JP2015032656A - Substrate levitation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate levitation device which stably levitates a substrate.SOLUTION: A substrate levitation device includes: a diaphragm part 2 which levitates a substrate W by ultrasonic vibration; an ultrasonic wave generation part 3 which applies the ultrasonic vibration to the diaphragm part 2; and a diaphragm support part 4 which is an elastic plate-like body and contacts with a lower surface of the diaphragm part 2 to support the diaphragm part 2.

Description

  The present invention relates to a substrate levitating apparatus that levitates a substrate by ultrasonic vibration.

  A flat panel display such as a liquid crystal display or a plasma display uses a substrate coated with a resist solution (referred to as a coated substrate). The coated substrate is produced by forming a coating film by uniformly applying a resist solution on the substrate by a coating apparatus, and then drying the coating film by a heat treatment apparatus.

  As one type of this heat treatment apparatus, for example, there is a floating conveyance heat treatment apparatus as shown in Patent Document 1 and FIG. As shown in FIG. 5, the levitation transfer heat treatment device 90 includes a substrate levitation device 91 including a vibration plate portion 92 and an ultrasonic wave generation portion 93 and a heating device 94 that heats the vibration plate portion 92, and is heated by the heating device 94. The substrate levitation device 91 thus formed causes the substrate W to be ultrasonically oscillated and floated so that the substrate W can be heated in a non-contact manner.

  In installing the substrate levitation apparatus 91 on the gantry of the levitation conveyance heat treatment apparatus 90, conventionally, as shown in FIG. 6A, the location corresponding to the vibration node when the vibration plate portion 92 vibrates ultrasonically is used as the gantry. A method of supporting and fixing with a supporting member 95 such as a connected pin or bracket has been used. In the vibration node, the vibration plate portion 92 is not displaced. Therefore, by supporting the vibration plate portion 92 there, the support member 95 does not prevent the vibration of the vibration plate portion 92, and the vibration plate portion 92 holds the substrate W. It is possible to float stably.

Japanese Patent Application No. 2011-74335

  However, the levitation transfer heat treatment apparatus 90 having the substrate levitation apparatus 91 has a problem that the levitation of the substrate becomes unstable. Specifically, the vibration plate 92 heated by the heating device 94 has a resonance frequency that changes due to a slight change in the surrounding environment such as a temperature change, and the position of the vibration node changes accordingly. For this reason, even if the support member 95 supports the diaphragm 92 at the position of the vibration node as shown in FIG. 6A in a certain state, it is shown in FIG. As described above, the support position is not the position of the vibration node, and the vibration of the vibration plate portion 92 is hindered, and the substrate may be unstable. Further, when the support member 95 supports the vibration plate portion 92 at a position other than the vibration node, the vibration plate portion 92 and the support member 95 are in a state where the entire load of the vibration plate portion 92 is applied to the support member 95. There is a problem in that the diaphragm portion 92 and the support member 95 are quickly worn due to continuous hitting.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate floating apparatus that can stably float a substrate.

  In order to solve the above-described problems, a substrate levitation apparatus according to the present invention includes a vibration plate portion that oscillates a substrate ultrasonically, an ultrasonic wave generation portion that applies ultrasonic vibration to the vibration plate portion, and an elastic plate-like body. And having a diaphragm support part that contacts the lower surface of the diaphragm part and supports the diaphragm part.

  According to the substrate levitation device, the position of the vibration node of the vibration plate portion is changed by having a vibration plate support portion that is in contact with the lower surface of the vibration plate portion and is supported by an elastic plate-like body. Even in such a case, since the diaphragm support portion can support the diaphragm portion at the position of the vibration node of the diaphragm portion, the substrate can be stably levitated. Specifically, since the diaphragm support portion has elasticity, the diaphragm portion can be vibrated to some extent, and the vibration of the diaphragm portion can be prevented from being hindered. In addition, by supporting the diaphragm with the diaphragm support part of the plate-like body, the diaphragm support part always maintains the state in which the vibration of the diaphragm part is received at the position of the vibration node of the diaphragm part. Therefore, it is possible to prevent the diaphragm support portion from being subjected to the full load of the diaphragm portion at the position of the vibration antinode of the diaphragm portion, so that the diaphragm support portion is not compressed and hardened, It is possible to sufficiently vibrate the vibration part.

