CN102820308A - Dual-waveband linear infrared focal plane detector integrated structure - Google Patents
Dual-waveband linear infrared focal plane detector integrated structure Download PDFInfo
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- CN102820308A CN102820308A CN2012102739911A CN201210273991A CN102820308A CN 102820308 A CN102820308 A CN 102820308A CN 2012102739911 A CN2012102739911 A CN 2012102739911A CN 201210273991 A CN201210273991 A CN 201210273991A CN 102820308 A CN102820308 A CN 102820308A
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Abstract
The invention discloses a dual-waveband linear infrared focal plane detector integrated structure. The integrated structure comprises a spliced substrate, first waveband sub-modules, second waveband sub-modules, an integrated thin film lead, and so on, wherein the lead wires of even-numbered sub-modules are led out by making the connection ends of the even-numbered sub-modules of an integrated lead to pass through a lead through-groove on the back side of the substrate and then pass through a through-slot on the substrate. The dual-waveband linear infrared focal plane detector integrated structure provided by the invention is modularized and assembled in design, and has manufacturability.
Description
Technical field
The present invention relates to the infrared focal plane detector manufacturing technology, particularly a kind of two waveband alignment infrared focal plane detector structure, integrated outer lead and outbound course of multimode splicing.
Background technology
Infrared detection technique has extremely widely at military project civil areas such as earth observation, Aero-Space early warning, meteorology, geomorphology, environmental monitoring, resource investigations to be used, to strengthening national defence and promoting that socio-economic development has great importance.For any one infrared acquisition application system, infrared focal plane detector is the core component of whole detection system.In Aeronautics and Astronautics infrared remote sensing technology field, along with the further raising of application demand, the main developing direction of systems technology, the one, raising system detectivity is to obtain meticulousr target information; The 2nd, develop to the multispectral sensing direction, to obtain abundanter target information, expanding application scope; The 3rd, improve space exploration resolution, to improve space exploration precision to the detection of a target.For the infrared remote sensing instrument that is operated in sustained height and identical swath, the responsive first quantity of detector is many more, and then spatial resolution is high more; For the dual-band infrared remote sensing instrument, then need have the Infrared Detectors of two waveband detectivity.Therefore, the manufacturing technology of the infrared focal plane detector of extensive, two waveband is to satisfy the core technology that high spatial resolution, two waveband are surveyed the infrared remote sensing instrument.
The Aeronautics and Astronautics infrared remote sensing; Because aerospace vehicle self has one dimension and moves over the ground; So adopt the mode of operation of a kind of " push away and sweep ", promptly alignment is surveyed responsive unit along the arrangement of one dimension direction, and orientation is vertical with the spacecraft direction of motion; The one dimension relative motion that utilizes aircraft or satellite to orbit the earth in the high-altitude realizes the one-dimensional scanning (mechanical scanning) along the heading earth observation; And, form two-dimentional remote sensing images thus perpendicular to the responsive unit that heading is arranged combines to realize another dimension with reading circuit scanning (electronic scanning).For realizing the two waveband remote sensing, exactly in the arrangement that is arranged with the detector of two wave bands perpendicular to heading.Therefore, the purpose for realizing that high spatial resolution, two waveband are surveyed adopts the two waveband detector array, realizes with " push away and sweep " mode of operation.
(Infrared Detectors is worked at low temperatures because the infrared ray row detector receives factors such as material preparation, device technology technology and physical characteristic restriction; Because the existence of thermal stress; The full-size of detector physically is restricted), generally adopt the manufacturing of the long detector array of method realization of a plurality of submodules " seamless " splicing.(referring to Chinese patent: 200610027004.4).
Summary of the invention
The present invention provides a kind of splicing construction, integrated outer lead and outbound course of double wave segment length alignment focal plane of art recognized.
Technical solution of the present invention is following:
Shown in accompanying drawing, splicing construction of the present invention comprises substrate, wave band one submodule, wave band two submodules and integrated thin-film lead-in wire.
Described submodule is the alignment infrared focal plane detector separate on a kind of, electricity specially designed for " splicing ", that scale is less (for example, 512 * 1 focus planardetectors).Be designed with alignment mark on each module, there are definite corresponding relation in alignment mark and photosensitive unit.During splicing, as measurement point, make the splicing of the photosensitive unit of submodule on the position of design, guarantee the fine registration of each intermodule with mark.By wave band submodule is called wave band one submodule, wave band two submodules; Parity by the ordering numbering is called odd number submodule, even number submodule with submodule.
Described substrate is the hardware that the depth of parallelism, evenness are had high requirements, and it is made by the metal material of low thermal coefficient of expansion, but for example valve covar or invar invar.
Described integrated thin-film lead-in wire is used for the input of each module working pulse, power supply and the output of each submodule detectable signal; It adopts the polyimides base film lead-in wire that is suitable for cryogenic applications; A wave band is drawn with one group of integrated-lead, and whole two waveband detector array has two groups of integrated-leads.Integrated-lead merges line part 6-3, integrated-lead total exit part 6-4 and integrated-lead by odd even submodule link 6-1 and 6-2, submodule common lead and draws link 6-5 outward and form.Integrated-lead is installed on the splicing substrate, and each submodule is connected through key pressure mode with the link 6-1 or the 6-2 of integrated-lead.Wherein, integrated-lead even number submodule link is the groove 2-1 that passes through on the substrate, passes through groove 3-2 through the substrate back lead-in wire again and draws.
Be that the boundary divides substrate equally with the center of substrate be left and right sides two halves; Wave band one submodule, wave band two submodules symmetry respectively are installed on the basic left and right sides; Be spliced to form a long detector array to intersect, to rotate symmetric form separately between the submodule of a plurality of same wave bands; Wherein the even number submodule is positioned at the inboard (near substrate center's line) of substrate, and the odd number submodule is positioned at the outside of substrate, and the submodule splicing is aimed at the back that finishes and is fixed on the splicing substrate with low temperature glue.
The outbound course of integrated outer lead is following: the even number submodule link 6-2 of integrated-lead passes through groove from the lead-in wire that splices the substrate 1-1 back side and passes; Penetrate from passing through groove 3-1 again; Pass from passing through groove 2-1; After integrated-lead even number submodule link 6-2 passes, corresponding one by one with the even number submodule, like 2-2,2-4 state.Then, even number submodule link is fixed with integrated-lead fixation clip 1-6, has accomplished the installation of even number submodule link.And then carry out the installation of odd number submodule link; At first; It is corresponding one by one to equal each odd number submodule to integrated-lead odd number submodule link 6-1; Form 2-3,2-5 state; Fixing with the integrated-lead fixation clip equally then integrated-lead odd number submodule link 2-3,2-5 etc., so just accomplished the installation of integrated-lead odd even link.After the integrated-lead installation, realize being connected of submodule key pressure point and each submodule link of integrated-lead with key pressure method.
The present invention has following advantage:
1) two waveband can be confirmed long alignment specification as required on vertical scanning direction, has flexibility.
2) modularization, fabricated construction design can screen respectively, test and test parts, help commercialization production.
3) submodule of two wave bands can be the submodule of different size, has flexibility.On two each submodule electricity of wave band is independently, can adjust the working point of submodule respectively, the convenient application.
4) integrated form film outer lead structure has improved the reliability that goes between greatly.
5) input of the electrical parameter of two wave bands and signal output are respectively independently, make things convenient for parameter control and follow-up to handle.
Description of drawings
Fig. 1 is a double wave segment length alignment infrared focal plane device structure three-dimensional axonometric drawing;
Among the figure:
1-1 detector splicing substrate; 1-2 wave band one odd number submodule;
1-3 wave band one even number submodule; 1-4 wave band two even number submodules;
1-5 wave band two odd number submodules; 1-6 integrated-lead fixation clip;
1-7 integrated-lead and each submodule link;
1-8 integrated-lead even number submodule key presses link to draw groove.
Fig. 2 is a double wave segment length alignment infrared focal plane device structure vertical view;
Among the figure:
2-1 even number submodule lead-in wire link passes through groove;
2-2 wave band one even number submodule is connected with the integrated-lead link;
2-3 wave band one odd number submodule is connected with the integrated-lead link;
2-4 wave band two even number submodules are connected with the integrated-lead link;
2-5 wave band two odd number submodules are connected with the integrated-lead link;
Fig. 3 is double wave segment length alignment infrared focal plane device structure (back side) upward view;
Among the figure:
3-1 submodule link passes through groove;
3-2 submodule link substrate back lead-in wire passes through groove (lead-in wire does not draw among the figure).
Fig. 4 is a double wave segment length alignment infrared focal plane device structure A-A profile;
Among the figure:
4-1 integrated-lead fixation clip groove;
4-2 even number submodule link passes through groove;
4-3 even number submodule link substrate back lead-in wire passes through groove.
Fig. 5 is a double wave segment length alignment infrared focal plane device structure B-B profile;
Among the figure:
5-1 even number submodule link substrate back lead-in wire passes through groove;
5-2 even number submodule link is drawn (lead-in wire does not draw among the figure) through groove and groove.
Fig. 6 is that double wave segment length alignment infrared focal plane device is used integrated-lead figure;
Among the figure:
6-1 integrated-lead odd number submodule link;
6-2 integrated-lead even number submodule link;
6-3 integrated-lead submodule common lead merges the line funtion part;
The total exit part of 6-4 integrated-lead;
The 6-5 integrated-lead with draw link outward.
