CN102817052A - Electroplating mold for electroplating with characteristics of high precision and selectivity - Google Patents
Electroplating mold for electroplating with characteristics of high precision and selectivity Download PDFInfo
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- CN102817052A CN102817052A CN2012102896378A CN201210289637A CN102817052A CN 102817052 A CN102817052 A CN 102817052A CN 2012102896378 A CN2012102896378 A CN 2012102896378A CN 201210289637 A CN201210289637 A CN 201210289637A CN 102817052 A CN102817052 A CN 102817052A
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- band
- mould
- plating
- springform
- electroplating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The present invention discloses an electroplating mold for electroplating with characteristics of high precision and selectivity. The electroplating mold comprises a roller type mold body and an elastic mold zone, wherein the elastic mold zone is arranged on the outer periphery wall of the mold body, and is provided for covering a non-electroplating region on a lead wire frame. The mold body is circumferentially provided with a plurality of liquid spraying holes. The elastic mold zone is provided with spray plating ports corresponding to the liquid spraying holes. The mold body is circumferentially provided with a positioning device for fixing the lead wire frame on the outer periphery of the elastic mold zone. According to the present invention, the outer periphery of the mold body is additionally provided with the positioning mold nail and the precise elastic mold zone, such that the electroplating position region is precise, the size is accurate, the electroplating area of the electroplating region is small, the electroplating boundary is clear, precision is high, the uneven plating layer thickness is prevented, and unclear plating layer boundary is prevented; and the electroplating region is precisely positioned so as greatly reduce unnecessary loss and waste of precious metals, and save cost.
Description
[technical field]
The present invention relates to a kind of lead frame plating mould, relate to a kind of plating mould that is used for high-accuracy selective electroplating particularly.
[background technology]
At present in the electric blaster fuse frame field of electroplating; Divide whole full the plating and the plating of selective area property; Whole full plating step does not very simply need mould or very simple mould; A lot of in fact products do not need whole the plating, slow low precision loss of whole electroplating velocity and waste and serious.
Selective electroplating is the plating mode of a kind of high speed, economy.Owing to can accomplish the autotelic selective electroplating in functional zone through plating mould and mask band precision-fit.The plating area is little, precision is high, can reach higher electroplating velocity.Precious metals such as saving gold and silver are saved 40% precious metal than the plating mode of before traditional complete gold-plated silver.In the past electric blaster fuse frame is electroplated great majority all without mould or simply block the bar plating mould that electroplate liquid is used, and the plating area is accurate inadequately and have plating leakage and thickness of coating inhomogeneous like this, the phenomenon that the coating obscure boundary is clear.
[summary of the invention]
The technical problem that the present invention will solve is the deficiency that overcomes prior art, provides a kind of precision high, saves and electroplates precious metal consumption, practices thrift the plating mould that is used for high-accuracy selective electroplating of cost, and the present invention is applicable to the plating of lead frame.
The present invention adopts following technical scheme for solving the problems of the technologies described above:
A kind of plating mould that is used for high-accuracy selective electroplating; It is characterized in that comprising the trolley type die ontology and be arranged on the springform band that the die ontology periphery wall is used to hide electroless plating district on the lead frame; Circumferentially be provided with a plurality of spray holes on the described die ontology; Described springform band is provided with the spraying plating mouth corresponding with described spray hole, circumferentially is provided with the locating device that lead frame is fixed on springform band periphery on the described die ontology.
Aforesaid a kind of plating mould that is used for high-accuracy selective electroplating; It is characterized in that circumferentially being provided with on the described die ontology annular groove; Be provided with mould band chamber in the described annular groove, described spray hole is arranged in the described mould band chamber, and described locating device is arranged in the described annular groove.
Aforesaid a kind of plating mould that is used for high-accuracy selective electroplating is characterized in that each described spray hole both sides is provided with mould band pilot hole, and described springform band is provided with the positioning pin that can insert mould band pilot hole.
Aforesaid a kind of plating mould that is used for high-accuracy selective electroplating; The quantity that it is characterized in that described springform band is identical with the quantity of described spray hole; Each described springform band comprises the shelterarea; The periphery of described shelterarea is provided with the spacing preiection of assist location lead frame, and described spraying plating mouth is arranged on a side of spacing preiection.
Aforesaid a kind of plating mould that is used for high-accuracy selective electroplating; It is characterized in that described locating device comprise be arranged in the described annular groove, the lead frame pilot hole of mouth spray one side, be provided with the positioning module nail that stretches out the location lead frame to the die ontology periphery in the described lead frame pilot hole.
Aforesaid a kind of plating mould that is used for high-accuracy selective electroplating is characterized in that described positioning module nail is cone shape pottery nail for external part.
Aforesaid a kind of plating mould that is used for high-accuracy selective electroplating, the size that it is characterized in that described spray hole are length 1-3 millimeter, width 1-1.5 millimeter.
Aforesaid a kind of plating mould that is used for high-accuracy selective electroplating is characterized in that described springform band size is length 10-15 millimeter, width 6-8 millimeter, and the spraying plating mouth size on the said springform band is a length 1-3 millimeter, width 1-1.6 millimeter.
Aforesaid a kind of plating mould that is used for high-accuracy selective electroplating is characterized in that the positioning pin on each said springform band is two, and is corresponding with two mould band pilot holes respectively.
The present invention compared with prior art has following advantage:
The present invention has added positioning module nail and accurate springform band in the die ontology periphery, makes that the plating band of position is more accurate, and size is more accurate.
The springform band is set between lead frame and die ontology, can makes the plating area electroplate little, the coating sharpness of border of area, precision is high.Prevented that thickness of coating is inhomogeneous, the plating of layer border is unintelligible.
The present invention significantly reduces the loss and the waste of unnecessary noble metal through spray hole on the die ontology and the plating area, the dual accurate location of spraying plating mouth on the springform band, has practiced thrift cost.
Cycle type flow line of the present invention is electroplated, and electroplating velocity is fast and highly stable.
The present invention electroplates the tolerance that precision can reach 0.05mm, is applicable to the selective electroplating requirement of high-accuracy lead frame.
[description of drawings]
Fig. 1 is a three-dimensional structure diagram of the present invention;
Fig. 2 is a user mode explosive view of the present invention;
Fig. 3 is the A place enlarged view of Fig. 2;
Fig. 4 is the B place enlarged view of Fig. 2;
Fig. 5 is one of mould band structure synoptic diagram;
Fig. 6 is two of a mould band structure synoptic diagram;
Fig. 7 is positioned at the synoptic diagram in the present invention for lead frame;
Fig. 8 is the C place enlarged view of Fig. 7;
Fig. 9 is a user mode synoptic diagram of the present invention;
[embodiment]
Describe the present invention below in conjunction with accompanying drawing:
Shown in Fig. 1-9; A kind of plating mould that is used for high-accuracy selective electroplating; Comprise trolley type die ontology 1 and be arranged on the springform band 2 that die ontology 1 periphery wall is used to hide electroless plating district on the lead frame 3; Circumferentially be provided with a plurality of spray holes 11 on the die ontology 1, on springform band 2, be provided with the spraying plating mouth 21 corresponding, circumferentially be provided with the locating device that lead frame 3 is fixed on springform band 2 peripheries on the die ontology 1 with spray hole 11.
Described die ontology 1 is circular, on die ontology 1, circumferentially is provided with annular groove 13, is provided with mould band chamber 14 in the annular groove 13; Spray hole 11 is arranged in the mould band chamber 14; Each spray hole 11 both sides is provided with mould band pilot hole 12, and mould band chamber 14 is one-body molded by die ontology 1 with mould band pilot hole 12, and described springform band 2 is provided with the positioning pin 22 that can insert mould band pilot hole 12; Positioning pin 22 on each springform band 2 is two, and is corresponding with two mould band pilot holes 12 respectively.
Each springform band 2 comprises shelterarea 23, on the periphery of shelterarea 23, is provided with the spacing preiection 24 of assist location lead frame 3, and spraying plating mouth 21 is arranged on a side of spacing preiection 24.Whole springform band 2 is that RTV silica gel (room temperature vulcanized silicone rubber) is one-body molded.
The quantity of springform band 2 is identical with the quantity of spray hole 11; The quantity in mould band chamber 14 is a plurality of with the quantity of springform band 2 and spray hole 11 also; A plurality of mould bands chamber 14 circumferential array are in annular groove 13, and described locating device is arranged in the annular groove 13 of outer and spray hole 11 1 sides in mould band chamber 14.
This locating device comprise be arranged in the annular groove 13, the lead frame pilot hole 15 of mouth spray 11 1 sides; This lead frame pilot hole 15 is one-body molded by mold body 1, in lead frame pilot hole 15, is provided with the positioning module nail 4 that is stretched out location lead frame 3 by circumferential die ontology 1 periphery in the die ontology 1.This positioning module nail 4 is cone shape pottery nail for external part.
The size of spray hole 11 is a length 1-3 millimeter among the present invention; Width 1-1.5 millimeter, the size of springform band 2 are length 10-15 millimeter, width 6-8 millimeter; Spraying plating mouth 21 sizes on the springform band 2 are length 1-3 millimeter; Width 1-1.6 millimeter, the precision size of die ontology 1 and springform band 2 is applicable to the spraying plating of high-accuracy lead frame; Add springform band 2 between lead frame 3 and the die ontology 1, phenomenon such as plating leakage and plating bath seepage when utilizing the performances such as ductility of elastic silica gel to prevent spraying plating.
The size of spray hole 11, springform band 2 and spraying plating mouth 21 can change according to the size shape in lead frame spraying plating zone among the present invention.
The preferred size of spray hole 11 is 2 millimeters of length among the present invention, and is wide 1.15 millimeters, and the preferred size of springform band 2 is 12.2 millimeters of length, and 7.2 millimeters of width, the preferred size of the spraying plating mouth 21 on the springform band 2 are 2.3 millimeters of length, 1.35 millimeters of width.
During use, in the positioning pin 22 insertion mould band pilot holes 12 with springform band 2 springform band 2 is positioned in the mould band chamber 14, spray hole 11 aligns with spraying plating hole 12 and communicates simultaneously; Lead frame 3 is sleeved on the positioning module nail 4, making needs galvanized functional zone relative with spraying plating hole 12 with spray hole 11 on the lead frame 3 again, entire die body 1 is sleeved on sprays on the disk 5 again; The periphery fan that sprays disk 5 is to being distributed with a plurality of jet holes 51, and the part that lead frame 3 is installed on jet hole 51 and the die ontology 1 is relative, when the volume to volume lead frame is electroplated; When lead frame 3 passes through mould; Spray disk 5 work, with electroplate liquid directive spray hole 11 and spraying plating hole 12, electroplate liquid just contacts with the functional zone of lead frame 3; Through electric current, just can accomplish accurate spraying plating simultaneously.
Claims (9)
1. plating mould that is used for high-accuracy selective electroplating; It is characterized in that: comprise trolley type die ontology (1) and be arranged on die ontology (1) periphery wall being used to hide the springform band (2) that lead frame (3) is gone up the electroless plating district; Circumferentially be provided with a plurality of spray holes (11) on the described die ontology (1); Described springform band (2) is provided with the spraying plating mouth (21) corresponding with described spray hole (11), circumferentially is provided with the locating device that lead frame (3) is fixed on springform band (2) periphery on the described die ontology (1).
2. a kind of plating mould that is used for high-accuracy selective electroplating according to claim 1; It is characterized in that circumferentially being provided with on the described die ontology (1) annular groove (13); Be provided with mould band chamber (14) in the described annular groove (13); Described spray hole (11) is arranged in the described mould band chamber (14), and described locating device is arranged in the described annular groove (13).
3. a kind of plating mould that is used for high-accuracy selective electroplating according to claim 2; It is characterized in that each described spray hole (11) both sides is provided with mould band pilot hole (12), described springform band (2) is provided with the positioning pin (22) that can insert mould band pilot hole (12).
4. a kind of plating mould that is used for high-accuracy selective electroplating according to claim 3; The quantity that it is characterized in that described springform band (2) is identical with the quantity of described spray hole (11); Each described springform band (2) comprises shelterarea (23); The periphery of described shelterarea (23) is provided with the spacing preiection (24) of assist location lead frame (3), and described spraying plating mouth (21) is arranged on a side of spacing preiection (24).
5. a kind of plating mould that is used for high-accuracy selective electroplating according to claim 2; It is characterized in that described locating device comprise be arranged in the described annular groove (13), the lead frame pilot hole (15) of mouth spray (11) one sides, be provided with the positioning module nail (4) that stretches out location lead frame (3) to die ontology (1) periphery in the described lead frame pilot hole (15).
6. a kind of plating mould that is used for high-accuracy selective electroplating according to claim 5 is characterized in that described positioning module nail (4) is cone shape pottery nail for external part.
7. according to each described a kind of plating mould that is used for high-accuracy selective electroplating among the claim 1-6, the size that it is characterized in that described spray hole (11) is a length 1-3 millimeter, width 1-1.5 millimeter.
8. according to each described a kind of plating mould that is used for high-accuracy selective electroplating among the claim 1-6; The size that it is characterized in that described springform band (2) is a length 10-15 millimeter; Width 6-8 millimeter; Spraying plating mouth (21) size on the said springform band (2) is a length 1-3 millimeter, width 1-1.6 millimeter.
9. a kind of plating mould that is used for high-accuracy selective electroplating according to claim 3 is characterized in that the positioning pin (22) on each said springform band (2) is two, and is corresponding with two mould band pilot holes (12) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210289637.8A CN102817052B (en) | 2012-08-15 | 2012-08-15 | A kind of plating mould for high-accuracy selective electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210289637.8A CN102817052B (en) | 2012-08-15 | 2012-08-15 | A kind of plating mould for high-accuracy selective electroplating |
Publications (2)
| Publication Number | Publication Date |
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| CN102817052A true CN102817052A (en) | 2012-12-12 |
| CN102817052B CN102817052B (en) | 2015-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210289637.8A Active CN102817052B (en) | 2012-08-15 | 2012-08-15 | A kind of plating mould for high-accuracy selective electroplating |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103938234A (en) * | 2014-04-02 | 2014-07-23 | 曲悦峰 | Sealing structure of electroplating mould |
| CN106521585A (en) * | 2016-12-21 | 2017-03-22 | 昆山鼎工业科技有限公司 | Half-body type integrated circuit lead frame selective electroplating jig |
| CN106757226A (en) * | 2017-01-11 | 2017-05-31 | 吉林大学 | It is a kind of to prevent profiling fluidic device of plated item upper Positioning holes plating leakage and application thereof |
| CN108004572A (en) * | 2018-01-10 | 2018-05-08 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating mold |
| CN108385145A (en) * | 2018-05-24 | 2018-08-10 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating device |
| CN112725853A (en) * | 2021-01-27 | 2021-04-30 | 新恒汇电子股份有限公司 | Method for selectively electroplating intelligent card carrier band |
| CN114645303A (en) * | 2022-02-18 | 2022-06-21 | 深圳市长龙点金科技有限公司 | Application of point-to-point mask belt on noble metal coating die |
Citations (5)
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|---|---|---|---|---|
| JPH10183390A (en) * | 1996-12-25 | 1998-07-14 | Nikko Kinzoku Kk | Pattern plating method for long-sized metallic strip |
| WO2006108140A1 (en) * | 2005-04-06 | 2006-10-12 | Leviton Manufacturing Co., Inc. | Continuous plating system and method with mask registration |
| CN201301352Y (en) * | 2008-10-21 | 2009-09-02 | 宁波康强电子股份有限公司 | Plating die of lead frame |
| CN102191521A (en) * | 2011-05-24 | 2011-09-21 | 厦门永红科技有限公司 | Electroplating device for lead wire framework |
| CN202830196U (en) * | 2012-08-15 | 2013-03-27 | 中山品高电子材料有限公司 | Lead frame electroplating die for part spraying |
-
2012
- 2012-08-15 CN CN201210289637.8A patent/CN102817052B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10183390A (en) * | 1996-12-25 | 1998-07-14 | Nikko Kinzoku Kk | Pattern plating method for long-sized metallic strip |
| WO2006108140A1 (en) * | 2005-04-06 | 2006-10-12 | Leviton Manufacturing Co., Inc. | Continuous plating system and method with mask registration |
| CN201301352Y (en) * | 2008-10-21 | 2009-09-02 | 宁波康强电子股份有限公司 | Plating die of lead frame |
| CN102191521A (en) * | 2011-05-24 | 2011-09-21 | 厦门永红科技有限公司 | Electroplating device for lead wire framework |
| CN202830196U (en) * | 2012-08-15 | 2013-03-27 | 中山品高电子材料有限公司 | Lead frame electroplating die for part spraying |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103938234A (en) * | 2014-04-02 | 2014-07-23 | 曲悦峰 | Sealing structure of electroplating mould |
| CN103938234B (en) * | 2014-04-02 | 2016-09-14 | 深圳市长龙点金科技有限公司 | A kind of electroplating mold seals structure |
| CN106521585A (en) * | 2016-12-21 | 2017-03-22 | 昆山鼎工业科技有限公司 | Half-body type integrated circuit lead frame selective electroplating jig |
| CN106757226A (en) * | 2017-01-11 | 2017-05-31 | 吉林大学 | It is a kind of to prevent profiling fluidic device of plated item upper Positioning holes plating leakage and application thereof |
| CN108004572A (en) * | 2018-01-10 | 2018-05-08 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating mold |
| CN108385145A (en) * | 2018-05-24 | 2018-08-10 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating device |
| CN112725853A (en) * | 2021-01-27 | 2021-04-30 | 新恒汇电子股份有限公司 | Method for selectively electroplating intelligent card carrier band |
| CN112725853B (en) * | 2021-01-27 | 2022-09-09 | 新恒汇电子股份有限公司 | Method for selectively electroplating intelligent card carrier band |
| CN114645303A (en) * | 2022-02-18 | 2022-06-21 | 深圳市长龙点金科技有限公司 | Application of point-to-point mask belt on noble metal coating die |
Also Published As
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|---|---|
| CN102817052B (en) | 2015-08-26 |
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