CN202830196U - Lead frame electroplating die for part spraying - Google Patents
Lead frame electroplating die for part spraying Download PDFInfo
- Publication number
- CN202830196U CN202830196U CN 201220403328 CN201220403328U CN202830196U CN 202830196 U CN202830196 U CN 202830196U CN 201220403328 CN201220403328 CN 201220403328 CN 201220403328 U CN201220403328 U CN 201220403328U CN 202830196 U CN202830196 U CN 202830196U
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- China
- Prior art keywords
- lead frame
- die
- plating
- band
- springform
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a lead frame electroplating die for a part spraying. The lead frame electroplating die for a part spraying comprises a roller type die body and an elastic die belt which is arranged on a peripheral wall of the die body and used for covering unplated parts on the lead frame. The die body is provided with a plurality of liquid-injection holes in a circumferential direction. The elastic die belt is provided with spraying mouths corresponding to the liquid-injection holes. The die body is provided in a circumferential direction with a locating device which is used for fixing the lead frame on the periphery of the elastic die belt. The lead frame electroplating die for a part spraying is characterized in that die pins and the accuracy elastic die belt are additionally arranged on the periphery of the die body, thereby enabling the spraying position region to be more accurate, measurement to be more precise, spraying area of the spraying region to be smaller, plating boundary to be more accurate and precision to be higher, thus nonuniform plating thickness and unclear layer boundary are avoided. The lead frame electroplating die for a part spraying is capable of accurately locating spraying region, thereby greatly reducing unnecessary loss and wastage of precious metal and saving cost.
Description
[technical field]
The utility model relates to a kind of plating die of lead frame, relates to particularly a kind of plating die of lead frame for local spraying plating.
[background technology]
At present in the electric blaster fuse frame field of electroplating, divide whole full the plating and the selective area plating, whole complete very simple mould or the very simple mould of not needing of plating step, a lot of products do not need whole the plating in fact, the slow low precision loss of whole electroplating velocity and waste and serious.
Selective electroplating is the plating mode of a kind of high speed, economy.Owing to can accomplish the autotelic selective electroplating in functional zone by plating mould and mask band precision-fit.The plating area is little, precision is high, can reach higher electroplating velocity.The precious metals such as saving gold and silver are saved 40% precious metal than the plating mode of before traditional complete gold-plated silver.In the past electric blaster fuse frame is electroplated great majority all without mould or simply block the bar plating mould that electroplate liquid is used, and the plating area is accurate not and have plating leakage and thickness of coating inhomogeneous like this, the phenomenon that the coating obscure boundary is clear.
[utility model content]
The technical problems to be solved in the utility model is to overcome the deficiencies in the prior art, provides a kind of precision high, saves and electroplates precious metal consumption, saves the plating die of lead frame that is used for local spraying plating of cost.
The utility model is for solving the problems of the technologies described above, by the following technical solutions:
A kind of plating die of lead frame for local spraying plating, it is characterized in that comprising the trolley type die ontology and being arranged on the springform band that the die ontology periphery wall is used for hiding electroless plating district on the lead frame, circumferentially be provided with a plurality of spray holes on the described die ontology, described springform band is provided with the spraying plating mouth corresponding with described spray hole, circumferentially is provided with the locating device that lead frame is fixed on springform band periphery on the described die ontology.
Aforesaid a kind of plating die of lead frame for local spraying plating, it is characterized in that circumferentially being provided with on the described die ontology annular groove, be provided with mould band chamber in the described annular groove, described spray hole is arranged in the described mould band chamber, and described locating device is arranged in the described annular groove.
Aforesaid a kind of plating die of lead frame for local spraying plating is characterized in that each described spray hole both sides is provided with mould band pilot hole, and described springform band is provided with the positioning pin that can insert mould band pilot hole.
Aforesaid a kind of plating die of lead frame for local spraying plating, the quantity that it is characterized in that described springform band is identical with the quantity of described spray hole, each described springform band comprises the shelterarea, the periphery of described shelterarea is provided with the spacing preiection of auxiliary positioning lead frame, and described spraying plating mouth is arranged on a side of spacing preiection.
Aforesaid a kind of plating die of lead frame for local spraying plating, it is characterized in that described locating device comprise be arranged in the described annular groove, the lead frame pilot hole of mouth spray one side, be provided with the positioning module nail that stretches out the location lead frame to the die ontology periphery in the described lead frame pilot hole.
Aforesaid a kind of plating die of lead frame for local spraying plating is characterized in that described positioning module nail is cone shape pottery nail for external part.
Aforesaid a kind of plating die of lead frame for local spraying plating, the size that it is characterized in that described spray hole are length 1-3 millimeter, width 1-1.5 millimeter.
