CN201301352Y - Plating die of lead frame - Google Patents
Plating die of lead frame Download PDFInfo
- Publication number
- CN201301352Y CN201301352Y CNU2008201666607U CN200820166660U CN201301352Y CN 201301352 Y CN201301352 Y CN 201301352Y CN U2008201666607 U CNU2008201666607 U CN U2008201666607U CN 200820166660 U CN200820166660 U CN 200820166660U CN 201301352 Y CN201301352 Y CN 201301352Y
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- CN
- China
- Prior art keywords
- lead frame
- die ontology
- plating
- insulation layer
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a plating die of a lead frame, which comprises a roller-type die body 1 provided with a through-hole 2, wherein, a plating solution passes through the through-hole; the die body 1 is made of alloy steel; and an insulation layer 3 is arranged on the surface of the die body 1. The plating die of the lead frame has high plating precision and little possibility of deformation.
Description
Technical field
The utility model relates to plating mould, specifically is a kind of lead frame plating mould.
Background technology
Lead frame is a kind of semiconductor encapsulated element, is generally sheet metal or strip.In the lead frame plating production process of volume to volume, need use a kind of trolley type plating mould, utilize plating mould to cover on the lead frame earlier and do not need galvanized part, electroplate liquid is electroplated the galvanized part of needs by the through hole on the die ontology, like this regional area is carried out selective electroplating.
The trolley type plating mould generally selects for use the PEEK resin and plastic to process at present.But there is following shortcoming in the trolley type plating mould of prior art: can produce heat in electroplating process, because the thermal expansivity of PEEK resin and plastic is 2～3 times of the lead frames that are made of metal, can the precision of plating area be produced a very large impact like this.Because the non-deformability of PEEK resin and plastic is not ideal enough, after using certain time limit or after being subjected to heavier physical shock, will be out of shape again, make plating mould precision out of hand.
The utility model content
The technical problems to be solved in the utility model is to provide a kind of plating precision height, on-deformable lead frame plating mould.
The technical solution of the utility model is, provide a kind of lead frame plating mould: comprise being provided with the trolley type die ontology that can pass through the through hole of electroplate liquid with following structure, the die ontology of described die ontology for being made by steel alloy, the surface of described die ontology is provided with insulation layer.
After adopting above structure, the utility model compared with prior art has the following advantages: because the die ontology of described die ontology for making by steel alloy, its thermal expansivity with metal lead frame is arranged near 1 to 1, make plating precision height; And the non-deformability of steel alloy is strong, is not subject to the influence of working life or physical shock and is out of shape.In electroplating process, plating mould requires insulation, and is conducted electricity by the die ontology that steel alloy is made, so the surface of die ontology is provided with insulation layer.
As improvement, described insulation layer is the nano ceramics insulating coating, makes insulation effect better, and can guarantee high thermal resistance, chemical stability and the wear resistance of mould.
Description of drawings
Accompanying drawing 1 is the structural representation of lead frame plating mould of the present utility model.
As shown in the figure: 1, die ontology, 2, through hole, 3, insulation layer.
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
As shown in Figure 1 and Figure 2, lead frame plating mould of the present utility model, comprise being provided with the trolley type die ontology 1 that can pass through the through hole 2 of electroplate liquid, the die ontology of described die ontology 1 for making by steel alloy, the surface of described die ontology 1 is provided with insulation layer 3.
Described steel alloy is preferably bearing steel, and described bearing steel can be selected high carbon chromium GCr9, high carbon chromium GCr15 or the stainless 9Cr18Mo of high carbon chromium for use.
Described insulation layer 3 is the nano ceramics insulating coating, and described nano ceramics insulating coating can be selected titanium dioxide TiO for use
2, aluminium sesquioxide Al
2O
3The perhaps matrix material of the two.
Below only just the preferred plan of the utility model example is described, but can not be interpreted as it is restriction claim.The utility model not only is confined to above embodiment; it specifically allows multiple variation; steel alloy as described also can be selected stainless steel, duriron, wear resisting steel, high temperature steel, alloy tool steel or the like; insulation layer as described also can be selected silicon steel sheet insulating coating or the like; other the coating that can reach electric insulating effect is also passable, and these change all within protection domain of the present utility model.
Claims (2)
1, a kind of lead frame plating mould, comprise the trolley type die ontology (1) that is provided with through hole (2) that can be by electroplate liquid, it is characterized in that: the die ontology of described die ontology (1) for being made by steel alloy, the surface of described die ontology (1) is provided with insulation layer (3).
2, lead frame plating mould according to claim 1 is characterized in that: described insulation layer (3) is the nano ceramics insulating coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201666607U CN201301352Y (en) | 2008-10-21 | 2008-10-21 | Plating die of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201666607U CN201301352Y (en) | 2008-10-21 | 2008-10-21 | Plating die of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201301352Y true CN201301352Y (en) | 2009-09-02 |
Family
ID=41084975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201666607U Expired - Lifetime CN201301352Y (en) | 2008-10-21 | 2008-10-21 | Plating die of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201301352Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102373496A (en) * | 2011-11-04 | 2012-03-14 | 符士正 | Electrode for mold electroplating and process thereof |
| CN102080243B (en) * | 2009-11-30 | 2012-05-23 | 曲悦峰 | Adjustable strip-plating die |
| CN102817052A (en) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | Electroplating mold for electroplating with characteristics of high precision and selectivity |
-
2008
- 2008-10-21 CN CNU2008201666607U patent/CN201301352Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102080243B (en) * | 2009-11-30 | 2012-05-23 | 曲悦峰 | Adjustable strip-plating die |
| CN102373496A (en) * | 2011-11-04 | 2012-03-14 | 符士正 | Electrode for mold electroplating and process thereof |
| CN102373496B (en) * | 2011-11-04 | 2015-04-01 | 符士正 | Electrode for mold electroplating and process thereof |
| CN102817052A (en) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | Electroplating mold for electroplating with characteristics of high precision and selectivity |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090902 |