CN102814871A - Processing device - Google Patents
Processing device Download PDFInfo
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- CN102814871A CN102814871A CN2012101845504A CN201210184550A CN102814871A CN 102814871 A CN102814871 A CN 102814871A CN 2012101845504 A CN2012101845504 A CN 2012101845504A CN 201210184550 A CN201210184550 A CN 201210184550A CN 102814871 A CN102814871 A CN 102814871A
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- light quantity
- light
- chuck table
- processing
- light source
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Abstract
The present invention provides a processing device, which can adjust the light quantity of a camera component to appropriate light quantity. The processing device includes: a chuck workbench for keeping objects to-be-processed; a processing component for processing the objects kept on the workbench; a camera component for recording the objects to-be-processed on the workbench; and a processing feed component for relatively processing and feeding the chuck workbench and the objects to-be-processed. The processing device is characterized in that the camera component includes: a light source, which is used for lighting the objects to-be-processed; a camera, which is used for recording the processed objects being lighted; and a light quantity regulator, which is used for adjusting the light quantity from the light source. The light quantity regulator includes: a rotating plate with a rotating axis; an open part, which is formed on the rotating plate and used for the light from the light source to pass through; and a light screen for making the light quantity of the open part change between the maximum value and the minimum value with the rotating angle corresponding to the rotating axis.
Description
Technical field
The present invention relates to machined objects such as semiconductor wafer are implemented the processing unit (plant)s such as topping machanism, laser processing device of processing.
Background technology
Integrated circuit), LSI (Large Scale Integrated Circuit: a plurality of devices such as large scale integrated circuit) be formed with IC (Integrated Circuit: on the surface of wafer by cutting apart preset lines with demarcating; Through cutter sweep (topping machanism) or laser processing device said wafer is divided into device one by one along cutting apart preset lines, the device that is divided into extensively is utilized in the electronic equipments such as mobile phone, PC.
Processing unit (plant) such as cutter sweep or laser processing device has at least: chuck table, and it keeps machined objects such as semiconductor wafer; Tool member, it implements processing to the machined object that is kept by chuck table; The shooting member, it is made a video recording to the machined object that is kept by chuck table; And processing feeding member, it relatively processes feeding to chuck table and tool member.
In general; The shooting member comprises video camera that machined object is made a video recording and the microscope that amplifies the picture that is obtained by camera photography, and said shooting member can detect as answering cutting apart preset lines and accurately cutting tool or laser Machining head being positioned the preset lines of cutting apart that should process of machining area.
In existing processing unit (plant); Calibrate to carry out in order to detect the preset lines of cutting apart that to process with the shooting member, stop chuck table and answer cutting zone, therefore with the shooting of shooting member; The implementation of calibration relatively expends time in, and exists the problem of producing rate variance.
Therefore; The application's applicant has proposed following shooting member in TOHKEMY 2010-76053 communique: it adopts strobe light as light source, and the CCD of shooting member (Charge Coupled Device: charge-coupled image sensor) synchronously make a video recording to the camera watch region of wafer by the irradiation of video camera and strobe light.According to topping machanism, even wafer also in moving, also can be obtained rest image with this shooting member.
Patent documentation 1: TOHKEMY 2010-76053 communique
But, in topping machanism, the member that the light quantity of the strobe light that stroboscopic light source is sent is adjusted is not set with patent documentation 1 disclosed shooting member.Just do not make a video recording if do not adjust the light quantity of strobe light, can not obtain the problem of suitable photographed images when then having.Particularly adopting under the situation of xenon flash lamp as stroboscopic light source, existing almost near the problem that can not accomplish the stroboscopic shooting.
Summary of the invention
The present invention accomplishes in view of described point just, and its purpose is to provide a kind of processing unit (plant) with shooting member, and said shooting member has the mechanism of the light quantity that can adjust stroboscopic light source.