Embodiment
At first see also Fig. 1～Fig. 6, described double wave segment length alignment focus planardetector mainly is made up of parts such as splicing substrate 1-1, wave band one submodule 1-2, wave band two submodule 1-4, integrated thin-film lead-in wire, integrated-lead fixation clip 1-6.
Described splicing substrate 1-1 is the installation base plate of each parts, is processed by the metal material of low thermal coefficient of expansion, is provided with above screw is installed is used for the installation that Assembly part and through hole are used for detector and cold platform.
Described wave band one, wave band two detector submodules are alignment focus planardetectors of custom-designed 512 * 1, also can be the alignment submodules of other specification.Being designed with the alignment mark that is suitable for splicing application, responsive first array on each submodule is near device structural design on one side.Splicing is the concrete design according to double-waveband detector, is fixed on submodule on the splicing substrate with low temperature glue, forms double wave segment length alignment focus planardetector.And the input pulse of each submodule and signal output are mutually independently on electricity, draw respectively.The arrangement architecture of the double wave segment length alignment focus planardetector that is spliced to form, the submodule of wave band one forms the long alignment of wave band one; The submodule of wave band two forms the long alignment of wave band two.Splicing between the submodule of same wave band is rotational symmetric arrangement architecture.
Described integrated thin-film lead-in wire is the polyimides base film lead-in wire that is suitable for cryogenic applications, and a wave band is drawn with one group of integrated-lead, and whole two waveband detector array has two groups of integrated-leads.Integrated-lead merges line part 6-3, integrated-lead total exit part 6-4 and integrated-lead by odd even submodule link 6-1 and 6-2, submodule common lead and draws link 6-5 outward and form.Integrated-lead is installed on the splicing substrate, and each submodule is connected through key pressure mode with the link 6-1 or the 6-2 of integrated-lead.Wherein, integrated-lead even number submodule link is the groove 2-1 that passes through on the substrate, passes through groove 3-2 through the substrate back lead-in wire again and draws.Integrated-lead is used for the input of each module working pulse, power supply and the output of each submodule detectable signal.
Described integrated-lead fixation clip 1-6 is used for fixing integrated-lead even number submodule link, has through hole to be used for screw above and installs.In the middle of the integrated-lead fixation clip is the structural design that has groove 4-1, with effective fixedly integrated-lead submodule link.
At first, 1-1 is fixed on the 3-dimensional image tester mobile platform with three-dimensional real time function with the splicing substrate, and wave band one submodule 1-2 and 1-3 are pressed the designing requirement position, with rotation symmetric arrays mode, is fixed on the splicing substrate 1-1 with DW3 low temperature glue.Then, use wave band two submodule 1-4 and 1-5 with the quadrat method splicing again and be fixed on the splicing substrate 1-1, form the two waveband detector array.Splicing is under the monitoring in real time of the 3-dimensional image tester with real-time three-dimensional measurement function, to implement, with the precision positions that realizes that each sub-module requires.After accurate splicing is accomplished, begin to install integrated-lead.Passing through groove to the even number submodule link 6-2 of integrated-lead from the lead-in wire that splices the substrate 1-1 back side earlier passes; Penetrate from passing through groove 3-1 again, pass, after integrated-lead even number submodule link 6-2 passes from passing through groove 2-1; Corresponding one by one with the even number submodule, like 2-2,2-4 state.Then, even number submodule link is fixed with integrated-lead fixation clip 1-6, has accomplished the installation of even number submodule link like this.And then carry out the installation of odd number submodule link; At first; It is corresponding one by one to equal each odd number submodule to integrated-lead odd number submodule link 6-1; Form 2-3,2-5 state; Use integrated-lead fixation clip (not drawing among the figure) fixing then equally, so just accomplished the installation of integrated-lead odd even link integrated-lead odd number submodule link 2-3,2-5 etc.After the integrated-lead installation, realize being connected of submodule key pressure point and each submodule link of integrated-lead with key pressure method.Like this, accomplish the manufacture process of the complete two waveband detector array that has the integrated-lead structure, formed integrated double-waveband detector assembly, can get into the Dewar vacuum encapsulation process.
Claims (4)
1. two waveband alignment infrared focal plane detector integrated morphology; It comprises substrate, wave band one submodule, wave band two submodules and integrated thin-film lead-in wire; It is characterized in that: it be that the boundary divides substrate equally is left and right sides two halves that described two waveband alignment infrared focus plane is surveyed center with substrate; Wave band one submodule, wave band two submodules symmetry respectively are installed on the basic left and right sides; Be spliced to form a long detector array to intersect, to rotate symmetric form separately between the submodule of a plurality of same wave bands; Wherein the even number submodule inboard odd number submodule that is positioned at substrate is positioned at the outside of substrate, and the submodule splicing is aimed at the back that finishes and is fixed on the splicing substrate with low temperature glue, and integrated thin-film goes between and each wave band submodule is integrated into one group draws and form two row two waveband alignment infrared focal plane detectors.
2. a kind of two waveband alignment infrared focal plane detector integrated morphology according to claim 1 is characterized in that: but described substrate adopts the metal material valve or the invar of low thermal coefficient of expansion.
3. a kind of two waveband alignment infrared focal plane detector integrated morphology according to claim 1 is characterized in that: described integrated thin-film lead-in wire adopts polyimides base film band line.
4. one kind is used for the outbound course of the integrated outer lead of two waveband alignment infrared focal plane detector integrated morphology according to claim 1, and it is following to it is characterized by method:
Passing through groove to the even number submodule link (6-2) of integrated-lead from the lead-in wire that splices substrate (1-1) back side earlier passes; Penetrate from passing through groove (3-1) again, pass from passing through groove (2-1), after integrated-lead even number submodule link (6-2) passes; Corresponding one by one with the even number submodule; Then, even number submodule link is fixed with integrated-lead fixation clip 1-6, has accomplished the installation of even number submodule link; And then carry out the installation of odd number submodule link; At first; It is corresponding one by one to equal each odd number submodule to integrated-lead odd number submodule link (6-1); Use the integrated-lead fixation clip fixing then equally, so just accomplished the installation of integrated-lead odd even link integrated-lead odd number submodule link (2-3,2-5) etc.; After the integrated-lead installation, realize being connected of submodule key pressure point and each submodule link of integrated-lead with key pressure method.
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Cited By (7)
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| CN104538384A (en) * | 2014-10-16 | 2015-04-22 | 中国科学院上海技术物理研究所 | Densely arrayed and spliced dual-band long linear infrared focal plane detector structure |
| CN104748859A (en) * | 2015-01-21 | 2015-07-01 | 中国科学院上海技术物理研究所 | Thermal coupling structure and realization method for ultra-long line array detector and single-point cold source |
| CN106500835A (en) * | 2016-09-22 | 2017-03-15 | 北京空间机电研究所 | A kind of haplotype dual-band infrared probe assembly for being suitable to low temperature environment |
| CN107314821A (en) * | 2017-06-28 | 2017-11-03 | 中国电子科技集团公司第十研究所 | A kind of line type infrared focal plane read-out circuit and its design method |
| CN109786495A (en) * | 2019-02-01 | 2019-05-21 | 中国电子科技集团公司第十一研究所 | Ultra-large gazing type infrared detector splicing substrate and preparation method thereof |
| CN110793628A (en) * | 2019-10-18 | 2020-02-14 | 西安交通大学 | Irradiation intensity distribution measuring method based on photodiode array |
| CN111710749A (en) * | 2020-04-23 | 2020-09-25 | 中国科学院上海技术物理研究所 | Long-line detector splicing structure based on multi-substrate secondary splicing and implementation method |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104538384A (en) * | 2014-10-16 | 2015-04-22 | 中国科学院上海技术物理研究所 | Densely arrayed and spliced dual-band long linear infrared focal plane detector structure |
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| CN104748859A (en) * | 2015-01-21 | 2015-07-01 | 中国科学院上海技术物理研究所 | Thermal coupling structure and realization method for ultra-long line array detector and single-point cold source |
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| CN107314821A (en) * | 2017-06-28 | 2017-11-03 | 中国电子科技集团公司第十研究所 | A kind of line type infrared focal plane read-out circuit and its design method |
| CN107314821B (en) * | 2017-06-28 | 2020-03-27 | 中国电子科技集团公司第十一研究所 | Linear array type infrared focal plane reading circuit and design method thereof |
| CN109786495A (en) * | 2019-02-01 | 2019-05-21 | 中国电子科技集团公司第十一研究所 | Ultra-large gazing type infrared detector splicing substrate and preparation method thereof |
| CN110793628A (en) * | 2019-10-18 | 2020-02-14 | 西安交通大学 | Irradiation intensity distribution measuring method based on photodiode array |
| CN110793628B (en) * | 2019-10-18 | 2020-08-18 | 西安交通大学 | Irradiation intensity distribution measuring method based on photodiode array |
| CN111710749A (en) * | 2020-04-23 | 2020-09-25 | 中国科学院上海技术物理研究所 | Long-line detector splicing structure based on multi-substrate secondary splicing and implementation method |
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