Aforesaid a kind of plating die of lead frame for local spraying plating is characterized in that described springform band size is length 10-15 millimeter, width 6-8 millimeter, and the spraying plating mouth size on the described springform band is length 1-3 millimeter, width 1-1.6 millimeter.
The utility model compared with prior art has following advantage:
The utility model has added positioning module nail and accurate springform band in the die ontology periphery, so that the plating band of position is more accurate, size is more accurate.
The springform band is set between lead frame and die ontology, can makes the plating area electroplate that area is little, the coating sharpness of border, precision is high.Prevented that thickness of coating is inhomogeneous, the plating of layer border is unintelligible.
The utility model greatly reduces loss and the waste of unnecessary noble metal by the plating area, the dual accurate location of spraying plating mouth on the spray hole on the die ontology and the springform band, has saved cost.
The utility model cycle type streamline is electroplated, and electroplating velocity is fast and highly stable.
The utility model is electroplated the tolerance that precision can reach 0.05mm, is applicable to the requirement of high-accuracy lead frame.
[description of drawings]
Fig. 1 is the utility model three-dimensional structure diagram;
Fig. 2 is that the utility model uses state explosion figure;
Fig. 3 is the A place enlarged view of Fig. 2;
Fig. 4 is the B place enlarged view of Fig. 2;
Fig. 5 is one of mould band structure schematic diagram;
Fig. 6 is two of mould band structure schematic diagram;
Fig. 7 is that lead frame is positioned at the schematic diagram on the utility model;
Fig. 8 is the C place enlarged view of Fig. 7;
Fig. 9 is that the utility model uses view;
[embodiment]
Below in conjunction with accompanying drawing the utility model is described in detail:
Shown in Fig. 1-9, a kind of plating die of lead frame for local spraying plating, comprise trolley type die ontology 1 and be arranged on the springform band 2 that die ontology 1 periphery wall is used for hiding electroless plating district on the lead frame 3, circumferentially be provided with a plurality of spray holes 11 on the die ontology 1, be provided with the spraying plating mouth 21 corresponding with spray hole 11 at springform band 2, circumferentially be provided with the locating device that lead frame 3 is fixed on springform band 2 peripheries on the die ontology 1.
Described die ontology 1 is circular, on die ontology 1, circumferentially be provided with annular groove 13, be provided with mould band chamber 14 in the annular groove 13, spray hole 11 is arranged in the mould band chamber 14, each spray hole 11 both sides is provided with mould band pilot hole 12, mould band chamber 14 is one-body molded by die ontology 1 with mould band pilot hole 12, described springform band 2 is provided with the positioning pin 22 that can insert mould band pilot hole 12, each springform band 2 comprises shelterarea 23,23 periphery is provided with the spacing preiection 24 of auxiliary positioning lead frame 3 in the shelterarea, and spraying plating mouth 21 is arranged on a side of spacing preiection 24.Whole springform band 2 is that RTV silica gel (room temperature vulcanized silicone rubber) is one-body molded.
The quantity of springform band 2 is identical with the quantity of spray hole 11, the quantity in mould band chamber 14 is a plurality of with the quantity of springform band 2 and spray hole 11 also, a plurality of mould bands chamber 14 circumferential array are in annular groove 13, and described locating device is arranged in the annular groove 13 of outer and spray hole 11 1 sides in mould band chamber 14.
This locating device comprise be arranged in the annular groove 13, the lead frame pilot hole 15 of mouth spray 11 1 sides, this lead frame pilot hole 15 is one-body molded by mold body 1, is provided with the positioning module nail 4 that is stretched out location lead frame 3 by die ontology 1 interior circumferential die ontology 1 periphery in lead frame pilot hole 15.This positioning module nail 4 is cone shape pottery nail for external part.
The size of spray hole 11 is length 1-3 millimeter in the utility model, width 1-1.5 millimeter, the size of springform band 2 is length 10-15 millimeter, width 6-8 millimeter, spraying plating mouth 21 sizes on the springform band 2 are length 1-3 millimeter, width 1-1.6 millimeter, the precision size of die ontology 1 and springform band 2, be applicable to the spraying plating of high-accuracy lead frame, add springform band 2 between lead frame 3 and the die ontology 1, the phenomenon such as plating leakage and plating bath seepage when utilizing the performances such as ductility of elastic silica gel to prevent spraying plating.
The size of spray hole 11, springform band 2 and spraying plating mouth 21 can change according to the size shape in lead frame spraying plating zone in the utility model.
The preferred size of spray hole 11 is 2 millimeters of length in the utility model, and is wide 1.15 millimeters, and the preferred size of springform band 2 is 12.2 millimeters of length, and 7.2 millimeters of width, the preferred size of the spraying plating mouth 21 on the springform band 2 are 2.3 millimeters of length, 1.35 millimeters of width.
During use, in the positioning pin 22 insertion mould band pilot holes 12 with springform band 2 springform band 2 is positioned in the mould band chamber 14, spray hole 11 aligns with spraying plating hole 12 and communicates simultaneously, again lead frame 3 is sleeved on the positioning module nail 4, making needs the functional zone of electroplating relative with spraying plating hole 12 with spray hole 11 on the lead frame 3, again whole die ontology 1 is sleeved on and sprays on the disk 5, spray the periphery fan of disk 5 to being distributed with a plurality of jet holes 51, the part that lead frame 3 is installed on jet hole 51 and the die ontology 1 is relative, when the volume to volume lead frame is electroplated, when lead frame 3 passes through mould, spray disk 5 work, with electroplate liquid directive spray hole 11 and spraying plating hole 12, electroplate liquid just contacts with the functional zone of lead frame 3, by electric current, just can finish accurate spraying plating simultaneously.
Claims (8)
1. plating die of lead frame that is used for local spraying plating, it is characterized in that: comprise trolley type die ontology (1) and be arranged on the springform band (2) that die ontology (1) periphery wall is used for hiding the upper electroless plating district of lead frame (3), circumferentially be provided with a plurality of spray holes (11) on the described die ontology (1), described springform band (2) is provided with the spraying plating mouth (21) corresponding with described spray hole (11), circumferentially is provided with the locating device that lead frame (3) is fixed on springform band (2) periphery on the described die ontology (1).
2. a kind of plating die of lead frame for local spraying plating according to claim 1, it is characterized in that circumferentially being provided with on the described die ontology (1) annular groove (13), be provided with mould band chamber (14) in the described annular groove (13), described spray hole (11) is arranged in the described mould band chamber (14), and described locating device is arranged in the described annular groove (13).
3. a kind of plating die of lead frame for local spraying plating according to claim 2, it is characterized in that each described spray hole (11) both sides is provided with mould band pilot hole (12), described springform band (2) is provided with the positioning pin (22) that can insert mould band pilot hole (12).
4. a kind of plating die of lead frame for local spraying plating according to claim 3, the quantity that it is characterized in that described springform band (2) is identical with the quantity of described spray hole (11), each described springform band (2) comprises shelterarea (23), the periphery of described shelterarea (23) is provided with the spacing preiection (24) of auxiliary positioning lead frame (3), and described spraying plating mouth (21) is arranged on a side of spacing preiection (24).
5. a kind of plating die of lead frame for local spraying plating according to claim 2, it is characterized in that described locating device comprise be arranged in the described annular groove (13), the lead frame pilot hole (15) of mouth spray (11) one sides, be provided with the positioning module nail (4) that stretches out location lead frame (3) to die ontology (1) periphery in the described lead frame pilot hole (15).
6. a kind of plating die of lead frame for local spraying plating according to claim 5 is characterized in that described positioning module nail (4) is cone shape pottery nail for external part.
7. each described a kind of plating die of lead frame for local spraying plating according to claim 1-6, the size that it is characterized in that described spray hole (11) is length 1-3 millimeter, width 1-1.5 millimeter.
8. each described a kind of plating die of lead frame for local spraying plating according to claim 1-6, it is characterized in that described springform band (2) size is length 10-15 millimeter, width 6-8 millimeter, spraying plating mouth (21) size on the described springform band (2) is length 1-3 millimeter, width 1-1.6 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220403328 CN202830196U (en) | 2012-08-15 | 2012-08-15 | Lead frame electroplating die for part spraying |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220403328 CN202830196U (en) | 2012-08-15 | 2012-08-15 | Lead frame electroplating die for part spraying |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202830196U true CN202830196U (en) | 2013-03-27 |
Family
ID=47941950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220403328 Withdrawn - After Issue CN202830196U (en) | 2012-08-15 | 2012-08-15 | Lead frame electroplating die for part spraying |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202830196U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102817052A (en) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | Electroplating mold for electroplating with characteristics of high precision and selectivity |
| CN103882491A (en) * | 2014-04-02 | 2014-06-25 | 曲悦峰 | Electroplating mold diameter control structure |
-
2012
- 2012-08-15 CN CN 201220403328 patent/CN202830196U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102817052A (en) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | Electroplating mold for electroplating with characteristics of high precision and selectivity |
| CN102817052B (en) * | 2012-08-15 | 2015-08-26 | 中山品高电子材料有限公司 | A kind of plating mould for high-accuracy selective electroplating |
| CN103882491A (en) * | 2014-04-02 | 2014-06-25 | 曲悦峰 | Electroplating mold diameter control structure |
| CN103882491B (en) * | 2014-04-02 | 2016-05-18 | 深圳市长龙点金科技有限公司 | A kind of electroplating mold diameter control structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130327 Effective date of abandoning: 20150826 |
|
| RGAV | Abandon patent right to avoid regrant |