According to the present invention, a kind of processing unit (plant) is provided, said processing unit (plant) has: chuck table, said chuck table is used to keep machined object; Tool member, said tool member are used for the machined object that remains in said chuck table is implemented processing; The shooting member, said shooting member is used for the machined object that remains in said chuck table is made a video recording; And processing feeding member, said processing feeding member is used for said chuck table and said tool member are relatively processed feeding, and said processing unit (plant) is characterised in that said shooting member comprises: light source, said light source is used to the machined object that throws light on; Video camera, said video camera are used for illuminated machined object is made a video recording; And the light quantity adjuster, said light quantity adjuster is used for the light quantity from the light of said light source irradiation is adjusted, and said light quantity adjuster comprises: swivel plate, said swivel plate has rotating shaft; Peristome, said peristome is formed at said swivel plate, and is used to supply the light transmission from said light source irradiation; And shadow shield, the anglec of rotation of said shadow shield and said rotating shaft makes the light quantity that sees through said peristome between maximum and minimum of a value, change accordingly.
Processing unit (plant) of the present invention possesses the photography member and possesses the light quantity adjuster; Said light quantity adjuster comprises the shadow shield that light quantity changes that sees through that makes from light source; The light quantity that therefore, can the light quantity from light source be adjusted into the shooting that is suitable for machined object comes the machining area of answering of machined object is made a video recording.Particularly in that to use the light source that can not adjust light intensity as xenon flash lamp to carry out under the situation that stroboscopic makes a video recording very convenient.
Description of drawings
Fig. 1 is the summary structure chart of the topping machanism of embodiment of the present invention.
Fig. 2 is the stereogram that is supported on the semiconductor wafer of ring-shaped frame through cutting belt.
Fig. 3 is structure and the sketch map of effect thereof of the image unit of the embodiment of the present invention of explanation when cutting apart preset lines and detecting.
Fig. 4 is the stereogram of light quantity adjuster.
The sketch map of effect of the image unit of the embodiment of the present invention when Fig. 5 is the state confirmation of explanation cutting slot.
Label declaration
2: topping machanism;
14:X axle feed mechanism;
20: chuck table;
36:Y axle feed mechanism;
44:Z axle feed mechanism;
46: cutting unit;
50: cutting tool;
52: alignment unit;
54: image unit;
60: the water filled chamber;
68: object lens;
70: xenon flash lamp;
The 74:CCD video camera;
76: monitor;
82: the light quantity adjuster;
84: impulse motor;
92: shadow shield.
The specific embodiment
Below, with reference to accompanying drawing, the topping machanism 2 that embodiment of the present invention is related to is elaborated.Fig. 1 is the summary structure chart of expression topping machanism 2.Topping machanism 2 comprises pair of guide rails 6, and said pair of guide rails 6 is equipped on the stationary base 4 and along X-direction extends.
Through the X axle feed mechanism (X axle feeding member) 14 that constitutes by ball-screw 10 and impulse motor 12 X axle movable block 8 is moved along processing direction of feed that is X-direction.On X axle movable block 8, be equipped with chuck table 20 across cylindric supporting member 22.
Chuck table 20 has the adsorption section (absorption chuck) 24 that is formed by porous ceramics etc.Be equipped with a plurality of (in this embodiment being 4) binding clasp 26 at chuck table 20, said a plurality of binding clasps 26 are used to clamp ring-shaped frame F shown in Figure 2.
As shown in Figure 2, quadrature ground forms the 1st spacing track S1 and the 2nd spacing track S2 on as the surface of the semiconductor wafer W of the processing object of topping machanism 2, is formed with a large amount of device D dividing the zone that forms by the 1st spacing track S1 and the 2nd spacing track S2.
Wafer W is attached at as the cutting belt T that pastes band, and the peripheral part of cutting belt T is attached at ring-shaped frame F.Thus, wafer W becomes the state that is supported on ring-shaped frame F through cutting belt T, through clamping ring-shaped frame F with binding clasp shown in Figure 1 26, thereby said wafer W supporting is fixed on the chuck table 20.
X axle feed mechanism 14 has: rule 16, and it is provided on the stationary base 4 along guide rail 6; With read head 18, the X coordinate figure that it is provided in the lower surface of X axle movable block 8 and is used to read rule 16.Read head 18 links together with the controller of topping machanism 2.
On stationary base 4, also be fixed with along the pair of guide rails 28 of Y direction elongation.Through the Y axle feed mechanism (index feed mechanism) 36 that constitutes by ball-screw 32 and impulse motor 34 y-axis shift motion block 30 is moved along Y direction.
Be formed with along a pair of (only illustrating one) guide rail 38 of Z-direction elongation at y-axis shift motion block 30.Through the Z axle feed mechanism 44 that constitutes by not shown ball-screw and impulse motor 42 Z axle movable block 40 is moved along Z-direction.
Label 46 is cutting unit (cutting members), and the main spindle box 48 of cutting unit 46 is inserted into and is supported in the Z axle movable block 40.In main spindle box 48, holding main shaft, said main shaft is supported to and can be rotated by air bearing.By the not shown motor driving main shaft rotation that is contained in the main spindle box 48, be equipped with cutting tool 50 with the mode that can install and remove at the terminal part of main shaft.
Be equipped with alignment unit (calibrated component) 52 at main spindle box 48.Alignment unit 52 has image unit (shooting member) 54, and said image unit 54 is used for the wafer W that is kept by chuck table 20 is made a video recording.Cutting tool 50 and image unit 54 are along X-direction and row arrangement.
Then, with reference to figure 3, the structure of the image unit 54 that embodiment of the present invention is related to is elaborated.Image unit 54 has the framework 56 of holding object lens 68, and said object lens 68 are in the face of camera watch region, is attached with the next door 58 with light inlet window 59 at the terminal part of framework 56.
In the space that is separated out by the terminal part of framework 56, next door 58 and the wafer W that kept by chuck table 20, surround water filled chamber 60.Interval between the terminal 56a of framework 56 and the wafer W that kept by chuck table 20 is the degree of about 0.5～1mm preferably.When the otch inspection of wafer W, will be filled in the water filled chamber 60 via open and close valve 66 and 62 supplies of water supply port from the water at water source 64.
The image unit 54 of this embodiment has a kind of xenon flash lamp 70 as stroboscopic light source.The part of the strobe light that penetrates from xenon flash lamp 70 is shone the wafer W that is kept by chuck table 20 by optical splitter 72 reflections via object lens 68 and light inlet window 59.
Between xenon flash lamp 70 and optical splitter 72, be equipped with light quantity adjuster 82, said light quantity adjuster 82 is used for the light quantity of the light that sends from xenon flash lamp 70 is adjusted.As shown in Figure 4, light quantity adjuster 82 comprises: impulse motor 84; Rotating shaft 86, itself and impulse motor 84 link together; Swivel plate 88, it is fixed on the end of rotating shaft 86; Peristome 90, it is formed at swivel plate 88 and is used to supply from the light transmission of xenon flash lamp 70 irradiations; And shadow shield 92, it is provided in peristome 90, and and the anglec of rotation of rotating shaft 86 light quantity through peristome 90 is changed between maximum and minimum of a value.
Refer again to Fig. 3, ccd video camera 74 is luminous synchronously to being made a video recording by the camera watch region of the wafer W of chuck table 20 maintenances with xenon flash lamp 70, and the image that shooting obtains is displayed on the monitor 76.Xenon flash lamp 70, ccd video camera 74 and impulse motor 84 are connected with control member 80 and are controlled by control member 80.
Below the effect of the image unit 54 that as above constitutes is described.At first, keep wafer W as the cut object through chuck table 20 suction, drive then X axle feed mechanism 14 with wafer W be positioned at image unit 54 under.
In the image unit 54 of this embodiment, ccd video camera 74 is synchronously made a video recording to the camera watch region of wafer W with the irradiation from the strobe light of xenon flash lamp 70, therefore, even wafer W also in moving, also can obtain rest image clearly.
When making a video recording with the camera watch region of 54 pairs of wafer W of image unit; At first; The impulse motor 84 that drives light quantity adjuster 82 makes shadow shield 92 rotations that are assemblied in swivel plate 88; Select the section 92a～92j of shadow shield 92, make light quantity reach best position, cover the driving of position stop pulse motor 84 of the light path of the strobe light that sends from xenon flash lamp 70 at selected section from the strobe light of xenon flash lamp 70.
The selection of the section 92a～92j of shadow shield 92 is confirmed as follows: through impulse motor 84 shadow shield 92 rotations are made a video recording on one side with 74 pairs of wafer W of ccd video camera on one side; And on monitor 76, observe its photographed images, thereby confirm the selection of the section 92a～92j of shadow shield 92.
After having selected the best section 92a～92j of shadow shield 92, implement calibration procedure.In the calibration procedure of this embodiment; On one side the wafer W that is kept by chuck table 20 is moved along X-direction with X axle feed mechanism 14, on one side moment under certain point (it being made as the A point) arrival image unit 54 of wafer W make the camera watch region of the xenon flash lamp 70 luminous wafer W of throwing light on.
Synchronously make a video recording with the luminous of xenon flash lamp 70 with the device D at 74 pairs of A points of ccd video camera place; Detect be stored in alignment unit 52 in advance in the consistent target pattern of image of target pattern, then the coordinate figure of the target pattern at A point place is stored into the memory of alignment unit 52.
Then; Move chuck table 20; The B point place of ordering away from A; To with the spacing track S1 identical distance road S1 that makes a video recording at the A point adjacent device D make a video recording, go out target pattern through same operation detection, then the coordinate figure of the target pattern at B point place is stored into the memory of alignment unit 52.
Then, rotary chuck workbench 20 is so that parallel with X-direction with the straight line that the coordinate figure of the target pattern at B point place is formed by connecting with the coordinate figure of the target pattern at A point place.Then, move along Y direction through making cutting unit 46, the amount that moves is the distance between the center line of target pattern and spacing track S1, thus the calibration that completion makes cutting tool 50 align with the spacing track S1 that should cut.
After the calibration of the 1st spacing track S1 is implemented, chuck table 20 is revolved turn 90 degrees, then, spacing track S2 is also carried out same operation, carry out the calibration of the 2nd spacing track S2.
When carrying out calibration,, therefore, there is no need in water filled chamber 60, to supply with water owing to do not adhere to cutting fluid or smear metal etc. in the wafer W that is kept by chuck table 20.In the shooting when the calibration of the image unit that utilizes this embodiment 54; Owing to synchronously make a video recording with the cutting zone of answering of 74 pairs of wafer W of ccd video camera with irradiation from xenon flash lamp 70; Therefore; Even when the wafer W that is kept by chuck table 20 moves, also can take rest image below image unit 54.Consequently, the shooting of wafer W can be promptly carried out, the used time of calibration can be shortened.
When calibration is accomplished, with X axle feed mechanism 14 pair chuck tables 20 along X-direction process feeding on one side, make the cutting tool 50 of rotation at a high speed see through wafer W on one side and cut scheduled volume till cutting belt T, thereby cut the 1st spacing track S1.
Driving 36 pairs of cutting tools of Y axle feed mechanism 50 carries out index feed on one side, Yi Bian cut unidirectional the 1st all spacing track S1.Then, chuck table 20 is revolved turn 90 degrees, the 2nd spacing track S2 with the 1st spacing track S1 quadrature is cut.
Under the situation of the state of confirming cutting slot in the working angles of hope in wafer W, that is carry out under the situation of otch inspection, drive X axle feed mechanism 14 in hope, will be positioned at by the wafer W that chuck table 20 keeps image unit 54 under.
As shown in Figure 5, open open and close valve 66, in water filled chamber 60, supply with water; Be attached to the smear metal and/or the cutting fluid of wafer W with the water flushing of cleaning; In water filled chamber 60, supply with water on one side always, Yi Bian make xenon flash lamp 70 luminous, with the camera watch region of strobe light illumination wafer W.
Owing to synchronously make a video recording with ccd video camera 74 with the luminous of xenon flash lamp 70, therefore, even chuck table 20 also in mobile, rest image that also can enough ccd video camera 74 shooting clears.
The output of ccd video camera 74 is transfused to monitor 76, on monitor 76, shows the cutting slot 94 of making a video recording.The operator can observe the image on the monitor 76 on one side, observe the chip 96 that at cutting slot 94 produce etc. on one side, thereby can confirm the state of cutting slot 94.
Under the situation that the generation ratio of the chip 96 of the both sides that are formed at cutting slot 94 becomes very big, be judged as at cutting tool 50 pore obstruction etc. has taken place, the operator implements cutting tool 50 is replaced by new processing such as cutting tool.