  The diaphragm support portion may be in contact with substantially the entire lower surface of the diaphragm portion.

  By doing so, the load of the diaphragm can be sufficiently dispersed and supported, so that the vibration of the diaphragm can be sufficiently controlled without the diaphragm support being compressed and becoming hard. is there. Further, when the diaphragm part is heated from below the diaphragm support part via the diaphragm support part, the diaphragm part can be uniformly heated without causing unevenness in heat transfer.

  Moreover, the said diaphragm support part is good in it being a rubber sheet.

  By doing so, the elastic diaphragm support portion can be configured at low cost.

  Moreover, the hardness of the said diaphragm support part is good in it being Shore A60-80.

  By doing so, it is possible to firmly support the diaphragm part while applying vibration of the diaphragm part.

  Further, a temperature control unit that controls the temperature of the diaphragm part may be in contact with the lower surface of the diaphragm support part.

  In this way, since the temperature control unit and the diaphragm unit conduct heat through the diaphragm support unit, a space is provided between the temperature control unit and the diaphragm unit, and transmission to the diaphragm unit is performed by radiation or convection. The efficiency of heat conduction can be improved compared to the case where heat is generated.

  According to the substrate levitating apparatus of the present invention, the substrate can be stably levitated.

It is the schematic of the board | substrate floating apparatus in one Embodiment of this invention. It is the schematic of the board | substrate floating apparatus in one Embodiment of this invention. It is the schematic showing the support form of the diaphragm part in this embodiment. It is the schematic of the levitation conveyance heat processing line using the board | substrate levitation apparatus of this invention. It is the schematic of the conventional board | substrate floating apparatus. It is the schematic showing the support form of the diaphragm part in conventional embodiment.

  Embodiments according to the present invention will be described with reference to the drawings.

  1 and 2 are a perspective view and a side view of a substrate floating apparatus according to an embodiment of the present invention. The substrate levitation apparatus 1 includes a vibration plate unit 2, an ultrasonic wave generation unit 3, a vibration plate support unit 4, a temperature control unit 5, and a transport unit 6, and the vibration plate unit supported by the vibration plate support unit 4. 2 is ultrasonically vibrated by the ultrasonic wave generation unit 3 and the substrate W on the vibration plate unit 2 is floated by the radiation pressure due to the vibration. The diaphragm 2 is heated (or cooled) by the temperature controller 5 via the diaphragm support 4. Accordingly, the substrate W is transported on the diaphragm 2 by the transport unit 6 while being floated and heated (or cooled) by the diaphragm 2.

  In the following description, the direction in which the substrate W is transported is the Y-axis direction, the direction orthogonal to the Y-axis direction on the horizontal plane is the X-axis direction, and the direction orthogonal to both the X-axis and Y-axis directions is the Z-axis direction. The explanation will proceed as follows.

  The diaphragm portion 2 has a plurality of diaphragms 11. The vibration plate 11 is a metal plate made of aluminum (made of aluminum alloy) and having a rectangular plate shape in the present embodiment, and these are continuously arranged in the substrate transport direction (Y-axis direction). A diaphragm portion 2 is formed.

  Since the diaphragm 2 is heated by the temperature controller 5 via the diaphragm support 4 as described above, the substrate W levitated on the diaphragm 2 can be heated by radiation heating. .

  Here, the dimension in the X-axis direction and the dimension in the Y-axis direction of the diaphragm portion 2 are set larger than the dimensions in the X-axis direction and the Y-axis direction of the substrate W when the substrate W is placed on the diaphragm 11. Has been. Thus, when the substrate W is heated (or cooled) while flying over the diaphragm portion 2, there is no portion where the substrate W protrudes from the diaphragm portion 2, and the entire surface of the substrate W is the diaphragm portion 2. Therefore, the substrate W can be uniformly heated (or cooled) by the diaphragm 2 heated (or cooled) by the temperature controller 5.

  The ultrasonic generator 3 includes an ultrasonic transducer 12 and a horn 13. The ultrasonic transducer 12 is disposed on the side opposite to the surface on which the substrate W is levitated relative to the diaphragm 11 when viewed from the Z-axis direction. A horn 13 is connected to the ultrasonic vibrator 12, and the horn 13 penetrates a diaphragm support section and a temperature control section 5 described later and is in contact with the diaphragm 11.

  The ultrasonic vibrator 12 excites an object based on an oscillation signal from an oscillator (not shown). For example, there is a Langevin vibrator having an electrode and a piezoelectric element. In the Langevin type vibrator, when a driving voltage is applied to an electrode by an oscillator, the piezoelectric element vibrates and oscillates with a predetermined amplitude and frequency. The vibration of the ultrasonic vibrator 12 oscillated in this way is propagated to the diaphragm 11 which is the object via the horn 13 to vibrate the diaphragm 11. When the diaphragm 11 vibrates, a radiated sound pressure is generated from the diaphragm 11, and an upward force is applied to the substrate W on the diaphragm 11 by the radiated sound pressure. Thereby, it is possible to hold the substrate W in a state where it floats above the diaphragm 11 by a predetermined flying height.

  Further, the vibration of the ultrasonic transducer 12 can be adjusted in amplitude and frequency by controlling the drive voltage applied from the oscillator, and thereby the flying height of the substrate W floating on the diaphragm 11 can be adjusted. Is possible. The flying height of the substrate W is about 0.1 mm in this embodiment.

  The horn 13 has a shape in which a cylinder or a plurality of cylinders are connected, one end is connected to the ultrasonic vibrator 12, and the other end is connected to the vibration plate 11, and vibration of the ultrasonic vibrator 12 is emitted. The amplitude is amplified or attenuated and propagated to the diaphragm 11. Further, since the horn 13 is arranged to penetrate the diaphragm support 4 and the temperature controller 5, the diaphragm support 4 and the temperature controller 5 are provided with through holes or notches at the positions where the horn 13 is disposed. Interference with the horn 13 is avoided.

  The diaphragm support portion 4 is a plate-like body having elasticity, and is a rubber sheet having a hardness of Shore A 60 to 80 in this embodiment. The upper surface of the diaphragm support portion 4 is in contact with the lower surface of the diaphragm portion 2 without a gap and supports the diaphragm portion 2. And the diaphragm support part 4 which supported the diaphragm part 2 is being fixed to external apparatuses, such as a levitation conveyance heat processing line, via surfaces other than the upper surface of the diaphragm support part 4, for example.

  The diaphragm part 2 vibrates ultrasonically while being supported by the diaphragm support part 4. Incidentally, the substrate W floats ultrasonically on the diaphragm portion 2 due to the vibration of the diaphragm portion 2, but the weight of the diaphragm portion 2 is sufficiently heavier than that of the substrate W, and the vibration plate portion 2 itself vibrates due to the vibration of the diaphragm portion 2 itself. The part 2 does not float from the diaphragm support part 4.

  Further, the diaphragm support portion 4 has substantially the same area as the lower surface of the diaphragm portion 2 and is in contact with substantially the entire lower surface of the diaphragm portion 2 without a gap.

  The diaphragm support 4 is a fluoro rubber sheet and has a heat resistance of 200 ° C. or higher. Thereby, even if the diaphragm support part 4 is heated by the temperature control part 5 to be described later, the diaphragm support part 4 is not altered.

  Here, it is desirable that the thickness of the diaphragm support portion 4 is 0.5 mm or more in order to sufficiently vibrate the diaphragm portion 2 as described later. Further, in order to improve the heat conduction efficiency from the temperature control unit 5 to the diaphragm 2, it is desirable that it is 10 mm or less.

