CN102823003B - 用于光电装置的互连件 - Google Patents

用于光电装置的互连件 Download PDF

Info

Publication number
CN102823003B
CN102823003B CN201180016615.8A CN201180016615A CN102823003B CN 102823003 B CN102823003 B CN 102823003B CN 201180016615 A CN201180016615 A CN 201180016615A CN 102823003 B CN102823003 B CN 102823003B
Authority
CN
China
Prior art keywords
interconnect body
narrow groove
cross tie
interconnect
slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180016615.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN102823003A (zh
Inventor
瑞恩·林德曼
凯丝·约翰斯顿
符勝
马修·道森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maikesheng Solar Energy Co ltd
Original Assignee
SunPower Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SunPower Corp filed Critical SunPower Corp
Priority to CN201610076785.XA priority Critical patent/CN105679855B/zh
Publication of CN102823003A publication Critical patent/CN102823003A/zh
Application granted granted Critical
Publication of CN102823003B publication Critical patent/CN102823003B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/70—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising bypass diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/70—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising bypass diodes
    • H10F19/75—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising bypass diodes the bypass diodes being integrated or directly associated with the photovoltaic cells, e.g. formed in or on the same substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/904—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the shapes of the structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/908—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells for back-contact photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • H10F77/63—Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Led Device Packages (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
CN201180016615.8A 2010-09-29 2011-07-20 用于光电装置的互连件 Active CN102823003B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610076785.XA CN105679855B (zh) 2010-09-29 2011-07-20 用于光电装置的互连件

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/893,765 2010-09-29
US12/893,765 US8426974B2 (en) 2010-09-29 2010-09-29 Interconnect for an optoelectronic device
PCT/US2011/044743 WO2012050652A1 (en) 2010-09-29 2011-07-20 Interconnect for an optoelectronic device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201610076785.XA Division CN105679855B (zh) 2010-09-29 2011-07-20 用于光电装置的互连件

Publications (2)

Publication Number Publication Date
CN102823003A CN102823003A (zh) 2012-12-12
CN102823003B true CN102823003B (zh) 2016-03-09

Family

ID=45869828

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201180016615.8A Active CN102823003B (zh) 2010-09-29 2011-07-20 用于光电装置的互连件
CN201610076785.XA Active CN105679855B (zh) 2010-09-29 2011-07-20 用于光电装置的互连件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201610076785.XA Active CN105679855B (zh) 2010-09-29 2011-07-20 用于光电装置的互连件

Country Status (7)

Country Link
US (3) US8426974B2 (enExample)
EP (1) EP2622653B1 (enExample)
JP (2) JP5846529B2 (enExample)
KR (1) KR101779241B1 (enExample)
CN (2) CN102823003B (enExample)
AU (1) AU2011314342B2 (enExample)
WO (1) WO2012050652A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066752B2 (ja) 1985-07-29 1994-01-26 大同特殊鋼株式会社 フロ−テイング炉における循環ガス供給装置
US8530990B2 (en) * 2009-07-20 2013-09-10 Sunpower Corporation Optoelectronic device with heat spreader unit
US8636198B1 (en) * 2012-09-28 2014-01-28 Sunpower Corporation Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells
JP6352894B2 (ja) * 2015-12-24 2018-07-04 トヨタ自動車株式会社 太陽電池モジュール
USD822890S1 (en) 2016-09-07 2018-07-10 Felxtronics Ap, Llc Lighting apparatus
US10775030B2 (en) 2017-05-05 2020-09-15 Flex Ltd. Light fixture device including rotatable light modules
USD833061S1 (en) 2017-08-09 2018-11-06 Flex Ltd. Lighting module locking endcap
USD862777S1 (en) 2017-08-09 2019-10-08 Flex Ltd. Lighting module wide distribution lens
USD877964S1 (en) 2017-08-09 2020-03-10 Flex Ltd. Lighting module
USD832494S1 (en) 2017-08-09 2018-10-30 Flex Ltd. Lighting module heatsink
USD846793S1 (en) 2017-08-09 2019-04-23 Flex Ltd. Lighting module locking mechanism
USD872319S1 (en) 2017-08-09 2020-01-07 Flex Ltd. Lighting module LED light board
USD832495S1 (en) 2017-08-18 2018-10-30 Flex Ltd. Lighting module locking mechanism
USD862778S1 (en) 2017-08-22 2019-10-08 Flex Ltd Lighting module lens
USD888323S1 (en) 2017-09-07 2020-06-23 Flex Ltd Lighting module wire guard
CN115966622A (zh) * 2021-09-28 2023-04-14 黄耀纶 光伏电池组件及其制造方法
CN114203847B (zh) 2022-02-18 2022-07-15 浙江爱旭太阳能科技有限公司 一种背接触电池连接用异形焊带
CN118299447A (zh) * 2023-03-02 2024-07-05 武汉美格科技股份有限公司 一种自供电led显示的光伏组件及封装方法
US12283640B2 (en) * 2023-04-07 2025-04-22 The Boeing Company Bypass diode assemblies for a solar cell array
GB2635583A (en) * 2024-04-08 2025-05-21 Danecca Group Ltd A busbar and battery module comprising the same
KR102777875B1 (ko) * 2024-10-22 2025-03-13 대한민국 신규 페디오코커스 속 균주 및 그의 용도