In the shooting when the image unit that utilizes this embodiment 54 calibrations; Synchronously make a video recording with irradiation with 74 pairs of cutting zones of answering of ccd video camera with suitable light quantity irradiation from the strobe light of xenon flash lamp 70; Therefore; Even when the wafer W that is kept by chuck table 20 moves, also can take rest image below image unit 54.Consequently, the shooting of wafer W can be promptly carried out, the used time of calibration can be shortened.
And; When carrying out the otch inspection; In water filled chamber 60, supply with water on one side, with xenon flash lamp 70 luminous synchronously with ccd video camera 74 pair camera watch regions with suitable light quantity irradiation make a video recording on one side, therefore; Even chuck table 20 also in moving, also can be taken rest image by enough ccd video cameras 74.Thereby, can promptly carry out the otch inspection, even carry out the otch inspection, also can suppress productivity ratio and reduce.
In the above-described embodiment, the example that image unit 54 of the present invention is applied to topping machanism 2 is illustrated, but the present invention is not limited to this, image unit 54 of the present invention equally also can be applied to other processing unit (plant)s such as laser processing device.
Claims (3)
1. processing unit (plant), said processing unit (plant) has: chuck table, said chuck table is used to keep machined object; Tool member, said tool member are used for the machined object that remains in said chuck table is implemented processing; The shooting member, said shooting member is used for the machined object that remains in said chuck table is made a video recording; And processing feeding member, said processing feeding member is used for said chuck table and said tool member are relatively processed feeding, and said processing unit (plant) is characterised in that,
Said shooting member comprises:
Light source, said light source is used to the machined object that throws light on;
Video camera, said video camera are used for illuminated machined object is made a video recording; And
Light quantity adjuster, said light quantity adjuster are used for the light quantity from the light of said light source irradiation is adjusted,
Said light quantity adjuster comprises:
Swivel plate, said swivel plate has rotating shaft;
Peristome, said peristome is formed at said swivel plate, and is used to supply the light transmission from said light source irradiation; And
Shadow shield, the anglec of rotation of said shadow shield and said rotating shaft make the light quantity that sees through said peristome between maximum and minimum of a value, change accordingly.
2. processing unit (plant) as claimed in claim 1 is characterized in that,
Said shadow shield changes the light quantity that sees through with classifying continuously or.
3. according to claim 1 or claim 2 processing unit (plant) is characterized in that,
Said light quantity adjuster also has the impulse motor that is connected with said rotating shaft.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011127004A JP5828683B2 (en) | 2011-06-07 | 2011-06-07 | Processing equipment |
| JP2011-127004 | 2011-06-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102814871A true CN102814871A (en) | 2012-12-12 |
| CN102814871B CN102814871B (en) | 2018-11-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210184550.4A Active CN102814871B (en) | 2011-06-07 | 2012-06-06 | Processing unit (plant) |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5828683B2 (en) |
| CN (1) | CN102814871B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7007052B2 (en) * | 2017-09-19 | 2022-01-24 | 株式会社ディスコ | Wafer processing method |
| CN113843511B (en) * | 2021-09-13 | 2024-02-02 | 武汉先同科技有限公司 | Handheld laser marking machine capable of self-adjusting laser intensity |
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| JPS5723907A (en) * | 1980-07-21 | 1982-02-08 | Ricoh Co Ltd | Optical device using optical fiber and adjustable in quantity of light |
| JP2000252240A (en) * | 1999-03-03 | 2000-09-14 | Disco Abrasive Syst Ltd | Cutter |
| JP2002090686A (en) * | 2000-09-19 | 2002-03-27 | Mejiro Precision:Kk | Light irradiating apparatus |
| JP5389580B2 (en) * | 2009-09-17 | 2014-01-15 | 株式会社ディスコ | Cutting equipment |
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| CN1081537A (en) * | 1992-07-16 | 1994-02-02 | 周德余 | Non-contact active adjustable resistance |
| JPH11281900A (en) * | 1998-03-30 | 1999-10-15 | Fuji Photo Optical Co Ltd | Electronic endoscope device setting light shield period |
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| CN1875310A (en) * | 2003-11-04 | 2006-12-06 | 浜松光子学株式会社 | Shutter unit and laser processing device using the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2012253296A (en) | 2012-12-20 |
| CN102814871B (en) | 2018-11-13 |
| JP5828683B2 (en) | 2015-12-09 |
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