  The temperature control unit 5 is a heater unit in the present embodiment, and includes a plurality of heater units 21 that are arranged in the X-axis direction and the Y-axis direction.

  Further, the temperature control unit 5 is located on the opposite side of the diaphragm unit 2 with the diaphragm support unit 4 interposed therebetween, and is in contact with the diaphragm support unit 4 without a gap, so that the diaphragm support unit 4 can be connected without air. Heat directly. Thereby, compared with the case where space is provided between the temperature control part 5 and the diaphragm part 2 and heat transfer to the diaphragm part 2 is performed by radiation or convection, the efficiency of heat conduction can be improved. ing.

  In this embodiment, the heater unit 21 is a plate heater configured by inserting a cartridge heater or a sheathed heater into a rectangular aluminum plate, and these are arranged without gaps in the X-axis direction and the Y-axis direction.

  Here, the dimensions of the temperature control unit 5 in the X-axis direction and the Y-axis direction are equivalent to the dimensions of the diaphragm unit 2 in the X-axis direction and the Y-axis direction. When the temperature controller 5 is viewed from the diaphragm 2 along the Z-axis direction, the region of the diaphragm 2 overlaps the region of the temperature controller 5. Accordingly, the temperature control unit 5 can simultaneously heat the entire surface of the diaphragm unit 2 via the diaphragm support unit 4, and can heat the entire diaphragm unit 2 to a uniform temperature. Further, when the temperature control unit 5 is larger than the diaphragm unit 2, there is a difference in the heat radiation amount of the temperature control unit 5 between the portion where the diaphragm unit 2 is located above and the portion where the diaphragm unit 2 is not present, and as a result, the temperature control unit 5. Although there is a possibility that the temperature distribution accuracy of the battery becomes worse, it can be prevented. Each heater unit 21 forming the temperature control unit 5 may be smaller in dimensions in the X-axis direction and the Y-axis direction than the diaphragm 11. Further, a method may be used in which the diaphragm portion 2 is heated using only one heater unit 21 without taking the form of an aggregate.

  The transport unit 6 includes a hand 22 and an advance / retreat mechanism 23. The hand 22 has, for example, an L-shaped block, and supports the two sides of the substrate W in contact with the corners of the substrate W. Two hands 22 are provided in the diagonal direction of the substrate W with respect to the support of one substrate W so that the diagonal of the substrate W can be positioned and supported. The advancing / retracting mechanism 23 is a linear motion mechanism such as an air cylinder, to which the hand 22 is attached, and moves each hand 22 when the substrate W is supported and when the support is released. By this advance / retreat mechanism 23, the hand 22 approaches the substrate W when the substrate W is supported, and retracts from the substrate W when the support is released. Here, in the state in which the hand 22 is retracted, the substrate W is in a state in which the restraints in the X-axis direction and the Y-axis direction are released. Therefore, when the hand 22 approaches next, the position of the substrate W shifts. There is a possibility that the substrate W and the hand 22 are damaged by colliding with the hand 22. In this case, a pin that moves up and down is provided on the diaphragm 2, and when the hand 22 is retracted and the substrate W is floating at a predetermined position on the diaphragm 2, the pin is raised to restrain the position of the substrate W. When the substrate W is transported on the diaphragm 2, it is preferable that the pins are lowered so as not to disturb the transport operation.

  The advance / retreat mechanism 23 is connected to a travel axis in the Y-axis direction (not shown). When the hand 22 approaches the corner of the substrate W and supports the substrate W, the hand 22 and the advancing / retracting mechanism 23 move in the Y-axis direction by this traveling axis, whereby the substrate W is transported in the Y-axis direction. Is done.

  Next, the support form of the diaphragm part in the substrate floating apparatus of the present invention is shown in FIG. FIG. 3A shows a support form of the diaphragm portion 2 by the diaphragm support portion 4 when the resonance frequency of the diaphragm portion 2 has a predetermined value, and FIG. ) And the diaphragm part 2 are supported by the diaphragm support part 4 when the resonance frequency of the diaphragm part 2 is different.

