CN102806179B - Suspend and transmit heater - Google Patents
Suspend and transmit heater Download PDFInfo
- Publication number
- CN102806179B CN102806179B CN201210113664.XA CN201210113664A CN102806179B CN 102806179 B CN102806179 B CN 102806179B CN 201210113664 A CN201210113664 A CN 201210113664A CN 102806179 B CN102806179 B CN 102806179B
- Authority
- CN
- China
- Prior art keywords
- oscillating plate
- substrate
- plate portion
- heater
- described oscillating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
- B05D3/029—After-treatment with microwaves
Abstract
The invention provides a kind of suspension and transmit heater, transmit while can avoiding produce dry spot in coated film heating substrate, this suspension transmits heater and comprises: oscillating plate portion (2), vibrates suspend for making basal-plate ultrasonic; Heater portion (3), for heating described oscillating plate portion; Ultrasonic wave generating unit (4), for providing ultrasonic wave to vibrate to described oscillating plate portion; Transport unit (5), the end of supporting substrate, substrate is transmitted along the direction vertical with suspension direction, wherein, heater portion (3) forms predetermined space with oscillating plate portion (2) and arranges in the rear side in the face making substrate suspend of oscillating plate portion (2), the size in the oscillating plate portion (2) in the direction intersected vertically with the direction of transfer of substrate is greater than the size of equidirectional substrate (W), by being heated oscillating plate portion (2) by heater (3) portion, whole of the substrate (W) transmitted that suspends is heated by oscillating plate portion (2).
Description
Technical field
The present invention relates to the suspension transmission heater carrying out heating and transmitting under the substrate making to be formed with coated film by supersonic wave suspended is with the state suspended.
Background technology
In the flat-panel screens such as liquid crystal display or plasma scope, use the substrate (being called as coated substrates) being coated with anti-corrosion liquid on substrate.The production process of this coated substrates is as follows: be coated with anti-corrosion liquid with on substrate equably by apparatus for coating, form coated film thus, afterwards, carries out drying by the such as heat drying apparatus shown in following patent document 1 to coated film.
This heat drying apparatus uses the heating unit heats base materials such as electromagnetic radiation.And, supersonic wave suspended plate is set each other at multiple heating unit, and according to the ultrasonic wave vibration put on herein, base material is suspended, and transmits base material heated substrate with this state.So, transmit by using in the delivery unit in base material heating process to suspend, that can prevent from such as producing when using and guiding roller into, because causing with the difference at the position of substrate contact and the thermal characteristics at other positions the dry spot of coated film.
Patent document 1: Japanese Unexamined Patent Publication 2006-205064 publication
Summary of the invention
But, in the heat drying apparatus recorded in above-mentioned patent document 1, still there is the so-called problem producing the misgivings of dry spot on coated film surface.Specifically, be alternately arranged the difference that there is thermal characteristics between heating unit and supersonic wave suspended plate of arranging, base material is by having the heating environment of larger fluctuation, and therefore this causes the dry spot easily producing coated film.The described heating environment with larger fluctuation is heated when referring to the top of base material by heating unit fiercely, and during top by supersonic wave suspended plate, heat hardly (situation about being cooled on the contrary also exists).
The present invention proposes in view of the above problems, and its object is to provides a kind of suspension to transmit heater, and this suspension transmits heater and can suppress to form dry spot in coated film.
In order to solve the problem, the invention provides suspends transmits heater, it is characterized in that, this suspension transmits heater and comprises: oscillating plate portion, vibrates suspend for making basal-plate ultrasonic; Heater portion, for heating described oscillating plate portion; Ultrasonic wave generating unit, for providing ultrasonic wave to vibrate to described oscillating plate portion; Transport unit, the end of supporting substrate, substrate is transmitted along the direction vertical with suspension direction, wherein, described heater portion forms predetermined space with described oscillating plate portion and arranges in the rear side in the face making substrate suspend in described oscillating plate portion, the size in the described oscillating plate portion in the direction intersected vertically with the direction of transfer of substrate is greater than the size of equidirectional substrate, and by being heated described oscillating plate portion by described heater portion, whole of the substrate transmitted that suspends is heated by described oscillating plate portion.
Transmit heater according to described suspension, arrange because heater portion forms predetermined space with oscillating plate portion in the rear side in the face making substrate suspend in oscillating plate portion, therefore oscillating plate portion is by radiation heating.Thereby, it is possible to oscillating plate portion is heated into uniform temperature.And, be greater than the size of equidirectional substrate by the size in the oscillating plate portion making the direction intersected vertically with the direction of transfer of substrate, the direction heated substrates equably that can intersect vertically at the direction of transfer with substrate.And, transmit substrate by the upside in this oscillating plate portion, can whole of heated substrates equably, thus coated film when can avoid producing spot on dry substrate.
And, preferably be characterised in that, described ultrasonic wave generating unit contacts with described oscillating plate portion in the outside in following two regions, and provide ultrasonic wave to vibrate to described oscillating plate portion, wherein, described two regions be described oscillating plate portion the region that substrate is suspended and in described oscillating plate portion, the region of the rear side that is equivalent to the region that substrate is suspended.
According to this formation, contacted with below oscillating plate portion by this two region exteriors in region of rear side of the above-mentioned zone making the region of ultrasonic wave generating unit in the oscillating plate portion making substrate suspend and be equivalent to oscillating plate portion, make to have the possibility that produces temperature spots on oscillating plate, the contact site in ultrasonic wave generating unit and oscillating plate portion leaves the region that substrate is suspended, the i.e. region of heated substrates, therefore, it is possible to prevent the temperature spots in the region of the heated substrates in oscillating plate portion, and drying can be carried out when avoiding producing dry spot to the coated film of substrate.
And, preferably be characterised in that, multiple oscillating plate is arranged along a direction continuous arrangement and is formed by described oscillating plate portion, and the junction between described oscillating plate and the direction of transfer of substrate intersect vertically substantially, and described transport unit is at the uniform velocity to transmit the substrate in described oscillating plate portion.
Accordingly, even if at oscillating plate there is junction in portion, and the temperature in the oscillating plate portion of this part compare other parts slightly difference time, arrange oscillating plate by continuous arrangement, variations in temperature also can be made minimum, and, substantially intersect vertically owing to making the direction of transfer of the junction between oscillating plate and substrate, and make substrate to be transmitted at the uniform velocity in the above, with any part of identical heating curves heated substrates, thus can prevent the generation of dry spot accordingly.
Transmit heater according to suspension of the present invention, can avoid in coated film, producing dry spot and transmitting while heated substrates.
Accompanying drawing explanation
Fig. 1 is the approximate three-dimensional map of the suspension transmission heater of an embodiment of the present invention;
Fig. 2 suspends to transmit the side view of heater;
Fig. 3 represents the skeleton diagram according to the different heat characteristic of the substrate in the arranged direction of oscillating plate;
Fig. 4 suspends to transmit the action flow chart of heater;
Fig. 5 is the example using the coated film baking production line transmitting heater that suspends of the present invention.
Primary symbols explanation
1: suspend and transmit heater
2: oscillating plate portion
3: heater portion
4: ultrasonic wave generating unit
5: transport unit
6: make the face that substrate suspends
7: the back side in the face that substrate is suspended
21: oscillating plate
22: junction
31: unit heater
32: pad
33: heater assembly
41: ultrasonic oscillator
42: import bar
51: hand
52: driving and reversing mechanism
W: substrate
Detailed description of the invention
With reference to accompanying drawing, embodiments of the present invention are described.
Fig. 1 and Fig. 2 is stereogram and the side view of the suspension transmission heater of an embodiment of the present invention.Suspend and transmit heater 1 involving vibrations plate portion 2, heater portion 3, ultrasonic wave generating unit 4 and transport unit 5, wherein, oscillating plate portion 2 is heated by heater portion 3.And oscillating plate portion 2 carries out ultrasonic wave vibration by ultrasonic wave generating unit 4, and according to the radiation pressure that it vibrates, the substrate W in oscillating plate portion 2 is suspended.Accordingly, substrate W is suspended according to oscillating plate portion 2, is heated, and is transmitted by transport unit 5 in oscillating plate portion 2 simultaneously.
At this, in the following description, substrate W is set to Y direction by the direction of transmitting, the direction intersected vertically in the horizontal plane with Y direction is set to X-direction, and the direction intersected vertically with X-axis and Y direction both sides is set to Z-direction and is described.
Oscillating plate portion 2 has multiple oscillating plate 21.In the present embodiment, oscillating plate 21 is metallic plates with rectangular plate-like structure of aluminum (aluminum alloy), by these oscillating plate 21 continuous arrangements being arranged in the direction of transfer (Y direction) of substrate, forms oscillating plate portion 2.Now, the junction 22 between oscillating plate 21 exists along the direction (X-direction) intersected vertically with substrate direction of transfer.
At this, the X-direction size of the substrate W when size of the X-direction of each oscillating plate 21 is set greater than mounting substrate W on oscillating plate 21.Accordingly, when substrate W is transmitted on oscillating plate portion 2 by transport unit 5, the part that substrate W stretches out from oscillating plate portion 2 can not be there is in X-direction, because the whole face of substrate W is all above oscillating plate portion 2, thus can heated substrates W equably in the X direction by the oscillating plate portion 2 of being heated by heater portion 3.And because substrate W is transmitted evenly by transport unit 5, therefore as aftermentioned, the whole face of substrate W is uniformly heated.
Heater portion 3 is positioned at the side, the back side 7 in the face 6 that substrate W is suspended in oscillating plate portion 2, has multiple unit heater 31 and pad 32.By unit heater 31 is come X-direction and Y direction, form heater assembly 33 thus.In addition, pad 32 is arranged on section heaters unit 31, and to support oscillating plate 21, and by pad 32, oscillating plate portion 2 and heater assembly 33 separate predetermined interval.
In the present embodiment, unit heater 31 be inserted into rectangular plate-like by cartridge heater or encapsulation heater aluminium sheet in and the plate heater that forms, these heaters are seamlessly arranged side by side in X-direction and Y direction.But, also plate heater can be replaced to use with mica heater at this.
At this, the size of the X-direction of heater assembly 33 is greater than the size of the X-direction in oscillating plate portion 2, and the size of the Y direction of heater assembly 33 is more than or equal to the size of the Y direction in oscillating plate portion 2.And, when observing heater assembly 33 along Z-direction from oscillating plate portion 2, the layout that the region forming oscillating plate portion 2 is accommodated by the region of heater assembly 33.Accordingly, heater assembly 33 can whole of simultaneously heating vibration plate portion 2, and whole oscillating plate portion 2 can be heated to be uniform temperature.But it is also no problem that the X-direction of each unit heater 31 of formation heater assembly 33 and the size of Y direction are less than oscillating plate 21.And, do not adopt the shape of assembly, and adopt that to be only greater than the method in a unit heater 31 heating vibration plate portion 2 in oscillating plate portion 2 by the size of X-axis and Y-axis also passable.
Pad 32 is the blocks of the path such as using resin to make, and in the present embodiment, by pad 32, is provided with the interval of 1mm between oscillating plate portion 2 and heater assembly 33.According to so separating oscillating plate portion 2 and heater assembly 33, being not directly heating but radiation heating by the heating for oscillating plate portion 2 of heater assembly 33, comparing with direct heating, easily making the temperature in whole oscillating plate portion 2 become even.
And, in the arrangement that oscillating plate portion 2 contacts with heater assembly 33, due to the difference of both vibration characteristics such as such as intrinsic frequency, heater assembly 33 can be caused to hinder the vibration in oscillating plate portion 2, but by making both separately, the vibration in oscillating plate portion 2 can not be subject to the obstruction of heater assembly 33, can vibrate according to setting.
At this, preferably, the mode that pad 32 supports oscillating plate 21 according to the position at the vibration nodal point corresponding to oscillating plate 21 is disposed on unit heater 31.Accordingly, pad 32 can minimize the vibration accepted from oscillating plate 21, can prevent from thus interfering and the wearing and tearing of pad 32 that cause because pad 32 and oscillating plate 21 produce.
Ultrasonic wave generating unit 4 comprises ultrasonic oscillator 41 and imports bar 42.When observing from Z-direction, relative to oscillating plate 21, ultrasonic oscillator 41 and unit heater 31 are positioned at homonymy, and are arranged in relative to unit heater 31 more away from the position of oscillating plate 21.Ultrasonic oscillator 41 is connected with and imports bar 42, this importing bar 42 contacts with oscillating plate 21 through unit heater 31.
Ultrasonic oscillator 41 excites object based on the oscillator signal from not shown oscillator, such as, be the Langevin formula oscillator with electrode and piezoelectric element.In Langevin formula oscillator, by applying driving voltage by oscillator to electrode, piezoelectric element produces vibration thus, and with predetermined amplitude and hunting of frequency.The vibration so carrying out the ultrasonic oscillator 41 vibrated propagates into oscillating plate 21 as object via importing bar 42, produces vibration to make oscillating plate 21.By the vibration of oscillating plate 21, produce sound radiation pressure from oscillating plate 21, according to this sound radiation pressure, the substrate W be positioned on oscillating plate 21 is subject to power upwards.Accordingly, substrate W maintenance can be made to be suspended in the state above oscillating plate 21 with predetermined suspension amount.
And, by the driving voltage that controls to provide from oscillator to adjust amplitude and the frequency of the vibration of ultrasonic oscillator 41, the suspension amount of the substrate W be suspended on oscillating plate 21 can be adjusted accordingly.In the present embodiment, the suspension amount of basic W is about 0.1mm.
Import bar 42 and form shape cylinder or multiple cylinder coupled together, one end is connected with ultrasonic oscillator 41, and the other end contacts with oscillating plate 21, with amplify or vibration that ultrasonic attenuation oscillator 41 sends amplitude and be delivered to oscillating plate 21.And, importing bar 42 and run through unit heater 31 and arrange, therefore arranging the position importing bar 42, unit heater 31 being provided with through hole or otch, in order to the interference avoided with import bar 42.
And, import bar 42 and be arranged between ultrasonic oscillator 41 and oscillating plate 21, doublely accordingly play the effect separated from heater assembly 33 by ultrasonic oscillator 41., can be there is the impaired fault of piezoelectric element by during heating in ultrasonic oscillator 41 poor heat resistance, therefore use importing bar 42 to make ultrasonic oscillator 41 away from heater assembly 33, pass to ultrasonic oscillator 41 to prevent the heat of heater assembly 33.
And in the present embodiment, import bar 42 and adopt titanium to make, therefore thermal conductivity is low, even if import the end contacted with oscillating plate of bar 42 and heated near the part of unit heater 31, its heat is also difficult to be passed to the end be connected with ultrasonic oscillator 41.And, use not shown air cooling equipment cooling ultrasonic oscillator 41, and not shown heat-barrier material is set on the face relative with ultrasonic oscillator 41 of unit heater 31, thus minimize the impact of heater assembly 33 on ultrasonic oscillator 41.
At this, in present embodiment, consider the transmission avoiding hindering substrate W, when observing from Z-direction, Relative Vibration plate 21, make ultrasonic oscillator 41 be positioned at homonymy with unit heater 31, namely contact with oscillating plate 21 in the opposition side of the side with substrate W, but with the homonymy of substrate W contact with oscillating plate 21 also no problem.Even if the homonymy of ultrasonic oscillator 41 at substrate W is contacted with oscillating plate 21, with present embodiment the same with the opposition side contact vibration plate 21 of substrate W, also can obtain making substrate W to vibrate the effect suspended.
Transport unit 5 comprises hand 51 and driving and reversing mechanism 52.Hand 51 has the module of such as L font, contacts and supporting substrate W with two limits of substrate W in the corner of substrate W, and for the support of one piece of substrate W, hand 51 arranges two substrate W's to angular direction, the diagonal angle of supporting substrate W locating.And driving and reversing mechanism 52 is straight-line motion mechanisms of cylinder etc., and be provided with hand 51, when supporting substrate W and when removing support, move respective hand 51.By this driving and reversing mechanism 52, hand 51 when supporting substrate W near substrate W, and remove support time, keep out of the way from substrate W.At this, in the state that hand 51 is kept out of the way, because substrate W is in the restriction of X-direction and Y direction by the state removed, therefore when hand 51 next time near time, likely the position of substrate W produces and departs from, thus produces with hand 51 and conflict and damaged substrate W and hand 51.Now, preferably, oscillating plate portion 2 arranges the pin moved up and down, thus when hand 51 is kept out of the way, make pin increase with the position of restricting substrate W, and when substrate W transmits in oscillating plate portion 2, pin is declined with obstruction free transfer operation.
And driving and reversing mechanism 52 is connected to the shifting axle of not shown Y direction.At hand 51 near the corner of substrate W with in the state of supporting substrate W, moved to Y direction by this shifting axle according to hand 51 and driving and reversing mechanism 52, substrate W is transmitted along Y direction.
At this, cause hand 51 or oscillating plate 21 to be worn to prevent hand 51 from contacting with oscillating plate 21 and produce particulate, air bearing can be set below hand 51, make hand 51 and oscillating plate 21 keep predetermined interval.
Below, the installation site of the ultrasonic wave generating unit 4 in oscillating plate portion 2 is described with reference to Fig. 1 and Fig. 2.
As mentioned above, in order to by the Vibration propagation from ultrasonic oscillator 41 to oscillating plate 21, import bar 42 contact with oscillating plate 21, and corresponding to be furnished with importing bar 42 position, unit heater 31 is provided with through hole or otch.Therefore, on oscillating plate 21 with import the position that contacts of bar 42 and near, compare other positions, be difficult to the heating accepting unit heater 31, therefore temperature step-down.Also be like this in the face of the side making substrate W suspend, overleaf side with import the position and neighbouring temperature step-down thereof that bar 42 contacts.When this position heated substrates W, compared to other positions, cannot heat fully, therefore substrate W likely produce dry spot.
Therefore, in the present embodiment, can not heat substrate W at above-mentioned position, thus prevent the generation of dry spot.Specifically, relative to the region R1 making substrate W suspend shown in Fig. 1 and Fig. 2 and the region R2 being equivalent to its rear side, in the outside in these regions, that is, in the outside in the region of heated substrates W, oscillating plate 21 contacts with importing bar 42.
Then, with reference to Fig. 3, the relation arranged direction in multiple oscillating plate portion 2 and substrate W producing dry spot is described.Fig. 3 is the skeleton diagram of the different heat characteristic of the substrate W in the arranged direction illustrated according to oscillating plate 21.Fig. 3 (a) is for oscillating plate 21 is according to the situation of the junction between oscillating plate 21 along the mode arranged of the direction of transfer (Y direction) of substrate, the situation of the mode arranged in the direction (X-direction) that Fig. 3 (b) intersects vertically along the direction of transfer with substrate according to the junction between oscillating plate 21 for oscillating plate 21, Fig. 3 (c) is for oscillating plate 21 is according to the situation of the mode arranged of the gradient had between the junction between oscillating plate 21 and the direction of transfer of substrate in addition to perpendicular, the left side of each figure is the ideograph of the relation represented between the direction of transfer of substrate and the arranged direction of oscillating plate 21, right side is for representing the curve map (heating curves) of the change of A point on substrate W represented on ideograph and this substrate temperature of 2 of B point.
When multiple oscillating plate 2 arranges and forms oscillating plate portion 2, even if whole of oscillating plate portion 2 is heated by heater portion 3, also be difficult to allow the temperature of the junction 22 between oscillating plate portion 2 also become the temperature identical with other parts, therefore the temperature of junction 22 part is substantially lower than the temperature of other parts.At this, when junction as Suo Shi Fig. 3 (a) along Y direction time, exist as the B point on substrate W in substrate suspension transport process all the time by the point on junction 22.Heating curves on this point as shown in the right side graph figure of Fig. 3 (a), lower than the heating curves of the point (point as representated by A point) by the part beyond junction 22.That is, whole of substrate W is not uniformly heated and in coated film, produces the dry spot of the strip along junction 22.
In contrast to this, when junction 22 as Suo Shi Fig. 3 (b) along X-direction time, A point and B point are in identical heated condition.Although each point by junction 22 time substrate temperature slightly decline, because the time is also consistent, therefore heating curves of each point also can be identical.And in this case, by making the transfer rate of substrate W become at the uniform velocity further, the A point be not only arranged side by side in X-direction and B point, the whole point on substrate W also can form identical heating curves.
In the present embodiment, as mentioned above, according to oscillating plate 21 along Y direction arranged, junction 22 is formed along X-direction.Therefore, as shown in Fig. 3 (b), because the whole point on substrate W all forms identical heating curves, therefore, it is possible to whole of heated substrates W equably, and prevent the generation of the dry spot of coated film.
At this, as shown in Fig. 3 (c), even if the direction of junction 22 is not along X-direction, as long as Y direction has gradient relatively, can prevent from being present on substrate W by means of only the point of junction 22 all the time.But as shown in the curve map of Fig. 3 (c), each time by time substrate temperature step-down on junction 22 is all not identical, therefore cannot form identical heating curves.Also the possibility producing dry spot is there is based on this reason, therefore, preferably, junction 22 convergence X-direction (with the direction that substrate direction of transfer is slightly vertical).
At this, when the area of the substrate W that will transmit is little, and use one piece of oscillating plate 21 also can be heated to coated film dried fully time, one piece of oscillating plate 21 also can be used to form oscillating plate portion 2.Accordingly, by the variations in temperature that the junction without the need to considering between oscillating plate portion 2 causes, the generation of dry spot easily can be prevented.
Then, illustrate that the suspension of the substrate W transmitted on heater 1 that suspends adds thermally operated flow process based on Fig. 4.At this, suppose that, when carrying out transfer operation, oscillating plate portion 2 is in the state being heated to maximum temperature by heater portion 3.And suppose that oscillating plate portion 2 is in the state vibrated by ultrasonic wave generating unit 4, the substrate W transmitted on oscillating plate portion 2 is suspended immediately.
