CN102820308B - Dual-waveband linear infrared focal plane detector integrated structure - Google Patents
Dual-waveband linear infrared focal plane detector integrated structure Download PDFInfo
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- CN102820308B CN102820308B CN201210273991.1A CN201210273991A CN102820308B CN 102820308 B CN102820308 B CN 102820308B CN 201210273991 A CN201210273991 A CN 201210273991A CN 102820308 B CN102820308 B CN 102820308B
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Abstract
The invention discloses a dual-waveband linear infrared focal plane detector integrated structure. The integrated structure comprises a spliced substrate, first waveband sub-modules, second waveband sub-modules, an integrated thin film lead, and so on, wherein the lead wires of even-numbered sub-modules are led out by making the connection ends of the even-numbered sub-modules of an integrated lead to pass through a lead through-groove on the back side of the substrate and then pass through a through-slot on the substrate. The dual-waveband linear infrared focal plane detector integrated structure provided by the invention is modularized and assembled in design, and has manufacturability.
Description
Technical field
The present invention relates to infrared focal plane detector manufacturing technology, particularly the two waveband alignment infrared focal plane detector structure, integrated outer lead and the outbound course that splice of a kind of multimode.
Background technology
Infrared detection technique has at military project civil areas such as earth observation, Aero-Space early warning, meteorology, geomorphology, environmental monitoring, resource investigations to be applied extremely widely, has great importance to reinforcement national defence and promotion socio-economic development.For any one infrared acquisition application system, infrared focal plane detector is the core component of whole detection system.In Aeronautics and Astronautics infrared remote sensing technology field, along with the further raising of application demand, systems technology main development direction, one is improve system looks sensitivity, to obtain meticulousr target information; Two is to multispectral sensing future development, to obtain abundanter target information, expands range of application; Three is improve space exploration resolution, to improve the space exploration precision to the detection of a target.For being operated in the infrared remote sensing instrument of sustained height with identical swath, the responsive first quantity of detector is more, then spatial resolution is higher; For dual-band infrared remote sensing instrument, then need the Infrared Detectors with two waveband detectivity.Therefore, the manufacturing technology of the infrared focal plane detector of extensive, two waveband is the core technology meeting high spatial resolution, two waveband detection infrared remote sensing instrument.
Aeronautics and Astronautics infrared remote sensing, move over the ground because aerospace vehicle self has one dimension, so adopt the mode of operation of a kind of " push away and sweep ", namely the responsive unit of alignment detection is along one-dimensional square to arrangement, orientation is vertical with the spacecraft direction of motion, the one dimension relative motion utilizing aircraft or satellite to orbit the earth in high-altitude, realizes the one-dimensional scanning (mechanical scanning) along heading earth observation; And be combined perpendicular to the sensitivity unit of heading arrangement the scanning (electronic scanning) realizing another and tie up with reading circuit, form two-dimentional remote sensing images thus.For realizing two waveband remote sensing, be arranged with the arrangement of detection unit of two wave bands perpendicular to heading exactly.Therefore, for realizing the object of high spatial resolution, two waveband detection, adopting two waveband detector array, realizing with " push away and sweep " mode of operation.
Due to infrared alignment detector, by factors such as material preparation, device technology technology and physical characteristic restrictions, (Infrared Detectors works at low temperatures, due to the existence of thermal stress, the full-size of detector is physically restricted), the method that the multiple submodule of general employing " seamless " is spliced realizes the manufacture of long detector array.(see Chinese patent: 200610027004.4).
Summary of the invention
The invention provides a kind of splicing construction of technically feasible double wave segment length Linear FPA, integrated outer lead and outbound course.
Technical solution of the present invention is as follows:
As shown in drawings, splicing construction of the present invention comprises substrate, wave band one submodule, wave band two submodule and integrated thin-film lead-in wire.
Described submodule is a kind of is the alignment infrared focal plane detector separate in " splicing " and specially designed, electricity, scale is less (such as, 512 × 1 focus planardetectors).Each module is designed with alignment mark, and there are the corresponding relation determined in alignment mark and photosensitive unit.During splicing, to mark as measurement point, make the splicing of submodule photosensitive unit on the position of design, ensure the fine registration of each intermodule.By wave band, submodule is called wave band one submodule, wave band two submodule; By the parity of ordering numbering, submodule is called odd number submodule, even number submodule.
Described substrate is the hardware had high requirements to the depth of parallelism, evenness, and it is manufactured by the metal material of low thermal coefficient of expansion, such as can valve covar or invar invar.