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050093128A1 (en) * 2003-09-05 2005-05-05 Canon Kabushiki Kaisha Semiconductor device, process of producing semiconductor device, and ink jet recording head
US20050268959A1 (en) * 2004-06-04 2005-12-08 Sunpower Corporation Interconnection of solar cells in a solar cell module
US20080216887A1 (en) * 2006-12-22 2008-09-11 Advent Solar, Inc. Interconnect Technologies for Back Contact Solar Cells and Modules

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340096A (en) * 1962-02-26 1967-09-05 Spectrolab A Division Of Textr Solar cell array
US3454774A (en) * 1965-09-10 1969-07-08 Globe Union Inc Electrical connector for semiconductor devices
CA1159132A (fr) 1979-05-08 1983-12-20 Maurice Dran Procede de fabrication de panneaux de photopiles solaires et panneaux obtenus par ce procede
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US4927770A (en) 1988-11-14 1990-05-22 Electric Power Research Inst. Corp. Of District Of Columbia Method of fabricating back surface point contact solar cells
US5053083A (en) 1989-05-08 1991-10-01 The Board Of Trustees Of The Leland Stanford Junior University Bilevel contact solar cells
US5011544A (en) 1989-09-08 1991-04-30 Solarex Corporation Solar panel with interconnects and masking structure, and method
US5184019A (en) 1990-03-16 1993-02-02 The United States Of America As Represented By The United States Department Of Energy Long range alpha particle detector
US5100808A (en) 1990-08-15 1992-03-31 Spectrolab, Inc. Method of fabricating solar cell with integrated interconnect
US5185042A (en) 1991-08-01 1993-02-09 Trw Inc. Generic solar cell array using a printed circuit substrate
US5139427A (en) * 1991-09-23 1992-08-18 Amp Incorporated Planar array connector and flexible contact therefor
US5391235A (en) * 1992-03-31 1995-02-21 Canon Kabushiki Kaisha Solar cell module and method of manufacturing the same
US5360990A (en) 1993-03-29 1994-11-01 Sunpower Corporation P/N junction device having porous emitter
US5369291A (en) 1993-03-29 1994-11-29 Sunpower Corporation Voltage controlled thyristor
US5468652A (en) 1993-07-14 1995-11-21 Sandia Corporation Method of making a back contacted solar cell
JP3618802B2 (ja) 1994-11-04 2005-02-09 キヤノン株式会社 太陽電池モジュール
JP3488570B2 (ja) * 1996-03-29 2004-01-19 ローム株式会社 Ｌｅｄ発光装置およびこれを用いた面発光照明装置
JP3680490B2 (ja) * 1997-05-29 2005-08-10 富士電機アドバンストテクノロジー株式会社 可撓性太陽電池モジュール
US5972732A (en) 1997-12-19 1999-10-26 Sandia Corporation Method of monolithic module assembly
US6278054B1 (en) 1998-05-28 2001-08-21 Tecstar Power Systems, Inc. Solar cell having an integral monolithically grown bypass diode
JP2000323208A (ja) 1999-03-10 2000-11-24 Sharp Corp インターコネクタ、その形成方法およびその接合装置
US6387726B1 (en) 1999-12-30 2002-05-14 Sunpower Corporation Method of fabricating a silicon solar cell
US6423568B1 (en) 1999-12-30 2002-07-23 Sunpower Corporation Method of fabricating a silicon solar cell
US6337283B1 (en) 1999-12-30 2002-01-08 Sunpower Corporation Method of fabricating a silicon solar cell
US6274402B1 (en) 1999-12-30 2001-08-14 Sunpower Corporation Method of fabricating a silicon solar cell
US6313395B1 (en) 2000-04-24 2001-11-06 Sunpower Corporation Interconnect structure for solar cells and method of making same
JP2001339091A (ja) 2000-05-29 2001-12-07 Fuji Electric Co Ltd 薄膜太陽電池モジュールとその応力監視方法
US6333457B1 (en) 2000-08-29 2001-12-25 Sunpower Corporation Edge passivated silicon solar/photo cell and method of manufacture
JP4137415B2 (ja) 2000-11-21 2008-08-20 シャープ株式会社 太陽電池セルの交換方法
DE10139441C1 (de) 2001-08-10 2002-10-10 Astrium Gmbh Verfahren zur Reparatur eines Solar-Panels
US6713670B2 (en) 2001-08-17 2004-03-30 Composite Optics, Incorporated Electrostatically clean solar array
JP2006522492A (ja) 2003-04-04 2006-09-28 ビーピー・コーポレーション・ノース・アメリカ・インコーポレーテッド 光電池電源のための性能監視装置
US7378742B2 (en) * 2004-10-27 2008-05-27 Intel Corporation Compliant interconnects for semiconductors and micromachines
DE102004038112B4 (de) 2004-08-05 2006-11-16 Siemens Ag Elektrisches Schaltgerät
DE102004050269A1 (de) 2004-10-14 2006-04-20 Institut Für Solarenergieforschung Gmbh Verfahren zur Kontakttrennung elektrisch leitfähiger Schichten auf rückkontaktierten Solarzellen und Solarzelle
JP4182063B2 (ja) * 2005-01-24 2008-11-19 トヤマキカイ株式会社 リード構造
US7154361B2 (en) 2005-05-04 2006-12-26 General Electric Company Accessories for a rotatable latching shaft of a circuit breaker
US7148774B1 (en) 2005-07-11 2006-12-12 Eaton Corporation Contact assembly
US7732705B2 (en) * 2005-10-11 2010-06-08 Emcore Solar Power, Inc. Reliable interconnection of solar cells including integral bypass diode
JP4986462B2 (ja) * 2006-01-27 2012-07-25 シャープ株式会社 太陽電池ストリングおよびその製造方法、ならびに、その太陽電池ストリングを用いる太陽電池モジュール
US8148627B2 (en) * 2006-08-25 2012-04-03 Sunpower Corporation Solar cell interconnect with multiple current paths
US20090139557A1 (en) * 2007-11-30 2009-06-04 Douglas Rose Busbar connection configuration to accommodate for cell misalignment
US8636198B1 (en) * 2012-09-28 2014-01-28 Sunpower Corporation Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050093128A1 (en) * 2003-09-05 2005-05-05 Canon Kabushiki Kaisha Semiconductor device, process of producing semiconductor device, and ink jet recording head
US20050268959A1 (en) * 2004-06-04 2005-12-08 Sunpower Corporation Interconnection of solar cells in a solar cell module
US20080216887A1 (en) * 2006-12-22 2008-09-11 Advent Solar, Inc. Interconnect Technologies for Back Contact Solar Cells and Modules