First, the substrate W being coated with coating fluid is moved to by upstream process and transmits starting position (step S1).The method of moving into of substrate can according to conveyer belt, running roller etc., without restriction for kind.At this, in this transmission starting position, substrate W also not near oscillating plate portion 2, and under not also being in the environment of heated substrates W.Owing to stopping the scheduled time at this position substrate W, if therefore oscillating plate portion 2 starts heating, then because of the existence of junction 22, dry spot can be produced.
Then, hand 51 is by driving and reversing mechanism 52 near substrate W, and substrate W is supported (step S2) by locating thus.When arranging the pin of the position being used for restricting substrate W in oscillating plate portion 2, first hand 51 is near substrate W after supporting substrate W, and pin declines.
Then, according to not shown shifting axle, hand 51 and driving and reversing mechanism 52 at the uniform velocity move towards Y direction, and meanwhile substrate W is at the uniform velocity transmitted (step S3) towards Y direction.In this moving process, substrate W, near oscillating plate portion 2, performs the heat drying of substrate W from close position.
While basic W is transmitted, heat drying is also continuing, and then hand 51 and driving and reversing mechanism 52 arrive transmission end (step S4).After this, in order to the handing-over to subsequent processing, substrate W stops the scheduled time.And at this time point, the heat drying of substrate W terminates.If do not completed at the heat drying of this time point substrate W, then because the junction 22 in oscillating plate portion 2 likely produces dry spot.Therefore, be necessary to arrange the speed and transmitting range that at the uniform velocity transmit, with the heat drying of completing substrate W before arriving transmission end at hand 51.
Then, hand 51 is kept out of the way from substrate W, thus removes the support (step S5) to substrate W.When oscillating plate portion 2 being provided with the pin for the position of restricting substrate W, pin first rise and restricting substrate W, defensive position 51 just keep out of the way.And, until next handing-over is carried out, sell restricting substrate W always.
Then, hand 51 and driving and reversing mechanism 52 get back to the initial position position of supporting substrate W (in the transmission starting position of step S1 can), are in the holding state (step S6) transmitting next substrate W.
Finally, when substrate W is handed off to subsequent processing from suspension transmission heater 1, terminate heat drying operation, substrate W is given to subsequent processing (step S7).At this, identical with when moving into substrate, the method that takes out of for substrate W is not limited.
Transmit heater according to the suspension that as above illustrates, dry spot and heat drying substrate W can be formed in coated film, and transmission and the heat drying of substrate can be implemented simultaneously.
Fig. 5 is the example using the coated film baking production line transmitting heater 1 that suspends of the present invention.Suspend and transmit the drying process that heater 1 can not only be applied to aforesaid substrate, the design temperature of unit heater 31 can also be improved further and be applicable to toast coated film.And, by replacing the cartridge heater etc. in unit heater 31 with coolant, so that unit heater 31 is used as cooling unit, thus cooling base W can also be applied to.Accordingly, transmit heater 1 just can form the drying of substrate W, baking, refrigerating work procedure by means of only of the present invention suspension.
And, in the prior art, stove can be set respectively for these operations and implement, now, between each stove, being necessary to arrange charging appliance, with moving substrate.In contrast, adopting the coated film transmitting heater 1 that suspends of the present invention to toast in production line, just can substrate be transmitted without the need to loading machine, therefore, it is possible to shorten the length of production line and the cost of economy system.
Claims (3)
1. suspend and transmit a heater, it is characterized in that, this suspension transmits heater and comprises:
Oscillating plate portion, vibrates for making basal-plate ultrasonic and suspends;
Heater portion, for heating described oscillating plate portion;
Ultrasonic wave generating unit, for providing ultrasonic wave to vibrate to described oscillating plate portion;
Transport unit, the end of supporting substrate, transmits substrate along the direction vertical with suspension direction, wherein,
Described heater portion forms predetermined space with described oscillating plate portion and arranges in the rear side in the face making substrate suspend in described oscillating plate portion,
The size in the described oscillating plate portion in the direction intersected vertically with the direction of transfer of substrate is greater than the size of equidirectional substrate,
By being heated described oscillating plate portion by described heater portion, whole of the substrate transmitted that suspends is heated by described oscillating plate portion.
2. suspension according to claim 1 transmits heater, it is characterized in that, described ultrasonic wave generating unit contacts with described oscillating plate portion in the outside in following two regions, and provide ultrasonic wave to vibrate to described oscillating plate portion, described two regions be described oscillating plate portion the region that substrate is suspended and in described oscillating plate portion, the region of the rear side that is equivalent to the region that substrate is suspended.
