd main permanent magnet 33, the second attached permanent magnet 36 and the 4th main permanent magnet 34 along X-direction, each main permanent magnet and each attached permanent magnet are adhesively fixed on the surface of the second iron yoke 38.The magnetizing direction of the first main permanent magnet 31 and the 3rd main permanent magnet 33 is the Z axis negative direction, the magnetizing direction of the second main permanent magnet 32 and the 4th main permanent magnet 34 is the Z axis positive dirction, and the magnetizing direction of the first attached permanent magnet 35 is that the magnetizing direction of X-axis negative direction, the second attached permanent magnet 36 is the X-axis positive dirction.Each attached permanent magnet is mutually vertical with the magnetic direction of each main permanent magnet, and each permanent magnet of top and the bottom has consisted of respectively the Halbach array format,
To shown in Figure 10, micro displacement workbench is based on lorentz principle work as Fig. 8.The permanent magnet of driver element produces in surface level magnetic direction, micropositioner stator coil direction of current, and the Lorentz force direction that produces both are mutually vertical.When the logical equidirectional electric current of the 3rd group of 7c of the first group of 7a that only has the first Lorentz motor and the first Lorentz motor, driver element produces the directions X Lorentz force, thereby realizes that the micropositioner mover moves along directions X.When the logical equidirectional electric current of the 4th group of 7d of the second group of 7b that only has the first Lorentz motor and the first Lorentz motor, driver element produces the Y-direction Lorentz force, thereby realizes that the micropositioner mover moves along Y-direction.When the logical current in opposite of the 3rd group of 7c of first group of 7a of the first Lorentz motor and the first Lorentz motor, perhaps, when second group of 7b of the first Lorentz motor and the logical current in opposite of the 4th group of 7d of the first Lorentz motor, driver element produces two reverse direction Lorentz forces, thereby realizes that the micropositioner mover rotates around Z.
To shown in Figure 13, the Lorentz force that the second Lorentz motor produces is along Z-direction as Figure 11.As the 3rd group of 8c of second group of 8b of first group of 8a of the second Lorentz motor, the second Lorentz motor, the second Lorentz motor and the 4th group of 8d of the second Lorentz motor, during logical equidirectional electric current, driver element produces Z direction equidirectional thrust, thereby realizes that the micropositioner mover moves along the Z direction.When first group of 8a of the second Lorentz motor, the logical equidirectional electric current of second group of 8b of the second Lorentz motor, and during second group of 8b current in opposite of logical first group of 8a, the second Lorentz motor with the second Lorentz motor of the 4th group of 8d of second group of 8c of the second Lorentz motor and the second Lorentz motor, driver element produces around X-axis moment, thereby realizes that the micropositioner mover rotates around X.When the logical equidirectional electric current of the 4th group of 8d of first group of 8a of the second Lorentz motor and the second Lorentz motor, and during the logical first group of 8a current in opposite with the second Lorentz motor of second group of 8c of second group of 8b of the second Lorentz motor and the second Lorentz motor, driver element produces around Y-axis moment, thereby realizes that the micropositioner mover rotates around Y.
Claims (4)
1. a photo-etching machine silicon chip platform micro displacement workbench, contain pedestal (1), the micro displacement workbench mover, and the micro displacement workbench stator is characterized in that: this micro displacement workbench also comprises the first Lorentz motor and the second Lorentz motor; Described the first Lorentz motor is realized in surface level along directions X, Y-direction and is moved around the three degree of freedom that Z axis rotates; Described the second Lorentz motor is realized along the Z direction, is rotated and move around the three degree of freedom that Y-axis is rotated around X-axis; Described the first Lorentz motor adopts four, the layout that is square, and the coil of this kind motor is exerted oneself in surface level; Described the second Lorentz motor adopts four, and the second Lorentz motor correspondence respectively is arranged in outside each the first Lorentz motor, the layout that is square, and the coil of this kind motor is vertically exerted oneself;
The permanent magnet of the permanent magnet of four the first Lorentz motors, yoke and permanent magnet skeleton and four the second Lorentz motors, yoke and permanent magnet skeleton form the mover part of micro displacement workbench jointly; The coil of four the first Lorentz motors and four the second Lorentz motors and coil rack and micropositioner pedestal form the stationary part of micro displacement workbench jointly.
2. according to a kind of photo-etching machine silicon chip platform micro displacement workbench claimed in claim 1, it is characterized in that: described micro displacement workbench also comprises one group of gravity compensation structure, the gravity compensation structure is positioned at the micro displacement workbench centre, this group gravity compensation structure comprises at least three permanent magnet units and a gravity compensation dividing plate (11), each permanent magnet unit is comprised of permanent magnet and yoke, permanent magnet unit along annular be distributed on the vertical central axis of micropositioner around, the upper surface of permanent magnet unit and permanent magnet skeleton links together, gravity compensation dividing plate (11) is positioned at the bottom of permanent magnet unit, and link together with micro displacement workbench coil rack (4), leave the gap between described permanent magnet unit and gravity compensation dividing plate (11).
3. according to the described a kind of photo-etching machine silicon chip platform micro displacement workbench of claim 1 or 2, it is characterized in that: described micro displacement workbench also comprises three two-dimension displacement survey sensor assemblies that are positioned at micro displacement workbench inside, and each two-dimension displacement survey sensor assembly comprises two-dimension displacement survey sensor (41), laser head (42), sensor installation seat (43) and laser head mount pad (44); Each two-dimension displacement survey sensor (41) is arranged on sensor installation seat (43), and sensor installation seat (43) is arranged on the bottom of micro displacement workbench coil rack (4); Laser head (42) is arranged in laser head mount pad (44), and laser head mount pad (44) is arranged on the bottom of permanent magnet skeleton, and makes laser head (42) and the corresponding layout of two-dimension displacement survey sensor (41), and leaves the gap.
4. according to a kind of photo-etching machine silicon chip platform micro displacement workbench claimed in claim 1, it is characterized in that: the profile of described the first Lorentz motor and the second Lorentz motor structure that is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 201320224100 CN203275876U (en) | 2013-04-27 | 2013-04-27 | Micromotion working platform of silicon wafer platform of a photoetching machine |
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| CN 201320224100 CN203275876U (en) | 2013-04-27 | 2013-04-27 | Micromotion working platform of silicon wafer platform of a photoetching machine |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103226295A (en) * | 2013-04-27 | 2013-07-31 | 清华大学 | Lithography machine silicon wafer bench micro-motion workbench |
| CN105414772A (en) * | 2015-12-21 | 2016-03-23 | 深圳市木森科技有限公司 | Lifting platform |
| CN106881598A (en) * | 2017-03-03 | 2017-06-23 | 广东工业大学 | A kind of micro displacement workbench |
| CN107437878A (en) * | 2017-07-31 | 2017-12-05 | 华中科技大学 | A kind of Three Degree Of Freedom linear electromagnetic actuator |
-
2013
- 2013-04-27 CN CN 201320224100 patent/CN203275876U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103226295A (en) * | 2013-04-27 | 2013-07-31 | 清华大学 | Lithography machine silicon wafer bench micro-motion workbench |
| CN105414772A (en) * | 2015-12-21 | 2016-03-23 | 深圳市木森科技有限公司 | Lifting platform |
| CN106881598A (en) * | 2017-03-03 | 2017-06-23 | 广东工业大学 | A kind of micro displacement workbench |
| CN107437878A (en) * | 2017-07-31 | 2017-12-05 | 华中科技大学 | A kind of Three Degree Of Freedom linear electromagnetic actuator |
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Address after: 100084 Beijing Haidian District Beijing 100084 box 82 box, Tsinghua University Patent Office Co-patentee after: BEIJING U-PRECISION TECH Co.,Ltd. Patentee after: TSINGHUA University Address before: 100084 Beijing Haidian District Beijing 100084 box 82 box, Tsinghua University Patent Office Co-patentee before: U-PRECISION TECH Co.,Ltd. Patentee before: Tsinghua University |
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Granted publication date: 20131106 |