Also Published As

Publication number Publication date
EP2622653A1 (en) 2013-08-07
US8426974B2 (en) 2013-04-23
JP5846529B2 (ja) 2016-01-20
AU2011314342A1 (en) 2013-05-02
KR101779241B1 (ko) 2017-09-18
CN102823003A (zh) 2012-12-12
AU2011314342B2 (en) 2014-07-10
WO2012050652A1 (en) 2012-04-19
JP6159978B2 (ja) 2017-07-12
KR20140009976A (ko) 2014-01-23
US20120074576A1 (en) 2012-03-29
JP2016054307A (ja) 2016-04-14
EP2622653A4 (en) 2016-04-13
EP2622653B1 (en) 2018-12-05
JP2013539232A (ja) 2013-10-17
US8786095B2 (en) 2014-07-22
CN105679855B (zh) 2017-07-28
US20130228906A1 (en) 2013-09-05
US20140291852A1 (en) 2014-10-02
US9537036B2 (en) 2017-01-03
CN105679855A (zh) 2016-06-15

Similar Documents

Publication Publication Date Title
CN102823003B (zh) 用于光电装置的互连件
CN103098228B (zh) 用于太阳能电池组件的二极管和散热器
US10483421B2 (en) Solar cell module
CN202948942U (zh) 太阳能电池及太阳能系统
US9735300B2 (en) Thermal management
JP2001168368A (ja) 端子ボックス
US8362829B2 (en) Semiconductor device
JP2014534798A (ja) ダイオードセルモジュール
JP2006066813A (ja) 半導体装置
US8921989B2 (en) Power electronics modules with solder layers having reduced thermal stress
US10373919B2 (en) Semiconductor device and method of manufacturing semiconductor device
US20080042302A1 (en) Plastic overmolded packages with molded lid attachments
KR20120087094A (ko) 전력반도체 요소 및 적어도 하나의 태양전지에 대한 전력반도체 요소의 배열
KR101186744B1 (ko) 기판 및 이를 갖는 파워 모듈
CN118486665A (zh) 一种芯片连接件及功率模块
US8841547B1 (en) Concentrated photovoltaic receiver package with built-in connector
TW202520469A (zh) 具有方向鎖定結構的半導體封裝
GB2429334A (en) Thermo-electric cooler

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220829

Address after: Singapore, Singapore City

Patentee after: Maikesheng solar energy Co.,Ltd.

Address before: California, USA

Patentee before: SUNPOWER Corp.

PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Interconnection components for optoelectronic devices

Granted publication date: 20160309

Pledgee: Deutsche Trust (Hong Kong) Ltd.

Pledgor: Maikesheng solar energy Co.,Ltd.

Registration number: Y2024990000329