CN103882491A - Electroplating mold diameter control structure - Google Patents
Electroplating mold diameter control structure Download PDFInfo
- Publication number
- CN103882491A CN103882491A CN201410130146.8A CN201410130146A CN103882491A CN 103882491 A CN103882491 A CN 103882491A CN 201410130146 A CN201410130146 A CN 201410130146A CN 103882491 A CN103882491 A CN 103882491A
- Authority
- CN
- China
- Prior art keywords
- micelle
- electroplating
- plating
- control structure
- plating mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 22
- 238000004033 diameter control Methods 0.000 title claims abstract description 12
- 239000000693 micelle Substances 0.000 claims description 43
- 238000007747 plating Methods 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 18
- 239000000919 ceramic Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract 6
- 238000010586 diagram Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000002407 reforming Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating mold diameter control structure, including an electroplating mold body, wherein a strip is arranged on the upper surface of the electroplating mold body, and a mask strip is arranged on the back surface of the strip; an electroplating region is arranged on the electroplating mold body, a groove is arranged on the edge of the electroplating region, and a first colloidal particle is embedded in the groove; a ceramic nail is arranged on the electroplating mold, a second colloidal particle is arranged on the periphery of the ceramic nail, lug bosses higher than the electroplating mold body are arranged on the upper surfaces of the first colloidal particle and the second colloidal particle, and the lug bosses on the first colloidal particle and the second colloidal particle have the same height. The electroplating mold diameter control structure has the beneficial effects of being capable of effectively controlling the mold diameter and greatly reducing the cost.
Description
Technical field
The present invention relates to a kind of plating mould diameter control structure.
Background technology
This technology is applicable to selective electroplating mould, is applied to the lead frame of electronic component (IC, diode, LED, triode etc.), or bonder terminal partially plating gold, silver-plated, zinc-plated.Lead frame and terminal are metal materials (copper, iron or alloy), are banded coiled strip.Selective electroplating is the position of controlling plating district by special plating mould, guarantees to need the ground of plating to plate, and does not need the place of plating not plate.Due to the easy seepage of electroplating solution, plating is installed silicone-rubber seals (being commonly called as micelle) near district, and presses silica gel mask band at lead frame or the terminal back side, utilizes the elasticity of silica gel to help sealing current.
On mould, there is ceramic locating pin to insert in the pilot hole of band material and anticipate position to band.The upper hole of band material to the distance in hole should and mould on be pinned to the arc length Perfect Matchings between nail, otherwise band material can depart from pottery nail, or pilot hole distortion.Due to pottery nail be one week uniform, arc length is difficult to measure, and in actual design and processing, is therefore to control arc length by the diameter of control mould.This has just proposed very high requirement to mould diameter precision, and diameter is generally in 244mm left and right, and error can not be greater than 0.03mm.
Mould is plastic material, and its diameter is difficult to accomplish very accurate:
1. its coefficient of thermal expansion is much larger than metal, and man-hour is very long, generally all to process one to two day, and the therefore envrionment temperature in the course of processing, machine temperature has larger variation, causes mould diameter to produce error;
2. plastics internal stress is large, poor rigidity, and the distortion that the internal stresses release in the course of processing causes is also very large;
3. plastics poor rigidity, is affected by clamping power and has distortion, and after machining, the size of measuring on fixture and the size removing while use also have very big difference.
4. other are because the intended diameter that material strip feature causes is difficult to situation about being consistent with actual effective diameter.
Because mould diameter scrapping of being forbidden to cause is the main reason that this type of mould is scrapped.Owing to being plating mould, long term operation environment is 60～70 degrees Celsius, and band material has punching burr and its friction, and in strong acid or strong base solution, therefore moulding stock requirement is high temperature resistant, and high-frequency insulation is good, water-intake rate is low, self lubricity good (wear-resisting), and intensity is high, good toughness, coefficient of thermal expansion is low, good stability of the dimension, corrosion-resistant, ageing-resistant, be easy to machining, meet a kind of material of only having of full terms---PEEK.Only have a qualified supplier in the whole world, so material price is very expensive, the loss of scrapping is very large.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of plating mould diameter control structure.The scheme that the present invention adopts is:
A kind of plating mould diameter control structure, comprises plating mould body, and plating mould body upper surface is provided with band material, and the band material back side is provided with mask band; Plating mould body is provided with electroplating region, and electroplating region edge is provided with groove, is embedded with the first micelle in groove; Plating mould is provided with pottery nail, is provided with the second micelle in pottery nail periphery, and the first micelle and the second micelle upper surface are equipped with the boss that exceeds plating mould body, and the boss on the first micelle and the second micelle is contour.
Preferably, groove cross-sectional shape is L shaped, and the first micelle cross-sectional shape is identical with groove cross-sectional shape L shaped, and boss is located at the section anyhow in micelle cross section near the end top of electroplating region.
Preferably, the first micelle and the second micelle are connected as a single entity.
Beneficial effect of the present invention is, sets up near of pottery nail the micelle of controlling diameter.According to the concrete size difference of band material, this micelle may be integrated with the micelle of controlling plating district size, may be also independently.This micelle protrudes die surface contour with the micelle in control plating district, uses after this micelle, and band material no longer includes with PEEK expects the chance contacting, completely by micelle control mould effective diameter: in the time that mould finds that through trying out diameter is bigger than normal, micelle is done thinner; When diameter is less than normal, micelle is done thicker.Because micelle mould is made of synthetic glass, material cost is very low.The man-hour requirement tens hours of reforming in addition plating mould, this type of micelle mould of reforming only needs one hour.
Brief description of the drawings
Fig. 1 is that prior art plating mould coordinates schematic diagram with micelle and mask band.
Fig. 2 is for being with material to coordinate schematic diagram with plating mould diameter.
Fig. 3 is plating mould diameter control architecture schematic diagram of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further details.
Plating mould diameter control structure, comprises plating mould body 1, and plating mould body upper surface is provided with band material 2, and the band material back side is provided with mask band 3; Plating mould body is provided with electroplating region 4, and electroplating region edge is provided with groove 5, is embedded with the first micelle 6 in groove; Plating mould is provided with pottery nail 7, and being provided with the second micelle 8, the first micelles and the second micelle upper surface in pottery nail periphery, to be equipped with boss on boss 9, the first micelles and the second micelle that exceeds plating mould body contour.
Groove cross-sectional shape is L shaped, and the first micelle cross-sectional shape is identical with groove cross-sectional shape L shaped, and boss is located at the 61 end tops near electroplating region of section anyhow in the first micelle cross section.
The first micelle and the second micelle also can be connected as a single entity.
The above; it is only preferred embodiment of the present invention; not in order to limit the present invention, any trickle amendment that every foundation technical spirit of the present invention is done above embodiment, be equal to and replace and improve, within all should being included in the protection domain of technical solution of the present invention.
Claims (3)
1. a plating mould diameter control structure, is characterized in that, comprises plating mould body, and plating mould body upper surface is provided with band material, and the band material back side is provided with mask band; Plating mould body is provided with electroplating region, and electroplating region edge is provided with groove, is embedded with the first micelle in groove; Plating mould is provided with pottery nail, is provided with the second micelle in pottery nail periphery, and the first micelle and the second micelle upper surface are equipped with the boss that exceeds plating mould body, and the boss on the first micelle and the second micelle is contour.
2. plating mould diameter control structure as claimed in claim 1, is characterized in that, groove cross-sectional shape is L shaped, and the first micelle cross-sectional shape is identical with groove cross-sectional shape L shaped, and boss is located at the section anyhow in micelle cross section near the end top of electroplating region.
3. plating mould diameter control structure as claimed in claim 1, is characterized in that, the first micelle and the second micelle are connected as a single entity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410130146.8A CN103882491B (en) | 2014-04-02 | 2014-04-02 | A kind of electroplating mold diameter control structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410130146.8A CN103882491B (en) | 2014-04-02 | 2014-04-02 | A kind of electroplating mold diameter control structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103882491A true CN103882491A (en) | 2014-06-25 |
| CN103882491B CN103882491B (en) | 2016-05-18 |
Family
ID=50951600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410130146.8A Expired - Fee Related CN103882491B (en) | 2014-04-02 | 2014-04-02 | A kind of electroplating mold diameter control structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103882491B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113733380A (en) * | 2021-08-30 | 2021-12-03 | 深圳市长龙点金科技有限公司 | Colloidal particle structure for enhancing noble metal covering efficiency |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0788899A (en) * | 1993-09-22 | 1995-04-04 | Mitsubishi Plastics Ind Ltd | In-mold plating molds |
| JP2004084059A (en) * | 2002-07-04 | 2004-03-18 | Sumitomo Electric Ind Ltd | Die for plating with fine pattern, fine metal structure, die for fine working, method for producing die for plating with fine pattern, and method for producing fine metal structure |
| JP2004217995A (en) * | 2003-01-14 | 2004-08-05 | Nikon Corp | Method for producing electroformed product |
| CN202830196U (en) * | 2012-08-15 | 2013-03-27 | 中山品高电子材料有限公司 | Lead frame electroplating die for part spraying |
| CN202865360U (en) * | 2012-09-20 | 2013-04-10 | 中山复盛机电有限公司 | Plating mould |
-
2014
- 2014-04-02 CN CN201410130146.8A patent/CN103882491B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0788899A (en) * | 1993-09-22 | 1995-04-04 | Mitsubishi Plastics Ind Ltd | In-mold plating molds |
| JP2004084059A (en) * | 2002-07-04 | 2004-03-18 | Sumitomo Electric Ind Ltd | Die for plating with fine pattern, fine metal structure, die for fine working, method for producing die for plating with fine pattern, and method for producing fine metal structure |
| JP2004217995A (en) * | 2003-01-14 | 2004-08-05 | Nikon Corp | Method for producing electroformed product |
| CN202830196U (en) * | 2012-08-15 | 2013-03-27 | 中山品高电子材料有限公司 | Lead frame electroplating die for part spraying |
| CN202865360U (en) * | 2012-09-20 | 2013-04-10 | 中山复盛机电有限公司 | Plating mould |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113733380A (en) * | 2021-08-30 | 2021-12-03 | 深圳市长龙点金科技有限公司 | Colloidal particle structure for enhancing noble metal covering efficiency |
| CN113733380B (en) * | 2021-08-30 | 2024-06-07 | 深圳市长龙点金科技有限公司 | Colloidal particle structure for enhancing precious metal coverage efficiency |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103882491B (en) | 2016-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201824524U (en) | Hot runner device with integral threads | |
| CN103882491A (en) | Electroplating mold diameter control structure | |
| CN204800906U (en) | Location built -in fitting that aerospace combined material mould was used | |
| CN203879880U (en) | Sheet metal positioning pin | |
| CN204867046U (en) | Mould anchor clamps | |
| CN204673929U (en) | A kind of novel cooling sprue bush | |
| CN202348883U (en) | Mould locating pin | |
| CN105080417A (en) | Stirring blade | |
| CN203900906U (en) | Clamp for machining length of mould punches | |
| CN205211793U (en) | LED support | |
| CN206030462U (en) | Cooling device of hot runner system needle driving cylinder | |
| CN202185523U (en) | Cold stamping die with WC (Water Cooled) coating | |
| CN205044230U (en) | Plastic and integrative injection moulding board of metal nanometer | |
| CN209512632U (en) | Super thick intercooler chip body | |
| CN204054475U (en) | A kind of plastic pipe insert structure | |
| CN203853497U (en) | Combined closed die | |
| CN205008813U (en) | Carbide formula moulding -die head structure | |
| CN202572850U (en) | Die joint structure of tail part of shower head body die | |
| CN203919809U (en) | A kind of permanent magnetic ferrite magnetic shoe mould | |
| CN205219834U (en) | Electron support long -life mould | |
| CN203878055U (en) | Double-layer overlapped punch mold | |
| CN105206734A (en) | LED support and manufacturing method thereof | |
| CN205021897U (en) | Insulating bush embossing mold | |
| CN202326587U (en) | Guiding locating pin for metal processing machinery | |
| CN209477105U (en) | A kind of stamping die of W-shaped sheet metal part |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Changlong Dianjin Technology Co. Ltd. patent responsible person Document name: Notification that Application Deemed not to be Proposed |
|
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN LONG DRAGON SPOT GOLD TECHNOLOGY LTD. Free format text: FORMER OWNER: QU YUEFENG Effective date: 20140903 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518017 SHENZHEN, GUANGDONG PROVINCE TO: 518000 SHENZHEN, GUANGDONG PROVINCE |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20140903 Address after: 5, 1 floor C District, 518000 Housing Science and Technology Park, Longhua street, Shenzhen, Guangdong, Baoan District, China Applicant after: Shenzhen Hong Kong Long Dragon Co., LTD. Address before: 518017 Guangdong city of Shenzhen province Futian District Liyang world gardens A 20F Applicant before: Qu Yuefeng |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160518 Termination date: 20190402 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |