CN108004572A - Multi-row lead frame frame electroplating mold - Google Patents
Multi-row lead frame frame electroplating mold Download PDFInfo
- Publication number
- CN108004572A CN108004572A CN201810022440.5A CN201810022440A CN108004572A CN 108004572 A CN108004572 A CN 108004572A CN 201810022440 A CN201810022440 A CN 201810022440A CN 108004572 A CN108004572 A CN 108004572A
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- China
- Prior art keywords
- lead frame
- spraying plating
- die ontology
- electroplating
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000009713 electroplating Methods 0.000 title claims abstract description 67
- 238000007747 plating Methods 0.000 claims abstract description 91
- 238000005507 spraying Methods 0.000 claims abstract description 57
- 239000012530 fluid Substances 0.000 claims abstract description 31
- 230000000694 effects Effects 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of multi-row lead frame frame electroplating mold, including at least two rows of mould nail groups that die ontology, some annulars for being arranged on die ontology periphery wall are drawn film strips and are disposed on die ontology periphery wall；The periphery wall of die ontology is equipped with some groups of spaced annularly plating areas, and every group of electroplating region includes two spaced spraying plating areas, multiple spraying plating holes being circumferentially with spraying plating area；Draw film strips correspondence to be fitted in spraying plating area, draw and multiple fluid holes are circumferentially with film strips, fluid hole is corresponding with the spraying plating hole；Between mould nail group is located at per Liang Zu annularly platings area, often arranges mould nail group and followed closely including some along the circumferentially spaced mould of die ontology.Above-mentioned multi-row lead frame frame electroplating mold, which leads to, can complete the plating plating of multi-row lead frame frame at the same time, effectively improve the electroplating efficiency of lead frame, and electroplating cost reduces；By setting mould nail group between every two groups of electroplating regions, be conducive to improve the electroplating effect of lead frame.
Description
Technical field
The present invention relates to lead frame electroplating technology apparatus field, more particularly to a kind of multi-row lead frame frame electroplating mould
Tool.
Background technology
Chip carrier of the lead frame as integrated circuit, is a kind of real by means of bonding material (spun gold, aluminium wire, copper wire)
The electrical connection of existing chip internal circuits exit and outer lead, forms the key structure part of electric loop, it is played and outside
The function served as bridge of portion conducting wire connection, is required for use lead frame in most semiconductor integrated blocks, is that electronic information is produced
Important basic material in industry.In order to ensure the load in packaging technology, bonding performance, make chip and welding wire and lead frame shape
Into good Diffusion Welding, it is necessary to which load, bond area (on terminal pin and island) in lead frame carry out special table
Surface treatment, is exactly lead frame plating.
At present for lead frame field of electroplating, point overall full plating and selective area's property are electroplated.Selective area's property electricity
Plating is that the functional areas on a lead frame are electroplated, lead frame selective electroplating generally in disc type electroplating mold into
OK, lead frame is tightly around on electroplating mold, and then anode nozzle sprays electroplate liquid, by the plating position of electroplating mold to drawing
Electroplated functional areas on wire frame.
Traditional electroplating mold can only once electroplate single or double lead frame, it is impossible to while electroplate multi-row lead frame
Frame, causes lead frame electroplating efficiency low, and electroplating cost is high.
The content of the invention
Based on this, it is necessary to single or double lead frame can only be once electroplated for prior art electroplating mold, no
Multi-row lead frame frame can be electroplated at the same time, causes the problem of lead frame electroplating efficiency is low, and electroplating cost is high, there is provided one kind is multiple rows of to draw
Wire frame electroplating mold, can electroplate multi-row lead frame frame at the same time, and lead frame electroplating efficiency is high, and electroplating cost is low.
A kind of multi-row lead frame frame electroplating mold, if including die ontology, being arranged on the die ontology periphery wall
Dry annular draws film strips and at least two rows of mould nail groups being disposed on the die ontology periphery wall；The die ontology
Periphery wall be equipped with some groups of spaced annularly plating areas, electroplating region described in every group includes two spaced annular sprays
Area is plated, multiple spraying plating holes are circumferentially with the spraying plating area；The film strips correspondence of drawing is fitted in the spraying plating area, described to draw film
Take and be circumferentially with multiple fluid holes, the fluid hole is corresponding with the spraying plating hole；The mould nail group is positioned at every two groups annulars
Between electroplating region, often arrange the mould nail group and followed closely including some along the circumferentially spaced mould of die ontology.
Above-mentioned multi-row lead frame frame electroplating mold is by that in some groups of electroplating regions of die ontology, can complete multiple rows of lead at the same time
Frame plating plating, effectively improves the electroplating efficiency of lead frame, and electroplating cost reduces；By being set between every two groups of electroplating regions
Mould nail group is put, multi-row lead frame frame can be made to be fitted closely with die ontology, prevent electroplate liquid from leaking, is conducive to improve lead frame
Electroplating effect；Drawing the setting of film strips can make plating area plating area small, coating sharpness of border, the plating on guarantee lead frame
Uniformly, lead frame plating precision is high for layer.
In one of the embodiments, the mould nail respectively arranged in the mould nail group corresponds setting from each other.
In one of the embodiments, the die ontology periphery wall is equipped with least two annular mounting surfaces, the peace
Between annularly plating area described in every two groups, the mould nail group is located on the mounting surface in dress face.
In one of the embodiments, some spaced slots are circumferentially with the mounting surface, the mould nail is worn
If the slot and extending the die ontology periphery wall.
In one of the embodiments, the mould nail is set for cylinder, and the mould is followed closely away from the die ontology
One end is the frustum of a cone.
In one of the embodiments, the outer surface of the outer surface for drawing film strips and the die ontology is in same arc
Face.
In one of the embodiments, the both sides in the spraying plating area are equipped with card slot, and the card slot has body along the film
Circumferentially disposed, the internal perisporium both sides for drawing film strips are provided with strip, and strip card corresponding with the card slot is set.
In one of the embodiments, the spraying plating hole is provided at both ends with convex block, and the internal perisporium for drawing film strips corresponds to
The both ends of the fluid hole are equipped with groove, and groove card corresponding with the convex block is set.
In one of the embodiments, the arc length of the fluid hole is equal with the arc length in the spraying plating hole, the fluid hole
Width be less than the spraying plating hole width.
In one of the embodiments, the arc length value in the spraying plating hole is 2.25mm-2.35mm, the spraying plating hole
Width range value is 0.87mm-0.97mm；The arc length value of the fluid hole is 2.25mm-2.35mm, the fluid hole
Width range value is 0.77mm-0.92mm.
Brief description of the drawings
Fig. 1 is the assembling figure of the multi-row lead frame frame electroplating mold of the better embodiment of the present invention；
Fig. 2 is the exploded view of the multi-row lead frame frame electroplating mold of Fig. 1；
Fig. 3 is enlarged drawing at the A of the multi-row lead frame frame electroplating mold of Fig. 2；
Fig. 4 is enlarged drawing at the B of the multi-row lead frame frame electroplating mold of Fig. 2；
Fig. 5 is enlarged drawing at the C of the multi-row lead frame frame electroplating mold of Fig. 2；
Fig. 6 is enlarged drawing at the D of the multi-row lead frame frame electroplating mold of Fig. 2；
Fig. 7 is that the mould of the multi-row lead frame frame electroplating mold of Fig. 2 follows closely enlarged drawing；
The implication of each label is in attached drawing：
Die ontology 10, ring baffle 11, the first guide surface 12, mounting surface 13, slot 14, annular groove 15, second is oriented to
Face 16；
Electroplating region 20, spraying plating area 30, spraying plating hole 31, card slot 32, convex block 33；
Draw film strips 40, fluid hole 41, strip 42, groove 43；
Mould nail 50, the frustum of a cone 51.
Embodiment
For the ease of understanding the present invention, the present invention will be described more fully below.But the present invention can be with perhaps
More different form is realized, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is to make
Understanding more thorough and comprehensive to the disclosure.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood implication of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element be referred to as " directly existing " another element " on " when,
There is no intermediary element.Term as used herein " vertically ", " horizontal ", "left", "right" and similar statement are
For illustrative purposes.
Please refer to Fig.1 to Fig. 7, for the multi-row lead frame frame electroplating mold of a better embodiment of the invention, including mould
Body 10, some annulars being arranged on 10 periphery wall of die ontology are drawn film strips 40 and are disposed on outside die ontology 10
At least two rows of mould nail groups on perisporium.The periphery wall of die ontology 10 is equipped with some groups of spaced annularly plating areas 20, often
Group electroplating region 20 includes two spaced annular spraying plating areas 30, multiple spraying plating holes 31, spraying plating being circumferentially with spraying plating area 30
Hole 31 is sprayed for electroplate liquid on injection disk；Draw film strips 40 and correspond to and be fitted in spraying plating area 30, that is, draw the inner surfaces of film strips 40 with
Spraying plating area 30 fits closely, draw film strips 40 outer surface be used for be bonded lead frame, draw be circumferentially with film strips 40 it is multiple go out liquid
Hole 41, fluid hole 41 is corresponding with spraying plating hole 31, and the electroplate liquid that fluid hole 41 is used to spray disk ejection with spraying plating hole 31 passes through
Then the lead frame being bonded with drawing film strips 40 is sprayed to.Between mould nail group is located at per Liang Zu annularly platings area 20, mould nail group is often arranged
50 are followed closely along 10 circumferentially spaced mould of die ontology including some, mould nail 50 is used to wear the location hole on lead frame to determine
Position lead frame.
Please refer to Fig.1 to Fig. 3, die ontology 10 and set in circular ring type, the opposite end of die ontology 10, which is provided with, to be equipped with
Ring baffle 11, prevents electroplate liquid annularly plating area 20 between second ring baffle 11；The inner wall of ring baffle 11 has the
One guide surface 12, the first guide surface 12 are inclined plane, and the setting of the first guide surface 12 is easily installed lead frame and pressure zone.Mould
Have 10 periphery wall of body and be equipped with least two annular mounting surfaces 13, between mounting surface 13 is located at per Liang Zu annularly platings area 20,
Mould nail group is located on mounting surface 13, and some spaced slots 14 are circumferentially with mounting surface 13, and slot 14 is used to install mould
Nail 50, in the present embodiment, slot 14 are set to be circular, in other embodiments, easy to firm installation mould nail 50, slot 14
Can be that hexagon is set；When mould nail 50 is worn, so as to be replaced, be conducive to extend the use of the electroplating mold
In the service life, reduce production cost.
Please refer to Fig.4, the position that 10 internal perisporium of die ontology corresponds to spraying plating area 30 is equipped with annular groove 15, and arc groove 15 is used for
Card sets extraneous injection disk, spraying plating hole 31 in injection disk alignment spraying plating area 30 is carried out accurate spraying plating, is conducive to improve lead
Frame electroplating effect.The both sides that die ontology 10 corresponds to annular groove 15 are equipped with the second guide surface 16, and in this embodiment, second is oriented to
Face 16 is inclined plane, and in one embodiment, the second guide surface 16 can also be outer convex globoidal, and the setting of the second guide surface 16 is just
In the external world, injection disk is caught in annular groove 15.
In the present embodiment, the arc length value in spraying plating hole 31 is 2.25mm-2.35mm, the width range value in spraying plating hole 31
For 0.87mm-0.97mm；Preferably, the arc length value in spraying plating hole 31 is 2.3mm, and the width value in spraying plating hole 31 is 0.92mm.Spraying plating
The both sides in area 30 are equipped with card slot 32, and card slot 32 is circumferentially disposed along film tool body 10, and card slot 32, which is used to house, draws film strips 40.Spraying plating
Hole 31 is provided at both ends with convex block 33, and convex block 33 is set for card draws film strips 40, while prevents electroplate liquid between adjacent spray hole 31
Interfere with each other and cause to leak, influence the electroplating effect of lead frame.
Please refer to Fig.1 and 2, drawing the setting of film strips 40 can make that plating area plating area is small, and coating sharpness of border, ensures to draw
Coating on wire frame is uniform, and lead frame plating precision is high.When drawing film strips 40 and being fitted in spraying plating area 30, draw the outer of film strips 40
The outer surface of surface and die ontology 10 is in same cambered surface so that lead frame integrally can be tight with 10 periphery wall of die ontology
Closely connected conjunction, prevents electroplate liquid from preventing from leaking.The material that film strips 40 are drawn in face is room temperature vulcanized sili cone rubber (abbreviation RTV silica gel), room
Warm vulcanization type silicon rubber has the performances such as good elasticity and ductility, enables to draw between film strips 40 and die ontology 10 and draw
Fitted closely between film strips 40 and lead frame, further prevent electroplate liquid from leaking.In the present embodiment altogether, the width of film strips 40 is drawn
Angle value is 3.15mm-3.25mm, it is preferable that the width value for drawing film strips 40 is 3.2mm.In the present embodiment, fluid hole 41 is square
Shape hole, the arc length of fluid hole 41 is equal with the arc length in spraying plating hole 31, and the width of fluid hole 41 is less than the width in spraying plating hole 31, can have
Effect improves the plating precision of lead frame；Specifically, the arc length value of fluid hole 41 is 2.25mm-2.35mm, fluid hole 41
Width range value be 0.77mm-0.92mm；Preferably, the arc length value of fluid hole 41 is 2.3mm, and the width value of fluid hole 41 is
0.88mm.Fig. 5 and 6 is refer to, the internal perisporium both sides for drawing film strips 40 are provided with strip 42, corresponding with spraying plating area 30 when drawing film strips 40
During fitting installation, strip 42 is set with 32 corresponding card of card slot.The internal perisporium for drawing film strips 40 corresponds to the both ends of fluid hole 41 and is equipped with groove
43, when draw film strips 40 it is corresponding with spraying plating area 30 fitting installation when, groove 43 is set with 33 corresponding card of convex block.
In the present invention, spraying plating hole 31, the size drawing film strips 40 and draw film strips 40 and shape can be electroplated according to lead frame
The size and shape in area and change.
Fig. 7 is refer to, mould nail 50 wears slot 14 and extends 10 periphery wall of die ontology, each mould nail arranged in mould nail group
50 correspond setting from each other, ensure that lead frame keeps uniform force in plating, avoid lead frame from electroplating
Deform in journey and further prevent electroplate liquid from leaking.And two in each row's mould nail group correspond to mould and follow closely the distance between 50 value ranges
For 23.45mm-23.55mm, it is preferable that the distance between 50 value of two correspondence mould nails in each row's mould nail group is 23.50mm.Mould is followed closely
50 material is ceramics.In the present embodiment, mould nail 50 is set for cylinder, and 50 one end away from die ontology 10 of mould nail are
The frustum of a cone 51, easy to wear the location hole on lead frame.
The multi-row lead frame frame electroplating mold in use, draw film strips 40 correspond to be fitted in spraying plating area 30, fluid hole 41 with
Spraying plating hole 31 corresponds to and communicates；Multiple multi-row lead frame framves are connected to form multi-row lead frame frame one by one by tiny company's muscle, multiple rows of
Positioning on lead frame is set on mould nail 50, and multi-row lead frame frame is fitted closely with 10 periphery wall of die ontology, Duo Paiyin
Need the functional areas electroplated opposite with fluid hole 41 and spraying plating hole 31 on wire frame；Die ontology 10 is sleeved on injection disk,
The spray-hole 51 sprayed on disk 5 is opposite with fluid hole 41 and spraying plating hole 31, when volume to volume lead frame is electroplated, multiple rows of lead
When frame is by the electroplating mold, pressure zone is moved with the transmission of lead frame to be covered on the lead frames, sprays disk work
Make, electroplate liquid is contacted through fluid hole 41 and spraying plating hole 31 with functional areas on lead frame, while by electric current, so that at the same time
Complete the plating of multi-row lead frame frame.
The multi-row lead frame frame electroplating mold of the present invention by that in some groups of electroplating regions of die ontology, can complete multiple rows of at the same time
Lead frame plating plating, effectively improves the electroplating efficiency of lead frame, and electroplating cost reduces.By every two groups of electroplating regions it
Between set mould nail group, multi-row lead frame frame can be made to be fitted closely with die ontology, prevent electroplate liquid from leaking, be conducive to raising lead
The electroplating effect of frame；Drawing the setting of film strips can make plating area plating area small, coating sharpness of border, on guarantee lead frame
Coating it is uniform, lead frame plating precision is high.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously
Cannot therefore it be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of multi-row lead frame frame electroplating mold, it is characterised in that including die ontology, be arranged on the die ontology periphery
Some annulars on wall draw film strips and at least two rows of mould nail groups being disposed on the die ontology periphery wall；It is described
The periphery wall of die ontology is equipped with some groups of spaced annularly plating areas, and electroplating region described in every group includes two interval settings
Annular spraying plating area, be circumferentially with multiple spraying plating holes in the spraying plating area；The film strips correspondence of drawing is fitted in the spraying plating area,
It is described draw multiple fluid holes are circumferentially with film strips, the fluid hole is corresponding with the spraying plating hole；The mould nail group is positioned at every
Between Liang Zu annularly platings area, often arrange the mould nail group and followed closely including some along the circumferentially spaced mould of die ontology.
2. multi-row lead frame frame electroplating mold according to claim 1, it is characterised in that：Respectively arrange the institute in the mould nail group
State mould nail and correspond setting from each other.
3. multi-row lead frame frame electroplating mold according to claim 1, it is characterised in that：On the die ontology periphery wall
Equipped with least two annular mounting surfaces, between annularly plating area described in every two groups, the mould nail group is located at the mounting surface
On the mounting surface.
4. multi-row lead frame frame electroplating mold according to claim 3, it is characterised in that：It is circumferentially with the mounting surface
Some spaced slots, the mould nail wear the slot and extend the die ontology periphery wall.
5. multi-row lead frame frame electroplating mold according to claim 4, it is characterised in that：The mould nail sets for cylinder
Put, and the one end of mould nail away from the die ontology is the frustum of a cone.
6. multi-row lead frame frame electroplating mold according to claim 1, it is characterised in that：The outer surface for drawing film strips with
The outer surface of the die ontology is in same cambered surface.
7. multi-row lead frame frame electroplating mold according to claim 1, it is characterised in that：The both sides in the spraying plating area are equipped with
Card slot, the card slot is circumferentially disposed along film tool body, and the internal perisporium both sides for drawing film strips are provided with strip, the card
Bar card corresponding with the card slot is set.
8. the multi-row lead frame frame electroplating mold according to claim 1 or 7, it is characterised in that：The both ends in the spraying plating hole
Convex block is provided with, the both ends that the internal perisporium for drawing film strips corresponds to the fluid hole are equipped with groove, the groove and the convex block
Corresponding card is set.
9. multi-row lead frame frame electroplating mold according to claim 1, it is characterised in that：The arc length of the fluid hole and institute
State that the arc length in spraying plating hole is equal, the width of the fluid hole is less than the width in the spraying plating hole.
10. multi-row lead frame frame electroplating mold according to claim 9, it is characterised in that：The arc length model in the spraying plating hole
It is 2.25mm-2.35mm to enclose value, and the width range value in the spraying plating hole is 0.87mm-0.97mm；The arc length model of the fluid hole
It is 2.25mm-2.35mm to enclose value, and the width range value of the fluid hole is 0.77mm-0.92mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810022440.5A CN108004572A (en) | 2018-01-10 | 2018-01-10 | Multi-row lead frame frame electroplating mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810022440.5A CN108004572A (en) | 2018-01-10 | 2018-01-10 | Multi-row lead frame frame electroplating mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108004572A true CN108004572A (en) | 2018-05-08 |
Family
ID=62050069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810022440.5A Pending CN108004572A (en) | 2018-01-10 | 2018-01-10 | Multi-row lead frame frame electroplating mold |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108385145A (en) * | 2018-05-24 | 2018-08-10 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating device |
| CN110484948A (en) * | 2019-09-27 | 2019-11-22 | 江苏澳光电子有限公司 | A kind of cylindrical body electroplating technology and its electroplated structural |
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| CN203999863U (en) * | 2014-07-15 | 2014-12-10 | 中山品高电子材料有限公司 | A kind of Novel lead frame plating mould |
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| KR19990018672U (en) * | 1997-11-13 | 1999-06-05 | 유무성 | Lead Frame Plating Equipment |
| US20110227208A1 (en) * | 2008-09-25 | 2011-09-22 | Ji Yun Kim | Structure and Manufacture Method For Multi-Row Lead Frame and Semiconductor Package |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108385145B (en) * | 2018-05-24 | 2024-08-06 | 中山品高电子材料有限公司 | Multi-row lead frame electroplating equipment |
| CN110484948A (en) * | 2019-09-27 | 2019-11-22 | 江苏澳光电子有限公司 | A kind of cylindrical body electroplating technology and its electroplated structural |
| CN110484948B (en) * | 2019-09-27 | 2021-07-06 | 江苏澳光电子有限公司 | Cylindrical body electroplating process and electroplating structure thereof |
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