  In the state shown in FIG. 3A, the vibration plate 2 is not displaced in the vibration direction (Z-axis direction) at the portion corresponding to the vibration node of the vibration plate portion 2 indicated by an arrow in the drawing. It will be in the state supported by the support part 4. FIG. Therefore, while the diaphragm portion 2 is vibrating, the load of the diaphragm portion 2 is dispersed and supported at least at the portion corresponding to the vibration node.

  And the more the diaphragm support part 4 supports the diaphragm part 2 in a larger area, the more the number of portions corresponding to the vibration nodes of the diaphragm part 2 in the region supported by the diaphragm support part 4 increases, so the more In this point, the load of the diaphragm portion 2 can be dispersed and supported, and the load per point can be reduced.

  Here, in a portion other than the vibration node of the vibration plate portion 2 and displaced downward due to vibration, the vibration plate portion 2 pushes in the vibration plate support portion 4 having elasticity. Here, if the load of the diaphragm 2 is applied to the diaphragm support 4 only at the portion corresponding to the vibration antinode of the diaphragm 2, the diaphragm support 4 is excessively compressed and hardened, and the vibration There is a possibility that the vibration of the diaphragm portion 2 may be interrupted and the vibration of the diaphragm portion 2 may be disturbed.

  On the other hand, in the present embodiment, since the diaphragm portion 2 is supported even in the portion corresponding to the vibration node as described above, the portion where the diaphragm portion 2 is displaced downward (the portion where the diaphragm support portion 4 is pushed in). , It is possible to prevent the entire load of the diaphragm portion 2 from being applied, and the load applied to the diaphragm support portion 4 is reduced. Thereby, even if the diaphragm support part 4 is pushed in corresponding to the position of the vibration antinode of the diaphragm part 2, the diaphragm support part 4 is not compressed excessively and hardened. It is possible to play well without disturbing the vibration of the part 2.

  On the other hand, when the temperature controller 5 heats the diaphragm 2, a slight change in temperature of the diaphragm 2 may cause a change in the resonance frequency of the diaphragm 2. Further, depending on the presence or absence of the substrate W on the diaphragm 2, the resonance frequency of the diaphragm 2 may change. At this time, for example, the position of the vibration node of the diaphragm portion 2 changes so as to change from the position indicated by the arrow in FIG. 3A to the position indicated by the arrow in FIG.

  On the other hand, in the substrate levitation apparatus 1 of the present invention, the diaphragm support portion 4 is a plate-like body having elasticity, and the diaphragm portion 2 is supported by the surface, so that the diaphragm portion 2 is supported by points. Unlike the case, even if a change occurs in the position of the vibration node of the diaphragm part 2, the position of the node exists in the region where the diaphragm support part 4 supports the diaphragm part 2.

  Therefore, regardless of how the position of the vibration node of the vibration plate portion 2 changes, the vibration plate support portion 4 maintains the state of supporting the vibration plate portion 2 at the position of the vibration node of the vibration plate portion 2. Therefore, the load of the diaphragm portion 2 is dispersed and supported at the positions of these nodes. That is, no matter how the resonance frequency of the diaphragm portion 2 changes, the diaphragm support portion 4 is not compressed too hard at the antinode of the vibration of the diaphragm portion 2, and the vibration of the diaphragm portion 2 is not hardened. It is possible to play well without disturbing. Thereby, the diaphragm portion 2 can stably float the substrate W.

  In the present embodiment, the diaphragm support portion 4 is in contact with the entire lower surface of the diaphragm portion 2, so that the vibration of the diaphragm portion 2 is within the region where the diaphragm support portion 4 supports the diaphragm portion 2. Since there are always a sufficient number of points corresponding to the nodes, the diaphragm support part 4 can firmly support the diaphragm part 2 by dispersing the load of the diaphragm part 2.

  Further, since the diaphragm support unit 4 is in contact with the entire lower surface of the diaphragm unit 2, heating (or cooling) of the diaphragm unit 2 by the temperature control unit 5 is performed through the diaphragm support unit 4 over the entire surface. Therefore, a portion heated (or cooled) via the diaphragm support portion 4 and a portion heated (or cooled) by convection or radiation without going through the diaphragm support portion 4 are mixed to cause uneven heat transfer. Can be prevented, and the diaphragm 2 is heated (or cooled) uniformly over the entire surface.

  Moreover, in this embodiment, by using the rubber sheet of Shore A60-80 as the diaphragm support part 4, it is too soft and does not collapse when the diaphragm part 2 is placed. Moreover, it is possible to support the diaphragm 2 firmly while keeping the vibration of the diaphragm 2 without disturbing the vibration of the diaphragm 2 due to being too hard.

  Next, FIG. 4 shows a levitation transfer heat treatment line using the substrate levitation apparatus of the present invention.

  The levitation transfer heat treatment line 7 includes a plurality of substrate levitation apparatuses 1 having different temperature settings of the temperature control unit 5. A substrate levitation apparatus 1 in which the temperature of the vibration plate portion 2 is controlled so that the temperature of the substrate W becomes 70 ° C. is provided along the transport path of the substrate W, and the coating film on the substrate W is dried here. Is done.

  Next, the substrate levitation apparatus 1 in which the temperature of the vibration plate portion 2 is controlled so that the temperature of the substrate W becomes 120 ° C. is provided, and the coating film on the substrate W is baked here. A substrate levitation apparatus 1 having a role of a temperature raising zone for gradually increasing the temperature of the substrate W may be provided between the substrate levitation apparatus 1 and the substrate levitation apparatus 1 having the set temperature of 70 ° C. .

  Next, the substrate levitation apparatus 1 in which the temperature of the diaphragm portion 2 is controlled so that the temperature of the substrate W becomes equal to room temperature is provided, and the substrate W is cooled here. The substrate W whose temperature has been returned to room temperature in this way is transported to the next step. In this substrate levitation apparatus 1, the temperature control unit 5 may cool the diaphragm 2, but the temperature control unit 5 may not be provided. In this case, the substrate W is cooled by the diaphragm portion 2 exposed to the surrounding atmosphere and having a temperature equivalent to room temperature.

  In this way, by connecting the substrate levitation apparatus 1 having different set temperatures of the temperature control unit 5 in the direction of transporting the substrate W, the levitation transport heat treatment line 7 having the steps of drying, baking, and cooling the substrate W can be formed. Is possible.

  With the above substrate floating apparatus, the substrate can be stably floated.

DESCRIPTION OF SYMBOLS 1 Substrate levitation device 2 Vibration plate part 3 Ultrasonic wave generation part 4 Vibration plate support part 5 Temperature control part 6 Transfer part 7 Levitation transfer heat treatment line 11 Vibration plate 12 Ultrasonic vibrator 13 Horn 14 Support plate 21 Heater unit 22 Hand 23 Progression Mechanism 90 Levitation transfer heat treatment device 91 Substrate levitation device 92 Vibration plate part 93 Ultrasonic wave generation part 94 Heating device 95 Support member W Substrate

Claims (5)

A vibrating plate part for ultrasonically levitating the substrate;
An ultrasonic generator for applying ultrasonic vibration to the diaphragm,
A plate-like body having elasticity, and a diaphragm support part that contacts the lower surface of the diaphragm part and supports the diaphragm part;
A substrate floating apparatus characterized by comprising:   The substrate floating apparatus according to claim 1, wherein the diaphragm support part is in contact with substantially the entire lower surface of the diaphragm part.   The substrate levitation apparatus according to claim 1, wherein the diaphragm support portion is a rubber sheet.   The substrate floating apparatus according to claim 3, wherein a hardness of the diaphragm support portion is Shore A 60-80.   5. The substrate floating apparatus according to claim 1, wherein a temperature control unit that controls a temperature of the diaphragm unit is in contact with a lower surface of the diaphragm support unit.

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