3. suspension according to claim 1 and 2 transmits heater, it is characterized in that, multiple oscillating plate is arranged along a direction continuous arrangement and is formed by described oscillating plate portion, junction between described oscillating plate and the direction of transfer of substrate intersect vertically substantially, and described transport unit is at the uniform velocity to transmit the substrate in described oscillating plate portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-120762 | 2011-05-30 | ||
| JP2011120762A JP5869782B2 (en) | 2011-05-30 | 2011-05-30 | Levitation conveyance heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102806179A CN102806179A (en) | 2012-12-05 |
| CN102806179B true CN102806179B (en) | 2016-04-13 |
Family
ID=47230151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210113664.XA Active CN102806179B (en) | 2011-05-30 | 2012-04-18 | Suspend and transmit heater |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5869782B2 (en) |
| KR (1) | KR101850359B1 (en) |
| CN (1) | CN102806179B (en) |
| TW (1) | TWI529840B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5851295B2 (en) * | 2012-03-16 | 2016-02-03 | 東レエンジニアリング株式会社 | Heat treatment equipment |
| JP5995675B2 (en) * | 2012-11-20 | 2016-09-21 | 東レエンジニアリング株式会社 | Cooling system |
| JP6095394B2 (en) * | 2013-02-13 | 2017-03-15 | 東レエンジニアリング株式会社 | Substrate processing system and substrate processing method |
| KR101888280B1 (en) * | 2013-07-22 | 2018-08-13 | 제트에스-핸들링 게엠베하 | Device for treating or machining a surface |
| JP2015032656A (en) * | 2013-08-01 | 2015-02-16 | 東レエンジニアリング株式会社 | Substrate levitation device |
| JP6180245B2 (en) * | 2013-09-10 | 2017-08-16 | 東レエンジニアリング株式会社 | Cleaning device |
| KR102190687B1 (en) * | 2014-12-08 | 2020-12-15 | 엘지디스플레이 주식회사 | slit coaster system |
| JP6634516B2 (en) * | 2015-09-24 | 2020-01-22 | カティーバ， インコーポレイテッド | Printing system assembly and method |
| KR101960661B1 (en) * | 2016-12-01 | 2019-07-15 | 주식회사 케이씨텍 | Substrate transfering apparatus and substrate processing system having the same |
| CN106784411B (en) * | 2017-03-09 | 2018-11-23 | 京东方科技集团股份有限公司 | A kind of film levelling equipment |
| CN107552304B (en) * | 2017-09-22 | 2019-01-25 | 东莞市松研智达工业设计有限公司 | Ultrasonic spray workbench |
| KR101971213B1 (en) * | 2017-12-29 | 2019-04-23 | 인덕대학교 산학협력단 | The Device of Forming Flat-Cured Film |
| CN109638122B (en) * | 2018-12-20 | 2019-08-27 | 广东工业大学 | A method of using ultrasonic standing wave manipulation Micro-LED flood tide transfer |
| JP6916833B2 (en) * | 2019-04-18 | 2021-08-11 | 株式会社Ｓｃｒｅｅｎホールディングス | Coating device and coating method |
| CN115056401B (en) * | 2022-06-08 | 2023-02-03 | 佛山巨马新材料有限公司 | Preparation method of electronic adhesive |
| CN116067158B (en) * | 2023-02-07 | 2023-07-04 | 无锡爱德旺斯科技有限公司 | Air supporting oven |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63202516A (en) * | 1987-02-17 | 1988-08-22 | Hitachi Plant Eng & Constr Co Ltd | Board like object transfer device |
| JP2006205064A (en) * | 2005-01-28 | 2006-08-10 | Dainippon Printing Co Ltd | Dryer |
| JP2007061713A (en) * | 2005-08-30 | 2007-03-15 | Infinity Kk | Cleaning/drying apparatus and washing system |
| CN101101856A (en) * | 2006-07-04 | 2008-01-09 | 大日本网目版制造株式会社 | Substrate processing device |
| CN101542763A (en) * | 2006-11-21 | 2009-09-23 | 赢创德固赛有限责任公司 | Thermoelectric elements, method for the production thereof, and use thereof |
| CN101874297A (en) * | 2007-11-22 | 2010-10-27 | Ap系统股份有限公司 | Substrate rotating and oscillating apparatus for rapid thermal process |
| CN201807518U (en) * | 2010-10-12 | 2011-04-27 | 上海涂装工程有限公司 | Film coating, floating and drying device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2934379B2 (en) * | 1994-03-07 | 1999-08-16 | 株式会社カイジョー | Object transfer device with object levitation device |
