CN204167315U - A kind of double wave segment length alignment infrared focal plane detector structure of solid matter splicing - Google Patents
A kind of double wave segment length alignment infrared focal plane detector structure of solid matter splicing Download PDFInfo
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- CN204167315U CN204167315U CN201420597247.1U CN201420597247U CN204167315U CN 204167315 U CN204167315 U CN 204167315U CN 201420597247 U CN201420597247 U CN 201420597247U CN 204167315 U CN204167315 U CN 204167315U
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Abstract
This patent discloses the double wave segment length alignment infrared focal plane detector of a kind of solid matter splicing, detector adopts sequence of modules arrangement, intermodule intersects splicing, two waveband dense arrangement long alignment splicing construction, the integrated outer lead of modularization mounting design and structural design and the composing method such as module common wire merging method and the discrete filter installing rack of integral type.The splicing construction of two waveband dense arrangements, makes the spacing of two detecting band modules reduce 1/3rd; The module common wire of integrated outer lead inside merges, and outer lead quantity can be made to reduce 2/3rds; Modularized design, installation, be conducive to the commercialization of highly reliable double wave segment length detector array.This patent well solves the problem manufacturing long alignment double-waveband detector, and can better meet application requirement.
Description
Technical field
This patent relates to a kind of long alignment infrared focal plane detector, refers to the long detector array of a kind of transversely arranged thousands of unit, two waveband detection, multimode splicing especially.
Background technology
In Aeronautics and Astronautics infrared remote sensing technology field, its main development direction, one is the photoelectric properties improving Infrared Detectors, improves detectivity, to obtain more information; Two is increase infrared-sensitive unit quantity, and improve infrared system space exploration resolution, namely at the remote sensing instrument of phase co-altitude, identical swath, responsive first quantity is more, then spatial resolution is higher.Three is the detections of development multiband, namely at the same time or standard obtain the infrared information of different-waveband simultaneously, effectively can improve infrared system to the identification of target and detection, there is in technical fields such as space infrared early warning, search, tracking the application of particular importance.The core component of infrared detection system and performance index, embody a concentrated reflection of Infrared Detectors technical indicator and manufacturing technology.So, solve the Development Techniques of novel infrared detector, meet the application demand of high-performance infrared remote sensing system, the applications such as reinforcement national defense construction are had great importance.
Long alignment infrared focal plane detector, upwards be arranged with a kind of scanning-type infrared focal plane detector of thousands of first infrared-sensitive unit exactly at one-dimensional square, formed a kind of image device of two dimensional image by one-dimensional scanning (perpendicular to photosensitive identical permutation direction).And double wave segment length alignment infrared focal plane detector, spliced by multiple module exactly, perpendicular to scanning direction being formed two detecting bands, respectively having a kind of sweep type Infrared Detectors of thousands of infrared-sensitive identical permutation, realize single pass, target is carried out to the dual-waveband imaging of two infrared bands.
Because infrared focal plane detector must at low-temperature working, and the problem of materials and process technology, single detector cannot reach the scale of thousands of unit.So the manufacture of general long alignment infrared focal plane detector, the method all adopting multiple submodule to splice realizes.Submodule is generally the infrared alignment detector of 300 ~ 500 photosensitive yuan of scales, using small-scale detector as module, realizes the arrangement of one-dimensional square to thousands of photosensitive unit with connecting method.Such as 512 submodules, be spliced to form 6000 yuan of long detector array by 12 modules.In addition, the long detector array be spliced to form for there being number of modules, because module is independently in electricity, the method adopting common wire to merge, can reduce outer lead quantity, to improve the reliability of outer lead and to reduce the cold damage of conduction.