Described integrated thin-film lead-in wire is used for the input of each module work pulse, power supply and the output of each submodule detectable signal, it adopts the Polyimide based films lead-in wire being suitable for cryogenic applications, a wave band one group of integrated-lead is drawn, and whole two waveband detector array has two groups of integrated-leads.Integrated-lead merges line part 6-3, integrated-lead total exit part 6-4 and integrated-lead by odd even submodule link 6-1 and 6-2, submodule common lead and outer extraction link 6-5 forms.Integrated-lead is arranged on splicing substrate, and each submodule is connected by key mode of pressing with link 6-1 or 6-2 of integrated-lead.Wherein, integrated-lead even number submodule link is the groove 2-1 passed through on substrate, then is passed through groove 3-2 drawn by substrate back lead-in wire.
With the center of substrate for substrate is divided equally for left and right two halves by boundary, wave band one submodule, wave band two submodule be the symmetrical left and right sides being installed on substrate respectively, a long detector array is spliced to form with intersection, rotational-symmetric form separately between the submodule of multiple the same band, wherein even number submodule is positioned at the inner side (near substrate center's line) of substrate, odd number submodule is positioned at the outside of substrate, and submodule splicing is fixed on splicing substrate by low temperature glue after aiming at.
The outbound course of integrated outer lead is as follows: the even number submodule link 6-2 of integrated-lead passes through groove from the lead-in wire at the splicing substrate 1-1 back side and passes, penetrate from passing through groove 3-1 again, pass from passing through groove 2-1, after integrated-lead even number submodule link 6-2 passes, with even number submodule one_to_one corresponding, as 2-2,2-4 state.Then, even number submodule link integrated-lead fixation clip 1-6 fixes, and completes the installation of even number submodule link.And then carry out the installation of odd number submodule link; First, integrated-lead odd number submodule link 6-1 etc. and each odd number submodule one_to_one corresponding, form 2-3,2-5 state, then with integrated-lead fixation clip, integrated-lead odd number submodule link 2-3,2-5 are fixed equally, this completes the installation of integrated-lead odd even link.After integrated-lead installation, realize connecting of submodule key pressure point and each submodule link of integrated-lead by key pressure method.
The present invention has the following advantages:
1) two waveband as required, can be determined long alignment specification, has flexibility on vertical scanning direction.
2) modularization, fabricated construction design, can screen respectively parts, test and test, and is conducive to commercialization and produces.
3) submodule of two wave bands can be the submodule of different size, has flexibility.Two each submodule electricity of wave band are independently, can adjust the working point of submodule respectively, convenient application.
4) integrated form film outer lead structure, substantially increases the reliability of lead-in wire.
5) the electrical parameter input of two wave bands and signal output are independently, facilitate state modulator and follow-up process.
Accompanying drawing explanation
Fig. 1 is double wave segment length alignment infrared focal plane device structure three-dimensional axonometric drawing;
In figure:
1-1 detector splicing substrate; 1-2 wave band one odd number submodule;
1-3 wave band one even number submodule; 1-4 wave band two even number submodule;
1-5 wave band two odd number submodule; 1-6 integrated-lead fixation clip;
1-7 integrated-lead and each submodule link;
1-8 integrated-lead even number submodule key pressure link draws groove.
Fig. 2 is double wave segment length alignment infrared focal plane device structure vertical view;
In figure:
2-1 even number submodule lead-in wire link passes through groove;
2-2 wave band one even number submodule is connected with integrated-lead link;
2-3 wave band one odd number submodule is connected with integrated-lead link;
2-4 wave band two even number submodule is connected with integrated-lead link;
2-5 wave band two odd number submodule is connected with integrated-lead link;
Fig. 3 is double wave segment length alignment infrared focal plane device structure (back side) upward view;
In figure:
3-1 submodule link passes through groove;
3-2 submodule link substrate back lead-in wire passes through groove (lead-in wire not shown in FIG.).
Fig. 4 is double wave segment length alignment infrared focal plane device structure A-A profile;
In figure:
4-1 integrated-lead fixation clip groove;
4-2 even number submodule link passes through groove;
4-3 even number submodule link substrate back lead-in wire passes through groove.
Fig. 5 is double wave segment length alignment infrared focal plane device structure B-B profile;
In figure:
5-1 even number submodule link substrate back lead-in wire passes through groove;
5-2 even number submodule link is drawn (lead-in wire not shown in FIG.) by groove and groove.
Fig. 6 is double wave segment length alignment infrared focal plane device integrated-lead figure;
In figure:
6-1 integrated-lead odd number submodule link;
6-2 integrated-lead even number submodule link;
6-3 integrated-lead submodule common lead merges line funtion part;
The total exit part of 6-4 integrated-lead;
6-5 integrated-lead and outer extraction link.
Embodiment
First refer to Fig. 1 ~ Fig. 6, described double wave segment length Linear FPA detector, form primarily of the parts such as splicing substrate 1-1, wave band one submodule 1-2, wave band two submodule 1-4, integrated thin-film lead-in wire, integrated-lead fixation clip 1-6.
