CN203999863U - A kind of Novel lead frame plating mould - Google Patents
A kind of Novel lead frame plating mould Download PDFInfo
- Publication number
- CN203999863U CN203999863U CN201420390939.9U CN201420390939U CN203999863U CN 203999863 U CN203999863 U CN 203999863U CN 201420390939 U CN201420390939 U CN 201420390939U CN 203999863 U CN203999863 U CN 203999863U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- plating
- band
- springform
- die ontology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims abstract description 95
- 238000005507 spraying Methods 0.000 claims abstract description 33
- 239000007921 spray Substances 0.000 claims abstract description 15
- 230000008719 thickening Effects 0.000 claims abstract description 14
- 210000002435 tendon Anatomy 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 3
- 229920006351 engineering plastic Polymers 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 101100400452 Caenorhabditis elegans map-2 gene Proteins 0.000 description 1
- 101150064138 MAP1 gene Proteins 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a kind of Novel lead frame plating mould, comprise trolley type die ontology and multiple springform band circumferentially arranging along described die ontology, on described die ontology, be circumferentially with the locating device that lead frame is fixed on to springform band periphery, the main points of its technical scheme are the spacing preiections that springform band comprises shelterarea and auxiliary positioning lead frame, on spacing preiection, be provided with main jet plating mouthful, described shelterarea is provided with two auxiliary spraying plating mouths that size is identical, on described die ontology, correspondence is provided with the spray hole corresponding with described main jet plating mouth and auxiliary spraying plating mouth, described main jet plating mouth and two described auxiliary spraying plating mouth edges are provided with the thickening layer that exceeds described springform band plane, between described auxiliary spraying plating mouth and described main jet plating mouth, be provided with wall, on described wall wall, between two described auxiliary spraying plating mouths, be provided with the fixing convex tendon that is triangle cylindricality.The utility model plating die of lead frame is electroplated rear coating functional area precision and can be doubled.
Description
[technical field]
The utility model relates to a kind of plating mould, especially relates to a kind of novel high-precision plating die of lead frame.
[background technology]
It is poor that common plating die of lead frame and mould band point plate the plating water level precision of controlling, the window design of the mould band using is simpler, also poor to the control of plating solution seepage, in electroplating process, conplane mould band is under the injection immersion of certain temperature plating solution and the extruding of pressure zone, mould band can produce deformation to a certain degree, cause pressure zone and the mould band can not perfect joint close, can not meet more and more high plating water level requirement, and the seepage of plating solution can cause consumption and the waste of more electroplating cost.
[utility model content]
The utility model object is to have overcome the deficiencies in the prior art, provides a kind of precision high, can prevent plating solution seepage, save and electroplate precious metal consumption, cost-saving Novel lead frame plating mould.
The utility model is achieved through the following technical solutions:
A kind of Novel lead frame plating mould, include trolley type die ontology 1 and multiple springform band 2 circumferentially arranging along described die ontology 1, on described die ontology 1, be circumferentially with the locating device that lead frame is fixed on to springform band 2 peripheries, it is characterized in that: described springform band 2 comprises the spacing preiection 22 of shelterarea 21 and auxiliary positioning lead frame, described spacing preiection 22 is provided with main jet plating mouth 3, described shelterarea 21 is provided with two auxiliary spraying plating mouths 4 that size is identical, on described die ontology 1, correspondence is provided with the spray hole 5 corresponding with described main jet plating mouth 3 and auxiliary spraying plating mouth 4, described main jet plating mouth 3 and two described auxiliary spraying plating mouth 4 edges are provided with the thickening layer 6 that exceeds described springform band 2 planes, between described auxiliary spraying plating mouth 4 and described main jet plating mouth 3, be provided with wall 7, on described wall 7 walls, between two described auxiliary spraying plating mouths 4, be provided with the fixing convex tendon 8 that is triangle cylindricality.
Novel lead frame plating mould as above, is characterized in that: described thickening layer 6 exceeds described springform band 2 plane 0.05-0.1 millimeters, the wide 0.3-0.5 millimeter of described thickening layer 6.
Novel lead frame plating mould as above, is characterized in that: described wall 7 thickness 0.4-0.6 millimeters.
Novel lead frame plating mould as above, it is characterized in that: the cross section of described fixing convex tendon 8 is right-angle triangle, the hypotenuse length of described right-angle triangle is 1.3 millimeters, and the square edge length that described right-angle triangle is positioned at described shelterarea 21 is 0.3-0.5 millimeter.
Novel lead frame plating mould as above, it is characterized in that: on described die ontology 1, be circumferentially with annular groove 9, in described annular groove 9, be provided with mould band chamber 10, described spray hole 5 is arranged in described mould band chamber 10, and described locating device is arranged in described annular groove 9.
Novel lead frame plating mould as above, is characterized in that: described spray hole 5 both sides are provided with mould band pilot hole 11, and described springform band 2 is provided with the positioning pin 12 that can insert mould band pilot hole 11.
Novel lead frame plating mould as above, it is characterized in that: described locating device comprises in the annular groove 9 described in being arranged on, the lead frame pilot hole 13 of spray hole 5 one sides, is provided with to die ontology 1 periphery and stretches out the positioning module nail 14 for locating lead frame in described lead frame pilot hole 13.
Novel lead frame plating mould as above, is characterized in that: described positioning module nail 4 is followed closely for external part is cone shape pottery.
Novel lead frame plating mould as above, is characterized in that: described springform band 2 materials are RTV silica gel.
Novel lead frame plating mould as above, is characterized in that: described die ontology 1 material is PEEK engineering plastics.
Compared with prior art, the utility model has the following advantages:
1, spraying plating mouth single prior art is divided into main jet plating mouth and auxiliary spraying plating mouth by the utility model, between described auxiliary spraying plating mouth and described main jet plating mouth, be provided with wall, on described wall wall, between two described auxiliary spraying plating mouths, be provided with the fixing convex tendon that is triangle cylindricality, and main jet plating mouth and auxiliary spraying plating mouth edge are provided with the thickening layer that exceeds springform band integral planar, position that can stable mode band spraying plating mouth, prevent that the colloidal silica of spraying plating mouth junction is by plating solution shock-produced deformation, cause the variation of electroplating water level, by above-mentioned comprehensive setting, the utility model plating die of lead frame is electroplated rear coating functional area can be accurate to 0.05mm, the tolerance range of the 0.1mm of more general mould doubles.
[brief description of the drawings]
Fig. 1 is the utility model stereographic map;
Fig. 2 is the utility model exploded view;
Fig. 3 is the stereographic map 1 of the utility model mould grain;
Fig. 4 is the stereographic map 2 of the utility model mould grain;
Fig. 5 is the enlarged view at A place in the utility model Fig. 1;
Fig. 6 is the enlarged view at B place in the utility model Fig. 2.
In figure; 1 is die ontology; 2 is springform band; 3 is main jet plating mouthful; 4 is auxiliary spraying plating mouth; 5 is spray hole; 6 is thickening layer; 7 is wall; 8 is fixing convex tendon; 9 is annular groove; 10 is mould band chamber; 11 is mould band pilot hole; 12 is positioning pin; 13 is lead frame pilot hole; 14 is positioning module nail; 21 is shelterarea; 22 is spacing preiection.
[embodiment]
Below in conjunction with accompanying drawing, the utility model is further described:
The utility model plating mould, the special tool that the lead frame to specific electron product (lead frame) selective electroplating uses on general volume to volume electroplating machine exactly.Include trolley type die ontology 1 and multiple springform band 2 circumferentially arranging along described die ontology 1, on described die ontology 1, be circumferentially with the locating device that lead frame is fixed on to springform band 2 peripheries, described springform band 2 comprises the spacing preiection 22 of shelterarea 21 and auxiliary positioning lead frame, described spacing preiection 22 is provided with main jet plating mouth 3, described shelterarea 21 is provided with two auxiliary spraying plating mouths 4 that size is identical, on described die ontology 1, correspondence is provided with the spray hole 5 corresponding with described main jet plating mouth 3 and auxiliary spraying plating mouth 4, described main jet plating mouth 3 and two described auxiliary spraying plating mouth 4 edges are provided with the thickening layer 6 that exceeds described springform band 2 planes, between described auxiliary spraying plating mouth 4 and described main jet plating mouth 3, be provided with wall 7, on described wall 7 walls, between two described auxiliary spraying plating mouths 4, be provided with the fixing convex tendon 8 that is triangle cylindricality.Prevent that wall 6 between main jet plating mouthfuls 3 and auxiliary spraying plating mouth 4 is too thin and impacted modification, but also play the effect of stablizing integral, flexible mould band 2.
Two described auxiliary spraying plating mouths 4 are identical with described main jet plating mouthful 3 shapes, just vary in size.And according to product difference, can also other shape, as trilateral, square etc.The thickening layer at two described auxiliary spraying plating mouth 4 edges is identical with the thickening layer at described main jet plating mouthful 3 edges.In the present embodiment, the distance between two described auxiliary spraying plating mouths 4 is 2.7 millimeters.The area of the Area Ratio spraying plating mouth 5 of described spray hole 4 is large, overflows with the seepage that prevents plating solution.
Described thickening layer 6 exceeds described springform band 2 plane 0.05-0.1 millimeters, described thickening layer 6 width 0.3-0.5 millimeters.
Described wall 7 thickness 0.4-0.6 millimeters.
The cross section of described fixing convex tendon 8 is right-angle triangle, and the hypotenuse length of described right-angle triangle is 1.3 millimeters, and the square edge length that described right-angle triangle is positioned at described shelterarea 21 is 0.3-0.5 millimeter.
On described die ontology 1, be circumferentially with annular groove 9, be provided with mould band chamber 10 in described annular groove 9, described spray hole 5 is arranged in described mould band chamber 10, and described locating device is arranged in described annular groove 9.
Described spray hole 5 both sides are provided with mould band pilot hole 11, and described springform band 2 is provided with the positioning pin 12 that can insert mould band pilot hole 11.
Described locating device comprises in the annular groove 9 described in being arranged on, the lead frame pilot hole 13 of spray hole 5 one sides, is provided with to die ontology 1 periphery and stretches out the positioning module nail 14 for locating lead frame in described lead frame pilot hole 13.
Described positioning module nail 4 is followed closely for external part is cone shape pottery.The utility model plating mould, is sealed the position that does not allow to electroplate exactly and exposes the region that will electroplate simultaneously with silica gel lead frame location by ceramic positioning module nail 14.
Described die ontology 1 material is PEEK engineering plastics, corrosion-resistant, high temperature resistant.
Described springform band 2 materials are RTV silica gel, and RTV silica gel has good electrical isolation and anti-electric-arc performance, nontoxic, pollution-free, corrosion-free, are applicable to-60 DEG C～200 DEG C working temperatures.Described die ontology 1 and springform band 2 all use import starting material to process, and ensure quality product and processing requirement.
Claims (10)
1. a Novel lead frame plating mould, include trolley type die ontology (1) and multiple springform band (2) circumferentially arranging along described die ontology (1), on described die ontology (1), being circumferentially with the locating device that lead frame is fixed on to springform band (2) periphery is characterized in that: described springform band (2) comprises the spacing preiection (22) of shelterarea (21) and auxiliary positioning lead frame, described spacing preiection (22) is provided with main jet plating mouthful (3), described shelterarea (21) is provided with two auxiliary spraying plating mouths (4) that size is identical, the upper correspondence of described die ontology (1) is provided with the spray hole (5) corresponding with described main jet plating mouthful (3) and auxiliary spraying plating mouth (4), described main jet plating mouthful (3) and two described auxiliary spraying plating mouths (4) edge are provided with the thickening layer (6) that exceeds described springform band (2) plane, between described auxiliary spraying plating mouth (4) and described main jet plating mouthful (3), be provided with wall (7), on described wall (7) wall, be positioned at and between two described auxiliary spraying plating mouths (4), be provided with the fixing convex tendon (8) that is triangle cylindricality.
2. Novel lead frame plating mould according to claim 1, it is characterized in that: described thickening layer (6) exceeds described springform band (2) plane 0.05-0.1 millimeter described thickening layer (6) width 0.3-0.5 millimeter.
3. Novel lead frame plating mould according to claim 1, is characterized in that: described wall (7) thickness 0.4-0.6 millimeter.
4. Novel lead frame plating mould according to claim 1, it is characterized in that: the cross section of described fixing convex tendon (8) is right-angle triangle, the hypotenuse length of described right triangular cross-sectional is 1.3 millimeters, and the square edge length that described trilateral is positioned at described shelterarea (21) is 0.3-0.5 millimeter.
5. Novel lead frame plating mould according to claim 1, it is characterized in that: on described die ontology (1), be circumferentially with annular groove (9), in described annular groove (9), be provided with mould band chamber (10), described spray hole (5) is arranged in described mould band chamber (10), and described locating device is arranged in described annular groove (9).
6. Novel lead frame plating mould according to claim 1, it is characterized in that: described spray hole (5) both sides are provided with mould band pilot hole (11), and described springform band (2) is provided with the positioning pin (12) that can insert mould band pilot hole (11).
7. Novel lead frame plating mould according to claim 5, it is characterized in that: described locating device comprises in the annular groove (9) described in being arranged on, the lead frame pilot hole (13) of spray hole (5) one sides, is provided with to die ontology (1) periphery and stretches out the positioning module nail (14) for locating lead frame in described lead frame pilot hole (13).
8. Novel lead frame plating mould according to claim 7, is characterized in that: described positioning module nail (4) is followed closely for external part is cone shape pottery.
9. Novel lead frame plating mould according to claim 1, is characterized in that: described springform band (2) material is RTV silica gel.
10. Novel lead frame plating mould according to claim 1, is characterized in that: described die ontology (1) material is PEEK engineering plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420390939.9U CN203999863U (en) | 2014-07-15 | 2014-07-15 | A kind of Novel lead frame plating mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420390939.9U CN203999863U (en) | 2014-07-15 | 2014-07-15 | A kind of Novel lead frame plating mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203999863U true CN203999863U (en) | 2014-12-10 |
Family
ID=52039891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420390939.9U Expired - Lifetime CN203999863U (en) | 2014-07-15 | 2014-07-15 | A kind of Novel lead frame plating mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203999863U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108004572A (en) * | 2018-01-10 | 2018-05-08 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating mold |
| CN108385145A (en) * | 2018-05-24 | 2018-08-10 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating device |
-
2014
- 2014-07-15 CN CN201420390939.9U patent/CN203999863U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108004572A (en) * | 2018-01-10 | 2018-05-08 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating mold |
| CN108385145A (en) * | 2018-05-24 | 2018-08-10 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141210 |