In the manufacture of the long Linear FPA detector of single band (see Chinese patent ZL200610027004.4), the mode that module splicing adopts " Rotational Symmetry, the splicing that intersects " realizes the splicing not having " seam ".So-called Rotational Symmetry, the splicing that intersects, rotate 180o by odd number module and even illumination Block direction, staggered cross on odd, even module volume, limit, photosensitive first limit is tangent, perpendicular to scanning direction not being leaked first a kind of joining method.For the manufacture of double wave segment length detector array, due to two photosensitive identical permutation of wave band will be realized in a plane, and require that photosensitive first space interval of two wave bands is little as far as possible, to improve scan efficiency.According to the joining method of the long alignment of original single band, two long detector array are arranged side by side, functionally can realize the double wave segment length alignment of two waveband detection, outer lead then must adopt film strip line through splicing substrate, and the extraction that the method for passing the extraction of splicing substrate from bottom realizes long alignment outer lead could realize (Chinese patent (application number) 201210273991.1).The subject matter that this outer lead method exists is, (1) need take up space due to lead-in wire installation, causes the spacing of two band detector intermodules comparatively large, unfavorable to two waveband detection; (2) because film lead-in wire must pass from splicing base plate bottom, long line array device complicated integral structure, mounting technique difficulty is high.(3) because splicing base plate bottom takies a large amount of area through outer lead, to the design of the multiple spot heat transfer cold chain of double wave segment length detector array transverse temperature uniformity, install and bring great difficulty, be even difficult to reach technical requirement on design.
Summary of the invention
Manufacture Problems existing for above-mentioned double wave segment length detector array, this patent proposes a kind of connection scheme of long Linear FPA detector newly.The program can be summarized as: sequence of modules arrangement, the splicing of intermodule intersection, two waveband dense arrangement, outer lead two limit deriving structures respectively; In Rotational Symmetry relation between long detector array wave band 1 and wave band 2.The splicing construction of two waveband dense arrangements, makes the spacing of two detecting band modules reduce 1/3rd; The module common wire of integrated outer lead inside merges, and outer lead quantity can be made to reduce 2/3rds; Modularized design, installation, be conducive to the commercialization of highly reliable double wave segment length detector array.This patent well solves the problem manufacturing long alignment double-waveband detector, and can better meet application requirement.
Double wave segment length alignment infrared focal plane detector described in this patent, comprises the parts such as splicing substrate, wave band 1 module, wave band 2 module, the integrated outer lead of wave band 1, the integrated outer lead of wave band 2, module transition lead wire plate, integrated filtering horse.
The splicing that described wave band 1 module 1-5 arranges by same direction order, wave band 1 module 1-5 presses odevity staggered cross, last yuan of odd number module and even number module limit, first yuan of limit is tangent;
Described wave band 2 module 1-4 does splice same with wave band 1 module 1-5, in Rotational Symmetry relation between the long alignment that wave band 1 module spliced is connected into and the long alignment that wave band 2 module spliced is connected into; Dense arrangement between wave band 1 module and wave band 2 module;
Wave band 1 module 1-5 is connected with integrated outer lead by transition lead wire plate 1-6 with the even number module of wave band 2 module 1-4; The long alignment of wave band 1 and the long alignment of wave band 2 are drawn respectively by integrated outer lead, and integrated outer lead adopts the mounting means being arranged on splicing substrate front side;
Discrete type filter is pasted onto on filter installing rack 2-1, and is positioned at the top of corresponding module, and filter installing rack 2-1 entirety is screwed on splicing substrate, and has good thermo-contact with splicing substrate, plays the effect of cold filter;
Described wave band 1 integrated outer lead 1-3 and wave band 2 integrated outer lead 1-2 is the pulse of long Linear FPA detector, the input of power supply and the output bus of signal; Integrated outer lead is a kind of Polyimide based films lead-in wire, double-decker, and the inside realizing module common wire merges; Long detector array wave band 1 and wave band 2 point of two limit are drawn respectively, integrated outer lead one end and model calling, and the other end and long alignment encapsulate Dewar and wear vacuum exit and be connected, and reaching lead-in wire and drawing object outside vacuum dewar;
There is heat transfer cold chain at the back side of splicing substrate 1-1, realize multiple spot heat transfer, ensure the uniformity of long detector array transverse temperature.
Described splicing substrate 1-1 is by making the metal material of valve or invar low thermal coefficient of expansion, and the flatness PV value requirement of splicing substrate 1-1 is less than 0.01mm, the filter installing rack screwhole position required precision≤± 0.05mm on substrate.
Described wave band 1 module 1-5 and wave band 2 module 1-4 is the Linear FPA detector that scale is less, and their geometry, pad arrangement are identical, and each module is mutually independently in electricity.
The transition lead wire plate corresponding with module key pressure point that described module transition lead wire plate 1-6 is a kind of metallic film by being deposited on ceramic wafer, prepared by photoetching method, for the transition lead wire plate of key pressure between long alignment even number module and integrated outer lead, the reliability of impact lead-in wire to avoid key line ball long.
The double wave segment length alignment infrared focal plane detector solid matter splicing construction that this patent proposes and method have the following advantages:
1) wave band 1 module, wave band 2 module solid matter splicing construction, makes the spacing between two detecting bands reduce 1/3rd, better can meet the requirement of application system to long detector array, greatly reduce two wave bands to the time difference of target acquisition;
2) the integrated outer lead structure utilizing module common lead to merge, can reduce outer lead quantity 2/3rds, reduces the cold damage of leading conductive, improves outer lead reliability;
3) two detecting band signals method of being drawn by integrated outer lead subrane, is conducive to Subsequent electronic signal transacting;
4) Module specifications of each wave band unanimously designs, and is conducive to the consistent module of screenability for splicing, is conducive to improving long alignment double-waveband detector performance uniformity, and is conducive to reducing production cost;
5) discrete type filter adopts filter installing rack mounting means to be placed in the method for detector modules input path, solves the difficulty of long detector array filter;
6) whole modules, filter installing rack, integrated outer lead etc. all install the front at splicing substrate concentratedly, and splice the installation that substrate back can be used for multiple spot heat transfer cold chain, solve the difficulty of the installation of multiple spot cold chain;
7) splice the critical pieces such as substrate, concatenation module, integrated outer lead, filter installing rack and be modular assembly design, can manufacture respectively, carry out reliability screening respectively, greatly maintainability be can increase, production and the manufacture of highly reliable long alignment double-waveband detector are conducive to.
Accompanying drawing explanation
Fig. 1 is the long detector array of two waveband close-packed configuration (not installing filter and installing rack additional) schematic diagram.Wherein:
1-1-splicing substrate; The integrated outer lead of 1-2-wave band 2;
The integrated outer lead of 1-3-wave band 1; 1-4-wave band 2 module;
1-5-wave band 1 module; 1-6-even number module transition lead wire plate;
Fig. 2 is the long detector array of two waveband close-packed configuration (not installing filter and installing rack additional) schematic diagram.Wherein:
2-1-two waveband filter installing rack; 2-2-two waveband filter installing rack installation screw;
2-3-wave band 2 filter installation site; 2-4-wave band 1 filter installation site;
2-5-heat transfer cold chain and splicing substrate link;
Fig. 3 is the 2A-A profile of figure
Embodiment
Below to two waveband long alignment infrared focal plane detector solid matter splicing construction and implementation method, by reference to the accompanying drawings the concrete enforcement of this patent is elaborated.
The critical piece of this patent forms by splicing substrate 1-1, wave band 1 integrated outer lead 1-3, the integrated outer lead 1-2 of wave band 2, wave band 1 module 1-5, wave band 2 module 1-4, filter installing rack 2-1, even number module transition lead wire plate 1-6 etc.
Described splicing substrate 1-1 is the mechanical component be made up of the metal material of low thermal coefficient of expansion (such as, can valve covar, invar invar etc.), is one of critical piece of double wave segment length detector array.Splicing substrate mainly provides a plane, for mounting the purposes such as detector module, filter holder installation, outer lead installation, is designed with the structures such as installation screw above.For the integral planar degree requirement of double wave segment length detector array, depend on the flatness of splicing substrate to a great extent, so the geometric parameter to splicing substrate, the depth of parallelism, evenness, installation screw positional precision etc. as substrate have strict demand.
Described wave band 1 module 1-5 is the Linear FPA detector of a kind of scale less (such as 512 yuan), and the detecting band of this alignment infrared focal plane detector is defined as wave band 1 (such as: 1 ~ 3um detecting band); Equally, described wave band 2 module 1-4 is the alignment infrared focal plane detector that detecting band is defined as wave band 2 (such as: 3 ~ 5um detecting band).Each module is that mutually independently generally, wave band 1 module is identical design with the geometry, pad arrangement etc. of wave band 2 module in electricity.
Described wave band 1 integrated outer lead 1-3 and wave band 2 integrated outer lead 1-2 is the pulse of long Linear FPA detector, the input of power supply and the output bus of signal respectively, is wherein integrated with the functions such as the merging of module common wire.Integrated outer lead is a kind of Polyimide based films lead-in wire, double-decker, and the inside realizing the common lead between module merges.Long detector array wave band 1 and wave band 2 point of two limit are drawn respectively.Integrated outer lead one end and model calling, the other end and long alignment encapsulate Dewar and wear vacuum exit and be connected, and reaching lead-in wire and drawing object outside vacuum dewar.Owing to have employed the method that module common wire merges, the outer lead total quantity of extraction is made to decrease 2/3rds.
Described module transition lead wire plate 1-6, a kind of metallic film by being deposited on ceramic wafer, the transition lead wire plate corresponding with module key pressure point prepared of photoetching method, for the transition lead wire plate of key pressure between long alignment even number module and integrated outer lead, the reliability of impact lead-in wire to avoid key line ball long.
Described filter installing rack 2-1 is a kind of hardware, above the corresponding wave band 1 module 1-5 and wave band 2 module 1-4 of filter installing rack, have rectangular through slot hole, as attachment wave band 1 filter position 2-4 and attachment wave band 2 filter position 2-3; Filter installing rack is designed with installation screw 2-2.As a whole parts, before long alignment assembling, complete the attachment of discrete filter.
Specific implementation process is as follows: splicing substrate 1-1 is mechanically fixed on the splicing station with three-dimensional real-time detection function, wave band 1 module 1-5 and wave band 2 module 1-4 according to design attitude coordinate, is tentatively fixed on splicing substrate 1-1 by DW3 low temperature glue; Before DW3 low temperature glue is not solidified completely, utilize the three-dimensional real-time detection function (measuring accuracy ± 0.001mm) of splicing station, precision adjustment is carried out to each module.In operation, adopt absolute coordinate method of testing, avoid repeatedly accumulated error, between last module, site error is less than≤± 5um.Wherein, wave band 1 module and the feature of wave band 2 module on arrangement mode are, intersection splicing, order arrangement, the intensive splicing construction arranged of two waveband.Specifically, as the splicing of wave band 1, wave band 1 module is tangent with limit, even number module first yuan of limit by odevity staggered cross, last yuan of odd number module by the order arrangement of same direction, wave band 1 module, forms long detector array.Same splicing is done to wave band 2 module.But to the long alignment of wave band 1 and the long alignment of wave band 2, therebetween in Rotational Symmetry relation.Another feature is, is dense arrangement between wave band 1 module and wave band 2 module, makes the space length between two wave bands reduce 1/3rd.After completing splicing, utilize the screw on splicing substrate that integrated outer lead 1-2,1-3 are installed, utilize key compression technology that each module key pressure pressure point is connected with integrated outer lead one end.Again, discrete filter is pasted onto on filter installing rack, then filter installing rack entirety screw is arranged on splicing substrate.Thus, complete splicing and the assembling of double wave segment length Linear FPA detector, form the manufacture with two-band infrared detector.
Claims (4)
1. the double wave segment length alignment infrared focal plane detector of a solid matter splicing, it comprises splices substrate (1-1), wave band 1 module (1-5) and wave band 2 module (1-4), the integrated outer lead of wave band 1 (1-3), the integrated outer lead of wave band 2 (1-2), discrete type filter installing rack (2-1), it is characterized in that:
Described wave band 1 module (1-5) by the order arrangement of same direction, wave band 1 module (1-5) by the tangent splicing in odevity staggered cross, last yuan of odd number module and even number module limit, first yuan of limit;
Described wave band 2 module (1-4) does splice same with wave band 1 module (1-5), in Rotational Symmetry relation between the long alignment that wave band 1 module spliced is connected into and the long alignment that wave band 2 module spliced is connected into; Dense arrangement between wave band 1 module and wave band 2 module;
Wave band 1 module (1-5) is connected with integrated outer lead by transition lead wire plate (1-6) with the even number module of wave band 2 module (1-4); The long alignment of wave band 1 and the long alignment of wave band 2 are drawn respectively by integrated outer lead, and integrated outer lead adopts the mounting means being arranged on splicing substrate front side;
Discrete type filter is pasted onto on filter installing rack (2-1), and be positioned at the top of corresponding module, filter installing rack (2-1) entirety is screwed on splicing substrate, and has good thermo-contact with splicing substrate, plays the effect of cold filter;
The described integrated outer lead of wave band 1 (1-3) and the integrated outer lead of wave band 2 (1-2) are the pulse of long Linear FPA detector, the input of power supply and the output bus of signal; Integrated outer lead is a kind of Polyimide based films lead-in wire, double-decker, and the inside realizing module common wire merges; Long detector array wave band 1 and wave band 2 point of two limit are drawn respectively, integrated outer lead one end and model calling, and the other end and long alignment encapsulate Dewar and wear vacuum exit and be connected, and reaching lead-in wire and drawing object outside vacuum dewar;
There is heat transfer cold chain at the back side of splicing substrate (1-1), realize multiple spot heat transfer, ensure the uniformity of long detector array transverse temperature.
2. the double wave segment length alignment infrared focal plane detector of a kind of solid matter splicing according to claim 1, it is characterized in that: described splicing substrate (1-1) is by can the metal material of valve or invar low thermal coefficient of expansion) make, the flatness PV value requirement of splicing substrate (1-1) is less than 0.01mm, the filter installing rack screwhole position required precision≤± 0.05mm on substrate.
3. the double wave segment length alignment infrared focal plane detector of a kind of solid matter splicing according to claim 1, it is characterized in that: described wave band 1 module (1-5) and wave band 2 module (1-4) are the Linear FPA detectors that scale is less, their geometry, pad arrangement are identical, and each module is mutually independently in electricity.
4. the double wave segment length alignment infrared focal plane detector of a kind of solid matter splicing according to claim 1, it is characterized in that: the transition lead wire plate corresponding with module key pressure point that described module transition lead wire plate (1-6) is a kind of metallic film by being deposited on ceramic wafer, prepared by photoetching method, for the transition lead wire plate of key pressure between long alignment even number module and integrated outer lead.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104538384A (en) * | 2014-10-16 | 2015-04-22 | 中国科学院上海技术物理研究所 | Densely arrayed and spliced dual-band long linear infrared focal plane detector structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104538384A (en) * | 2014-10-16 | 2015-04-22 | 中国科学院上海技术物理研究所 | Densely arrayed and spliced dual-band long linear infrared focal plane detector structure |
| CN104538384B (en) * | 2014-10-16 | 2017-08-25 | 中国科学院上海技术物理研究所 | Double wave segment length's alignment infrared focal plane detector structure of solid matter splicing |
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