Described splicing substrate 1-1, is the installation base plate of each parts, is made up of the metal material of low thermal coefficient of expansion, is provided with installation screw above for the installation for detector and cold platform of Assembly part and through hole.
Described wave band one, wave band two detector submodule are the Linear FPA detectors of custom-designed 512 × 1, also can be the alignment submodules of other specification.Each submodule is designed with the alignment mark being suitable for splicing application, responsive first array is close device structural design on one side.Splicing is the specific design according to double-waveband detector, and submodule low temperature glue is fixed on splicing substrate, forms double wave segment length Linear FPA detector.And the input pulse of each submodule and signal to export in electricity be mutually independently, draw respectively.The arrangement architecture of the double wave segment length Linear FPA detector be spliced to form, the submodule of wave band one forms the long alignment of wave band one; The submodule of wave band two forms the long alignment of wave band two.Splicing between the submodule of the same band is rotational symmetric arrangement architecture.
Described integrated thin-film lead-in wire, be the Polyimide based films lead-in wire being suitable for cryogenic applications, a wave band one group of integrated-lead is drawn, and whole two waveband detector array has two groups of integrated-leads.Integrated-lead merges line part 6-3, integrated-lead total exit part 6-4 and integrated-lead by odd even submodule link 6-1 and 6-2, submodule common lead and outer extraction link 6-5 forms.Integrated-lead is arranged on splicing substrate, and each submodule is connected by key mode of pressing with link 6-1 or 6-2 of integrated-lead.Wherein, integrated-lead even number submodule link is the groove 2-1 passed through on substrate, then is passed through groove 3-2 drawn by substrate back lead-in wire.Integrated-lead is used for the input of each module work pulse, power supply and the output of each submodule detectable signal.
Described integrated-lead fixation clip 1-6, for fixing integrated-lead even number submodule link, has through hole to install for screw above.The structural design being with fluted 4-1 in the middle of integrated-lead fixation clip, effectively to fix integrated-lead submodule link.
First, splicing substrate 1-1 is fixed on and has on the 3-dimensional image tester mobile platform of three-dimensional real time function, by wave band one submodule 1-2 and 1-3 by designing requirement position, with Rotational Symmetry arrangement mode, be fixed on splicing substrate 1-1 by DW3 low temperature glue.Then, then wave band two submodule 1-4 and 1-5 same method spliced and is fixed on splicing substrate 1-1, forming two waveband detector array.Splicing implements under the 3-dimensional image tester with real-time three-dimensional measurement function is monitored in real time, to realize the precision positions of each submodule requirement.Precision starts to install integrated-lead after having spliced.First the even number submodule link 6-2 of integrated-lead is passed through groove from the lead-in wire at the splicing substrate 1-1 back side to pass, penetrating from passing through groove 3-1 again, passing from passing through groove 2-1, after integrated-lead even number submodule link 6-2 passes, with even number submodule one_to_one corresponding, as 2-2,2-4 state.Then, even number submodule link integrated-lead fixation clip 1-6 fixes, and completes the installation of even number submodule link like this.And then carry out the installation of odd number submodule link; First, integrated-lead odd number submodule link 6-1 is equaled each odd number submodule one_to_one corresponding, form 2-3,2-5 state, then use integrated-lead fixation clip (not shown in FIG.) that integrated-lead odd number submodule link 2-3,2-5 etc. are fixing equally, this completes the installation of integrated-lead odd even link.After integrated-lead installation, realize connecting of submodule key pressure point and each submodule link of integrated-lead by key pressure method.Like this, complete the manufacture process of the complete two waveband detector array with integrated-lead structure, define integrated double-waveband detector assembly, Dewar vacuum packaging technology can be entered.
Claims (4)
1. a two waveband alignment infrared focal plane detector integrated morphology, comprises two waveband focal plane splicing substrate (1-1), wave band one submodule, wave band two submodule and integrated thin-film lead-in wire, it is characterized in that:
Described two waveband alignment infrared focus plane detects with the center of substrate as substrate is divided equally for left and right two halves by boundary, wave band one submodule, wave band two submodule is the symmetrical left and right sides being installed on substrate respectively, separately to intersect between the submodule of multiple the same band, rotational-symmetric form is spliced to form a long detector array, wherein even number submodule is positioned at the inner side of substrate, odd number submodule is positioned at the outside of substrate, submodule splicing is fixed on splicing substrate by low temperature glue after aiming at, each wave band submodule is integrated into one group of lead-in wire and draws and form two row two waveband alignment infrared focal plane detectors by integrated thin-film lead-in wire,
Two wave bands of described two waveband alignment infrared focal plane detector be splicing on same splicing substrate (1-1), wave band one, wave band two submodule are independently submodules, and after splicing, each submodule is in same plane;
The signal of two wave bands is that signal divides two limits independently to draw by two groups of integrated thin-film lead-in wires.
2. a kind of two waveband alignment infrared focal plane detector integrated morphology according to claim 1, is characterized in that: described splicing substrate (1-1) structure is:
1) back side of splicing substrate (1-1) is designed with integrated-lead even number submodule key and presses (6-2) of link to draw groove (1-8,3-2);
2) splicing substrate (1-1) is designed with wave band one, wave band two integrated-lead even number submodule link (6-2) passes through groove (2-1,3-1), groove (1-8,3-2) and groove (2-1,3-1) passing through for integrated thin-film lead-in wire even number submodule link, thus the signal realizing even number submodule is drawn.
3. a kind of two waveband alignment infrared focal plane detector integrated morphology according to claim 1, is characterized in that: described integrated thin-film lead-in wire is Polyimide based films band line, and an integrated-lead draws whole signals of a wave band submodule; Concerning each integrated-lead, integrated-lead even number submodule link (6-2) is by the groove (1-8) of substrate back, connects one to one through the groove (2-1) on substrate and even number submodule, so integrated-lead even number submodule link (6-2) and odd number submodule link (6-1) are the structural designs of unequal length, thus pin configuration that the signal realizing two row two waveband alignment infrared focal plane detectors, two wave bands divides two limits independently to draw.
4., for an outbound course for the integrated outer lead of two waveband alignment infrared focal plane detector integrated morphology as claimed in claim 1, it is characterized by method as follows:
First the even number submodule link (6-2) of integrated-lead is passed through groove from the lead-in wire at splicing substrate (1-1) back side to pass, penetrate from passing through groove (3-1) again, pass from passing through groove (2-1), after integrated-lead even number submodule link (6-2) passes, with even number submodule one_to_one corresponding, then, even number submodule link integrated-lead fixation clip (1-6) is fixed, and completes the installation of even number submodule link; And then carry out the installation of odd number submodule link; First, integrated-lead odd number submodule link (6-1) and each odd number submodule one_to_one corresponding, then use integrated-lead fixation clip that integrated-lead odd number submodule link (2-3,2-5) is fixed equally, this completes the installation of integrated-lead odd even link; After integrated-lead installation, realize connecting of submodule key pressure point and each submodule link of integrated-lead by key pressure method.
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| CN104538384B (en) * | 2014-10-16 | 2017-08-25 | 中国科学院上海技术物理研究所 | Double wave segment length's alignment infrared focal plane detector structure of solid matter splicing |
| CN104748859B (en) * | 2015-01-21 | 2017-09-26 | 中国科学院上海技术物理研究所 | The thermal coupling structure and implementation method of super long alignment detector and single-point low-temperature receiver |
| CN106500835B (en) * | 2016-09-22 | 2017-12-22 | 北京空间机电研究所 | A kind of haplotype dual-band infrared probe assembly suitable for low temperature environment |
| CN107314821B (en) * | 2017-06-28 | 2020-03-27 | 中国电子科技集团公司第十一研究所 | Linear array type infrared focal plane reading circuit and design method thereof |
| CN109786495B (en) * | 2019-02-01 | 2020-12-18 | 中国电子科技集团公司第十一研究所 | Super-large scale staring type infrared detector splicing substrate and preparation method thereof |
| CN110793628B (en) * | 2019-10-18 | 2020-08-18 | 西安交通大学 | Irradiation intensity distribution measuring method based on photodiode array |
| CN111710749B (en) * | 2020-04-23 | 2022-09-09 | 中国科学院上海技术物理研究所 | Long-line detector splicing structure based on multi-substrate secondary splicing and implementation method |
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| CN1542467A (en) * | 2003-11-04 | 2004-11-03 | 中国科学院上海技术物理研究所 | Discrete light filter structure of ultralong lines range infrared focal plane detector |
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| CN201466029U (en) * | 2009-06-26 | 2010-05-12 | 北京京仪博电光学技术有限责任公司 | integrated detector |
| CN102214662B (en) * | 2011-04-26 | 2012-12-19 | 北京大学 | Monolithic integration structure of un-cooled infrared focal plane array detector and manufacturing method thereof |
| CN102280456B (en) * | 2011-05-11 | 2013-06-26 | 北京大学 | Infrared focal plane array seeker integrated structure and manufacturing method |
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| CN1542467A (en) * | 2003-11-04 | 2004-11-03 | 中国科学院上海技术物理研究所 | Discrete light filter structure of ultralong lines range infrared focal plane detector |
| CN1858906A (en) * | 2006-05-26 | 2006-11-08 | 中国科学院上海技术物理研究所 | Super long alignment infrared focus plane detector |
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