| JP3122061B2 (en) * | 1997-07-22 | 2001-01-09 | 株式会社カイジョー | Cluster tool type single wafer processing equipment with ultrasonic levitation transport mechanism |
| JP4003568B2 (en) * | 2001-07-27 | 2007-11-07 | 株式会社豊田自動織機 | Object levitation device, object transport device, and unloading device |
| JP2008302320A (en) * | 2007-06-08 | 2008-12-18 | Infinity Enterprises Inc | Cleaning apparatus |
| US8354616B2 (en) * | 2008-03-31 | 2013-01-15 | Corning Incorporated | Heater apparatus, system, and method for stabilizing a sheet material |
| JP4592787B2 (en) * | 2008-07-11 | 2010-12-08 | 東京エレクトロン株式会社 | Substrate processing equipment |
-
2011
- 2011-05-30 JP JP2011120762A patent/JP5869782B2/en not_active Expired - Fee Related
-
2012
- 2012-03-02 TW TW101107084A patent/TWI529840B/en not_active IP Right Cessation
- 2012-04-18 CN CN201210113664.XA patent/CN102806179B/en active Active
- 2012-04-27 KR KR1020120044460A patent/KR101850359B1/en active IP Right Grant
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63202516A (en) * | 1987-02-17 | 1988-08-22 | Hitachi Plant Eng & Constr Co Ltd | Board like object transfer device |
| JP2006205064A (en) * | 2005-01-28 | 2006-08-10 | Dainippon Printing Co Ltd | Dryer |
| JP2007061713A (en) * | 2005-08-30 | 2007-03-15 | Infinity Kk | Cleaning/drying apparatus and washing system |
| CN101101856A (en) * | 2006-07-04 | 2008-01-09 | 大日本网目版制造株式会社 | Substrate processing device |
| CN101542763A (en) * | 2006-11-21 | 2009-09-23 | 赢创德固赛有限责任公司 | Thermoelectric elements, method for the production thereof, and use thereof |
| CN101874297A (en) * | 2007-11-22 | 2010-10-27 | Ap系统股份有限公司 | Substrate rotating and oscillating apparatus for rapid thermal process |
| CN201807518U (en) * | 2010-10-12 | 2011-04-27 | 上海涂装工程有限公司 | Film coating, floating and drying device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI529840B (en) | 2016-04-11 |
| KR20120135029A (en) | 2012-12-12 |
| KR101850359B1 (en) | 2018-04-19 |
| CN102806179A (en) | 2012-12-05 |
| TW201248761A (en) | 2012-12-01 |
| JP2012248755A (en) | 2012-12-13 |
| JP5869782B2 (en) | 2016-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102806179B (en) | Suspend and transmit heater | |
| CN103302009B (en) | Annealing device | |
| TWI590367B (en) | Suspension transfer heat treatment device | |
| CN103781733B (en) | Method and apparatus for hard glass | |
| WO2016178966A1 (en) | Method and apparatus for controlling thickness of glass sheet | |
| KR20160004213A (en) | Levitation transportation apparatus | |
| TW201350447A (en) | Sound wave levitation device, sound wave levitation method, plate glass manufacturing apparatus, and plate glass manufacturing method | |
| JP2014022538A (en) | Heat treatment apparatus and heat treatment method | |
| JP2016216238A (en) | Substrate conveyance apparatus | |
| JP6053468B2 (en) | Levitation transfer heat treatment equipment | |
| JPWO2011155299A1 (en) | Leveling processing apparatus, coating film manufacturing apparatus equipped with the same, and coating film manufacturing method | |
| JP5988359B2 (en) | Heat treatment equipment | |
| CN105705446A (en) | Roll manufacturing method and manufacturing device | |
| JP2015032656A (en) | Substrate levitation device | |
| JP5580703B2 (en) | Reflow soldering equipment | |
| JP5995675B2 (en) | Cooling system | |
| JP6166065B2 (en) | High frequency heating device | |
| TW201922636A (en) | Systems and methods for processing thin glass ribbons | |
| JP6241913B2 (en) | Substrate heat treatment equipment | |
| JP5874634B2 (en) | Heat treatment apparatus and heat treatment method | |
| JP2018074070A (en) | Heat treatment equipment and heat treatment method | |
| JP2014005113A (en) | Supersonic vibration levitation device | |
| KR102100894B1 (en) | The drying with floating substrate device | |
| KR101583491B1 (en) | Bonding Apparatus of Semiconductor Package having Cooling Device | |
| JPS6234691B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |